JP6520342B2 - 超音波プローブ - Google Patents
超音波プローブ Download PDFInfo
- Publication number
- JP6520342B2 JP6520342B2 JP2015085196A JP2015085196A JP6520342B2 JP 6520342 B2 JP6520342 B2 JP 6520342B2 JP 2015085196 A JP2015085196 A JP 2015085196A JP 2015085196 A JP2015085196 A JP 2015085196A JP 6520342 B2 JP6520342 B2 JP 6520342B2
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- circuit
- chip
- transducer
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- 239000000523 sample Substances 0.000 title claims description 45
- 238000002604 ultrasonography Methods 0.000 title claims description 24
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- 238000002059 diagnostic imaging Methods 0.000 description 7
- 230000001902 propagating effect Effects 0.000 description 4
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000003745 diagnosis Methods 0.000 description 2
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- 238000002592 echocardiography Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
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- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- 238000007747 plating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Images
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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Description
ンプ127は、入力されるエコー信号を増幅する。ADC128は、入力されるエコー信
号をアナログ値からデジタル値に変換して出力する。すなわち、ADC128は、アナログのエコー信号をデジタルのエコー信号に変換する。ADC128から出力されるエコー信号は、出力バッファ125及び出力端子126を介してICチップ13に送信される。ICチップ12が、エコー信号を増幅させずに、エコー信号をアナログ値からデジタル値に変換する場合、アンプ127を省略してもよい。
(Read Only Memory)、RAM(Random Access Memory)等のメモリ(記憶装置)とを備えるコンピュータである。モニタ4は、例えば、CRT(Cathode Ray Tube)、液晶ディスプレイ、プラズマディスプレイ及び有機EL(electroluminescence)ディスプレイ等
の表示装置である。
イッチング雑音や外部からの輻射雑音である。
)である。配線板20は、基板の一例である。配線板20を2層以上の多層配線とすることで、配線板20の内部における上下左右の層でのクロストークの発生を抑制することができる。また、配線板20の内層配線の周囲をグランドシールドすることにより、超音波プローブ2の外部からの雑音混入を抑制することができる。
続配線を短くすることができる。ICチップ11とICチップ12とを接続する接続配線を短くすることにより、ICチップ11とICチップ12を接続する接続配線を伝播するエコー信号に対する雑音混入が抑制される。また、ICチップ11、12の両方を配線板20の同一面に配置する場合と比較して、ICチップ11とICチップ12とを接続する接続配線の領域を小さくすることができる。
プ11とICチップ12の接続端子を交差させないことにより接続端子部分でのクロストークの発生が抑制される。
ることを抑制できる。したがって、ICチップ11、12に入力されるエコー信号に対する雑音混入が抑制される。
の配置の一例を示す図である。配線板20の下面に支柱(図示せず)が設けられており、配線板20の支柱に配線板40が固定されている。配線板40の上面(主面)に電源IC16、17及び電池ユニット18が配置されている。なお、図8では、電源IC17の図示が省略されている。配線板40の上面は、配線板20の下面と対向する側の面である。
ってもよい。図9は、超音波プローブ2の部分断面図である。図9に示すように、ICチップ11〜13と配線板20との間に半田ボール50を設けることにより、ICチップ11〜13の相互間の電気的な接続が行われている。
超音波の送受信パワーが減衰しても、エコー信号に対する雑音混入を抑制することができる。したがって、トランスデューサ10に送信されるパルスの電圧を下げることが可能となり、超音波プローブ2の低電力化が向上する。超音波プローブ2によれば、ICチップ11とICチップ12とを接続する接続配線の領域を小さくすることができるため、配線板20の実装面積が小さくなり、超音波プローブ2の小型化が向上する。
2 超音波プローブ
3 画像処理部
4 モニタ
10 トランスデューサ
11〜13 ICチップ
14 無線モジュール
15 アンテナ
16、17 電源IC
18 電池ユニット
20、40 配線板
Claims (6)
- 超音波を送受信し、かつ、超音波信号と電圧信号とを相互に変換するトランスデューサと、
前記トランスデューサにパルス電圧信号を送信し、かつ、前記トランスデューサから前記電圧信号を受信する第1回路と、
前記第1回路から受信した前記電圧信号をアナログ値からデジタル値に変換する第2回路と、
デジタル値に変換された前記電圧信号を前記第2回路から受信する第3回路と、
前記第1回路、前記第2回路及び前記第3回路に電力を供給する電池ユニットと、
前記トランスデューサ、前記第1回路及び前記第2回路が設けられた基板と、
前記第1回路及び前記第2回路に供給される電力を制御する第1電源回路と、
前記第3回路に供給される電力を制御する第2電源回路と、
を備え、
前記第1回路は、前記基板の第1面に配置され、
前記第2回路は、前記基板の前記第1面の反対側の第2面に配置され、
前記第3回路は、前記基板の前記第1面又は前記第2面に配置されていることを特徴とする超音波プローブ。 - 前記第1回路と前記第2回路とを接続する複数の第1接続配線と、
前記第2回路と前記第3回路とを接続する第2接続配線と、
を更に備え、
前記複数の第1接続配線と前記第2接続配線とが、平面視で互いに交差しないようにして前記基板内に形成されていることを特徴とする請求項1に記載の超音波プローブ。 - 前記第1電源回路は、DC−DCコンバータであり、
前記トランスデューサは、振動子を有し、
前記振動子の共振周波数を含む所定周波数と、前記DC−DCコンバータの動作周波数とを異ならせることを特徴とする請求項1又は2に記載の超音波プローブ。 - 超音波を送受信し、かつ、超音波信号と電圧信号とを相互に変換するトランスデューサ
と、
前記トランスデューサにパルス電圧信号を送信し、かつ、前記トランスデューサから前記電圧信号を受信する第1回路と、
前記第1回路から受信した前記電圧信号をアナログ値からデジタル値に変換する第2回路と、
前記第1回路及び前記第2回路に電力を供給する電池ユニットと、
前記トランスデューサ、前記第1回路及び前記第2回路が設けられた基板と、
前記基板と対向して配置され、前記電池ユニットが設けられた第2基板と、
を備え、
前記第1回路は、前記基板の第1面に配置され、
前記第2回路は、前記基板の前記第1面の反対側の第2面に配置され、
前記電池ユニットは、前記第1回路と向かい合うようにして前記第2基板に配置されていることを特徴とする超音波プローブ。 - 超音波を送受信し、かつ、超音波信号と電圧信号とを相互に変換するトランスデューサと、
前記トランスデューサにパルス電圧信号を送信し、かつ、前記トランスデューサから前記電圧信号を受信する第1回路と、
前記第1回路から受信した前記電圧信号をアナログ値からデジタル値に変換する第2回路と、
前記第1回路及び前記第2回路に電力を供給する電池ユニットと、
前記トランスデューサ、前記第1回路及び前記第2回路が設けられた基板と、
前記基板と対向して配置され、前記電池ユニットが設けられた第2基板と、
を備え、
前記第1回路は、前記基板の第1面に配置され、
前記第2回路は、前記基板の前記第1面の反対側の第2面に配置され、
前記電池ユニットは、前記第2回路と向かい合うようにして前記第2基板に配置されていることを特徴とする超音波プローブ。 - 超音波を送受信し、かつ、超音波信号と電圧信号とを相互に変換するトランスデューサと、
前記トランスデューサにパルス電圧信号を送信し、かつ、前記トランスデューサから前記電圧信号を受信する第1回路と、
前記第1回路から受信した前記電圧信号をアナログ値からデジタル値に変換する第2回路と、
前記第1回路及び前記第2回路に電力を供給する電池ユニットと、
前記トランスデューサ、前記第1回路及び前記第2回路が設けられた基板と、
を備え、
前記第1回路は、前記基板の第1面に配置され、
前記第2回路は、前記基板の前記第1面の反対側の第2面に配置され、
前記基板の前記第1面に配置された前記第1回路との複数の接続端子は、前記基板の前記第2面に配置された前記第2回路との複数の接続端子を平面視で囲むように形成されていることを特徴とする超音波プローブ。
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US3727216A (en) * | 1971-01-28 | 1973-04-10 | Mosler Safe Co | Electromagnetic and ultrasonic doppler correlation intrusion alarm system |
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US8439840B1 (en) * | 2010-05-04 | 2013-05-14 | Sonosite, Inc. | Ultrasound imaging system and method with automatic adjustment and/or multiple sample volumes |
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