JP6495791B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6495791B2
JP6495791B2 JP2015180896A JP2015180896A JP6495791B2 JP 6495791 B2 JP6495791 B2 JP 6495791B2 JP 2015180896 A JP2015180896 A JP 2015180896A JP 2015180896 A JP2015180896 A JP 2015180896A JP 6495791 B2 JP6495791 B2 JP 6495791B2
Authority
JP
Japan
Prior art keywords
housing
semiconductor device
plug
circuit board
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015180896A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017058755A (ja
Inventor
宏貴 佐藤
宏貴 佐藤
向田　秀子
秀子 向田
慧至 築山
慧至 築山
尾山　勝彦
勝彦 尾山
明子 藤巻
明子 藤巻
善幸 小坂
善幸 小坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kioxia Corp
Original Assignee
Toshiba Memory Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Memory Corp filed Critical Toshiba Memory Corp
Priority to JP2015180896A priority Critical patent/JP6495791B2/ja
Priority to TW105106187A priority patent/TWI591902B/zh
Priority to CN201610239678.4A priority patent/CN106532298B/zh
Publication of JP2017058755A publication Critical patent/JP2017058755A/ja
Application granted granted Critical
Publication of JP6495791B2 publication Critical patent/JP6495791B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP2015180896A 2015-09-14 2015-09-14 半導体装置 Active JP6495791B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2015180896A JP6495791B2 (ja) 2015-09-14 2015-09-14 半導体装置
TW105106187A TWI591902B (zh) 2015-09-14 2016-03-01 Semiconductor device
CN201610239678.4A CN106532298B (zh) 2015-09-14 2016-04-18 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015180896A JP6495791B2 (ja) 2015-09-14 2015-09-14 半導体装置

Publications (2)

Publication Number Publication Date
JP2017058755A JP2017058755A (ja) 2017-03-23
JP6495791B2 true JP6495791B2 (ja) 2019-04-03

Family

ID=58358062

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015180896A Active JP6495791B2 (ja) 2015-09-14 2015-09-14 半導体装置

Country Status (3)

Country Link
JP (1) JP6495791B2 (zh)
CN (1) CN106532298B (zh)
TW (1) TWI591902B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109509736A (zh) * 2017-09-14 2019-03-22 晨星半导体股份有限公司 电路板及芯片封装体

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100550180C (zh) * 2005-09-16 2009-10-14 株式会社东芝 半导体存储装置及使用它的usb存储器装置
US7581967B2 (en) * 2006-08-16 2009-09-01 Sandisk Corporation Connector with ESD protection
US7540786B1 (en) * 2008-04-17 2009-06-02 Hon Hai Precision Ind. Co., Ltd. Flash memory device with improved contact arrangement
US7862377B2 (en) * 2008-11-18 2011-01-04 Kingston Technology Corporation USB connector and method of manufacture
CN201608336U (zh) * 2010-01-29 2010-10-13 蔡添庆 一种u盘使用的usb连接器
CN201708305U (zh) * 2010-04-30 2011-01-12 富士康(昆山)电脑接插件有限公司 移动存储装置及其电连接器
CN202206683U (zh) * 2011-09-22 2012-04-25 深圳市正耀科技有限公司 改进的u盘组装结构
CN202797347U (zh) * 2011-11-29 2013-03-13 蔡周贤 具有套接壳的电连接公头
TWM459553U (zh) * 2013-03-20 2013-08-11 Zk Tek Technologies Co Ltd Ｕｓｂ連接器改良結構
CN203193014U (zh) * 2013-04-25 2013-09-11 常熟精微康电子元件有限公司 移动存储装置及其连接器
CN203950966U (zh) * 2014-05-04 2014-11-19 东莞市卡盟连接器有限公司 一种连接器端口

Also Published As

Publication number Publication date
TW201711292A (zh) 2017-03-16
CN106532298B (zh) 2019-06-07
CN106532298A (zh) 2017-03-22
TWI591902B (zh) 2017-07-11
JP2017058755A (ja) 2017-03-23

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