JP6516513B2 - ワイヤレス温度センサ及びその製造方法 - Google Patents

ワイヤレス温度センサ及びその製造方法 Download PDF

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Publication number
JP6516513B2
JP6516513B2 JP2015042968A JP2015042968A JP6516513B2 JP 6516513 B2 JP6516513 B2 JP 6516513B2 JP 2015042968 A JP2015042968 A JP 2015042968A JP 2015042968 A JP2015042968 A JP 2015042968A JP 6516513 B2 JP6516513 B2 JP 6516513B2
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Japan
Prior art keywords
temperature sensor
wireless temperature
electrode
lid
container body
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Expired - Fee Related
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JP2015042968A
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English (en)
Japanese (ja)
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JP2015180871A (ja
JP2015180871A5 (enExample
Inventor
勲 新井
新井　　勲
伸一 小峰
小峰　　伸一
陽一 野々垣
陽一 野々垣
智史 早田
智史 早田
嘉将 木下
嘉将 木下
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Citizen Watch Co Ltd
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Citizen Watch Co Ltd
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Priority to JP2015042968A priority Critical patent/JP6516513B2/ja
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Publication of JP2015180871A5 publication Critical patent/JP2015180871A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Measuring Temperature Or Quantity Of Heat (AREA)
JP2015042968A 2014-03-06 2015-03-04 ワイヤレス温度センサ及びその製造方法 Expired - Fee Related JP6516513B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015042968A JP6516513B2 (ja) 2014-03-06 2015-03-04 ワイヤレス温度センサ及びその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014043932 2014-03-06
JP2014043932 2014-03-06
JP2015042968A JP6516513B2 (ja) 2014-03-06 2015-03-04 ワイヤレス温度センサ及びその製造方法

Publications (3)

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JP2015180871A JP2015180871A (ja) 2015-10-15
JP2015180871A5 JP2015180871A5 (enExample) 2018-02-08
JP6516513B2 true JP6516513B2 (ja) 2019-05-22

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JP2015042968A Expired - Fee Related JP6516513B2 (ja) 2014-03-06 2015-03-04 ワイヤレス温度センサ及びその製造方法

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JP (1) JP6516513B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6852289B2 (ja) * 2016-06-20 2021-03-31 富士電機株式会社 ワイヤレスセンサシステム
KR20210005335A (ko) * 2019-07-03 2021-01-14 주식회사 에스아이피 무선 데이터 송신형 센서 시스템
CN114754892A (zh) * 2022-04-26 2022-07-15 苏州光声纳米科技有限公司 一种分体插装式声表面波温度传感器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1340050A2 (en) * 2000-12-08 2003-09-03 The Johns Hopkins University Wireless multi-functional sensor platform and method for its use
JP2006259156A (ja) * 2005-03-16 2006-09-28 Fuji Xerox Co Ltd 画像形成装置
US8730681B2 (en) * 2011-09-23 2014-05-20 Infineon Technologies Ag Power semiconductor module with wireless saw temperature sensor

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JP2015180871A (ja) 2015-10-15

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