JP6517130B2 - Repair method and connection method - Google Patents

Description

  The present invention relates to a repair method in connection using an anisotropic conductive film, and a connection method using an anisotropic conductive film.

  Conventionally, a tape-like connecting material (for example, anisotropic conductive film (ACF; Anisotropic Conductive Film)) in which a thermosetting resin in which conductive particles are dispersed is applied to a peeling film as a means for connecting an electronic component to a substrate Is used.

  This anisotropic conductive film is, for example, connected to a terminal of a flexible printed circuit (FPC) or an IC (Integrated Circuit) chip and an electrode formed on a glass substrate of an LCD (Liquid Crystal Display) panel. As, it is used when bonding and electrically connecting various terminals.

  In the connection method using such an anisotropic conductive film, the temporary sticking process of temporarily pressure-bonding and fixing an anisotropic conductive film on a board | substrate is performed normally. And when a malfunction has arisen in the fixed position of the anisotropic conductive film after temporary pressure bonding, the repair process which removes an anisotropic conductive film and carries out temporary pressure bonding again is performed.

  In particular, in recent years, with the miniaturization and high performance of electric devices, the fine pitching of electrodes in electronic parts and substrates has been promoted, but good connection reliability also in the fine pitch connection between electronic parts and the substrate It is required to obtain high connection reliability while securing the

  Here, in the case of fine pitch connection, since the connection area becomes extremely small, generation of temporary pressure bonding positional deviation is increased also in the temporary sticking step of the anisotropic conductive film, and therefore the anisotropic conductive film temporarily attached is Repair processing to tear off is also increasing. If the surface of the wiring board can be cleaned by mechanically peeling off the anisotropic conductive film even at the stage after temporary sticking, it becomes possible to reuse the wiring board if a failure occurs. However, the anisotropically conductive film in the temporary pressure-bonding stage has mechanical strength insufficient, and can not be cut off smoothly during peeling off.

Therefore, the first disposing step of disposing the adhesive film on the wiring board, the temporary pressure bonding step of fixing the adhesive film on the wiring board by heating at a temperature at which the adhesive film is not thermally cured, and fixing on the wiring board If no displacement occurs in the fixing position of the adhesive film, the second disposing step of disposing the electronic member on the adhesive film, and heat pressing the electronic member disposed on the adhesive film to cure the adhesive film Curing the adhesive film by light irradiation when there is a main pressure bonding step of pressure bonding the wiring board and the electronic member, and when the fixing position of the adhesive film fixed on the wiring board is deviated in the temporary pressure bonding step There is proposed a connection method having a repair step of peeling the adhesive film from the wiring board and returning the wiring board to the first arrangement step after the bonding board is made (see, for example, Patent Document 1).
However, in the proposed technology, there is a problem that the repairability is not sufficient.

JP 2014-096531A

  An object of the present invention is to solve the above-mentioned problems in the prior art and to achieve the following objects. That is, an object of the present invention is to provide a repair method having excellent repairability, and a connection method having the repair method and having excellent repairability.

The means for solving the problems are as follows. That is,
<1> A connection method for anisotropically conductively connecting a terminal of a first circuit member and a terminal of a second circuit member,
A thermosetting anisotropic conductive film is disposed on the terminal of the first circuit member, and the thermosetting anisotropic conductive film is not thermally cured while pressing the thermosetting anisotropic conductive film. A temporary sticking step of heating and fixing the thermosetting anisotropic conductive film on the first circuit member;
When there is no deviation in the fixing position of the thermosetting anisotropic conductive film fixed on the first circuit member in the temporary attaching step, the thermosetting anisotropic conductive film is not deformed. Arranging the second circuit member such that the terminal of the second circuit member is in contact with the thermosetting anisotropic conductive film;
Heating and pressing the second circuit member with a heating and pressing member;
When the fixing position of the thermosetting anisotropic conductive film fixed on the first circuit member is deviated in the temporary sticking step, the adhesive tape is attached to the thermosetting anisotropic conductive film. Is applied, the thermosetting anisotropic conductive film is irradiated with light through the pressure-sensitive adhesive tape to photocure the thermosetting anisotropic conductive film, and further, from the first circuit member Including a repair step of peeling the adhesive tape together with a thermosetting anisotropic conductive film,
Connection method characterized in that.
<2> The connection method according to <1>, wherein the thermosetting anisotropic conductive film contains a photo-curing agent.
The adhesive layer of the <3> above-mentioned adhesive tape is a connection method in any one of said <1> to <2> which is photocurable.
<4> The connection method according to any one of <1> to <3>, wherein the thermosetting anisotropic conductive film is a radical curable anisotropic conductive film.
The adhesive layer of the <5> above-mentioned adhesive tape is a connection method in any one of said <1> to <4> which is radical photocurable.
After sticking an adhesive tape on the thermosetting type anisotropic conductive film fixed on the 1st circuit member by the <6> temporary sticking process, it is photocurable to the said thermosetting type anisotropic conductive film over the said adhesive tape Irradiation is performed to photocure the thermosetting anisotropic conductive film, and further, the adhesive tape is peeled off from the first circuit member together with the thermosetting anisotropic conductive film,
In the temporary sticking step, the thermosetting anisotropic conductive film is disposed on the terminal of the first circuit member, and the thermosetting anisotropic conductive is performed while pressing the thermosetting anisotropic conductive film. A step of fixing the thermosetting anisotropic conductive film on the first circuit member by heating at a temperature at which the film is not thermally cured;
It is a repair method characterized by
The repair method as described in said <6> performed when the shift | offset | difference has arisen in the fixed position of the said thermosetting type anisotropic conductive film fixed on the said 1st circuit member by the <7> said temporary sticking process. It is.
<8> The repair method according to any one of <6> to <7>, wherein the thermosetting anisotropic conductive film contains a photo-curing agent.
<9> The repair method according to any one of <6> to <8>, wherein the adhesive layer of the adhesive tape is photocurable.
<10> The repair method according to any one of <6> to <9>, wherein the thermosetting anisotropic conductive film is a radical curable anisotropic conductive film.
<11> The repair method according to any one of <6> to <10>, wherein the adhesive layer of the adhesive tape is photocurable.

  According to the present invention, it is possible to solve the above-mentioned various problems in the related art, achieve the above object, and provide a repair method excellent in repairability and a connection method excellent in repairability including the repair method.

FIG. 1 is a flowchart for explaining an example of the connection method of the present invention. FIG. 2A is a schematic cross-sectional view for explaining an example of the connection method of the present invention (part 1). FIG. 2B is a schematic cross-sectional view for explaining an example of the connection method of the present invention (part 2). FIG. 2C is a schematic cross-sectional view for explaining an example of the connection method of the present invention (part 3). FIG. 2D is a schematic cross-sectional view for explaining an example of the connection method of the present invention (part 4). FIG. 2E is a schematic cross-sectional view for explaining an example of the connection method of the present invention (No. 5). FIG. 2F is a schematic cross-sectional view for explaining an example of the connection method of the present invention (part 6). FIG. 2G is a schematic cross-sectional view for explaining an example of the connection method of the present invention (part 7). FIG. 2H is a schematic cross-sectional view for explaining an example of the connection method of the present invention (part 8). FIG. 2I is a schematic cross-sectional view for explaining an example of the connection method of the present invention (part 9).

(Connection method)
The connection method of the present invention includes a temporary bonding step, a placement step, a heating and pressing step, and a repair step, and further includes other steps such as a positional deviation determination step as necessary.
The connection method is a method in which the terminal of the first circuit member and the terminal of the second circuit member are anisotropically conductively connected.

<First Circuit Member, Second Circuit Member>
The first circuit member and the second circuit member are not particularly limited as long as they have terminals and are to be subjected to anisotropic conductive connection using the anisotropic conductive film. For example, a glass substrate having a terminal, a plastic substrate having a terminal, an IC (Integrated Circuit), a TAB (Tape Automated Bonding) tape, a Flex-on-Glass (flex-on-glass, FOG), Chip-on-Glass (Chip-on-Glass, COG), Chip-on-Flex (Chip-on-Flex, COF), Flex-on-Board (Flex-on-board, FOB), Flex-on-Flex (Flex-on) Flex, FOF, LCD panel etc And the like.

Examples of the glass substrate having the terminals include an ITO (Indium Tin Oxide) glass substrate, an IZO (Indium Zinc Oxide) glass substrate, and other glass pattern substrates. Among these, ITO glass substrates and IZO glass substrates are preferable.
There is no restriction | limiting in particular as a material of the plastic substrate which has the said terminal, and a structure, According to the objective, it can select suitably, For example, the rigid board which has a terminal, the flexible substrate which has a terminal, etc. are mentioned.
Examples of the IC include an IC chip for liquid crystal display control in a flat panel display (FPD).

There is no restriction | limiting in particular as a shape and magnitude | size of a said 1st circuit member and a said 2nd circuit member, According to the objective, it can select suitably.
The first circuit member and the second circuit member may be the same circuit member or different circuit members.

<Provisional pasting process>
A thermosetting anisotropic conductive film is disposed on the terminal of the first circuit member, and the thermosetting anisotropic conductive film is not thermally cured while pressing the thermosetting anisotropic conductive film. If it is a process of heating and fixing the thermosetting anisotropic conductive film on the first circuit member, there is no particular limitation, and it can be appropriately selected according to the purpose.

<< Thermosetting anisotropic conductive film >>
There is no restriction | limiting in particular as said thermosetting type anisotropic conductive film, if it is an anisotropic conductive film hardened | cured by heating and used for the connection by heating, According to the objective, it selects suitably. it can.

The thermosetting anisotropic conductive film contains, for example, at least a film-forming resin, a curable resin, a thermosetting agent, and conductive particles, and further contains other components as necessary.
The thermosetting anisotropic conductive film preferably contains a photo-curing agent.

  The thermosetting anisotropic conductive film is preferably a radical curable anisotropic conductive film.

-Film forming resin-
There is no restriction | limiting in particular as said film formation resin, According to the objective, it can select suitably, For example, phenoxy resin, unsaturated polyester resin, saturated polyester resin, urethane resin, butadiene resin, a polyimide resin, polyamide resin, polyolefin Resin etc. are mentioned. The said film formation resin may be used individually by 1 type, and may use 2 or more types together. Among these, phenoxy resins are preferable in terms of film forming properties, processability, and connection reliability.
Examples of the phenoxy resin include resins synthesized from bisphenol A and epichlorohydrin.
As said phenoxy resin, what was synthesize | combined suitably may be used and a commercial item may be used.

  There is no restriction | limiting in particular as content of the said film formation resin in the said thermosetting type anisotropic conductive film, Although it can select suitably according to the objective, 20 mass%-70 mass% are preferable, and 30 mass% 60 mass% is more preferable.

-Curable resin-
There is no restriction | limiting in particular as said curable resin (hardening component), According to the objective, it can select suitably, For example, a radically polymerizable compound, an epoxy resin, etc. are mentioned.

--Radically polymerizable compound--
There is no restriction | limiting in particular as said radically polymerizable compound, According to the objective, it can select suitably, For example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, Trimethylolpropane triacrylate, dimethylol tricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy-1,3-diacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclodecanyl acrylate, tris (acryloxyethyl) Isocyanurate, and urethane acrylate. These may be used alone or in combination of two or more.
Moreover, what used the said acrylate as the methacrylate is mentioned, These may be used individually by 1 type, and may use 2 or more types together.

--Epoxy resin--
There is no restriction | limiting in particular as said epoxy resin, According to the objective, it can select suitably, For example, bisphenol A epoxy resin, bisphenol F epoxy resin, novolak epoxy resin, those modified epoxy resins, alicyclic An epoxy resin etc. are mentioned. These may be used alone or in combination of two or more.

  There is no restriction | limiting in particular as content of the said curable resin in the said thermosetting type anisotropic conductive film, Although it can select suitably according to the objective, 20 mass%-70 mass% are preferable, and 30 mass% 60 mass% is more preferable.

-Thermal curing agent-
The heat curing agent is not particularly limited as long as it has the effect of curing the curable resin by heat, and can be appropriately selected according to the purpose. For example, a heat radical curing agent, a heat cation curing agent Etc.

--Thermal radical curing agent--
There is no restriction | limiting in particular as said heat radical type | system | group hardening agent, According to the objective, it can select suitably, For example, an organic peroxide etc. are mentioned.
Examples of the organic peroxide include lauroyl peroxide, butyl peroxide, dilauroyl peroxide, dibutyl peroxide, peroxydicarbonate, benzoyl peroxide and the like.
The heat radical curing agent is preferably used in combination with a radical polymerizable compound as the curable resin.

--Thermal cationic curing agent--
The thermal cationic curing agent is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include sulfonium salts and onium salts. Among these, aromatic sulfonium salts are preferable.
The heat cationic curing agent is preferably used in combination with an epoxy resin as the curable resin.

  There is no restriction | limiting in particular as content of the said thermosetting agent in the said thermosetting type anisotropic conductive film, According to the objective, it can select suitably, 1 mass%-10 mass% are preferable, 3 mass%- 7 mass% is more preferable.

-Conductive particles-
There is no restriction | limiting in particular as said conductive particle, According to the objective, it can select suitably, For example, a metal particle, metal coating resin particle, etc. are mentioned.

There is no restriction | limiting in particular as said metal particle, According to the objective, it can select suitably, For example, nickel, cobalt, silver, copper, gold | metal | money, palladium, solder etc. are mentioned. These may be used alone or in combination of two or more.
Among these, nickel, silver and copper are preferable. These metal particles may have gold and palladium on the surface for the purpose of preventing surface oxidation. Furthermore, the surface may be provided with an insulating film with metal protrusions or organic substances.

The metal-coated resin particle is not particularly limited as long as it is a particle in which the surface of the resin particle is coated with a metal, and can be appropriately selected according to the purpose. For example, the surface of the resin particle is nickel, silver, solder And particles coated with at least one of copper, gold, and palladium. Furthermore, the surface may be provided with an insulating film with metal protrusions or organic substances. In the case of connection considering low resistance, particles in which the surface of resin particles is coated with silver are preferable.
There is no restriction | limiting in particular as a coating method of the metal to the said resin particle, According to the objective, it can select suitably, For example, the electroless-plating method, sputtering method, etc. are mentioned.
There is no restriction | limiting in particular as a material of the said resin particle, According to the objective, it can select suitably, For example, a styrene divinylbenzene copolymer, a benzoguanamine resin, a crosslinked polystyrene resin, an acrylic resin, styrene-silica composite resin etc. Can be mentioned.

  The conductive particles may have conductivity at the time of anisotropic conductive connection. For example, even in the case of particles in which an insulating film is applied to the surface of metal particles, the particles are the conductive particles as long as the particles are deformed at the time of anisotropic conductive connection and the metal particles are exposed.

There is no restriction | limiting in particular as an average particle diameter of the said electroconductive particle, Although it can select suitably according to the objective, 1 micrometer-50 micrometers are preferable, 2 micrometers-30 micrometers are more preferable, and 3 micrometers-15 micrometers are especially preferable.
The said average particle diameter is an average value of the particle diameter arbitrarily measured about ten electroconductive particles.
The particle size can be measured, for example, by scanning electron microscopy.

  There is no restriction | limiting in particular as content of the said electroconductive particle in the said thermosetting type anisotropic conductive film, Although it can select suitably according to the objective, 0.5 mass%-10 mass% are preferable, 3 % To 8% by mass is more preferable.

-Photo-curing agent-
The photo-curing agent is not particularly limited as long as it has the effect of curing the curable resin by light, and can be appropriately selected according to the purpose. For example, a photo-radical curing agent, photo-cation curing agent Etc.

--Photo radical curing agent--
There is no restriction | limiting in particular as said optical radical hardening agent, According to the objective, it can select suitably, For example, an acyl phosphine oxide type radical curing agent, an acetophenone type radical curing agent, a ketal type radical curing agent Etc. These are so-called photopolymerization initiators that generate radically active species by irradiation of active energy rays such as ultraviolet rays.
Examples of the acyl phosphine oxide based photo radical curing agent include 2,4,6-trimethyl benzoyl-diphenyl-phosphine oxide, 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, And bis 4- (2,4,6-trimethyl benzoyl) -phenyl phosphine oxide and the like.
Examples of the acetophenone photoradical curing agent include α-hydroxy-α, α'-dimethylacetophenone, methoxyacetophenone, 2,2-dimethoxy-2-phenylacetone, 2-hydroxy-2-cyclohexylacetophenone and the like. .
Examples of the ketal-based photo-radical curing agent include benzyl dimethyl ketal and the like.
The photo-radical curing agent is preferably used in combination with a radically polymerizable compound as the curable resin.

--Photo cationic curing agent--
The photocationic curing agent is not particularly limited and may be appropriately selected depending on the purpose. Examples thereof include sulfonium salts and iodonium salts. Among these, aromatic sulfonium salts are preferable.
The photocationic curing agent is preferably used in combination with an epoxy resin as the curable resin.

  In addition, a sulfonium salt, an iodonium salt, etc. may have an effect | action which hardens the said curable resin with any of heat | fever and light. That is, the thermal cationic curing agent may double as the photocationic curing agent.

There is no restriction | limiting in particular as content of the said photocuring agent in the said thermosetting type anisotropic conductive film, Although it can select suitably according to the objective, 0.1 mass%-5 mass% are preferable, 0 .2 mass% to 3 mass% is more preferable, and 0.3 mass% to 2 mass% is particularly preferable.
Moreover, there is no restriction | limiting in particular as content of the said photocuring agent in the said thermosetting type anisotropic conductive film, Although it can select suitably according to the objective, With respect to 100 mass parts of said curable resin, 0.2 parts by mass to 10 parts by mass is preferable, 0.4 parts by mass to 6 parts by mass is more preferable, and 0.6 parts by mass to 4 parts by mass is particularly preferable.

-Other ingredients-
There is no restriction | limiting in particular as said other component, According to the objective, it can select suitably, For example, a silane coupling agent etc. are mentioned.

--Silane coupling agent--
There is no restriction | limiting in particular as said silane coupling agent, According to the objective, it can select suitably, For example, an epoxy-type silane coupling agent, an acryl-type silane coupling agent, a thiol-type silane coupling agent, an amine silane Coupling agents and the like can be mentioned.
There is no restriction | limiting in particular as content of the said silane coupling agent, According to the objective, it can select suitably.

There is no restriction | limiting in particular as an average thickness of the said thermosetting type anisotropic conductive film, Although it can select suitably according to the objective, 1 micrometer-50 micrometers are preferable, 5 micrometers-40 micrometers are more preferable, 10 micrometers-30 micrometers are especially preferable.
Here, in the present specification, the average thickness is an arithmetic average value when ten arbitrary points are measured.

In the temporary sticking step, the thermosetting anisotropic conductive film is heated at a temperature at which the thermosetting anisotropic conductive film is not thermally cured while being pressed.
There is no restriction | limiting in particular as a pressure of the said pressurization, According to the objective, it can select suitably, For example, 0.1 Mpa-10 Mpa etc. are mentioned.
As a temperature of the said heating, 70 degreeC-100 degreeC etc. are mentioned, for example. The temperature may be determined with reference to the thermal decomposition temperature of the thermosetting agent of the thermosetting anisotropic conductive film.
As said time of pressurization and heating, 0.5 seconds-10 seconds etc. are mentioned, for example.

<Placement process>
In the disposing step, the second circuit member is disposed on the thermosetting anisotropic conductive film so that the terminal of the second circuit member is in contact with the anisotropic conductive film. There is no particular limitation, and it can be selected appropriately according to the purpose.

  The disposing step is performed when no displacement occurs in the fixing position of the thermosetting anisotropic conductive film fixed on the first circuit member in the temporary bonding step.

<Heating and pressing process>
The heating and pressing step is not particularly limited as long as it is a step of heating and pressing the second circuit member with the heating and pressing member, and can be appropriately selected according to the purpose.

Examples of the heating and pressing member include a pressing member having a heating mechanism. Examples of the pressing member having the heating mechanism include a heat tool.
There is no restriction | limiting in particular as temperature of the said heating, Although it can select suitably according to the objective, 150 degreeC-200 degreeC are preferable.
There is no restriction | limiting in particular as a pressure of the said press, Although it can select suitably according to the objective, 0.1 MPa-50 MPa are preferable.
There is no restriction | limiting in particular as time of the said heating and pressing, According to the objective, it can select suitably, For example, 0.5 second-120 second are mentioned.

<Repair process>
In the repair step, a pressure-sensitive adhesive tape is attached to the thermosetting anisotropic conductive film, and then the thermosetting anisotropic conductive film is irradiated with light through the adhesive tape, and the thermosetting anisotropic material is produced. There is no particular limitation as long as it is a step of photocuring a conductive conductive film and further peeling off the adhesive tape together with the thermosetting anisotropic conductive film from the first circuit member, and it is appropriately selected according to the purpose. be able to.

  The said repair process is performed when the shift | offset | difference has arisen in the fixed position of the said thermosetting type anisotropic conductive film fixed on the said 1st circuit member by the said temporary sticking process.

  The pressure-sensitive adhesive tape is preferably attached to the entire surface of the thermosetting anisotropic conductive film.

<< Adhesive tape >>
There is no restriction | limiting in particular as said adhesive tape, as long as it is a tape which has adhesiveness, According to the objective, it can select suitably, For example, it has a transparent base material and an adhesive layer.

-Light transmitting base material-
The light transmitting substrate is not particularly limited as long as it can transmit the light irradiated in the repair step, and can be appropriately selected according to the purpose. Examples thereof include polyethylene terephthalate film.
As an average thickness of the said transparent substrate, 10 micrometers-50 micrometers etc. are mentioned, for example.

-Adhesive layer-
The pressure-sensitive adhesive layer is not particularly limited as long as it has adhesiveness, and can be appropriately selected according to the purpose. For example, an acrylic resin, a crosslinking agent, preferably a curable resin, and a light curing agent It further contains other components such as a tackifier, if necessary.

  The adhesive layer is preferably photocurable, and more preferably photocurable.

--Acrylic resin--
If it is resin which can be used as an adhesive as said acrylic resin, there will be no restriction in particular, and it can choose suitably according to the object, for example, a hydroxyl group and a carboxyl group containing acrylic resin etc. are mentioned.

--Crosslinking agent--
The crosslinking agent is not particularly limited as long as it has the effect of curing the acrylic resin by heat, and can be appropriately selected according to the purpose. For example, polyisocyanate compound, polyepoxy compound, polyaziridine compound, melamine Formaldehyde condensates, metal salts, metal chelate compounds and the like can be mentioned.

  Examples of the polyisocyanate compound include aromatic polyisocyanate compounds, aliphatic or alicyclic polyisocyanate compounds, dimers or trimers of these polyisocyanate compounds, and these polyisocyanate compounds and polyols such as trimethylolpropane. Examples include adducts with compounds.

--Curable resin--
There is no restriction | limiting in particular as said curable resin, According to the objective, it can select suitably, For example, the radically polymerizable compound etc. which were mentioned by description of the said thermosetting type anisotropic conductive film are mentioned.

-Photo-curing agent--
The photo-curing agent is not particularly limited as long as it has an action of curing the curable resin by light, and can be appropriately selected according to the purpose. For example, the description of the thermosetting anisotropic conductive film And the like.

<< Light Irradiation >>
There is no restriction | limiting in particular as light used for the said light irradiation, as long as it hardens the said thermosetting type anisotropic conductive film, Although it can select suitably according to the objective, An ultraviolet-ray is preferable.
There is no restriction | limiting in particular as irradiation amount of the said light, According to the objective, it can select suitably.
When the thermosetting anisotropic conductive film is photocured, the film strength is increased, and when peeling off with the adhesive tape, the thermosetting anisotropic conductive film is torn and the first circuit member is formed. You can prevent it from remaining.

  The light irradiation is performed through the adhesive tape. At this time, if the adhesive layer of the adhesive tape is photocurable, the adhesive layer of the adhesive tape is also photocured.

  The pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape is preferably photocurable. Moreover, it is more preferable that the photocuring type of the said thermosetting type anisotropic conductive film and the photocuring type of the said adhesion layer are the same. That is, when the photocurable type of the thermosetting anisotropic conductive film is a radical curable type, it is more preferable that the photocurable type of the adhesive layer is also a radical curable type. By doing so, the adhesiveness of the said thermosetting type anisotropic conductive film and the said adhesion layer becomes larger after light irradiation, and repairability is more excellent.

<Position shift determination process>
If the step of determining the positional deviation is a step of determining whether or not the fixing position of the thermosetting anisotropic conductive film fixed on the first circuit member is deviated, there is no particular limitation. Instead, it can be selected appropriately according to the purpose, and for example, it can be performed by image recognition using a camera.
In the misregistration determination step, for example, a predetermined value within an allowable range set in advance is compared with the measured value, and it is determined that misregistration occurs when the measured value exceeds the predetermined value.

  Here, the connection method of the present invention will be described with reference to the drawings. FIG. 1 is a flowchart for explaining an example of the connection method of the present invention. 2A to 2I are schematic cross-sectional views for explaining an example of the connection method of the present invention.

  First, the first circuit member 1 is prepared (FIG. 2A). The first circuit member 1 has a terminal 1A.

[Temporary sticking process]
Next, the thermosetting anisotropic conductive film 2 is disposed on the terminal 1A of the first circuit member 1 (FIG. 2B).
Next, the thermosetting anisotropic conductive film 2 is heated to a temperature at which the thermosetting anisotropic conductive film 2 is not thermally cured while being pressed, and the thermosetting anisotropic conductive film is formed on the first circuit member 1 Fix 2 (Figure 2C).

Misalignment determination process
Next, it is determined whether a shift has occurred in the fixing position of the thermosetting anisotropic conductive film 2 fixed on the first circuit member 1 in the temporary bonding step.

[Placement process]
Next, in the case where the fixing position of the thermosetting anisotropic conductive film 2 fixed on the first circuit member 1 in the temporary bonding step is not deviated, the thermosetting anisotropic conductive film 2 is formed. The second circuit member 3 is disposed such that the terminal 3A of the second circuit member 3 is in contact with the thermosetting anisotropic conductive film 2 (FIG. 2D).

[Heating and pressing process]
Next, the second circuit member 3 is heated and pressed by the heating and pressing member (FIG. 2E).

  If no displacement occurs in the fixed position, the bonded body can be obtained by the above method, but if the displacement occurs in the fixed position, the repair process is performed.

Repair process
When the fixing position of the thermosetting anisotropic conductive film 2 fixed on the first circuit member 1 is deviated by the temporary attaching process, the adhesive tape 11 is formed on the thermosetting anisotropic conductive film 2. Paste (Figure 2F).
Next, UV irradiation is performed on the thermosetting anisotropic conductive film 2 through the adhesive tape 11 to photocure the thermosetting anisotropic conductive film 2 (FIG. 2G).
Next, the adhesive tape 11 is peeled off from the first circuit member 1 together with the thermosetting anisotropic conductive film 2 (FIG. 2H).
By doing so, the first circuit member 1 to which the thermosetting anisotropic film 2 is not attached is regenerated (FIG. 2I). The first circuit member 1 is reused in the temporary bonding process.

(Repair method)
In the repair method of the present invention, after the pressure-sensitive adhesive tape is attached to the thermosetting anisotropic conductive film fixed on the first circuit member in the temporary attaching process, the thermosetting anisotropy is obtained through the adhesive tape. A method of irradiating a conductive film with light, photocuring the thermosetting anisotropic conductive film, and further peeling off the adhesive tape together with the thermosetting anisotropic conductive film from the first circuit member . This method provides a reusable first circuit member.

  In the temporary sticking step, the thermosetting anisotropic conductive film is disposed on the terminal of the first circuit member, and the thermosetting anisotropic conductive is performed while pressing the thermosetting anisotropic conductive film. In this step, the thermosetting anisotropic conductive film is fixed on the first circuit member by heating at a temperature at which the film is not thermally cured.

  Details of the repair method are the same as the repair step in the connection method, and examples and preferred embodiments are also the same.

  Examples of the present invention will be described below, but the present invention is not limited to these examples.

(Production Example 1)
<Preparation of anisotropic conductive film>
The following formulations were uniformly mixed to make a mixture.
-Formulation-
Phenoxy resin (trade name: YP-50, manufactured by Nippon Steel Sumikin Chemical Co., Ltd.) 50 parts by mass Urethane acrylate (trade name: M-1600, manufactured by Toagosei Co., Ltd.) 25 parts by mass Polyfunctional acrylate (trade name: M-315, Toagosa synthesis 25 parts by mass Thermosetting agent (trade name: Peroyl L, manufactured by NOF Corporation) 4 parts by mass Photocuring agent (trade name: IRG 184, manufactured by BASF Corp.) 1 part by mass Conductive particles (trade name: Micropearl AU) Sekisui Chemical Co., Ltd., average particle diameter 4 μm) 3 parts by mass The resulting mixture was coated on a silicone-treated PET (polyethylene terephthalate) by a bar coater so as to have an average thickness of 20 μm after drying, at 70 ° C. It dried for 5 minutes and produced the anisotropic conductive film.

(Production Example 2)
An anisotropic conductive film was obtained in the same manner as in Production Example 1 except that, in Production Example 1, the phenoxy resin was replaced with a polyester urethane resin (trade name: UR4410, manufactured by Toyobo Co., Ltd.).

(Production Example 3)
An anisotropic conductive film was obtained in the same manner as in Production Example 1 except that, in Production Example 1, the light curing agent was changed to Darocur 1173 (manufactured by BASF Corporation).

(Production Example 4)
An anisotropic conductive film was obtained in the same manner as in Production Example 1 except that the compounding amount of the light curing agent was changed to 0.5 parts by mass in Production Example 1.

(Production Example 5)
An anisotropic conductive film was obtained in the same manner as in Production Example 1 except that the content of the photo-curing agent was changed to 2 parts by mass in Production Example 1.

(Comparative Production Example 1)
An anisotropic conductive film was obtained in the same manner as in Production Example 1 except that the photocuring agent was not blended in Production Example 1.

(Production Example 6)
<Production of acrylic resin>
The following acrylic monomers were blended at the following molar ratios and polymerized to synthesize an acrylic resin for pressure-sensitive adhesive.
-Monomer-
BA: n-butyl acrylate 2 EHA: 2-ethylhexyl acrylate MMA: methyl methacrylate AA: acrylic acid HEMA: hydroxyethyl methacrylate-molar ratio-
BA / 2 EHA / MMA / AA / HEMA = 30/53/9 / 7.5 / 0.5

(Production Example 7)
<Manufacture of photocurable adhesive tape>
The following formulations were uniformly mixed to make a mixture.
-Formulation-
Acrylic resin manufactured in Production Example 6 80 parts by mass Multifunctional acrylate (trade name: M-450, manufactured by Toagosei Co., Ltd.) 20 parts by mass Curing agent (trade name: Coronate L, manufactured by Tosoh Corp.) 2 parts by mass Photocurable agent ( Brand name: IRG 184, manufactured by BASF) 0.5 parts by mass

  The obtained mixture was coated on a PET (polyethylene terephthalate) with an average thickness of 25 μm by a bar coater so that the average thickness after drying was 5 μm, and dried at 70 ° C. for 5 minutes to produce a photocurable pressure-sensitive adhesive tape.

Production Example 8
<Production of adhesive tape>
The following formulations were uniformly mixed to make a mixture.
-Formulation-
80 parts by mass of an acrylic resin manufactured in Production Example 6 2 parts by mass of a curing agent (trade name: Coronate L, manufactured by Tosoh Corporation)

  The obtained mixture was coated on a PET (polyethylene terephthalate) having an average thickness of 25 μm by a bar coater such that the average thickness after drying was 5 μm, and dried at 70 ° C. for 5 minutes to prepare a pressure-sensitive adhesive tape.

<Manufacture of bonded body>
The joined body was manufactured by the following method.
As a second circuit member, COF for evaluation (chip on flex) (Dexerials Inc. evaluation substrate, 50 μm P (pitch), Cu 8 μ mt (thickness)-Sn plating, PI (polyimide) 38 μ mt (thickness)-S'perflex group Material) was used.
As a first circuit member, ITO coated glass (Dexerials Inc. evaluation substrate, all surface ITO coat, glass thickness 0.7 mm) was used.
An anisotropic conductive film slit to a width of 1.5 mm was disposed on the first circuit member. At the time of arrangement, they were stuck and fixed at 80 ° C. and 1 MPa for 1 second. Subsequently, the second circuit member was disposed on the anisotropic conductive film so as not to protrude from the anisotropic conductive film. Subsequently, pressure bonding was performed at 170 ° C. and 4 MPa for 5 seconds with a heating tool (width 1.5 mm) through a buffer material (Teflon (registered trademark), thickness 0.15 mm) to obtain a bonded body.
The conduction resistance of the obtained bonded body was evaluated by the following method. The results are shown in Table 1.

<< Conduction resistance >>
The initial conduction resistance value (Ω) of the joined body was measured by the following method.
Specifically, using a digital multimeter (part number: digital multimeter 7555, manufactured by Yokogawa Electric Corporation), a resistance value was measured when a current of 1 mA was applied by a four-terminal method. The resistance value was measured for 30 channels, and the maximum resistance value was taken as the measured value. The evaluation criteria were as follows.
〔Evaluation criteria〕
○: less than 5 Ω ×: 5 Ω or more

(Examples 1 to 6, Comparative Example 1)
The repairability was evaluated by the following method using the anisotropic conductive film and the adhesive tape produced in the above production example. The combinations of the anisotropic conductive film and the pressure-sensitive adhesive tape, and the results are shown in Tables 3-1 and 3-2.

Repairability
The repairability was evaluated by the following method.
(Step 1) An anisotropic conductive film was temporarily attached to a glass substrate having ITO formed thereon at 80 ° C., 1 MPa, for 1 second.
(Step 2) Next, an adhesive tape was attached to the anisotropic conductive film.
(Step 3) Next, UV irradiation was performed on the adhesive tape for 3 seconds under the following UV irradiation conditions.
<< UV irradiation conditions >>
-UV irradiator: SP-9, manufactured by Ushio Inc.-UV intensity: 300 mW / cm ^{2 at} 365 nm
(Step 4) Next, the adhesive tape was peeled off from the anisotropic conductive film.
And it confirmed visually whether the residue of an anisotropic conductive film exists on a glass substrate, and evaluated it by the following evaluation criteria.
〔Evaluation criteria〕
○: Residue less than 10% :: Residue greater than 10% and less than 50% ×: Residue greater than 50%

(Comparative example 2)
In Example 6, evaluation of repairability was performed in the same manner as in Example 6 except that UV irradiation was not performed (step 3 was not performed). The results are shown in Table 3-2.

(Comparative example 3)
In Example 6, evaluation of repairability is carried out in the same manner as in Example 6, except that UV irradiation is performed before the pressure-sensitive adhesive tape is attached to the anisotropic conductive film (the order of Step 2 and Step 3 is switched). Did. The results are shown in Table 3-2.

Similarly to the anisotropic conductive film of Comparative Production Example 1, there was no problem in the conduction resistance when each of the anisotropic conductive films of Production Examples 1 to 5 was a joined body. That is, even if it mix | blended the photocuring agent with an anisotropic conductive film, the performance at the time of setting it as a bonded body was not affected.
Moreover, in Examples 1 to 5 using the anisotropic conductive film of Production Examples 1 to 5 and a photocurable pressure-sensitive adhesive tape, the reparability is better than Example 6 using a non-light-curable pressure-sensitive adhesive tape. Was better. This is considered to be because the adhesion of the interface between the anisotropic conductive film and the adhesive layer of the adhesive tape is further increased by photocuring both the anisotropic conductive film and the adhesive layer of the adhesive tape by light irradiation. Be

On the other hand, when the anisotropic conductive film was not cured by light, the film strength of the anisotropic conductive film was weak, and thus the repairability was insufficient (Comparative Example 1).
When UV irradiation was not performed in the repair process, since the film strength of the anisotropic conductive film was weak, the repairability was insufficient (Comparative Example 2).
After UV irradiation in the repair step, even if a pressure-sensitive adhesive tape was attached to the anisotropic conductive film, the repairability was insufficient (Comparative Example 3). It is considered that this is because the anisotropic conductive film is not covered with the pressure-sensitive adhesive tape, so that curing inhibition occurs due to oxygen and the film strength of the anisotropic conductive film does not become strong.

1 first circuit member 1A terminal 2 thermosetting anisotropic conductive film 3 second circuit member 3A terminal 11 adhesive tape

Claims (11)

It is a connection method for anisotropically conductively connecting a terminal of a first circuit member and a terminal of a second circuit member,
A thermosetting anisotropic conductive film is disposed on the terminal of the first circuit member, and the thermosetting anisotropic conductive film is not thermally cured while pressing the thermosetting anisotropic conductive film. A temporary sticking step of heating and fixing the thermosetting anisotropic conductive film on the first circuit member;
When there is no deviation in the fixing position of the thermosetting anisotropic conductive film fixed on the first circuit member in the temporary attaching step, the thermosetting anisotropic conductive film is not deformed. Arranging the second circuit member such that the terminal of the second circuit member is in contact with the thermosetting anisotropic conductive film;
Heating and pressing the second circuit member with a heating and pressing member;
When the fixing position of the thermosetting anisotropic conductive film fixed on the first circuit member is deviated in the temporary sticking step, the adhesive tape is attached to the thermosetting anisotropic conductive film. Is applied, the thermosetting anisotropic conductive film is irradiated with light through the pressure-sensitive adhesive tape to photocure the thermosetting anisotropic conductive film, and further, from the first circuit member Including a repair step of peeling the adhesive tape together with a thermosetting anisotropic conductive film,
Connection method characterized by   The connection method according to claim 1, wherein the thermosetting anisotropic conductive film contains a photo-curing agent.   The connection method according to any one of claims 1 to 2, wherein the adhesive layer of the adhesive tape is photocurable.   The connection method according to any one of claims 1 to 3, wherein the thermosetting anisotropic conductive film is a radical curable anisotropic conductive film.   The connection method according to any one of claims 1 to 4, wherein the adhesive layer of the adhesive tape is photo curable. After affixing an adhesive tape to the thermosetting anisotropic conductive film fixed on the first circuit member in the temporary attaching step, the thermosetting anisotropic conductive film is irradiated with light through the adhesive tape. A repair method of photocuring the thermosetting anisotropic conductive film and further peeling off the adhesive tape together with the thermosetting anisotropic conductive film from the first circuit member,
In the temporary sticking step, the thermosetting anisotropic conductive film is disposed on the terminal of the first circuit member, and the thermosetting anisotropic conductive is performed while pressing the thermosetting anisotropic conductive film. A step of fixing the thermosetting anisotropic conductive film on the first circuit member by heating at a temperature at which the film is not thermally cured;
Repair method characterized by   The repair method according to claim 6, which is performed when the fixing position of the thermosetting anisotropic conductive film fixed on the first circuit member is deviated by the temporary sticking step.   The repair method according to any one of claims 6 to 7, wherein the thermosetting anisotropic conductive film contains a photo-curing agent.   The repair method according to any one of claims 6 to 8, wherein the adhesive layer of the adhesive tape is photocurable.   The repair method according to any one of claims 6 to 9, wherein the thermosetting anisotropic conductive film is a radical curable anisotropic conductive film.   The repair method according to any one of claims 6 to 10, wherein the adhesive layer of the adhesive tape is photo curable.