JP2015180871A5 - - Google Patents

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JP2015180871A5
JP2015180871A5 JP2015042968A JP2015042968A JP2015180871A5 JP 2015180871 A5 JP2015180871 A5 JP 2015180871A5 JP 2015042968 A JP2015042968 A JP 2015042968A JP 2015042968 A JP2015042968 A JP 2015042968A JP 2015180871 A5 JP2015180871 A5 JP 2015180871A5
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Japan
Prior art keywords
green sheet
ceramic green
electrode
lid
container body
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JP2015042968A
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Japanese (ja)
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JP6516513B2 (en
JP2015180871A (en
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本発明に係るワイヤレス温度センサの製造方法は、第一のセラミックグリーンシートと、第二のセラミックグリーンシートと、を用意する工程と、第二のセラミックグリーンシートよりも熱伝導率が高い第一のセラミックグリーンシートを焼成して容器本体を形成する工程と、第二のセラミックグリーンシートにアンテナ電極及びＧＮＤ電極を配置し、アンテナ電極及びＧＮＤ電極が配置された第二のセラミックグリーンシートを、第一のセラミックグリーンシートよりも低い焼成温度で焼成してアンテナを有する蓋を形成する工程と、温度検出素子を、アンテナ電極及びＧＮＤ電極に電気的に接続する工程と、温度検出素子が容器本体及び蓋の内部に固定されるように、容器本体と蓋とを貼り合わせる工程と、を有することを特徴とする。 A method for manufacturing a wireless temperature sensor according to the present invention includes a step of preparing a first ceramic green sheet and a second ceramic green sheet, and a first thermal conductivity higher than that of the second ceramic green sheet. A step of firing the ceramic green sheet to form a container body, an antenna electrode and a GND electrode are disposed on the second ceramic green sheet, and the second ceramic green sheet on which the antenna electrode and the GND electrode are disposed Forming a lid having an antenna by firing at a firing temperature lower than that of the ceramic green sheet, electrically connecting the temperature detection element to the antenna electrode and the GND electrode, and the temperature detection element including the container body and the lid And a step of bonding the container body and the lid together so as to be fixed inside.

Claims (1)

ワイヤレス温度センサの製造方法であって、
第一のセラミックグリーンシートと、第二のセラミックグリーンシートと、を用意する工程と、
前記第二のセラミックグリーンシートよりも熱伝導率が高い前記第一のセラミックグリーンシートを焼成して容器本体を形成する工程と、
前記第二のセラミックグリーンシートにアンテナ電極及びＧＮＤ電極を配置し、前記アンテナ電極及び前記ＧＮＤ電極が配置された前記第二のセラミックグリーンシートを、前記第一のセラミックグリーンシートよりも低い焼成温度で焼成してアンテナを有する蓋を形成する工程と、
温度検出素子を、前記アンテナ電極及び前記ＧＮＤ電極に電気的に接続する工程と、
前記温度検出素子が前記容器本体及び前記蓋の内部に固定されるように、前記容器本体と前記蓋とを貼り合わせる工程と、
を有することを特徴とするワイヤレス温度センサの製造方法。 A method for manufacturing a wireless temperature sensor, comprising:
Preparing a first ceramic green sheet and a second ceramic green sheet;
Firing the first ceramic green sheet having a higher thermal conductivity than the second ceramic green sheet to form a container body;
An antenna electrode and a GND electrode are disposed on the second ceramic green sheet, and the second ceramic green sheet on which the antenna electrode and the GND electrode are disposed is lower in firing temperature than the first ceramic green sheet. Baking to form a lid with an antenna;
Electrically connecting a temperature detection element to the antenna electrode and the GND electrode;
Bonding the container body and the lid so that the temperature detection element is fixed inside the container body and the lid;
A method for manufacturing a wireless temperature sensor.
JP2015042968A 2014-03-06 2015-03-04 Wireless temperature sensor and method of manufacturing the same Active JP6516513B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015042968A JP6516513B2 (en) 2014-03-06 2015-03-04 Wireless temperature sensor and method of manufacturing the same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014043932 2014-03-06
JP2014043932 2014-03-06
JP2015042968A JP6516513B2 (en) 2014-03-06 2015-03-04 Wireless temperature sensor and method of manufacturing the same

Publications (3)

Publication Number Publication Date
JP2015180871A JP2015180871A (en) 2015-10-15
JP2015180871A5 true JP2015180871A5 (en) 2018-02-08
JP6516513B2 JP6516513B2 (en) 2019-05-22

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Family Applications (1)

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JP2015042968A Active JP6516513B2 (en) 2014-03-06 2015-03-04 Wireless temperature sensor and method of manufacturing the same

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JP (1) JP6516513B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6852289B2 (en) * 2016-06-20 2021-03-31 富士電機株式会社 Wireless sensor system
KR20210005335A (en) * 2019-07-03 2021-01-14 주식회사 에스아이피 Wireless date transmitting typed sensor system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2002230637A1 (en) * 2000-12-08 2002-06-18 The Johns Hopkins University Wireless multi-functional sensor platform and method for its use
JP2006259156A (en) * 2005-03-16 2006-09-28 Fuji Xerox Co Ltd Image forming apparatus
US8730681B2 (en) * 2011-09-23 2014-05-20 Infineon Technologies Ag Power semiconductor module with wireless saw temperature sensor

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