JP6461870B2 - Molding die for resin molding - Google Patents

Description

  The present invention relates to a molding die for a resin molded body that is thin and has a small heat capacity and can uniformly and quickly heat and cool a resin for molding.

  There is a method for molding a resin molded body in which a molten resin is pressed and cooled by a molding die to be molded into a predetermined shape. A molding die used in such a molding method has a heating / cooling means, and can cool the molten resin by pressing it at a predetermined temperature. In this molding method, uniformity of heating / cooling of the molding die is required to mold a resin molded body free from internal distortion and deformation, and rapidity is required to increase productivity.

  Patent Document 1 proposes a mold apparatus including a mold that can perform uniform heating / cooling and has little thermal distortion and no internal distortion or deformation. That is, in a pair of opposing molds, at least one mold is heated from the target surface side for obtaining a molded body, the target surface constituent member that forms the target surface, and the target surface constituent member. A mold apparatus comprising a cavity mold having both means and cooling means, and a main mold for holding the cavity mold, wherein the heating means and the cooling means are each the object surface with respect to the cavity mold A mold apparatus has been proposed which is arranged symmetrically in an in-plane direction parallel to the target surface and in a direction perpendicular to the target surface.

  Patent Document 2 proposes a method for manufacturing a fine shape transfer sheet that can heat and cool a mold in a short time and can make the temperature of the mold surface uniform. That is, the temperature of the mold is adjusted by supplying the heating medium and the cooling refrigerant made of the same medium to the mold by switching to the heat refrigerant flow path in the mold, and the mold is heated. Before heating, the heating medium circulating step for circulating the heating medium outside the mold, and the heating medium is simultaneously supplied to a plurality of heat refrigerant supply ports provided in the mold to A heating medium supply step for heating, a refrigerant circulation step for circulating the cooling refrigerant outside the mold before cooling the mold, and a plurality of the thermal refrigerants provided with the cooling refrigerant in the mold There has been proposed a method for manufacturing a fine shape transfer sheet, which includes a refrigerant supply step of simultaneously supplying the supply port to cool the mold.

JP 2010-89327 A JP 2011-201188

  The molding die for the resin molding is preferably one that can heat and cool the resin uniformly and rapidly. The mold of the mold apparatus described in Patent Document 1 and the fine shape transfer mold used in the manufacturing method described in Patent Document 2 both have a structure in which the molding surface of the mold can be heated uniformly. . However, the mold described in Patent Document 1 is configured so that the heating means and the cooling means are arranged symmetrically in both the in-plane direction parallel to the target surface and the direction perpendicular thereto, so that rapid heating and cooling are performed. Has a problem that the mold is thick and the heat capacity is large. The fine shape transfer mold described in Patent Document 2 has a problem that the responsiveness of the temperature control is not necessarily good because the heating medium and the cooling refrigerant must be switched in the in-mold thermal refrigerant flow path.

  In view of such a conventional problem, the present invention provides a molding die for a resin molding, in which the die is thin and the heat capacity is small, and the resin or the resin molding can be uniformly and rapidly heated and cooled. It is an object of the present invention to provide a mold and a mold apparatus that can mold a highly accurate resin molded body without internal distortion using such a mold.

  A molding die according to the present invention is a molding die for molding a resin molded body by pressing a resin film with a lower molding die and an upper molding die, and the lower molding die is placed on a contact surface of the resin film. The linear forward path and the return path in which the medium flows in parallel planes are alternately arranged at equal intervals, and the linearly heated body that is electromagnetically heated is in the middle of the forward path and the return path. The upper mold is inserted into through holes provided in parallel with each other at intervals, and the linear forward path and the return path in which the medium flows in a plane parallel to the contact surface of the resin film are alternately spaced at equal intervals. And a linear heating element that is electromagnetically heated is inserted in a through hole provided in an intermediate portion of the forward path and the return path at an equal interval and in parallel with the linear heating element. Provided on the outside of the side surface of the lower mold or upper mold through the outward path of the lower mold or upper mold from the pipe The through a folded path through return of the lower mold or upper mold, so as to circulate the lower mold within Mataue the mold back to the medium discharge pipe.

  The molding die is generally used by being mounted on a base mold incorporating various control devices. That is, a mold apparatus having the molding die and the base die can be configured, and in the molding die, the lower molding die is adsorbed and held by the lower base die via the heat insulating material. The upper mold is preferably adsorbed and held by the upper base mold via a heat insulating material.

  In the above mold apparatus, the lower or upper mold may be supported by the lower or upper base mold by a positioning pin protruding at the center thereof. The lower or upper mold may be provided with a detachment preventing means for preventing detachment from the lower or upper base mold.

  In the above mold apparatus, the lower or upper mold can be further provided with a lower or upper stamper. The lower or upper stamper is preferably held by the lower or upper molding die by positioning pins provided on the peripheral edge thereof. The positioning pin can be engaged with a U-shaped groove or slot provided in the lower or upper stamper, and the U-shaped groove or slot extends from the center of the molding die toward the positioning pin. A long U-shaped groove or slot is recommended.

  According to the present invention, it is possible to configure a molding die that is thin, has a small heat capacity, and can be heated and cooled uniformly and rapidly. And the mold apparatus which mounted | wore with this shaping die can be made into the structure which is hard to produce a thermal distortion to a shaping die. Thereby, it is possible to mold a resin molded body having no internal distortion and high molding accuracy.

It is a schematic diagram of the molding die of the resin molding which concerns on this invention, Fig.1 (a) is an external view, FIG.1 (b) is AA sectional drawing. It is a mimetic diagram of a metallic mold device concerning the present invention. 2A is a front view and FIG. 2B is a plan view.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. FIG. 1 shows a molding die of a resin molded body according to the present invention. The main mold 10 includes a lower mold 11 and an upper mold 16, and the planes P1 and P2 are the contact surfaces of the resin film, respectively. The lower mold 11 includes a lower mold body 12 and a connecting block 18 joined to the outside of the side surface. The upper mold 16 has an upper mold body 17 and a connecting block 18 joined to the outside of the side surface. The connection between the connection block 18 and the lower mold 11 or the upper mold 16 may be an integral connection such as a connection by welding, but a detachable screw connection is preferable from the viewpoint of maintenance and the like. In that case, the connecting block 18 and the lower mold 11 or the upper mold 16 can be sealed with an O-ring or a gasket. The lower mold 11 and the upper mold 16 have the same configuration as shown in FIG.

  Since the lower mold 11 and the upper mold 16 have the same configuration as described above, the details thereof will be described focusing on the lower mold 11. 1B shows an AA cross section (plane P3) of FIG. 1A parallel to the plane P1 of the lower mold 11. As shown in FIG. 1B, the lower mold 11 has a cooling means 14 and a heating means 15 so that temperature control of the lower mold 11 is performed.

  The cooling means 14 can circulate a cooling medium inside the lower mold 11. The medium is supplied from the medium supply pipe 140 and provided in the forward path 142 provided in the lower mold body 12 of the lower mold 11, the return path 143 provided in the block body 180 of the connecting block 18, and the lower mold body 12. The lower mold 11 is cooled through the returned path 144 and returned to the medium drain pipe 145 to circulate the lower mold 11. The forward path 142 and the backward path 144 pass through the lower mold 11 in a straight line and are arranged at equal intervals. That is, the cross section (plane P3) of the lower mold 11 includes the forward path 142, the return path 143 and the return path 144 (A block), the forward path 142, the return path 143 and the return path 144 (B block), the forward path 142, and the return path 143. And the return path 144 (C block) are arranged in an orderly manner on the plane P3. The forward path 142 and the return path 144 can be formed by a hole penetrating the lower mold 11 linearly, and can be formed by embedding a pipe. The medium can use water.

  The heating means 15 can be composed of a heating body 152 capable of electromagnetically heating a linear through hole 115 provided in the lower mold 11. For example, the heater 152 can be formed by inserting a sheathed heater through the through-hole 115 and filling the sheathed heater around the sheathed heater with an electrothermal accelerator. The heating elements 152 are provided at equal intervals in parallel with an intermediate portion between the forward path 142 and the backward path 144 through which the medium flows. Since the heating elements 152 are arranged in parallel at equal intervals over almost the entire width of the lower mold 11, the lower mold 11 can be efficiently heated uniformly. In consideration of the thermal expansion of the heating body 152, it is preferable to provide a space portion 182 in the portion that abuts against the connecting block 18 as shown in FIG. The heating elements 152 that are evenly arranged in the lower mold 11 can be connected in parallel, and the heating elements 152 can be independently controlled so that the heating rate of the portion of the lower mold 11 that is difficult to heat can be increased. Wiring can be done. Moreover, the heating body 152 can use what can provide a temperature gradient in itself.

  In the main mold 10, the thickness of the lower mold 11 and the upper mold 16 can be set to 20 to 30 mm. For this reason, it is possible to form a molding die that is thin and has a small heat capacity and can be heated and cooled uniformly and rapidly. However, such a thin mold having a small heat capacity is likely to cause thermal distortion. Therefore, when configuring a mold apparatus in which a molding mold is held and fixed to a base mold, it is preferable to have a structure that hardly causes thermal distortion. For example, the mold apparatus of FIG. 2 can be shown as a mold apparatus in which a molding mold is held and fixed to a base mold.

  In the mold apparatus 50 shown in FIG. 2, the lower mold 11 is held by suction on the lower base mold 51 via a heat insulating material 52. In this case, the lower mold 11 is preferably supported by the lower base mold 51 by positioning pins 53 protruding from the center thereof. For example, as shown in FIG. 2A, the lower mold 11 is attracted to the lower base mold 51 by vacuum suction while the center portion of the lower mold 11 is supported by the lower base mold 51 by the positioning pins 53. You can make it. With such a configuration, problems due to the occurrence of thermal distortion of the lower mold 11 can be prevented. That is, when the lower base mold 51 and the lower molding die 11 are rigidly connected with bolts or the like, a difference in thermal expansion occurs in the bolts or the like based on the temperature difference between the lower base mold 51 and the lower molding die 11. As a result, thermal distortion occurs in the lower mold 11. Similarly, for the upper mold 16 and the upper base mold 56, thermal distortion occurs in the upper mold 16, and the lower mold 11 and the upper mold 16 do not contact evenly, causing uneven transfer and defective mold release. It becomes. It is preferable to provide a drop prevention means 54 so that the lower mold 11 is securely held by the lower base mold 51 and is not detached from the lower base mold 51.

  The upper mold 16 is the same as the lower mold 11. That is, the central portion of the upper mold 16 is supported by the upper base mold 56 via the heat insulating material 57 by the positioning pins 58, and the upper mold 16 is held by the upper base mold 51 by suction. Further, it is preferable to provide a drop prevention means 59 so that the upper mold 16 does not separate from the upper base mold 56.

  With the molding die 10 composed of the lower molding die 11 and the upper molding die 16, the resin film can be pressed to mold a resin molding with high molding accuracy without internal distortion. However, when the resin film is pressed to mold a resin molded body having a fine structure transferred, a stamper having a fine structure in the lower mold 11 and / or the upper mold 16 may be used. . Such a stamper should have a structure that does not cause thermal distortion as in the above-described molding die. For example, as shown in FIG. 2B, the lower stamper 61 is preferably held and fixed to the lower mold 11 by the positioning pins 63. The positioning pin 63 is preferably provided on the outer edge portion of the lower stamper 61, and is preferably engaged with a U-shaped groove or a long hole provided in the lower stamper 61. At this time, it is preferable that the U-shaped groove or the elongated hole is elongated from the center of the lower molding 11 in the direction of the positioning pin 63. Thereby, it is possible to prevent the occurrence of thermal distortion during the thermal expansion of the lower stamper 61. As shown in FIG. 2A, the upper stamper 66 can be held and fixed to the upper mold 16 by the positioning pins 68 in the upper mold 16 as well. In addition, alignment pins 71 and 72 that are fitted to each other can be provided so as to reliably align the lower mold 11 and the upper mold 16.

  The resin film used in the present mold may be a resin film formed by applying a molten resin to the lower mold, or may be a resin film (film resin). That is, the molding die according to the present invention is suitable for a melt fine transfer process in which a molten resin is applied to a lower mold having a fine structure and pressed, and a fine structure in which the fine structure is transferred is formed. Can be used for The molding die according to the present invention is suitable for a thermal imprint (hot embossing) process in which a film resin is heated and softened and then pressed to mold a microstructure having a microstructure transferred and molded. Can be used for

  The present molding die and the die apparatus have been described above. The present molding die can be reduced in thickness, and uniform heating and cooling can be performed. The mold apparatus can hold and fix the mold apparatus so as not to cause thermal distortion in the mold. As a result, a resin molded body having no internal distortion and high molding accuracy can be molded. In addition, since this mold apparatus uses a heating body that electromagnetically heats as a heating means, it is easy to perform rapid heating of the molding mold and perform relatively complicated temperature control. Can do. Also, since electromagnetic heating has no upper temperature limit unlike medium heating, the mold apparatus can be suitably used for super engineering plastic molding and glass imprinting that require a mold temperature of 200 ° C. or higher. it can.

  Further, in the molding die and the mold apparatus according to the present invention, since the heating or cooling of the molding die uses dedicated means, respectively, heating or cooling can be started or stopped immediately. The structure of the mold and the mold apparatus can be simplified. The cooling of the molding die is sufficient if it has a function of distributing or stopping water to the medium supply pipe, so that the structure of the mold apparatus according to the present invention can be made simple and inexpensive. However, depending on the environment in which the mold apparatus according to the present invention is installed, it is possible to distribute or stop water in the medium supply pipe and to distribute or stop water vapor so that the medium of the mold can be heated. Can be done.

10 Mold
11 Upper mold
115 Through hole
12 Upper mold body
14 Cooling means
140 Medium supply pipe
142 Outbound
143 Return road
144 Return
145 Media discharge pipe
15 Heating means
152 Heating body
16 Upper mold
17 Upper mold body
18 Connecting block
180 block body
182 Space
50 mold equipment
51 Lower base type
52 Insulation
53 Locating pin
54 Preventive measures
56 Upper base type
57 Insulation
58 Locating pin
59 Drop-off prevention measures
61 Lower stamper
63 Positioning pin
66 Upper Stamper
68 Positioning pin
71, 72 Alignment pin

Claims (6)

A molding die for molding a resin molding by pressing a resin film with a lower molding die and an upper molding die,
In the lower mold, a linear forward path and a return path in which the medium flows are alternately arranged at equal intervals in a plane parallel to the contact surface of the resin film, and the linear mold is electromagnetically heated. The heating body is inserted in a through hole provided in the middle part of the forward path and the return path at an equal interval and parallel to them,
In the upper mold, a linear forward path and a return path in which the medium flows are alternately arranged at equal intervals in a plane parallel to the contact surface of the resin film, and the linear mold is electromagnetically heated. The heating body is inserted in a through hole provided in the middle part of the forward path and the return path at an equal interval and parallel to them,
The medium passes through a forward path of the lower mold or upper mold from a medium supply pipe, and passes through a return path provided outside the side surface of the lower mold or upper mold. It goes through the return path, returns to the medium drain pipe, and circulates in the lower mold or the upper mold ,
The return path is detachably tightly coupled to the outside of the side surface of the lower mold or the upper mold, is provided with a pipe line that communicates with the forward path and the return path, and is provided with a space that faces the opening of the through hole. A mold having a connected block .   The lower mold according to claim 1 is adsorbed and held by the lower base mold via a heat insulating material, and the upper mold according to claim 1 is formed from an upper base via a heat insulating material. A mold apparatus having an upper mold adapted to be held by suction on the mold.   The mold apparatus according to claim 2, wherein the lower or upper mold is supported by the lower or upper base mold by a positioning pin protruding at a center portion thereof.   4. The mold apparatus according to claim 2, wherein the lower or upper mold is provided with a detachment preventing means for preventing detachment from the lower or upper base mold.   The lower or upper molding die further has a lower or upper stamper, and the lower or upper stamper is held by the lower or upper molding die by a positioning pin provided on a peripheral edge thereof. 5. The mold apparatus according to any one of 4.   The positioning pin is adapted to engage with a U-shaped groove or slot provided in the lower or upper stamper, and the U-shaped groove or slot is long from the center of the molding die toward the positioning pin. The mold apparatus according to claim 5, wherein the mold apparatus is a mold groove or a long hole.

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