JP2015180871A5 - - Google Patents
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- Publication number
- JP2015180871A5 JP2015180871A5 JP2015042968A JP2015042968A JP2015180871A5 JP 2015180871 A5 JP2015180871 A5 JP 2015180871A5 JP 2015042968 A JP2015042968 A JP 2015042968A JP 2015042968 A JP2015042968 A JP 2015042968A JP 2015180871 A5 JP2015180871 A5 JP 2015180871A5
- Authority
- JP
- Japan
- Prior art keywords
- green sheet
- ceramic green
- electrode
- lid
- container body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims description 14
- 238000010304 firing Methods 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015042968A JP6516513B2 (ja) | 2014-03-06 | 2015-03-04 | ワイヤレス温度センサ及びその製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014043932 | 2014-03-06 | ||
| JP2014043932 | 2014-03-06 | ||
| JP2015042968A JP6516513B2 (ja) | 2014-03-06 | 2015-03-04 | ワイヤレス温度センサ及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015180871A JP2015180871A (ja) | 2015-10-15 |
| JP2015180871A5 true JP2015180871A5 (enExample) | 2018-02-08 |
| JP6516513B2 JP6516513B2 (ja) | 2019-05-22 |
Family
ID=54329175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015042968A Expired - Fee Related JP6516513B2 (ja) | 2014-03-06 | 2015-03-04 | ワイヤレス温度センサ及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6516513B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6852289B2 (ja) * | 2016-06-20 | 2021-03-31 | 富士電機株式会社 | ワイヤレスセンサシステム |
| KR20210005335A (ko) * | 2019-07-03 | 2021-01-14 | 주식회사 에스아이피 | 무선 데이터 송신형 센서 시스템 |
| CN114754892A (zh) * | 2022-04-26 | 2022-07-15 | 苏州光声纳米科技有限公司 | 一种分体插装式声表面波温度传感器 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2002230637A1 (en) * | 2000-12-08 | 2002-06-18 | The Johns Hopkins University | Wireless multi-functional sensor platform and method for its use |
| JP2006259156A (ja) * | 2005-03-16 | 2006-09-28 | Fuji Xerox Co Ltd | 画像形成装置 |
| US8730681B2 (en) * | 2011-09-23 | 2014-05-20 | Infineon Technologies Ag | Power semiconductor module with wireless saw temperature sensor |
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2015
- 2015-03-04 JP JP2015042968A patent/JP6516513B2/ja not_active Expired - Fee Related