CN104221469B - Die insert with layer heating part, the template with this die insert and the method for operating this die insert - Google Patents
Die insert with layer heating part, the template with this die insert and the method for operating this die insert Download PDFInfo
- Publication number
- CN104221469B CN104221469B CN201380018829.8A CN201380018829A CN104221469B CN 104221469 B CN104221469 B CN 104221469B CN 201380018829 A CN201380018829 A CN 201380018829A CN 104221469 B CN104221469 B CN 104221469B
- Authority
- CN
- China
- Prior art keywords
- die
- layer
- die insert
- main body
- heating part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2737—Heating or cooling means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2673—Moulds with exchangeable mould parts, e.g. cassette moulds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0227—Applications
- H05B1/023—Industrial applications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2737—Heating or cooling means therefor
- B29C2045/2743—Electrical heating element constructions
- B29C2045/2745—Film-like electrical heaters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2737—Heating or cooling means therefor
- B29C2045/2753—Heating means and cooling means, e.g. heating the runner nozzle and cooling the nozzle tip
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
- B29C2045/7356—Heating or cooling of the mould the temperature of the mould being near or higher than the melting temperature or glass transition temperature of the moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
- B29C45/2642—Heating or cooling means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/011—Heaters using laterally extending conductive material as connecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
Abstract
The heating mold cavity of injecting molding die needs long heating and cooling stage so that due to causing yielding poorly for unit component for temperature controlled energy, unit cost is high and level of efficiency is low.Therefore the problem of the present invention is to eliminate or reduce these shortcomings.According to the present invention, this is in the following way solving：A kind of die insert for being defined in the die cavity configure in the template of injecting molding die at least in part, the injecting molding die is for manufacturing part by flowable materials, the die insert has main body, the main body includes the shaping front and the back side contrary with the shaping front for the die cavity, wherein the main body shapes supporting course heating part on front at which.
Description
The present invention relates to the die insert of preamble according to claim 1, according to claim 16 with this
The template of die insert and the method for operating this die insert according to claim 22.
Injecting molding die generally includes the template with die cavity, the material of heated free-flowing, particularly plastics
It is introduced in the die cavity by least one cast gate.The material of free-flowing solidifies in die cavity, so as to generating means.Then
The part is removed from the molds.
In the simplest situations, template is constituted with two parts, and for the taking-up from mould, half module divides each other
Open.It is well known, however, that embodiment has a large amount of templates segmentation (fragments) or so-called slip cast gate, so as to have back-off
Labyrinth can be removed from the molds.
Problem be the material of free-flowing is incorporated into into die cavity during and solidification during Temperature Distribution.Especially, by
The known defect type that this causes is bubble, be not completely filled with die cavity, shearing line (also referred to as brave line), weld bond and incomplete
Granular impressing etc..These defects are not only dysopia, and in the case of part safety to importance go back band
Carry out risk.It is especially problematic in the case of part of the manufacture with high-aspect-ratio.This be by the depth of cavity from cast gate with
Ratio that the minimum lateral of die cavity extends and determined by the overall dimensions of part.Part is less, and depth-to-width ratio is higher.Right
In the filling process of the die cavity with high-aspect-ratio, the material of free-flowing is cooled to its blocking while still in motion
Degree (produce shearing line, and die cavity not exclusively may fill), granular texture not exclusively fills and (produces incomplete granular
Impressing), cured film is produced in material forward position so that produce weld bond when two shuntings meet one another.
For the demand on current part, only it is no longer able to overcome these problems by high injection pressure.Thus it is known
The chiller of the heater and template side of injection molded nozzle and template side so that shadow can be applied to Temperature Distribution
Ring.This is intended to the generation for helping prevent defect.
The most methods well known adjusted for die plate temperature is included for transmitting the channel design of conditioned fluid, interior
Portion and outside inductive heating element, the infra-red radiation when mould is opened and stratie.
Have been established for by the use of water or oil as the temperature adjustment of heat transfer medium, but which has the shortcomings that poor efficiency.
This is slowly caused due to the dynamic of the high loss on supply line and temperature change.The dynamic of temperature change is slowly needs
, so as to during the material of free-flowing is incorporated into die cavity and before heated die plate be subsequently allowed to solid by cooling
Change.And, thermal conditioning is limited to about 160 DEG C to 200 DEG C.
Higher performance can be obtained using inductive heating element, but be extremely complex in being integrated into injecting molding die
With costliness.And, the relatively large part of here also heating quality, its temperature change are slow.This slows down the production cycle.
The heating carried out by infra-red radiation adopts thermal-radiating principle.Herein, by the externally heated type of heat radiation
Chamber surface.However, as mold cavity surface is generally by very retrofit, the efficiency of heating surface is low and coefficient of heat transfer is high.And, can reach
Temperature by emitter power distribution and size limitation.Finally, occur to radiate when mould is opened, therefore significantly extend production
Cycle.
In the wt of Dipl.-Ing Ingo Brexeler and Nico K ü ls (BREXLER et al.)
In Werkstatttechnik online (the 99th (200) phase, volume 11/12, the 830-836 page), in article
“FunktionaleThe regulation of high dynamic mold temperature is described in dynamisch temperiert ".This article
Chapter provides the die insert being integrated into high-performance ceramic (CPH) and in the mould of die cavity cooling.
However, according to BREXLER et al., shortcoming herein is that heating element heater has relatively large heating quality.This leads
Cause die cavity cooling slowly, which is related to long cycle time.Pass through cooling of the proposed utilization cooling medium by fluid passage
Method, only can make up the shortcoming in limited degree.
Therefore, problem of the invention is to overcome the shortcoming of prior art and provide a kind of device, can using the device
Most fast possibility cycle time is being realized by the material for flowing freely, in particularly by plastic manufacturing part, while with high
Part quality.Especially, the device should allow for the high dynamic temperature adjustment of die cavity (which alternatively can be adapted to
It is temperature required)；Described device is easily installed, and operation is reliable, with cost benefit, and with high level of efficiency.
The principal character of the present invention is set forth in the characteristic of claim 1 and 22.Embodiment is corresponding power
Profit requires the theme of 16 and claim 2 to 15,17 to 21 and 23 to 27.
Die insert is used at least partially define the die cavity being implemented in the template of injecting molding die, described to be injected into
Pattern has for by the material for flowing freely to manufacture part, and the die insert has main body, and the main body is included for type
The shaping front in chamber and the back side contrary with shaping front, present invention provide that main body is shaped at which is supported with layer heating on front
Portion.
Using this die insert, because the direction of die cavity is pointed in layer heating part, made by the material for flowing freely
Make part and can realize very quick cycle time.Therefore through-body is not needed to be heated.Thus layer heating part is exceedingly fast
The profiled surface of ground heating die insert.When layer heating part stops heating, a small amount of heat energy of the thin layer is by band very fast
Walk, especially enter in the template for then mould being entered into from main body in main body.
Due to the MIN heating quality of layer heating part, cause short heat time heating time and quick cool time, because
This realizes very quick Periodic Temperature curve.Due to directly being heated on surface, so in die insert and/or mould
Template continuous coo1ing is not adversely affected to low temperature after the main body of insert.Freedom can also be controlled by regulating course heating part
The curing rate of the material of flowing.Conductor and/or separate band are heated by making banding heat the cross section difference of conductor, banding
The target distribution of shape heating conductor is different, temperature adjustment even can be carried out in the way of local directed complete set and to adjacently situated surfaces area
There is no significant heat affecting in domain.Thus the high-temperature gradient on surface can be utilized to realize the high dynamic temperature adjustment of die cavity simultaneously
Realize high efficiency.
Therefore, using die insert of the invention, can be by the material for flowing freely, particularly plastic manufacturing portion
Part, which has very high part quality.Therefore, especially, the melt quickly not cooled down by the flowing of the material of free-flowing
Forward position hinders.Therefore relatively low injection pressure be enough to fill die cavity.It is possible thereby to the closing unit with little mold clamping force is realized, this
Cause the relatively low unit cost of each part.Additionally, be achieved in the molding of improved surface texture/texture structure, for
Thin-walled parts are easier to make for mould filling, and reduce weld bond, shearing line and streamline.For this purpose, for example, can be in note
Mold cavity surface was not long ago warming up to its vitrification point or fusion temperature by the material for penetrating free-flowing, and in filling process
Calcining temperature is cooled to afterwards, and cooling is assisted by the heat transfer medium for flowing in the cooling channel if desired.
Additionally, in practice, the installation with test mould insert is attempted in many occasions so that with layer heating part
Die insert of the invention can also be easily installed in a straightforward manner.
Layer heating part should be substantially 10 to 500 μ m-thicks.However, particularly working as when mold cavity surface profile needs such
Local peaking's thickness of 2mm can also so be provided up.Thin film and thick film technology are particularly suitable for the manufacture of layer heating part.
In a development program of the present invention, it is stipulated that layer heating part includes leading with the banding heating that thick film technology is manufactured
Body.It is possible thereby to realize that 1 to 50 μm of banding heats the preferred thickness of conductor.As can be seen that thus causing low-down to be added
Thermal mass, this allows for very dynamic temperature adjustment.Material silver (Ag), palladium (Pd), platinum (Pt), ruthenium (Ru) and gold
(Au) or these materials combination be particularly suitable for manufacture banding heating conductor.In order to form surface profile, can recommend with 3D
Printing technology, especially by ink-jetting process, aerosol process, gluing process or microdot glue come manufacture banding heating conductor.
Tampon-printing process or silk-screen printing technique are also likely to be suitable.
According to a more detailed embodiment of the layer heating part according to the present invention, this layer of heating part is with thick film skill
Art manufactures and the first electric insulation layer of conductor is heated in frontal overlying cover strip shape.Therefore the people of operation mould is protected from electricity
Hit.Thus prevent due to for example by machinery bridge joint cause short circuit and due to mechanical failure cause to banding heat conductor damage
It is bad.Finally, can be compensated by insulating barrier and the small ripple mark that conductor causes is heated by banding.In order to perform the function, first is electric
Insulating barrier should be 10 to 50 μ m-thicks, but in order to form the morphology of die cavity, the local peaking's thickness for reaching 2mm can
Can be necessary.Using this material thickness, quality to be heated still remains relatively low, can realize the temperature adjustment of high dynamic.
Glass, glass ceramics or enamel are particularly suitable as the material for the first insulating barrier of manufacture.Should seek these materials with regard to
The optimization of high heat conductance.So, in order to replicate the morphology of die cavity, preferably manufactured with 3D coating processes.Especially
Ground, is that this not only considers ink-jetting process, aerosol process, gluing process or microdot adhesive process, tampon-printing process and screen printing
Dataller's skill, it is also contemplated that electrophoresis, spraying and impregnation technology and other techniques generally used in enamel technology.
A change programme of the invention, it is stipulated that layer heating part be included in banding heating conductor and main body between with
Second electric insulation layer of thick film technology manufacture.This is especially necessary in host conductive.Main body can also be by non-conducting material
Make, but die insert generally can be more easily realized when using tool steel, particularly with mould material identical material
It is embedded in die cavity.This is because main body now with template identical hot property, particularly identical thermal expansion.Second
Electric insulation layer should have 10 to 50 μm of thickness.It is possible thereby to obtain continuous electric insulation layer, which only has little quality in addition.
Glass, glass ceramics or enamel are particularly suitable as the material for the second electric insulation layer.These materials should be sought with regard to height
The optimization of heat conductivity.So, in order to replicate the morphology of die cavity, preferably the second electric insulation is carried out by 3D coating processes
The manufacture of layer.Especially, it is that this not only considers ink-jetting process, aerosol process, gluing process or microdot adhesive process, bat printing work
Skill and silk-screen printing technique, it is also contemplated that electrophoresis, spraying and impregnation technology and other techniques generally used in enamel technology.
One more detailed embodiment of conductor is heated according to the banding according to the present invention, the banding heating conductor has
The connecting terminal being arranged on the tongue-like part of main body, wherein tongue-like part are may be located at outside die cavity, and thereon along front side
To sealing surface is built, the sealing surface defines positive shaped region.Thus, tongue-like part and connecting terminal may be located at die cavity it
Outward and without undergoing high injection pressure.Further, since being not required to form clear and definite morphology, it is possible to which connection is touched
Point is more freely designed outside die cavity.Furthermore, it is possible to using external current source and/or control unit come operation layer heating part.
Sealing surface can correspond to the reciprocal sealing surface of template or corresponding to other die insert.Therefore die cavity is except the phase
It is surely closed off outside the opening of prestige.
In another embodiment of the invention, banding heating conductor has and is overleaf guided through master on direction
The connecting terminal of body.Sealing surface is it is possible thereby to be made up of template completely, therefore avoid a difficult problem related to matching.Meanwhile, can
Outside electrical connection section is guided to die cavity below die insert in a straightforward manner.
In order to reliable contact be produced between connecting terminal and banding heating conductor, will heat the connection of conductor in banding
It is favourable that power on area direction acts on the development program on connecting terminal.As an alternative or additionally, connecting terminal can
So that the bonding pad that banding heats conductor is connected in the way of strong bonded.
In the case where connecting terminal is directed across main body along back side direction, the following change programme of the present invention is suitable
's：Wherein the insulator with one or more connecting terminals is guided through main body, wherein the end of the insulator exists
The side of layer heating part is concordant with main body, and connecting terminal constitutes contact area on the side.Second electric insulation layer is touched in connection
At least one otch should be included in the region of the contact area of point.Then banding heating conductor is preferably connected thereto region with thick film
Technology is deposited on the contact area of connecting terminal.
It is positive most that one important development program specified layer heating part of the present invention is configured shaping on frontal
Whole contour layer is covered.The surface and material property of die cavity and layer heating part is generally different from each other.This makes it difficult to match surface
To obtain uniform parts surface.Using contour layer of the invention, this problem can be overcome in a straightforward manner.
According to creative design, contour layer is substantially 50 to 500 μ m-thicks.This be enough to provide the quality of surface profile and
The ripple struction of conductor is heated to cover banding.Additionally, contour layer can be completed after deposition so that for example produce contour layer
With the common graining (graining) of the remaining contour surface of die cavity.Therefore work as contour layer and template uses same reaction material system
Cheng Shi, can also carry out chemical graining jointly across a point mould edge.It is particularly preferred that contour layer is substantially 70 to 150 μ m-thicks,
But the material thickness of 2mm can be provided up in local peaking region.Therefore the quality of contour layer is also little, and only slight shadow
Ring the high dynamic temperature adjustment of layer heating part.
In a change programme of the present invention, contour layer is manufactured by blast coating or micro- forging.By blast
Coating, can result particularly in fine microstructures of the retained porosity less than 0.25%.Additionally, adhesion strength is more than 70MPa,
And contour layer has long service life, even if being also such when with substantial amounts of injection process.Under high pressure with micro- forging
Make technique and carry out compressed metal powder.For this purpose, carrying out compressed metal powder especially by using water, normality air and compressed air
End., structure that may also extremely complex very fine in this generation.
In another change programme of manufacture, contour layer is manufactured with electroplating technology or by chemical coating processes.Such as profit
Nickel electroplating technology is used, by the regulation of electric current, can be within the very short time with very high thickness degree deposited nickel layer.With this
Conversely, chemical nickel be deposited on do not apply foreign current in the case of carry out.By the chemical oxidation reaction in the bath of itself
Produce the electronics needed for nickel ion deposition.Thus it is obtained in particular with complying with the coating of profile.Nickel chemical plating technology is particularly suitable for reaching
To 50 μm of layer, this is because, compared with using nickel electroplating technology, deposition needs the significantly more time and with larger layers
Mechanical stress is produced in the layer of thickness.
In nickel electroplating technology, the intermediate layer of conductive base material or conduction is needed.In nickel chemical plating technology, with non-conductive
Substrate need at least one times plus crystal seed, this is because deposition starts from exposed metal surface.The manufacture of conductive intermediate layer
Can be realized by the one kind in aforementioned coatings technique.
Before with electroplating technology or chemical plating process deposits contour layer, it should carry out chemical attack cleaning with true
Protect the bonding of layer.When using the first electric insulation layer of cleaning agent is not tolerated, the change programme of the present invention specifies in contour layer
Lower section arranges the intermediate layer of resistance to chemical attack.Thus the intermediate layer has the property of protective layer and adhesive layer.Die insert
Ruggedness thus it is especially good.Can also be by aforementioned 2D or 3D coating processes come depositing inter-layer.
Additionally, one of the invention more detailed embodiment defined outline layer is made of metal, particularly by work
Tool steel is made up of nickel.For coating processes and to ruggedness, cohesive, heat conductivity, surface treatment and surface quality
Require, nickel is particularly suitable.
An embodiment of the invention, main body are made of metal, particularly by hard metal or tool steel or
Person comprising chromium, tungsten, nickel, molybdenum and carbon alloy or the alloy comprising chromium, manganese, phosphorus, silicon, sulfur and carbon or comprising chromium, titanium,
The alloy of niobium, manganese and carbon is made.These materials can be particularly adapted to all cheek boards.Additionally, specifically, hard metal is especially suitable for
For the coating using normal glass.
According to according to an alternative embodiment of the present invention, main body is made up of ceramics.This makes it possible to directly coating tool
There is banding to heat the main body of conductor.Additionally, ceramics are very suitable for the coating using normal glass.
One development program of the present invention is related on frontal by the layer temperature sensor of body abutment.Based on this
Temperature sensor quality is little and can be directly integrated in layer heating part, be for example integrated in banding heating conductor between or
The banding separated by thin dielectric layer heats the surface or lower section of conductor, this temperature sensor make it possible to as quick as thought and
Measurement temperature at correct position.Thus the measure of temperature is especially accurate.On the other hand, the ordinary temperature with sensor tip
The front that must be orientated as with produce profile is spaced apart by sensor.However, very thin due to utilizing layer heating part only to heat
Layer, so the temperature in sensor tip region may be departed significantly from.Layer temperature sensor of the invention is prevented
Such case, this is particularly advantageous；Reason can be accurately detect layer heating part in or heater surfaces on height move
State thermal change.Thus layer heating part and injection molding, the direct quick regulation of particularly injection cycle are also possibly realized.Layer temperature
The connection of degree sensor can be similarly carried out with the connection of layer heating part design.Can provide shared or individually match somebody with somebody
Put.
The invention further relates to a kind of template for injecting molding die, the injecting molding die is for by flowing freely
Material manufacture part, the template includes the die cavity defined by profiled surface, the cast gate being passed through in die cavity and die insert seat,
Accommodate according to die insert in any one of the preceding claims wherein in die insert seat.Using this template, can be to type
The surface of intracavity especially dynamically carries out temperature adjustment.Other advantages of die insert for describing before can also be realized.
According to a development program of template of the present invention, die insert is concordant with the profiled surface of die cavity to shape front
Mode is embedded in.It is possible thereby to build morphology on die insert without detectable transition.
One special change programme of the present invention is also beneficial to this point, wherein being located in die insert seat in die insert
Under installment state, by machining and/or grinding and/or the shaping table of the front of processing mold insert and die cavity together is polished
Face.Thus mismatch between die insert front and mold cavity surface can be eliminated by the processing.Can be with die parting line
Manufacture fine structure.
Machining and/or grinding can be particularly preferably carried out at zone of heating heating part and/or is polished.Thus in system
Consider during making that minimum thermic profile rises and falls.Thus the first insulating barrier and contour layer can build extremely thin, without
As banding heats the running surface that conductor is produced.However, banding heating conductor can be used for providing profile, as long as portion
The design reasons of part this be desired.It is desirable that with flow freely material solidification during later operating temperature,
The temperature that the vitrification point of the material for flowing freely is corresponding is processed.Therefore, the surface profile of die insert can be with
Change only when layer heating part cools down.However, part solidifies at least in part and keeps its shape.
In another manufacture change programme, being located under the installment state in die insert seat in die insert carries out mould together
Tool insert front and the graining on mold cavity forming surface.Can also carry out across the die parting line between die insert and mold cavity surface
This technology graining or chemical graining.
In one of the invention favourable installation change programme, die insert is arranged on the welding line position of part
Region in.The side that can there is weld bond thereon was had built up by simulation before manufacture injecting molding die.
By the local heating in weld bond region, the cured film in forward position becomes to separate, and the forward position of material is converged without material
Defect and/or dysopia.
In order to the uniform temperature of die cavity is adjusted and by the consumption of the introduced heat of the free flowing material of layer heating part and injection
Dissipate, a development program regulation of template builds fluid passage in a template.Heat transfer medium can be transmitted in the process to pass through
Fluid passage.Thus, for example, template can be cooled continuously.Need not be interrupted during the operation for being cooled in layer heating part.
Even so, as the quality of thermal region to be added is little, so efficiency still keeps very high.
In another development program, present invention provide that die insert is fixed on mould edge by dismountable fixing device
In block.It is possible thereby to individually change, reprocess and processing mold insert with template.In the case of defect, injection mold
Tool also rapidly prepares to reuse.Fixing device is activated preferably by the opening in the template outside die cavity.Cause
This need not be operated in die cavity, it is to avoid damage to mold cavity surface.This fixation can by the screwed hole in main body or
Hole with pin profile is constituted, and can also be by constituting through template into the hole in die insert seat.Then can be with
In the hole that screw or pin are fed through die insert seat and can be fixed in main body.Alternatively, which can also be used
His securing member, the fixture for for example engaging with template and main body.
It is also recommended that die insert floating mount in die insert seat.This reduce due to uneven thermal stress and/
Or the die insert deformation caused by pressure caused by stress.
A development program of the invention, main body and die insert seat thermal coupling.As a result, it is possible thereby to will be added by layer
The heat energy that the free flowing material of hot portion and injection is introduced is taken away from the region of die cavity as quickly as possible in a straightforward manner.This
Realize (big) contact area that can pass through between main body and die insert seat.Heat-conducting cream between main body and die insert seat
Useful help is provided.
The invention further relates to a kind of mould edge for describing before operating in the die cavity of the template of injecting molding die
The method of block, the injecting molding die for by the material manufacture part for flowing freely, in the process first by applying
Making alive carries out the heating of layer heating part, then starts fill cycle, wherein the material of free-flowing is incorporated in die cavity, and
And wherein before fill cycle, reduce or remove the voltage of layer heating part during or after, and after cooling stage
Open die cavity and take out at least partially curing part.
Due to die insert of the invention, express injection cycle can be realized by methods described.But, by
In by the high dynamic temperature adjustment of layer heating part, the quality of institute's injection member is especially high.
Another optional step in the method according to the invention transmits the material of free-flowing during being included in cooling stage
Heat energy and layer heating part heat energy pass through main body and enter in template.In like fashion, according to design, as quickly as possible and with letter
Heat is taken away by single mode by die cavity region.After voltage is removed soon, the surrounding enviroment of layer heating part and die cavity are cold
But to the temperature of template, this is that, due to only heating very little quality, which also has for conduction of heat relative to its body in addition
Big surface for product.
One change programme of the method according to the invention specifies that heat transfer medium is transmitted during cooling stage passes through template
Interior fluid passage.It is possible thereby to the heat from usual large volume of template related to quality is continuously taken away so that
Dynamic temperature is adjusted and reliably can also be carried out in substantial amounts of injection cycle.
Layer heating part of the invention also allows a kind of method change programme, wherein layer heating part heating and/or
During fill cycle, heat transfer medium is transmitted by the fluid passage in template.Thus layer heating part and template can be with dual sides
Formula carries out temperature adjustment.It is also contemplated that by Transfer Medium come the specific region of heated die plate.However, it is particularly preferred to
Layer heating part also cools down the selection of template when being activated, temperature is remained as low as possible.Correspondingly, stop in layer heating part
The heat flux entered in template from this layer during heating and the heat flux for leaving die cavity are also fast as much as possible.
Additionally, layer heating part was heated at least before fill cycle starts by a development program regulation of this method
150℃.At these temperatures, compared with the filling of thermoregulator template is not carried out, find most of material for flowing freely
Filling capacity be significantly improved, and part has corresponding high quality.Due to can be in 20 seconds, particularly preferably exist
The probability heated in 8 seconds, obtains a particular advantage of layer heating part.Injection cycle is correspondingly fast, and per single
The position time can manufacture multiple parts, and this causes low unit cost.
A kind of other method also contributes to realize the temperature adjustment of high dynamic that the other method specifies main body temperature
Degree remains essentially in the temperature of the die insert seat for accommodating die insert, and heating is substantially limited to layer heating by regulation
The region in portion.Keeping for the temperature can also be including the startup stage of layer heating part so that deposit between layer heating part and main body
In thermograde as big as possible.For this purpose, main body can also include fluid passage, its cooling duct preferably with template
Coupling.Therefore, the radiating in die cavity region is especially good.
From the word of claim and from the description below based on accompanying drawing to embodiment example, the present invention is other
Feature, details and advantage become obvious.In the accompanying drawings：
Fig. 1 shows the injecting molding die with die insert with decomposition diagram；
Fig. 2 shows the cross section by the injecting molding die with die insert；
Fig. 3 shows template and die insert with exploded view；
Fig. 4 is shown through the transversal of the injecting molding die with die insert in the electric coupling area of layer heating part
Face detail drawing；
Fig. 5 shows the detailed cross-sectional view through the die insert in the electric coupling area of layer heating part；
Fig. 6 shows the detailed cross-sectional view through the template with die insert in the electric coupling area of layer heating part；
With
Fig. 7 shows detailed through the cross section of the die insert with layer heating part in the electric coupling area of layer heating part
Figure.
Fig. 1 is shown for being injected into by the material M manufacture part P for flowing freely using die insert 1 with exploded view
Pattern tool 100.Fig. 2 shows the sectional view through this injecting molding die 100 with die insert 1.According to Fig. 1 and 2
Injecting molding die 100 have two-piece type template 101.Die cavity 102 with profiled surface 103 is implemented in template 101, tool
Body ground is between its two half modules.The upper mold section of template 101 is included for the material M of free-flowing is filled in die cavity
Cast gate 104.Nozzle insert 111 is inserted in cast gate 104, injection molded nozzle 110 is further extended in nozzle insert 111.This
Place has no intention to describe injection molded nozzle 110 and its nozzle tip, tubes of material, housing, material tube head, heater, temperature in detail
The design that degree sensor, its electrical connection and injection molded nozzle 110 are connected with machine nozzle or allotter.
For the temperature adjustment of template 101, fluid passage 107 is introduced in template 101 here, by the fluid passage
107 can transmit heat transfer medium F.It is die insert seat 105 in die cavity 102 to be implemented in the female die of template 101, mould
Insert 1 is accommodated therein.In the embodiment being shown here at, die insert 1 is arranged on die insert seat in floating manner
In 105.Especially, 105 thermal coupling of die insert 1 and die insert seat, especially by the back side S2 of die insert 1
Relatively large contact area carrys out thermal coupling.Heat-conducting cream can be introduced between die insert 1 and die insert seat 105 to contribute to heat
Contact.
Additionally, die insert 1 has the shaping front S1 for pointing to 102 direction of die cavity.Described back side S2 points to template
101 directions.Overleaf on the direction of S2, die insert 1 is included in the main body 10 of supporting course heating part 20 on the direction of front S1.
Layer heating part 20 is substantially 10 to 500 μ m-thicks.The detail drawing of layer heating part 20 is found in Fig. 7.It can also be seen that layer heating part 20
Including the banding heating conductor 21 manufactured with thick film technology.Banding heating conductor 21 is 1 to 50 μ m-thick, line section and thus
Local electrical resistance is adapted to the heat demand of local requirement.This enables banding heating conductor 21 to manufacture by 3D coating processes.
In the case of flat surfaces, 2D techniques such as silk screen printing can also be used.
Layer heating part 20 also includes the first electric insulation layer 22, and which is manufactured with thick film technology and in front S1 directions overlying cover strip
Shape heats conductor 21.The insulating barrier is 10 to 50 μ m-thicks.Which can be made up of glass, glass ceramics or enamel.First electric insulation
Layer 22 can also be manufactured with 3D coating processes.In the case of flat surfaces, 2D techniques such as silk screen printing can also be used.Also deposit
In the second electric insulation layer 23, which is arranged between banding heating conductor 21 and main body 10 and is manufactured with thick film technology.Second electricity is absolutely
Edge layer 23 is 10 to 50 μ m-thicks.Which can be made up of glass, glass ceramics or enamel.If main body 10 by metal, particularly by
Tool steel is made, then need the second insulating barrier 23.The material for so selecting is conductive.
Additionally, layer heating part 20 is covered on the direction of front S1 by final contour layer 26, this constitutes shaping front S1.
Contour layer 26 is substantially 50 to 500 μ m-thicks, but which includes reaching local peaking's thickness of 2mm.Contour layer 26 can pass through
Blast coating or micro- forging are manufacturing.Alternative also is suitable as with electroplating technology or by chemical coating processes manufacture
Case.Contour layer 26 is made of metal, and particularly makes by tool steel or by nickel.Non-conductive material is selected if contour layer 26
Expect, then which can undertake the function of the first electric insulation layer 22, i.e. the first electric insulation layer 22 and constitute contour layer 26.
Die insert 1 also includes layer temperature sensor 30.Which is supported by main body 10 on the S1 directions of front.Especially, its
It is integrated in the Rotating fields of layer heating part 20 as temperature sensor track.The measurement of temperature is in particular upon related to temperature
Voltage.
Banding heating conductor 21 has the connecting terminal 24 being arranged on the tongue-like part 11 of main body 10.This connecting terminal 24
Detail drawing can see in Fig. 2,3,4 and 5.Tongue-like part 11 is located at outside die cavity 102, and is upwardly formed in the side of front S1 close
Front cover 12, the sealing surface define the shaped region of front S1.Sealing surface of the sealing surface 12 corresponding to the upper mold section of template 101.Layer
The electrical connection of temperature sensor 30 is similarly in the region of tongue-like part 11.
Using this injecting molding die 100, the method for operating die insert 1 can be now performed, wherein first
The heating of layer heating part 20 is carried out by applied voltage.Then start fill cycle, material M of free-flowing is drawn during which
Enter in die cavity 102.During fill cycle or afterwards, the voltage of layer heating part 20 is reduced or removes with will be from die cavity
The heat energy E of the material M for flowing freely and layer heating part 20 is passed in template 101 by the torrid zone in region especially by main body 10
Lead in template 101.Can be by the temperature adjustment of fluid passage 107 be flow through by means of heat transfer medium F by heat from 101 band of template
Walk.After cooling stage, die cavity 102 is opened, and takes out the part P for solidifying at least in part.Template is cooled down using heat transfer medium F
102 can also be carried out during the heating of layer heating part 20 and/or fill cycle.It is desirable that the temperature of main body 10 is thus basic
On be maintained at the temperature of die insert seat 105, and the region of layer heating part 20 is restricted to by the heating of layer heating part 20,
Also include contour layer 26 if appropriate.The heating of layer heating part 20 and the heating of 1 front S1 of die insert thus exist
Fill cycle is carried out before starting, and is preferably heated at least 150 DEG C.In view of little quality, this can be within the very short time
Realize, such as in 8 seconds.Cooling after the stopping heating of layer heating part 20 can also be carried out very fast.Alternatively, which can
To be affected by the temperature curve of layer heating part 20 in targetedly mode.
Fig. 3 shows die insert 1 and template 101, the particularly half module of template 101 with decomposition diagram.Template 101 is set
The injecting molding die for counting into for by the material for flowing freely to manufacture part.Template 101 have be built with mould wherein
The die cavity 102 of insert seat 105.Die insert 1 is contained in die insert seat 105.Especially, die insert 1 is by detachable
Fixing device (not shown) be fixed in die insert seat 105.Die insert 1 is floated as much as possible in die insert seat 105
In.Main body 10 and 105 thermal coupling of die insert seat, especially by relatively large contact area and its thermal coupling.Due to being arranged on
In die insert seat 105, the circumferential groove in die insert 1 becomes fluid passage 13, and heat transfer medium is by the fluid in template 101
Passage 107 and be fed to fluid passage 13.Heat transfer medium is it is possible thereby to be directly delivered along die insert 1.
Die insert 1 has the shaping front S1 for pointing to die cavity 102 direction, as can be seen, the front with
Three dimensional constitution builds.The back side S2 of die insert 1 points to the direction of template 101.On the direction of back side S2, die insert 1
Main body 10 with supporting course heating part 20 and layer temperature sensor 30 on the direction of front S1.For more detailed design,
At this point with reference to the description of Fig. 1,2 and 7.Additionally, layer heating part 20 is configured shaping front S1's on the direction of front S1
Final profile layer 26 is covered, and this is also described in more detail in the embodiment with regard to Fig. 1,2 and 7.
Layered heating 20 and layer temperature sensor 30 each have the connecting terminal being arranged on the tongue-like part 11 of main body 10,
Wherein tongue-like part 11 is located at outside die cavity 102.On the direction of front S1, tongue-like part 11 constitutes to form sealing surface 12, and this is close
Front cover 12 defines the shaped region of front S1.As it can be seen, sealing surface 12 is radially around whole shaping front S1.This
Sample, sealing are continuous, and avoid the sealing problem of transition position.
Fig. 4,5 and 6 respectively illustrate detailed through the cross section of the die insert 1 in the electric coupling area of layer heating part 20
Figure.Fig. 4 shows two half modules of template 101 in the close position, and the half of template 101 is can be only seen in Fig. 5 and 6
Mould.
The template 101 of Fig. 4 to 6 each constitutes the die cavity 102 with profiled surface 103.Additionally, they have die insert
The 1 die insert seat 105 being accommodated therein.
Die insert 1 has the shaping front S1 in the direction for pointing to die cavity 102 and points to the back side S2 in 101 direction of template.
Overleaf on the direction of S2, main body 10 of the die insert 1 with the supporting course heating part 20 on the S1 directions of front.In addition main body 10
Supporting course temperature sensor 30 is gone back in this place.For the layer heating part that conductor 21 and layer temperature sensor 30 are heated with its banding
20 structure, at this point with reference to the embodiment with regard to Fig. 1,2 and 7.Banding heating conductor 21 all has in each case
Connecting terminal 24.This is equally applicable to the thermocouple 30 of layer.
According to Figure 4 and 5, connecting terminal 24 is each arranged on the tongue-like part 11 of main body 10.Connecting terminal 24 is located at herein
On the S1 of front, due to this reason, tongue-like part 11 is located at outside die cavity 102.Sealing surface 12 is implemented in ligule on the S1 directions of front
In portion 11, which defines the region of front S1 shapings.Connecting terminal 24 is thus outside the shaped region of front S1.Banding is heated
The bonding pad 25 of conductor 21 is exposed on tongue-like part 11, and especially bonding pad 25 is not by the first insulating barrier 22 and/or contour layer 26
Cover.Connecting terminal 24 with contact area 241 is built as corresponding with bonding pad 25.According to Fig. 4, by stored energy mechanism, spy
It is not that spring element 41 is pressed into the contact area 241 of connecting terminal 24 on bonding pad 25.Conversely, according to the connecting terminal of Fig. 5
24 contact area 241 is connected to bonding pad 25 in the way of strong bonded, especially by soldering or welding.
In Figure 5 it can be seen that specific feature, wherein fluid passage 13 is implemented in main body 10 so that main body 10 can
Particularly rapidly cooled down.
According to Fig. 6, banding heating conductor 21 and layer thermocouple 30 have on the overleaf direction of S2 and are guided through main body
10 connecting terminal 24.For this purpose, insulator 40 passes through main body 10 with connecting terminal 24.Insulator 40 and connecting terminal 24
End is concordant on the side of layer heating part 20 with main body 10, and 24 here of connecting terminal forms contact area 241.In these contact areas
In 241 region, the second electric insulation layer 23 includes otch 231.Additionally, connecting terminal 24 is connected to band in the way of strong bonded
Shape heats the bonding pad 25 of conductor 21.Especially, banding heating conductor 21 is connected thereto contact 24 and is deposited on company with thick film technology
On the contact area 241 of contact point 24.
Fig. 7 can be seen according to the detail drawing of 30 structure of connection and 20 structure of layer heating part and layer temperature sensor of Fig. 6
In.Die cavity in the template 101 of the injecting molding die that herein show for by the material for flowing freely to manufacture part
The detail drawing of the die insert 1 in 102.The shaping front S1 of die insert 1 points to the direction of die cavity 102, and back side S2 points to mould
The direction of plate 101.The main body 10 of die insert 1 in back side S2 directions is pointed in the direction supporting course heating part 20 of front S1.
In template 101, the mould for accommodating die insert 1 wherein is particularly built with the region of die cavity 102
Insert seat 105.Die insert 1 is fixed in die insert seat 105 by dismountable fixing device 108, particularly screw.Gu
Determine device 108 to manipulate by the opening 109 in template 101, the opening is outside die cavity 102.Can see herein
Go out, screw is screwed together in screwed hole 14 on the back side S2 of main body 10.Main body 10 is made up of tool steel, or by comprising chromium, tungsten,
The alloy of nickel, molybdenum and carbon or the alloy comprising chromium, manganese, phosphorus, silicon, sulfur and carbon or the conjunction comprising chromium, titanium, niobium, manganese and carbon
Gold is made.
By the thermo-contact between main body 10 and die insert seat 105 or template 101, can be by heat energy E by die cavity 102
It is sent in template 101 by main body 10 with layer heating part 20.For fast dissipation heat energy E, provide also in template 101
Fluid passage 107, provides fluid passage 13 in the main body 10, can transmit heat transfer in varied situations by these passages and be situated between
Matter F.
Layer heating part 20 includes the banding heating conductor 21 of 1 to 50 μ m-thick manufactured with thick film technology.Its by Ag, Pd, Pt,
Ru, Au or its mixture are made.Which is manufactured with 2D or 3D coating processes, especially, ink-jetting process, aerosol process, dispensing
Technique or microdot adhesive process, tampon-printing process and silk-screen printing technique are suitable for this.
Additionally, layer heating part 20 also includes manufacturing with thick film technology and in the direction overlying cover strip shape heating conductor of front S1
21 the first electric insulation layer 22.First electric insulation layer is 10 to 50 μ m-thicks, is made up of glass, glass ceramics or enamel, and
And manufactured with 2D or 3D coating processes.Not only ink-jetting process, aerosol process, gluing process or microdot adhesive process, bat printing
Technique and silk-screen printing technique, and electrophoresis, spraying or impregnation technology or other works being generally used in enamel technology
Skill is also suitable for this.
Heat between conductor 21 and main body 10 in banding, layer heating part 20 includes the second electric insulation manufactured with thick film technology
Layer 23.Second electric insulation layer is 10 to 50 μ m-thicks, is made up of glass, glass ceramics or enamel, and with 2D or 3D
Coating processes are manufactured.Not only ink-jetting process, aerosol process, gluing process or microdot adhesive process, tampon-printing process and silk screen
Typography, and electrophoresis, spraying or impregnation technology or other techniques being generally used in enamel technology are also suitable for this.
Banding heating conductor 21 has the connecting terminal 24 that main body 10 is guided through on the overleaf direction of S2.For this mesh
, insulator 40 is guided through main body 10 with connecting terminal 24.The end of the insulator is on the side of layer heating part 20
Concordant with main body 10, on the side, connecting terminal 24 constitutes contact area 241.Region of second electric insulation layer 23 in contact area 241
In have otch 231.Connecting terminal 24 is deposited on thick-film technique actually as banding heating conductor 21 is connected thereto region
Contact area 241 on, so heat in banding the presence of the company of strong bonded between the bonding pad 25 of conductor 21 and connecting terminal 24
Connect.
Main body 10 goes back supporting course temperature sensor 30 on the direction of front S1, and which is embedded in 22 He of the first electric insulation layer
Between second electric insulation layer 23.Its electric connection contacts is cannot see that, the electric connection contacts can be with the electrical connection of layer heating part 20
Contact similarly builds.
Layer heating part 20 is covered by the final profile layer 26 for constituting shaping front S1 on the direction of front S1.Contour layer 26
Substantially 50 to 500 μ m-thicks.Material thickness up to 2mm is provided only in little local peaking region.Additionally, contour layer is by gold
Belong to, particularly make by tool steel or by nickel.Which is manufactured by blast coating processes or by micro- forging.Alternatively,
Consider with electroplating technology or by chemical coating processes manufacture.In order to realize the extremely abrasive fixation of contour layer 26, at which
The intermediate layer 27 of lower section deposition resistance to chemical attack.During the surface treatment using corrosivity cleaning agent, the intermediate layer protection
First electric insulation layer 22.Now intermediate layer 27 constitutes the adhesion layer of contour layer 20.
As can be seen that die insert 1 is embedded in the way of front S1 is concordant with the profiled surface 103 of die cavity 102.For this mesh
, it is located under the shown installment state in die insert seat 105 in die insert 1, by machining, grinding and polishes come one
Play the profiled surface 103 of the front S1 and die cavity 102 of processing mold insert 1.The processing is especially at zone of heating heating part 20
Carry out.Additionally, being located under the installment state in die insert seat 105 in die insert 1, carried out on the S1 of front jointly and die cavity
Graining on 102 profiled surface 103.
The invention is not restricted in implementation described below scheme, and can be to modify in a variety of ways.It is special
Not, the selection according to material, layer heating part 20 can include only one or even without insulating barrier, or the first insulating barrier
22 and contour layer 26 can be made up of single layer.The combination of various electrical connections is also possible, can be with common Rotating fields
The thermocouple 30 and banding heating conductor 20 of the layer of varying number is provided.The peripheral border of the die insert 1 in die cavity 101
Can targetedly in the visible edge of part or design crimping.Finally, the peace in positioned at die insert seat 105
Under dress state, the peripheral border deposition profile layer 26 of die insert 1 can also be crossed in principle so that in die insert 1 and type
Flowing transition is formed between the profiled surface 103 in chamber 102.It is also contemplated that cloth of the multiple die inserts 1 in single die cavity 102
Put.
The all feature and advantage occurred from claims, specification and drawings (include that design details, space are arranged
And processing step) possibly for being all necessary for invention itself and most various combination.
Reference numerals list
1 die insert, 40 insulator
41 spring elements
10 main bodys
11 tongue-like part, 100 injecting molding die
12 sealing surface, 101 template
13 fluid passage, 102 die cavity
14 screwed hole, 103 profiled surface (die cavity)
104 cast gates
20 layers of 105 die insert seat of heating part
21 bandings heating conductor, 107 fluid passage
22 first electric insulation layer, 108 fixing device
23 second electric insulation layers 109 are open
231 otch (the second electric insulation layer) 110 injection molded nozzles
24 connecting terminal, 111 nozzle insert
241 (connecting terminal) contact area
25 bonding pad E heat energy
26 contour layer F heat transfer mediums
27 intermediate layer M materials
P parts
30 layers of temperature sensor S1 fronts
The S2 back sides
Claims (27)
1. a kind of die insert (1), which is used at least partially define the template (101) for being implemented in injecting molding die (100)
In die cavity (102), the injecting molding die (100) manufactures part (P) for by the material (M) for flowing freely, described
Die insert (1) with main body (10), it include for the die cavity (102) shaping front (S1) and with the shaping front
(S1) the contrary back side (S2), wherein the main body (10) is shaped at which be supported with a layer heating part (20) on front (S1), which is special
Levy and be, the layer heating part (20) includes banding heating conductor (21) manufactured with thick film technology, wherein, the layer heating part
(20) include banding heating conductor (21) is manufactured and covered on shaping front (S1) direction with thick film technology
First electric insulation layer (22).
2. die insert (1) according to claim 1, it is characterised in that the layer heating part (20) is included in the banding
The second electric insulation layer (23) manufactured with thick film technology between heating conductor (21) and the main body (10).
3. die insert (1) according to any one of claim 1 to 2, it is characterised in that the banding heats conductor
(21) with the connecting terminal (24) being arranged on the tongue-like part (11) of the main body (10), wherein the tongue-like part (11) is located at
Outside the die cavity (102), and sealing is built with the direction of the shaping front (S1) on the tongue-like part (11)
The shaped region of the shaping front (S1) is defined in face (12), the sealing surface.
4. die insert (1) according to claim 1 and 2, it is characterised in that banding heating conductor (21) with
The connecting terminal (24) of the main body (10) is guided through on the direction of the back side (S2).
5. die insert (1) according to claim 1 and 2, it is characterised in that the layer heating part (20) is in the shaping
The final contour layer (26) that the shaping front (S1) is configured on the direction in front (S1) is covered.
6. die insert (1) according to claim 5, it is characterised in that the contour layer (26) is 50 to 500 μ m-thicks.
7. die insert (1) according to claim 5, it is characterised in that by explode coating or by micro- forging making
Make the contour layer (26).
8. die insert (1) according to claim 5, it is characterised in that with electroplating technology or by chemical coating processes
To manufacture the contour layer (26).
9. die insert (1) according to claim 5, it is characterised in that the contour layer (26) is made of metal.
10. die insert (1) according to claim 5, it is characterised in that be provided with below the contour layer (26)
The intermediate layer (27) of resistance to chemical attack.
11. die inserts (1) according to claim 1 and 2, it is characterised in that the main body (10) is made up of hard metal.
12. die inserts (1) according to claim 1 and 2, it is characterised in that the main body (10) is made up of ceramics.
13. die inserts (1) according to claim 1 and 2, it is characterised in that the main body (10) is in the shaping front
(S1) supporting course temperature sensor (30) on direction.
14. die inserts (1) according to claim 5, it is characterised in that the contour layer (26) by tool steel or by
Nickel is made.
15. die inserts (1) according to claim 1 and 2, it is characterised in that the main body (10) by tool steel or
Alloy comprising chromium, tungsten, nickel, molybdenum and carbon or the alloy comprising chromium, manganese, phosphorus, silicon, sulfur and carbon or comprising chromium, titanium, niobium,
The alloy of manganese and carbon is made.
A kind of 16. templates (101) for injecting molding die (100), the injecting molding die (100) is for by freely flowing
Dynamic material (M) manufacture part (P), the template (101) include the die cavity (102) defined by profiled surface (103), are passed through institute
Cast gate (104) in die cavity (102), and die insert seat (105) are stated, according to mould in any one of the preceding claims wherein
Tool insert (1) is contained in the die insert seat.
17. templates (101) according to claim 16, it is characterised in that the die insert (1) is with the shaping front
(S1) mode concordant with the profiled surface (103) of the die cavity (102) is embedded in.
18. templates (101) according to any one of claim 16 or 17, it is characterised in that in the die insert (1)
Under the installment state in the die insert seat (105), by machining and/or grinding and/or polish come together plus
The shaping front (S1) of die insert described in work (1) and the profiled surface (103) of the die cavity (102).
19. templates (101) according to claim 16 or 17, it is characterised in that be built with stream in the template (101)
Body passage (107).
20. templates (101) according to claim 16 or 17, it is characterised in that by dismountable fixing device (108)
The die insert (1) is fixed in the die insert seat (105).
21. templates (101) according to claim 16 or 17, it is characterised in that the main body (10) and the die insert
Seat (105) thermal coupling.
22. it is a kind of for operation in the die cavity (102) of the template (101) of injecting molding die (100) according to claim 1
To the method for the die insert (1) any one of 15, the injecting molding die (100) is for by the material for flowing freely
(M) manufacturing part (P), methods described is characterised by following steps：
The layer heating part (20) is heated by applied voltage；
Then start fill cycle, the material (M) for flowing freely is introduced into the die cavity (102) during the fill cycle
In；
Reduce or remove the voltage of the layer heating part (20) before the fill cycle, in period or afterwards；
The die cavity (102) is opened after cooling stage, and takes out at least partially curing part (P).
23. methods according to claim 22, it is characterised in that following steps：
During the cooling stage, by the heat energy (E) of the material (M) of the free-flowing and the layer heating part (20)
Heat energy (E) is by the main body (10) conduction in the template (101).
24. methods according to any one of claim 22 or 23, it is characterised in that following steps：
During the cooling stage, transmission heat transfer medium (F) is by the fluid passage (107) in the template (101).
25. methods according to claim 23, it is characterised in that following steps：
During the heating of the layer heating part (20) and/or the fill cycle, transmission heat transfer medium (F) is by the mould
Fluid passage (107) in plate (101).
26. methods according to claim 22 or 23, it is characterised in that following steps：
Before the fill cycle starts, the layer heating part (20) is heated at least 150 DEG C.
27. methods according to claim 22 or 23, it is characterised in that following steps：
The temperature of the main body (10) is kept being substantially equal to accommodate the die insert seat of the die insert (1)
(105) temperature, and
By the region heated and be substantially limited to the layer heating part (20).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102012103120A DE102012103120A1 (en) | 2012-04-11 | 2012-04-11 | Tool insert with layer heating, mold plate with such a tool insert and method for operating such a tool insert |
| DE102012103120.7 | 2012-04-11 | ||
| PCT/EP2013/057051 WO2013152976A2 (en) | 2012-04-11 | 2013-04-03 | Die insert with layer heating, moulding plate having a die insert of this type, and method for operating a die insert of this type |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104221469A CN104221469A (en) | 2014-12-17 |
| CN104221469B true CN104221469B (en) | 2017-03-29 |
Family
ID=48083148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380018829.8A Expired - Fee Related CN104221469B (en) | 2012-04-11 | 2013-04-03 | Die insert with layer heating part, the template with this die insert and the method for operating this die insert |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20150054199A1 (en) |
| EP (1) | EP2837256B1 (en) |
| JP (1) | JP6170132B2 (en) |
| CN (1) | CN104221469B (en) |
| DE (1) | DE102012103120A1 (en) |
| MX (1) | MX358380B (en) |
| PL (1) | PL2837256T3 (en) |
| WO (1) | WO2013152976A2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10259152B2 (en) | 2014-12-11 | 2019-04-16 | Otto Männer Innovation GmbH | Injection molding apparatus with heated mold cavities |
| CN104924546A (en) * | 2015-07-10 | 2015-09-23 | 曼盛包装（上海）有限公司 | Low-cost high-forming-efficiency injection mold |
| EP3344433B1 (en) * | 2015-08-31 | 2020-01-29 | Uniplas Enterprises PTE Ltd | Injection moulding apparatus and method for injection moulding and ir-compatible display frame |
| CN108027167B (en) * | 2015-09-09 | 2022-06-10 | 马瑞利(中国)汽车空调有限公司 | Fluid heating device and method for manufacturing the same |
| DE202016103464U1 (en) * | 2016-06-29 | 2016-07-19 | SMR Patents S.à.r.l. | Heater, device for applying a heater and exterior rearview mirror with a heater |
| DE102017211723B4 (en) * | 2017-07-10 | 2024-02-29 | Franz Binder Gmbh + Co. Elektrische Bauelemente Kg | Method for producing a heating element |
| DE102017215752A1 (en) * | 2017-09-07 | 2019-03-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | mold |
| DE102018107795A1 (en) * | 2018-04-03 | 2019-10-10 | Volkswagen Aktiengesellschaft | A method of making a 3D printed tool, and such a 3D printed tool, and using such a 3D printed tool |
| CN108436066A (en) * | 2018-04-28 | 2018-08-24 | 深圳市甘露珠宝首饰有限公司 | A kind of continuous injection molding machine |
| WO2020162925A1 (en) | 2019-02-06 | 2020-08-13 | Hewlett-Packard Development Company, L.P. | Movable mold insert adjuster |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4828479A (en) * | 1987-08-25 | 1989-05-09 | Pleasant Ronald E | Molding apparatus |
| US7182890B2 (en) * | 1998-10-14 | 2007-02-27 | Gyros Patent Ab | Matrix and method of producing said matrix |
| CN101077035A (en) * | 2003-11-21 | 2007-11-21 | 沃特洛电气制造公司 | Two-wire layered heater system |
| CN101239499A (en) * | 2006-12-15 | 2008-08-13 | 日本普莱泰克株式会社 | Injection mold assembly |
| CN101682936A (en) * | 2007-06-30 | 2010-03-24 | 赫斯基注射器成型系统有限公司 | Spray deposited heater element |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE68921778T2 (en) * | 1988-03-30 | 1995-12-07 | Gen Electric | Multi-layer composite structure for molding on hot surfaces. |
| US5041247A (en) * | 1988-09-29 | 1991-08-20 | General Electric Company | Method and apparatus for blow molding parts with smooth surfaces |
| DE9012186U1 (en) * | 1990-08-24 | 1990-10-31 | Fehr, Ernst, 9403 Goldach, Ch | |
| JPH05116182A (en) * | 1991-07-10 | 1993-05-14 | Ebara Corp | Plastic molding die |
| US5388803A (en) * | 1993-08-17 | 1995-02-14 | General Electric Company | Apparatus for producing textured articles |
| US5569474A (en) * | 1994-06-06 | 1996-10-29 | Daiho Industrial Co., Ltd. | Mold for injection molding of plastics using thin film electric heater |
| DE19929731A1 (en) * | 1999-06-29 | 2001-01-04 | Zumtobel Staff Gmbh | Heating injection molds |
| US6222166B1 (en) * | 1999-08-09 | 2001-04-24 | Watlow Electric Manufacturing Co. | Aluminum substrate thick film heater |
| DE60232521D1 (en) * | 2002-10-11 | 2009-07-16 | Liteco S R L | Modular system for molding of injection molding machines |
| US20050023433A1 (en) * | 2003-07-31 | 2005-02-03 | Alps Electric Co., Ltd. | Resin optical component mold having minute concavo-convex portions and method of manufacturing resin optical component using the same |
| US8680443B2 (en) * | 2004-01-06 | 2014-03-25 | Watlow Electric Manufacturing Company | Combined material layering technologies for electric heaters |
| JP2006187969A (en) * | 2005-01-07 | 2006-07-20 | Matsushita Electric Ind Co Ltd | Lens mold |
| ITMO20060314A1 (en) * | 2006-10-05 | 2008-04-06 | Maria Prudenziati | INNOVATIVE HEATING ELEMENT, IN PARTICULAR FOR HOT ROOMS OF PLASTIC INJECTION MOLDING EQUIPMENT |
| US7794223B2 (en) * | 2007-09-20 | 2010-09-14 | Kuo Fei-Pin | Tri-plate injection die with changeable male and female die cores |
| AT507718B1 (en) * | 2008-12-16 | 2010-11-15 | Engel Austria Gmbh | INJECTION MOLDING |
-
2012
- 2012-04-11 DE DE102012103120A patent/DE102012103120A1/en active Pending
-
2013
- 2013-04-03 US US14/390,139 patent/US20150054199A1/en not_active Abandoned
- 2013-04-03 EP EP13715188.2A patent/EP2837256B1/en active Active
- 2013-04-03 CN CN201380018829.8A patent/CN104221469B/en not_active Expired - Fee Related
- 2013-04-03 JP JP2015504905A patent/JP6170132B2/en not_active Expired - Fee Related
- 2013-04-03 PL PL13715188.2T patent/PL2837256T3/en unknown
- 2013-04-03 MX MX2014012250A patent/MX358380B/en active IP Right Grant
- 2013-04-03 WO PCT/EP2013/057051 patent/WO2013152976A2/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4828479A (en) * | 1987-08-25 | 1989-05-09 | Pleasant Ronald E | Molding apparatus |
| US7182890B2 (en) * | 1998-10-14 | 2007-02-27 | Gyros Patent Ab | Matrix and method of producing said matrix |
| CN101077035A (en) * | 2003-11-21 | 2007-11-21 | 沃特洛电气制造公司 | Two-wire layered heater system |
| CN101239499A (en) * | 2006-12-15 | 2008-08-13 | 日本普莱泰克株式会社 | Injection mold assembly |
| CN101682936A (en) * | 2007-06-30 | 2010-03-24 | 赫斯基注射器成型系统有限公司 | Spray deposited heater element |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2837256A2 (en) | 2015-02-18 |
| CN104221469A (en) | 2014-12-17 |
| US20150054199A1 (en) | 2015-02-26 |
| JP2015517934A (en) | 2015-06-25 |
| JP6170132B2 (en) | 2017-07-26 |
| PL2837256T3 (en) | 2016-12-30 |
| MX358380B (en) | 2018-08-15 |
| MX2014012250A (en) | 2015-05-08 |
| EP2837256B1 (en) | 2016-08-03 |
| DE102012103120A1 (en) | 2013-10-17 |
| WO2013152976A2 (en) | 2013-10-17 |
| WO2013152976A3 (en) | 2014-01-30 |
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