JP5518591B2 - Resin molding equipment - Google Patents

Description

  The present invention relates to a resin molding apparatus for molding various resin products. More specifically, the present invention relates to a resin molding apparatus provided with a mold having excellent thermal conductivity.

  Conventionally, various resin molding apparatuses or resin molding methods have been proposed to shorten the molding cycle and improve the productivity of resin molding. For example, when molding a thermoplastic resin, a cooling channel for circulating the coolant is provided near the cavity and core in the mold to increase the cooling rate of the resin product and shorten the molding cycle. No. 2009-196138). On the other hand, in the case of molding a thermosetting resin, the molding cycle can be shortened by increasing the heating rate of the resin product in the mold. That is, in order to improve the productivity of resin molding, it is necessary to shorten the double-track cycle of heat, and as a method for realizing this, it is conceivable to improve the thermal conductivity of the mold.

JP 2009-196138 A

  Therefore, an object of the present invention is to provide a resin molding apparatus that shortens the molding cycle and improves the resin molding productivity by configuring a mold having excellent thermal conductivity.

  In order to solve the above-mentioned problems, a resin product is molded between a first mold plate having a cavity and the cavity of the first mold plate that is disposed to face the first mold plate. A resin molding apparatus comprising a second mold plate having a core, wherein a laminate of DLC plates is disposed near the cavity or / and the core Device.

  The DLC plate is preferably arranged in parallel with the extending direction of the PL surface of the first mold plate or the second mold plate. The DLC plate is preferably formed by applying DLC coating on the surface of an aluminum plate-like body. It is preferable that the laminate of the DLC plates is disposed in a nest inserted in the first mold plate and / or the second mold plate.

According to the first aspect of the present invention, a mold having excellent thermal conductivity can be configured, the molding cycle can be shortened, and the productivity of resin molding can be improved.
According to the invention described in claim 2, since the heat in the mold flows in the extending direction of the PL surface and is released to the outside of the mold, it is possible to configure a mold having more excellent thermal conductivity.
According to the third aspect of the present invention, an effective DLC plate that further increases the thermal conductivity of the mold can be manufactured at low cost.
According to the invention described in claim 4, a mold having excellent thermal conductivity can be configured simply by fitting the insert into the mold plate.

It is the front schematic of one Example of the resin molding apparatus of this invention. It is a longitudinal cross-sectional view of the nest | insert inserted in the metal mold | die of the resin molding apparatus shown in FIG. It is a top view by the side of the cavity of the nest | insert shown in FIG. FIG. 3 is a plan view on the core side of the nest shown in FIG. 2. It is a perspective schematic diagram for explaining an internal temperature measurement test. It is the longitudinal cross-sectional schematic of the test mold S for internal temperature measurement tests near the center. It is the longitudinal cross-sectional schematic of the test mold M for internal temperature measurement tests near the center. It is a longitudinal cross-sectional schematic diagram of the center vicinity of the test die P for internal temperature measurement tests. It is a schematic diagram for demonstrating the number of each thermocouple inserted in the test die for internal temperature measurement tests. It is the graph which showed the time-dependent temperature change of the test metal mold | die S in an internal temperature measurement test. It is the graph which showed the time-dependent temperature change of the test metal mold | die S in an internal temperature measurement test. It is the graph which showed the temperature change with time of the test metallic mold M in the internal temperature measurement test. It is the graph which showed the time-dependent temperature change of the test metal mold | die M in an internal temperature measurement test. It is the graph which showed the time-dependent temperature change of the test metal mold | die P in an internal temperature measurement test. It is the graph which showed the time-dependent temperature change of the test die P in the internal temperature measurement test.

  In the present invention, a DLC plate laminate 6 is arranged in the vicinity of the cavity 2 and / or the core 4 to form a mold having excellent thermal conductivity, shortening the molding cycle and improving the resin molding productivity. The resin molding apparatus 1 was realized.

A resin molding apparatus according to the present invention will be described with reference to an embodiment shown in FIGS.
As shown in FIG. 1, the resin molding apparatus 1 of this embodiment includes a first mold plate 3 having a cavity 2 and a cavity of the first mold plate 3 that is disposed to face the first mold plate 3. 2 is a resin molding apparatus including a second mold plate 5 having a core 4 for molding a resin product between the cavity 2 and / or the core 4 in the vicinity of the DLC plate. The body 6 is arranged. Hereinafter, each configuration will be described in detail.

  The resin molding apparatus 1 is an apparatus that performs resin molding by injection molding, and includes a first mold plate (movable side mold board) 3 and a second mold plate provided to face the first mold plate 3. (Fixed side mold platen) 5 is provided with a mold 7 arranged in the horizontal direction. A cavity 2 is provided on the PL surface of the first mold plate (movable mold platen) 3, while a core 4 is provided on the PL surface of the second mold plate 5. 3 and the second mold plate 5 are configured to mold a resin product.

  Each mold plate constituting the mold 7 including the first mold plate 3 and the second mold plate 5 is moved to the guide post 8 by driving a PL opening / closing cylinder (not shown) provided outside the mold 7. It is comprised so that reciprocation is possible in the perpendicular direction along.

  An injection device 9 is provided outside the mold 7 so that the molten resin is filled into the cavity 2 through the sprue runner 10 so as to penetrate the inside of the mold 7 from the injection device 9. It is configured. Further, an ejector pin 11 for releasing the molded resin product from the core 4 is disposed in the mold 7 so as to be capable of reciprocating in the vertical direction.

And the laminated body 6 of the DLC board is distribute | arranged to the cavity 2 and the core 4 vicinity of the resin molding apparatus 1 of this invention.
Here, in the present application, the “DLC plate” refers to a plate-like body in which Diamond Like Carbon (amorphous carbon hard film) is applied to the surface (entire surface).

  Specifically, the DLC plate of this example is formed by applying DLC coating to the surface of an aluminum plate-like body, and the plate thickness of the aluminum plate-like body is 0.3 mm, the DLC coating film thickness Is used with a thickness of 0.01 mm. Thus, by using an aluminum plate-like body having high thermal conductivity as a base material constituting the DLC plate, a mold having high thermal conductivity can be manufactured at a lower cost.

  A laminate 6 of DLC plates is configured by laminating a large number (several dozens to several hundreds) of the above DLC plates. As shown in FIG. A laminate 6A of DLC plates is arranged (above the cavity 2 in FIG. 1), and in the second mold plate 5, a laminate of DLC plates is located behind the core 4 (below the core 4 in FIG. 1). 6B, 6C, and 6D are arranged, respectively.

  More specifically, as shown in FIG. 2 or FIG. 3, a laminate 6 </ b> A having a strip-shaped DLC plate that is wider than the cavity 2 having a substantially all shape in plan view is disposed in the back of the cavity 2. On the other hand, at the back of the core 4, as shown in FIG. 2 or FIG. , 6C, 6D are arranged and arranged.

  As described above, in the resin molding apparatus of the present invention, since the laminate of the DLC plate is arranged in the vicinity of the cavity or / and the core, the mold has excellent thermal conductivity, the molding cycle is shortened, and the resin molding is performed. It is configured to improve productivity.

  The DLC plate or the laminated body 6 of this embodiment is arranged in parallel with the extending direction of the PL surface of the first mold plate 3 or the second mold plate 5. As a result, the heat in the mold 7 flows in the extending direction of the PL surface and is released to the outside of the mold and does not flow to the PL surface, so that a mold having more excellent thermal conductivity can be configured.

  The laminate 6 of DLC plates is arranged in nestings 12 and 13 fitted in the first mold plate 3 or the second mold plate 5, respectively. Thereby, the metal mold | die 7 excellent in heat conductivity can be comprised only by inserting the inserts 12 and 13 in the metal mold plates 3 and 5, respectively.

  In the resin molding apparatus 1 of this embodiment, the DLC plate laminate 6 is disposed in the vicinity of the cavity 2 and the core 4, but the present invention is not limited to this, and one of the cavity and the core is not limited thereto. The thing in which the laminated body of the DLC board was distribute | arranged to the vicinity is also included by the category of this invention. Further, in the resin molding apparatus 1 of this embodiment, the DLC plate laminate 6 is disposed only in the vicinity of the cavity 2 and the core 4, but the DLC plate laminate is disposed over the entire mold. Are included in the scope of the present invention. Further, the DLC plate of this example was prepared using an aluminum plate-like body as a base material layer, but those using a DLC coating with a base material layer other than aluminum are also included in the scope of the present invention. The Furthermore, although the plate | board thickness of the aluminum plate-shaped body of this Example is 0.3 mm and the DLC coating film thickness is 0.01 mm, it is not limited to this and may be of any size. However, if it is possible to produce a DLC plate, a thicker DLC coating film is preferable because thermal conductivity is improved.

(Internal temperature measurement test)
A test mold was manufactured to verify the effect of heat conduction on how the DLC plate laminate affects the thermal conductivity of the mold.
As test dies, (1) a test mold S (FIG. 6) in which a DLC plate stack is not arranged inside, (2) a test mold M (a small amount of DLC plate stack is arranged in the center inside) DLC-coated aluminum plate: plate thickness 1.0 mm, coat thickness 0.01 mm, number of laminated sheets 30: Fig. 7), (3) Test mold P (in which a large number of DLC plate laminates are arranged inside the center) DLC-coated aluminum plates: plate thickness 0.3 mm, coat thickness 0.01 mm, and stacking number 90 sheets: FIG.

As shown in FIG. 5, a copper block 20 (cartridge heater 250 ° C.) assuming a heat source is placed on the upper surface of each test mold S, M, P, and a temperature control circuit 21 that keeps the heat source constant on the outer periphery. The temperature controlled water at 80 ° C. was poured.
As an internal temperature measurement method, 20 thermocouples 22 (K type) are inserted into a test mold so that the temperature near the center can be measured, and they are inserted into a temperature measuring instrument (GL800, Graphtec Co., Ltd.). The temperature change over time of each part (No. 1 to No. 20 shown in FIG. 9) was measured at intervals of 10 seconds from the heat source standing to 50 seconds.

(Measurement result)
(1) In the test mold S in which the laminated body of the DLC plates is not arranged inside, as shown in FIGS. 10 and 11, the temperature directly below the heat source (thermocouple No. 9) is likely to be warmed and shows the highest temperature. Next to that (thermocouple No. 13 in the first row and second column and No. 5 in the first row and fourth column) and under the thermocouple 9 (thermocouple No. 10) are warmed at substantially the same temperature. Thus, the temperature of each part of the test mold S in which the laminated body of the DLC plates was not arranged was an acute angle.

  (2) In the test mold M in which a small amount of the DLC plate laminate is arranged in the center, as shown in FIGS. 12 and 13, the test mold S has the highest temperature immediately below the heat source (thermocouple number 9). ) Was lower than that of the test mold S, and the adjacent temperatures (thermocouple number 13 in the first row and second column and number 5 in the first row and fourth column) were higher than those of the test mold S. The thermocouple No. 10 below the thermocouple No. 9 is higher in the mold S than the other thermocouples in the second row and shows a mountain shape, but in the mold M, the second row is substantially flat. It was. This is because heat enters the column direction, whereas the DLC plate stack is arranged in the row direction, so the DLC plate stack has the effect of releasing heat outward in the row direction (in other words, Then, the effect of quickly diffusing heat was confirmed.

  (3) In the test mold P in which a large number of DLC plate laminates are arranged in the center, as shown in FIGS. 14 and 15, the effect of releasing heat further outward in the row direction than the test mold M is noticeable. It was. In addition, the mountain of the thermocouple No. 9 just below the heat source was considerably low, and it was seen that heat was being released to the surroundings. The shape of the graph also showed a sharp mountain shape in the test mold S, whereas it became a mountain shape with a loose obtuse angle.

  From the above measurement results, it was confirmed that arranging the laminate of DLC plates in the mold is effective as a mechanism for increasing the thermal conductivity of the mold and adjusting the temperature. Moreover, it was confirmed that the temperature can be controlled more effectively by increasing the DLC coating layer of the DLC plate.

  As described above, when the laminated body of the DLC plates is arranged in the mold, the temperature change inside the mold is reduced and the temperature distribution is also smoothed. This is because if a laminate of DLC plates is placed in the mold, the influence on the mold during cooling or heating will be reduced, and diffusion and release will be quickly performed outward without storing heat inside. This means that the cooling efficiency or the heating efficiency is increased. And if the cooling efficiency or heating efficiency of a metal mold | die becomes high, since a molding cycle can be shortened, according to the resin molding apparatus provided with such a metal mold | die, productivity of resin molding can be improved. it can.

DESCRIPTION OF SYMBOLS 1 Resin molding apparatus 2 Cavity 3 1st mold plate 4 Core 5 2nd mold plate 6 DLC board laminated body 7 Mold 8 Guide post 9 Injection apparatus 10 Sprue runner 11 Ejector pin 12 Nest 13 Nest 13

Claims (4)

A second mold having a core for molding a resin product between a first mold plate having a cavity and the cavity of the first mold plate disposed opposite to the first mold plate A resin molding apparatus comprising a mold plate, wherein a laminate of DLC plates is disposed in the vicinity of the cavity or / and the core. 2. The resin molding apparatus according to claim 1, wherein the DLC plate is disposed in parallel with an extending direction of a PL surface of the first mold plate or the second mold plate. The resin molding apparatus according to claim 1, wherein the DLC plate is formed by applying a DLC coating to a surface of an aluminum plate-like body. 4. The resin molding apparatus according to claim 1, wherein the laminate of the DLC plates is arranged in a nest inserted in the first mold plate and / or the second mold plate. 5.

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