JPH0737847Y2 - Mold structure - Google Patents
Mold structureInfo
- Publication number
- JPH0737847Y2 JPH0737847Y2 JP1990086929U JP8692990U JPH0737847Y2 JP H0737847 Y2 JPH0737847 Y2 JP H0737847Y2 JP 1990086929 U JP1990086929 U JP 1990086929U JP 8692990 U JP8692990 U JP 8692990U JP H0737847 Y2 JPH0737847 Y2 JP H0737847Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- mold body
- mold
- radial direction
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Description
【考案の詳細な説明】 産業上の利用分野 本考案は、成形品の外形形状を決定するキャビティ型面
を有する成形型の型本体と、成形機の可動盤や固定盤な
どの取付盤（以下、単に「盤」）という）に型本体を取
り付ける背板を含む基板とを有する成形型構造の改良に
関するものである。[Detailed Description of the Invention] Industrial field of application The present invention relates to a mold main body of a mold having a cavity mold surface that determines the outer shape of a molded product, and a mounting plate such as a movable platen or a fixed platen of a molding machine (hereinafter , And simply referred to as a "board") and a substrate including a back plate for mounting a mold body.
従来の技術 一般に、樹脂材料を成形する実質的に閉されたキャビテ
ィ空間を有する成形型にはインジェクション成形型，ブ
ロー成形型，コンプレッション成形型等が代表的なもの
として挙げることができる。2. Description of the Related Art In general, as a molding die having a substantially closed cavity space for molding a resin material, an injection molding die, a blow molding die, a compression molding die and the like can be mentioned as typical ones.
従来、この種の成形型はキャビティ空間を有する型本体
をボルト等で基板に締付け固定すると共に、その型本体
の背板を含む基板を成形機の盤に取り付けることにより
用いられている。2. Description of the Related Art Conventionally, this type of mold has been used by fastening a mold body having a cavity space to a substrate with bolts or the like and mounting a substrate including a back plate of the mold body on a board of a molding machine.
ところで、上述した成形型においては成形品の外表面粗
さ，形状をコントロールするべく、樹脂成形品を成形す
る過程で型本体のキャビティ型面を常に冷却するのみで
なく、例えば成形される樹脂材料の軟化点以上のある一
定温度に型本体のキャビティ型面を一定時間保つことに
より、成形型のキャビティ型面の型面粗さや平滑表面形
状を成形品の外表面に正確に転写することが提案されて
いる。By the way, in the above-mentioned molding die, in order to control the outer surface roughness and shape of the molded product, not only the cavity mold surface of the mold body is always cooled in the process of molding the resin molded product, but also the resin material to be molded, for example. It is proposed that the cavity surface of the die body be kept for a certain time at a certain temperature above the softening point of the mold to accurately transfer the surface roughness and smooth surface shape of the cavity surface of the molding die to the outer surface of the molded product. Has been done.
この成型工程では常温乃至は低温と高温とを繰返すのに
伴って型本体がサーマルサイクルを受けることになる
が、その型本体がどのような材料から形成されていて
も、高温に加熱されたときには常温乃至は低温のときに
比べて体積が膨張する。これに対し、型本体を成形機の
盤に取付ける基板にあっては型本体の熱を成形機の盤に
伝えないよう型本体の背板を含めて一定の常温に保たれ
ているのが好ましい。In this molding process, the mold body is subjected to a thermal cycle as it repeats normal temperature to low temperature and high temperature, but no matter what material the mold body is made of, when it is heated to high temperature The volume expands as compared with normal temperature or low temperature. On the other hand, it is preferable that the substrate on which the mold body is attached to the molding machine board is kept at a constant room temperature including the back plate of the mold body so as not to transfer the heat of the mold body to the molding machine board. .
その背景の下では加熱，冷却を受けて熱収縮を繰り返す
型本体と、ある一定の温度を保って熱収縮を繰り返さな
い基板側との膨張，収縮量の差を如何に吸収するかが大
きな課題となる。因みに、この伸縮差は型本体を例えば
アルミニウム合金と、S55C（JIS規格）の鉄でそれぞれ
長さ1mに製作し、低温時温度20℃，高温時温度220℃で
温度差200℃がある場合で鑑みると、アルミニウム合金
で約4.6mm,S55Cの鉄で約2.3mmにも達するものと計算上
考えられる。その伸縮差がある型本体を基板側にボルト
等で固定的に結合してしまうと、ボルトの剪断欠損や型
本体の熱変形等を来たす恐れがあるところから好ましく
ない。Under such a background, a major issue is how to absorb the difference in the amount of expansion and contraction between the mold body that repeats heat contraction by being heated and cooled and the substrate side that maintains a certain temperature and does not repeat heat contraction. Becomes By the way, this expansion and contraction difference is caused when the mold body is made of aluminum alloy and S55C (JIS standard) iron to a length of 1 m, and there is a temperature difference of 200 ° C at a low temperature of 20 ° C and a high temperature of 220 ° C. Considering this, it is calculated that the aluminum alloy reaches about 4.6 mm and the S55C iron reaches about 2.3 mm. If the mold body having the difference in expansion and contraction is fixedly coupled to the substrate side with a bolt or the like, it is not preferable because there is a risk of shear failure of the bolt or thermal deformation of the mold body.
考案が解決しようとする課題 本考案は、極めて簡単な構造で型本体の熱伸縮を基板側
に作用させないよう吸収可能な成形型構造を提供するこ
とを目的とする。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention An object of the present invention is to provide a mold structure that can absorb heat expansion and contraction of the mold body so as not to act on the substrate side with an extremely simple structure.
課題を解決するための手段 本考案の請求項１に係る成形型構造においては、成形機
に取り付けられる基板と、 断熱材層を介して該基板の裏面側に実質的に接して取り
付けられ、且つ、成形品の外形形状を決定するキャビテ
ィ型面を備えた型本体と、 前記キャビティ型面の温度を調節する温度調節手段とを
有し、 型本体と基板との間には型本体の裏面における任意の基
準点を中心として放射方向に延びる直線上で、基板に対
して型本体が基準点を中心に放射方向へ相対的に摺動し
て移動するのを許容するガイド手段と、 型本体が上記放射方向へ相対的に摺動して移動するのを
許容するが、型本体の裏面と直交する方向に基板と離脱
するのを阻止する型本体の保持手段とを夫々別ものとし
て別部分に備えることにより構成されている。Means for Solving the Problems In the molding die structure according to claim 1 of the present invention, a substrate mounted on a molding machine and a substrate mounted substantially in contact with a back surface side of the substrate via a heat insulating material layer, and A mold main body having a cavity mold surface for determining the outer shape of the molded product, and a temperature adjusting means for adjusting the temperature of the cavity mold surface, and between the mold main body and the substrate on the back surface of the mold main body. On a straight line that extends in the radial direction around an arbitrary reference point, the guide body that allows the die body to slide relative to the substrate in the radial direction around the reference point, and the die body The holding means of the mold body which allows sliding relative movement in the radial direction but prevents separation from the substrate in the direction orthogonal to the back surface of the mold body is provided as a separate part. It is configured by including.
その成形型構造においては、ガイド手段と保持手段とを
基板と型本体との間で互いに分離させて設けることがで
きる。この具体例としてはガイド手段がキー溝結合で、
保持手段が型本体の側面において型本体と基板とを橋渡
し固定具を挙げることができる。In the mold structure, the guide means and the holding means can be provided separately from each other between the substrate and the mold body. As a specific example of this, the guide means is a keyway connection,
The holding means may be a bridging fixture that bridges the mold body and the substrate on the side surface of the mold body.
本考案の請求項４に係る成形型構造においては、成形機
に取り付けられる基板と、 断熱材層を介して該基板の裏面側に実質的に接して取り
付けられ、且つ、成形品の外形形状を決定するキャビテ
ィ型面を備えた型本体と、 前記キャビティ型面の温度を調節する温度調節手段とを
有し、 型本体と基板との間には型本体の裏面における任意の基
準点を中心として放射方向に延びる直線上で、基板に対
して型本体が基準点を中心に放射方向へ相対的に摺動し
て移動するのを許容するガイド手段と、 型本体が上記放射方向へ相対的に摺動して移動するのを
許容するが、型本体の裏面と直交する方向に基板と離脱
するのを阻止する型本体の保持手段とを兼用するものと
して同一部分に備えることにより構成されている。In the molding die structure according to claim 4 of the present invention, a substrate to be mounted on a molding machine and a back surface side of the substrate are substantially in contact with each other via a heat insulating material layer, and the outer shape of the molded product is A mold body having a cavity mold surface for determining, and a temperature adjusting means for adjusting the temperature of the cavity mold surface are provided, and an arbitrary reference point on the back surface of the mold body is centered between the mold body and the substrate. Guide means for allowing the die body to slide relative to the substrate in a radial direction on a straight line extending in the radial direction, and the die body relatively in the radial direction. It is configured to be provided in the same part as a holding means of the die body that allows sliding but movement but prevents the substrate from being separated from the substrate in a direction orthogonal to the back surface of the die body. .
この成形型構造においては、ガイド手段と保持手段とを
基板と型本体との間で同一部分に設けられるガイド兼保
持手段で構成することができる。そのガイド兼保持手段
は、放射方向に沿って基板に設ける長孔を貫通させて型
本体に取り付けられるボルトで構成することができる。In this molding die structure, the guide means and the holding means can be constituted by the guide / holding means provided in the same portion between the substrate and the die body. The guide / holding means can be constituted by a bolt that is attached to the mold body by penetrating an elongated hole provided in the substrate along the radial direction.
作用 この成形型構造では、型本体が熱伸縮するのに伴って型
本体が基板に対して基準点を中心に放射方向へ相対的に
摺動して移動できるよう構成されているから、型本体と
基板側とを互いに係止する部材の欠損や型本体に熱変形
等が生ずるのを防ぐことができる。その型本体は裏面全
体が基板で支持されているので、樹脂の成形加工中にキ
ャビティにかかる圧力を均一に分散して受けることがで
きる。また、この成形型は型本体の裏面と直交する方向
に離脱するのを阻止する保持手段で基板に取り付けら
れ、成形型を取り付ける取扱い過程においても基板に対
して移動乃至は位置ずれすることがない。更に、型本体
は基板の裏面側に断熱材層を介して支持されているの
で、型本体の加熱に伴う熱が基板に伝わるのを抑えるこ
とができる。Action In this molding die structure, as the die body expands and contracts due to heat, the die body is configured to be able to slide relative to the substrate in the radial direction around the reference point, It is possible to prevent a member that locks the substrate and the substrate side from being damaged or the mold body from being thermally deformed. Since the entire back surface of the mold body is supported by the substrate, the pressure applied to the cavity during resin molding can be uniformly distributed and received. In addition, this mold is attached to the substrate by a holding means that prevents the mold from being separated in a direction orthogonal to the back surface of the mold body, and does not move or move relative to the substrate even in the handling process of attaching the mold. . Furthermore, since the mold body is supported on the back surface side of the substrate via the heat insulating material layer, it is possible to suppress the heat transmitted to the substrate due to the heating of the mold body.
実施例 以下、添付図面を参照して説明すれば、次の通りであ
る。Embodiments The following will be described with reference to the accompanying drawings.
図示の成形型は第１図で示すように紙面上で上型部１と
下型部２とを備えたブロー成形型でなり、その各部1,2
は成形機の機体側（図示せず）に取り付けられる基板3
0,40と基板30,40の裏面側に実質的に接して取り付けら
れる型本体10,20を備えて構成されている。型本体10,20
は、第２図で示す如くピンチオフ部11aを持って成形品
の外形形状を規定するキャビティ型面11,21を相対側に
有し、この型本体10,20の肉厚内にはキャビティ型面11,
21のＹ方向と平行させて水，蒸気，オイル等の如き熱媒
体を流動する挿通路12…,22…が温度調節手段として設
けられている。その型本体10,20は、左右の側板部13,2
3、14,24と、第３図で示す如く上下の側板部15,25、16,
26とを備え、その上下の側板部15,25、16,26を介しては
後述するように基板30,40に取り付けられる保持手段で
ある掛止め片で型本体10,20を係止するよう組立てられ
ている。基板30,40は背板31,41を含めて取付基板部32,4
2を備え、第１図で示すように片側の背板31から突設す
るガイドポスト33を型本体10,20の左右側板部13,23に設
けたガイドブッシュ43a,43bに挿通させることにより型
開きから型締め時に両者を案内できるよう組立てられて
いる。The molding die shown is a blow molding die having an upper mold part 1 and a lower mold part 2 on the paper surface as shown in FIG.
Is a substrate 3 attached to the machine side (not shown) of the molding machine
The mold bodies 10 and 20 are attached to the back surfaces of the substrates 0 and 40 and the substrates 30 and 40 in substantially contact with each other. Mold body 10,20
2 has cavity mold faces 11 and 21 on the opposite sides that have pinch-off portions 11a and define the outer shape of the molded product as shown in FIG. 2, and the cavity mold faces are within the thickness of the mold bodies 10 and 20. 11,
Insertion passages 12 ..., 22 ... through which a heat medium such as water, steam, oil or the like flows in parallel to the Y direction of 21 are provided as temperature adjusting means. The mold body 10, 20 has left and right side plate portions 13, 2
3, 14, 24 and the upper and lower side plate portions 15, 25, 16, as shown in FIG.
26, and via the upper and lower side plate portions 15, 25, 16 and 26, the die bodies 10 and 20 are locked by latching pieces which are holding means attached to the substrates 30 and 40 as described later. It is assembled. Boards 30 and 40 are mounting board parts 32 and 4 including back plates 31 and 41
2, the guide posts 33 protruding from the back plate 31 on one side are inserted into the guide bushes 43a, 43b provided on the left and right side plate portions 13, 23 of the mold bodies 10, 20, as shown in FIG. It is assembled so that both can be guided from the opening when the mold is clamped.
この成形型の基本構造に加えて、第１図で示すようにガ
イド手段であるキー50とキー溝51とを型本体10,20並び
に基板30,40の相対部に分け、キー50をボルト24a,24bで
固定することにより型本体10,20が摺動して移動するス
ライド移動手段として基板30,40に取り付けられてい
る。そのキー50,キー溝51は第２図で示す如く型本体10
の裏面の任意の位置，好ましくはその中心を基準点Ｏと
し、この基準点Ｏから放射方向X,Yの直線に沿って型本
体10,20をスライド移動する突片状のキー50とキー溝51
とを互いに嵌め合せるよう取り付けられている。そのキ
ー50とキー溝51とを基準点Ｏから放射方向に設けるが、
例えば第２図では基準点Ｏから長手方向の直線の左右端
側50a,51a、50b,51b並びにこれと直交する方向の直線方
向の上下端側50c,51c、50d,51dで型本体10,20と基板30,
40の相対部に設けている。このキー50とキー溝51とで
は、型本体10,20が基板30,40に対して基準点Ｏを中心に
して放射方向へ相対的に摺動して移動するのを許容する
ことになる。また、基準点Ｏの位置では型本体10,20と
基板30,40とが図示しない位置決めピンなどの位置決め
手段により固定されている。In addition to the basic structure of this molding die, as shown in FIG. 1, the key 50 as a guide means and the key groove 51 are divided into the relative parts of the die bodies 10 and 20 and the substrates 30 and 40, and the key 50 is bolt 24a. The mold bodies 10 and 20 are attached to the substrates 30 and 40 as slide moving means for slidingly moving by fixing with the molds 24 and 24b. The key 50 and the key groove 51 are as shown in FIG.
A reference point O is set to an arbitrary position on the back surface of the mold, preferably the center thereof, and a key 50 and a key groove in the form of a protrusion for slidingly moving the mold bodies 10 and 20 from the reference point O along a straight line in the radial directions X and Y. 51
Are mounted so that they fit together. The key 50 and the key groove 51 are provided in the radial direction from the reference point O,
For example, in FIG. 2, the left and right end sides 50a, 51a, 50b, 51b of the straight line in the longitudinal direction from the reference point O and the upper and lower end sides 50c, 51c, 50d, 51d of the straight line in the direction orthogonal thereto are formed on the mold main body 10, 20. And substrate 30,
It is provided at 40 relative parts. The key 50 and the key groove 51 allow the die bodies 10 and 20 to relatively slide in the radial direction with respect to the substrates 30 and 40 about the reference point O. Further, at the position of the reference point O, the die bodies 10 and 20 and the substrates 30 and 40 are fixed by a positioning means such as a positioning pin (not shown).
このキー50,キー溝51の他に、第１図で示す如く基準点
Ｏを中心とする方向で型本体10,20を相対的に摺動して
スライド移動する間隙を持つ掛止め片60a〜60dと受け溝
61a〜61dとが型本体10,20並びに基板30,40の各対接部に
分けて保持手段として設けられている。その各掛止め片
60a〜60dと受け溝61a〜61dは型本体10,20の長手方向端
部寄り数個所に設け、この各部においては型本体10,20
を長手方向を含む放射方向に沿ってスライド移動自在に
掛止め片60a〜60dで係止するよう基板30,40に組立てれ
ばよい。In addition to the key 50 and the key groove 51, as shown in FIG. 1, a latching piece 60a having a gap for sliding relative to the mold bodies 10 and 20 in a direction around the reference point O. 60d and receiving groove
61a to 61d are provided as holding means separately for each contact portion of the die bodies 10 and 20 and the substrates 30 and 40. Each hook piece
60a to 60d and receiving grooves 61a to 61d are provided at several places near the longitudinal ends of the mold bodies 10 and 20.
May be assembled to the substrates 30 and 40 so as to be slidably movable in the radial direction including the longitudinal direction by the latching pieces 60a to 60d.
具体的には、第４図で示すように常温時において掛止め
片60aの横方向の長さよりも長いl1＜l2受け溝61aを型本
体10に設けることにより隙間g1,g2を持たせ、また、第
５図で示す如く横断面略Ｌ字状の掛止め片60aをボルト1
7で基板側の背板31に取り付け、その掛止め片60aの突端
側を受け溝61aに嵌込み配置することにより型本体10,20
を基板側30,40に係止すればよい。Specifically, as shown in FIG. 4, by providing the mold body 10 with l 1 <l 2 receiving groove 61a longer than the lateral length of the latching piece 60a at room temperature, the gaps g 1 and g 2 are formed. In addition, as shown in FIG. 5, the bolt 1 is provided with a hooking piece 60a having a substantially L-shaped cross section.
It is attached to the back plate 31 on the substrate side by 7 and is inserted into the receiving groove 61a of the projecting end side of the latching piece 60a so that the die main body 10, 20
Should be locked to the board sides 30 and 40.
この掛止め片60aは型本体10,20を受け溝61aに沿ってス
ライド移動自在に支持することにより型本体10,20の長
手方向の熱伸縮を許容すると共に、型本体10,20の板厚
方向の熱伸縮を許容するべく常温時において相対間隙
g3,g4が受け溝61aの内面側と型本体10,20の側面との間
に生ずるよう取り付けられている。また、その掛止め片
60aは第６図で示すように横断面ほぼコの字状の本体形
状を有し、片端部を基板30或いは背板31に嵌め込んでボ
ルト17で締付け固定すると共に、他端側を上述したと同
様に受け溝61aに嵌込むことにより型本体10,20を背板3
1,41に実質的に接して係止させることによりスライド移
動可能に支持するよう取り付けられている。This latching piece 60a supports the mold bodies 10 and 20 slidably along the receiving grooves 61a to allow thermal expansion and contraction of the mold bodies 10 and 20 in the longitudinal direction, and the plate thickness of the mold bodies 10 and 20. Gap at room temperature to allow thermal expansion and contraction in the same direction
The g 3 and g 4 are attached so as to be generated between the inner surface side of the receiving groove 61a and the side surfaces of the mold bodies 10 and 20. Also, the latching piece
As shown in FIG. 6, 60a has a main body shape with a substantially U-shaped cross section, one end of which is fitted into the base plate 30 or the back plate 31 and is tightened and fixed by the bolt 17, and the other end side is described above. The mold bodies 10 and 20 are fitted into the receiving groove 61a in the same manner as in
It is mounted so as to be slidably supported by being brought into contact with and substantially in contact with 1,41.
このように構成する成形型構造では、ガイド手段として
は型本体10,20の裏面の任意の一点を基準点Ｏにして放
射方向の直線上に配置したキー50a〜50d,キー溝51a〜51
dで型本体10,20を基板30,40にスライド移動可能に取り
付けるから、型本体10,20が加熱，冷却に伴って基板30,
40に対して自由に熱収縮できるものの、基準点Ｏは位置
決め手段としての位置決めピンにより移動しないよう取
り付けられている。その型本体10,20は裏面全体が基板3
0,40で支持されているので、樹脂の成形加工中にキャビ
ティにかかる圧力を均一に分散して受けることができ
る。また、成形型を成形機に取り付ける取扱い過程にお
いては型本体10,20が基板20,30に対して移動乃至は位置
ずれすることがない。この型本体10,20は、掛止め片60a
〜60dと受け溝61a〜61dとを保持手段として設けること
により、基板30,40から離脱しないよう確実に係止され
ている。その掛止め片60a〜60dでは、型本体10,20の基
板30,40に対して相対的に摺動して移動することを許容
するが、型本体10,20が基板30,40から離脱するのを阻止
することができる。In the molding die structure configured as described above, as guide means, keys 50a to 50d and key grooves 51a to 51 arranged on a straight line in the radial direction with an arbitrary point on the back surface of the die bodies 10, 20 as a reference point O.
Since the die bodies 10 and 20 are slidably attached to the substrates 30 and 40 by d, the die bodies 10 and 20 are heated and cooled by the substrate bodies 30 and 40.
Although it is possible to freely heat-shrink with respect to 40, the reference point O is attached so as not to move by a positioning pin as positioning means. The mold body 10, 20 has a substrate 3 on the entire back surface.
Since it is supported by 0, 40, the pressure applied to the cavity during resin molding can be uniformly dispersed and received. Further, the mold bodies 10 and 20 are not moved or displaced with respect to the substrates 20 and 30 in the handling process of mounting the mold on the molding machine. This mold body 10, 20 is a hook piece 60a
By providing ~ 60d and receiving grooves 61a-61d as holding means, they are securely locked so as not to separate from the substrates 30, 40. The latching pieces 60a to 60d allow the mold bodies 10, 20 to slide relative to the substrates 30, 40, but the mold bodies 10, 20 separate from the substrates 30, 40. Can be prevented.
この成形型構造においては、ベークライト板等の型本体
10,20よりも熱伝導率の低い材料の断熱材層70,71が型本
体10,20と背板31,41との間に介装配置されている。その
断熱材層70,71は、型本体10,20に加えられる加熱，冷却
の熱を成形機の盤側に伝達しないよう遮断できるところ
から好ましい。In this mold structure, the mold body such as Bakelite plate
Insulating material layers 70, 71 made of a material having a lower thermal conductivity than 10, 20 are interposed between the mold bodies 10, 20 and the back plates 31, 41. The heat insulating material layers 70 and 71 are preferable because they can block the heat of heating and cooling applied to the mold bodies 10 and 20 so as not to be transferred to the board side of the molding machine.
上述した実施例では、ガイド手段と保持手段とを互いに
分離した別の部分に設けた例で説明したが、両手段を同
一の部分に設けて兼用させることもできる。即ち、第８
図並びに第９図a,bで示すように型本体10（20）と基板3
0（40）との間に型本体10（20）の裏面の任意の位置，
好ましくは中心に位置する基準点Ｏから放射方向の直線
上に沿うボルト501…を型本体10（20）の裏面に複数本
突設し、そのボルト501…をキーとして長径が放射方向
に向く長孔の受け孔502…を基板30（40）を設けてボル
ト501…を放射方向へスライド移動可能に嵌挿するよう
組み立てる。このガイド兼用保持手段でも、型本体10
（20）が熱伸縮するときに基板30（40）に対して相対的
に摺動して移動するのを許容できる。これと共に、第９
図a,bで示すようにボルト501…を掛止め片として用い、
受け孔502…の短径よりも大径の頭部501aを受ける広幅
な受け溝502aとボルト軸501bを受ける相対的に狭幅な受
け溝502bとを連通させて設け、その受け溝502a,502bで
ボルト501をスライド移動可能に係合することによって
型本体10（20）が基板側30（40）から離脱するのを阻止
することができる。この場合にはカラー501cをボルト軸
501bの軸線上に嵌装すると、ボルト501を円滑にスライ
ド移動させることができる。In the above-described embodiment, the example in which the guide means and the holding means are provided in separate parts separated from each other has been described, but both means may be provided in the same part and used in common. That is, the eighth
As shown in the figures and in Figures 9a and 9b, the mold body 10 (20) and the substrate 3
0 (40) and any position on the back of the mold body 10 (20),
Preferably, a plurality of bolts 501 extending along a straight line in the radial direction from the reference point O located at the center are provided on the back surface of the mold body 10 (20) so that the major axis of the bolts 501 ... The receiving holes 502 ... Of the holes are assembled so that the board 30 (40) is provided and the bolts 501 ... Are fitted so as to be slidably movable in the radial direction. Even with this guide and holding means, the mold body 10
It is possible to allow the (20) to slide and move relative to the substrate 30 (40) when thermally expanding and contracting. With this, the ninth
As shown in Figures a and b, using bolts 501 ... as a hook,
A wide receiving groove 502a for receiving a head 501a having a diameter larger than the short diameter of the receiving holes 502 ... Is provided in communication with a relatively narrow receiving groove 502b for receiving a bolt shaft 501b, and the receiving grooves 502a, 502b are provided. It is possible to prevent the mold body 10 (20) from coming off the board side 30 (40) by slidably engaging the bolt 501 with. In this case, attach the collar 501c to the bolt shaft.
When the bolt 501 is fitted on the axis of the 501b, the bolt 501 can be smoothly slid.
また、上述したガイド兼保持手段の他の例として、第10
図で示す如くあり形の突片510,あり溝形状の受け溝511
を型本体10（20），基板側30（40）に分けていずれも基
準点Ｏから放射方向に向けて設け、これらを互いに嵌め
合せることにより型本体10（20）を放射方向に沿ってス
ライド移動可能で且つ離脱しないよう基板30（40）に係
止することができる。それ以外に、第11図で示す如く逆
凸状の掛止め片520,c型チャンネル状の受け溝521によっ
ても型本体10（20）を基板30（40）に同様に取り付ける
ことができる。In addition, as another example of the above-mentioned guide / holding means,
As shown in the figure, the dovetail-shaped projection piece 510, the dovetail-shaped receiving groove 511
Are provided on the mold body 10 (20) and the substrate side 30 (40) in a radial direction from the reference point O, and the mold body 10 (20) is slid along the radial direction by fitting them together. It is movable and can be locked to the substrate 30 (40) so as not to be separated. Other than that, the mold body 10 (20) can be attached to the substrate 30 (40) in the same manner by the latching piece 520 having a reverse convex shape and the receiving groove 521 having a c-type channel shape as shown in FIG.
なお、上述した実施例ではブロー成形型を例示したが、
インジェクション成形型，コンプレッション成形型等に
も同様に適用できる。また、型本体を加熱する手段とし
ては電気ヒータやベルチェ素子等を型本体内に備え付け
てもよい。Although the blow molding die is illustrated in the above-mentioned embodiment,
The same applies to injection molding dies and compression molding dies. Further, as a means for heating the mold body, an electric heater, a Peltier element or the like may be provided in the mold body.
考案の効果 以上の如く、本考案に係る成形型構造に依れば、型本体
が熱伸縮するのに伴って型本体が基板に対して基準点を
中心に放射方向へ相対的に摺動して移動できるよう構成
されているから、型本体と基板側とを互いに係止する部
材の欠損や型本体に熱変形等が生ずるのを防ぐことがで
きる。また、型本体の裏面全体が基板で支持されている
ので、樹脂の成形加工中にキャビティにかかる圧力を均
一に分散して受けることができる。更に、成形型を成形
機に取り付ける取扱い過程において、型本体は基板に対
して移動乃至は位置ずれすることがない。また、型本体
が基板の裏面側に断熱材層を介して支持されているので
型本体の加熱に伴う熱が基板に伝わるのを迎えることが
できる。As described above, according to the molding die structure of the present invention, as the die body thermally expands and contracts, the die body relatively slides with respect to the substrate in the radial direction around the reference point. Since it is configured so that it can be moved, it is possible to prevent damage to the members that lock the die main body and the substrate side with each other and thermal deformation of the die main body. Further, since the entire back surface of the mold body is supported by the substrate, the pressure applied to the cavity during the resin molding process can be uniformly dispersed and received. Furthermore, the mold body does not move or shift with respect to the substrate during the handling process of mounting the mold on the molding machine. Further, since the mold body is supported on the back surface side of the substrate via the heat insulating material layer, heat accompanying the heating of the mold body can be transferred to the substrate.
第１図は本考案に係る成形型構造の正面図、第２図は第
１図のＡ−Ａ線に沿う成形型構造の断面図、第３図は第
２図におけるＢ−Ｂ線に沿う成形型構造の断面図、第４
図は同成形型構造に装備する掛止め片，受け溝の一例を
示す説明図、第５図は第４図におけるＣ−Ｃ線に沿う掛
止め片，受け溝の断面図、第６図は掛止め片，受け溝の
変化例を示す説明図、第７図は第６図におけるＤ−Ｄ線
に沿う断面図、第８図は本考案の他の実施例に係る成形
型構造を示す説明図、第９図ａは第８図におけるＥ−Ｅ
線に沿う要部の拡大断面図、第９図ｂは第９図ａにおけ
るＦ−Ｆ線に沿う断面図、第10図並びに第11図は本考案
に係る成形型構造の更に別の変形例を示す説明図であ
る。 10,20:型本体、11,12:キャビティ型面、30,40:基板、3
1,41:背板、50:ガイド手段、60a〜60d:保持手段、500,5
10,520:ガイド兼保持手段、501:ボルト、502:長孔、70,
71:断熱材層、O:基準点。1 is a front view of the mold structure according to the present invention, FIG. 2 is a sectional view of the mold structure taken along the line AA of FIG. 1, and FIG. 3 is taken along the line BB of FIG. Sectional view of mold structure, No. 4
FIG. 5 is an explanatory view showing an example of a latching piece and a receiving groove provided in the same mold structure, FIG. 5 is a sectional view of the latching piece and the receiving groove taken along the line CC in FIG. 4, and FIG. FIG. 7 is an explanatory view showing a variation of the latching piece and the receiving groove, FIG. 7 is a sectional view taken along the line D-D in FIG. 6, and FIG. 8 is an explanatory view showing a mold structure according to another embodiment of the present invention. Fig. 9a is EE in Fig. 8.
Fig. 9b is an enlarged sectional view of the main part along the line, Fig. 9b is a sectional view taken along the line F-F in Fig. 9a, and Figs. 10 and 11 are further modified examples of the molding die structure according to the present invention. FIG. 10,20: Mold body, 11,12: Cavity mold surface, 30,40: Substrate, 3
1,41: Back plate, 50: Guide means, 60a-60d: Holding means, 500,5
10,520: Guide and holding means, 501: Bolt, 502: Long hole, 70,
71: heat insulating material layer, O: reference point.
Claims (6)
質的に接して取り付けられ、且つ、成形品の外形形状を
決定するキャビティ型面（11）を備えた型本体（10）
と、 前記キャビティ型面（11）の温度を調節する温度調節手
段（12）とを有し、 型本体（10）と基板（30）との間には型本体（10）の裏
面における任意の基準点（Ｏ）を中心として放射方向に
延びる直線上で、基板（30）に対して型本体（10）が基
準点（Ｏ）を中心に放射方向へ相対的に摺動して移動す
るのを許容するガイド手段と、 型本体（10）が上記放射方向へ相対的に摺動して移動す
るのを許容するが、型本体（10）の裏面と直交する方向
に基板（30）と離脱するのを阻止する型本体（10）の保
持手段とを夫々別もの（50、60a〜60d）として別部分に
備えたことを特徴とする成形型構造。1. A substrate (30) attached to a molding machine, and a substrate (30) mounted substantially in contact with the back surface side of the substrate (30) via a heat insulating material layer (70, 71), and the outer shape of a molded article. Mold body (10) with cavity mold surface (11) to determine shape
And a temperature adjusting means (12) for adjusting the temperature of the cavity mold surface (11), and between the mold body (10) and the substrate (30), an arbitrary temperature on the back surface of the mold body (10) is provided. On a straight line extending in the radial direction around the reference point (O), the mold body (10) moves relative to the substrate (30) in the radial direction about the reference point (O) in the radial direction. The guide means that allows the mold body (10) and the mold body (10) to slide relative to each other in the radial direction, but to separate from the substrate (30) in a direction orthogonal to the back surface of the mold body (10). Molding die structure, characterized in that it is provided with separate means (50, 60a to 60d) for holding the die main body (10) for preventing them from moving.
0d）とが基板（30）と型本体（10）との間で互いに分離
させて別の部分に設けられていることを特徴とする請求
項１記載の成形型構造。2. The guide means (50) and holding means (60a-6)
Mold structure according to claim 1, characterized in that 0d) and 0d) are provided in separate parts separated from each other between the substrate (30) and the mold body (10).
り、保持手段（60a〜60d）が型本体（10）の側面におい
て型本体（10）と基板（30）とを橋渡し固定する固定具
であることを特徴とする請求項２記載の成形型構造。3. The fixing means for connecting the guide means (50) to the key groove and holding means (60a-60d) for bridging and fixing the mold body (10) and the substrate (30) on the side surface of the mold body (10). The mold structure according to claim 2, which is a tool.
質的に接して取り付けられ、且つ、成形品の外形形状を
決定するキャビティ型面（11）を備えた型本体（10）
と、 前記キャビティ型面（11）の温度を調節する温度調節手
段（12）とを有し、 型本体（10）と基板（30）との間には型本体（10）の裏
面における任意の基準点（Ｏ）を中心として放射方向に
延びる直線上で、基板（30）に対して型本体（10）が基
準点（Ｏ）を中心に放射方向へ相対的に摺動して移動す
るのを許容するガイド手段と、 型本体（10）が上記放射方向へ相対的に摺動して移動す
るのを許容するが、型本体（10）の裏面と直交する方向
に基板（30）と離脱するのを阻止する型本体（10）の保
持手段とを兼用するもの（500,510,520）として同一部
分に備えたことを特徴とする成形型構造。4. A substrate (30) attached to a molding machine, and a substrate (30) mounted substantially in contact with the back surface side of the substrate (30) via a heat insulating material layer (70, 71), and the outer shape of a molded article. Mold body (10) with cavity mold surface (11) to determine shape
And a temperature adjusting means (12) for adjusting the temperature of the cavity mold surface (11), and between the mold body (10) and the substrate (30), an arbitrary temperature on the back surface of the mold body (10) is provided. On a straight line extending in the radial direction around the reference point (O), the mold body (10) moves relative to the substrate (30) in the radial direction about the reference point (O) in the radial direction. The guide means that allows the mold body (10) and the mold body (10) to slide relative to each other in the radial direction, but to separate from the substrate (30) in a direction orthogonal to the back surface of the mold body (10). A molding die structure characterized in that it is provided in the same portion as one (500, 510, 520) that also serves as a holding means for the die main body (10) to prevent it.
と型本体（10）との間で同一部分に設けられたガイド兼
保持手段（500,510,520）であることを特徴とする請求
項４記載の成形型構造。5. The substrate (30) comprises the guide means and the holding means.
The molding die structure according to claim 4, wherein the molding die structure is a guide / holding means (500, 510, 520) provided in the same portion between the mold body and the mold body (10).
に設けられた長孔（502）と、この長孔（502）を貫通さ
せて型本体（10）に取り付けられたボルト（501）であ
ることを特徴とする請求項５記載の成形型構造。6. A long hole (502) provided with the guide and holding means (500) in a radial direction, and a bolt (501) attached to the mold body (10) through the long hole (502). The mold structure according to claim 5, wherein
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990086929U JPH0737847Y2 (en) | 1990-08-20 | 1990-08-20 | Mold structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990086929U JPH0737847Y2 (en) | 1990-08-20 | 1990-08-20 | Mold structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0445712U JPH0445712U (en) | 1992-04-17 |
| JPH0737847Y2 true JPH0737847Y2 (en) | 1995-08-30 |
Family
ID=31818865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990086929U Expired - Lifetime JPH0737847Y2 (en) | 1990-08-20 | 1990-08-20 | Mold structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0737847Y2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6461870B2 (en) * | 2016-08-17 | 2019-01-30 | 株式会社日本製鋼所 | Molding die for resin molding |
| JP6883175B2 (en) * | 2017-01-26 | 2021-06-09 | Ｄａｉｓｅｎ株式会社 | Master frame and die plate positioning structure |
| JP6836817B1 (en) * | 2020-09-08 | 2021-03-03 | 株式会社プロイスト | Lower mold |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60157053U (en) * | 1984-03-26 | 1985-10-19 | 本田技研工業株式会社 | Mold positioning device |
| JPS62103109A (en) * | 1985-10-30 | 1987-05-13 | Agency Of Ind Science & Technol | Synthetic resin molding die |
-
1990
- 1990-08-20 JP JP1990086929U patent/JPH0737847Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0445712U (en) | 1992-04-17 |
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