JP5708640B2 - Mold and mold manufacturing method - Google Patents

Description

  The present invention relates to a molding die used for injection molding and the like, and a method for manufacturing an optical element and other resin molded products using the molding die.

  Some molds include a fixed mold and a movable mold. As an injection molding machine that performs molding by incorporating such a mold, the fixed plate that supports the fixed mold and the movable mold are supported. In some cases, a cavity for injection molding is formed by aligning and fastening a fixed mold and a movable mold together (see Patent Document 1). In this injection molding machine, a stationary plate is provided with a heat insulating plate and supported on the fixed plate via the heat insulating plate, and a movable die is provided with a heat insulating plate and supported on the movable plate via the heat insulating plate. The heat that escapes to the support base such as the movable platen is reduced to stabilize the temperature of the mold.

JP 2010-5852 A

  However, in the above-described molding die, for example, when optical elements such as a plurality of lenses are molded together, there is a difference in transferability between products, and it is not easy to increase the yield rate. In particular, camera lenses for mobile phones and objective lenses for optical pickups are required to advance both miniaturization and high performance, and it is necessary to increase the yield rate while making the resin molded products have high optical performance. .

  The inventors of the present application have studied a phenomenon in which it is not easy to increase the yield rate in the molding method using the molding die as described above, and as a result, the heat insulating plate has a non-uniform temperature distribution in the plane. I noticed that. In particular, in the fixed platen, it was found that a large temperature difference occurred in the vertical direction of the heat insulating plate, and that the temperature difference caused an uneven temperature distribution in the surface of the fixed mold. When molding multiple optical elements from a molding die at once, the flow path of the temperature control medium is limited, and multiple mold parts corresponding to each optical element are individually temperature controlled precisely. Can not do it.

  Therefore, an object of the present invention is to provide a molding die capable of molding a resin molded product having high optical performance with a high yield by reducing a temperature distribution generated in a fixed die and a movable die.

  The present invention also relates to a method of manufacturing an optical element or other resin molded product using the above-described molding die.

In order to solve the above problems, a molding die according to the present invention includes a first die having a first transfer surface and a second die having a second transfer surface, and the first transfer surface is closed by mold closing. A mold die forming a mold space between the first transfer surface and the second transfer surface, wherein the first die is supported by a support base and holds a core having the first transfer surface ; a mounting plate for supporting the mold plate from behind with the core, and the heat insulating plate disposed between the mounting plate and the support base, the mounting plate and arranged in the mold plate between the insulating plate, the mounting plate and the heat insulating plate And a heat homogenizing member having a higher thermal conductivity than that of the first embodiment.
In this case, it is possible to effectively prevent the temperature difference of the heat insulating plate from reaching the mold plate, the core and the like by arranging the heat uniformizing member in the vicinity of the heat insulating plate.
The molding die according to the present invention includes a first die having a first transfer surface and a second die having a second transfer surface, and the first transfer surface and the second transfer surface are closed by closing the die. The first mold is supported by the support base and holds the core having the first transfer surface, and the mold plate from the back together with the core. High heat conductivity compared to the mold plate, the mounting plate and the heat insulating plate disposed between the mounting plate to be supported, the heat insulating plate disposed between the mounting plate and the support base, and the mold plate and the mounting plate. And a heat homogenizing member having a rate.
In this case, it is possible to suppress the temperature distribution formed on the rear mounting plate from reaching the front template.
The molding die according to the present invention includes a first die having a first transfer surface and a second die having a second transfer surface, and the first transfer surface and the second transfer surface are closed by closing the die. The first mold is supported by the support base and holds the core having the first transfer surface, and the mold plate from the back together with the core. A mounting plate for supporting, and a heat insulating plate disposed between the mounting plate and the support base, and the mounting plate is a heat uniformizing member having a higher thermal conductivity than the mold plate and the heat insulating plate. It is characterized by being.
In this case, the temperature distribution formed on the mounting plate can be suppressed from reaching the template and the core.

  In the molding die, the first die has a heat uniformizing member that is disposed between the mold space and the heat insulating plate and has a higher thermal conductivity than the mold member and the heat insulating plate. The control member suppresses the influence of the temperature difference generated in the heat insulating plate on the mold member. That is, even during the injection or during cooling, even if the temperature distribution is generated in the heat insulating plate itself that prevents the heat flow to the support base, the influence on the mold space from the heat insulating plate is reduced. Thereby, the difference in temperature distribution in the mold surface at the time of cooling after resin injection or the like can be reduced, and a resin molded product having high optical performance can be molded with a high yield. In particular, when a plurality of resin molded products are molded together, it is possible to prevent a difference in transferability between the resin molded products.

  In still another aspect of the present invention, the first mold is attached to the support base, which is a fixed platen, and the second mold is attached to the movable platen. In this case, even if a large temperature difference occurs in the vertical direction of the fixed platen, it is possible to prevent the temperature difference from causing a non-uniform temperature distribution in the surface of the mold member, and the first optical surface can be made highly accurate. Can be molded.

  In still another aspect of the present invention, the first mold is attached to the support base which is a movable platen, and the second mold is attached to the fixed platen. In this case, even if a large temperature difference occurs in the vertical direction of the movable platen, it is possible to prevent the temperature difference from causing a non-uniform temperature distribution in the surface of the mold member, and the first optical surface can be made highly accurate. Can be molded.

The method for producing a resin molded product according to the present invention is characterized by using any of the molding dies of the above invention.

In the above manufacturing method, by using the molding die of the present invention, even if temperature distribution occurs in the heat insulating plate itself that prevents heat flow to the support base during injection or cooling, the heat insulating plate to the template plate The impact on is reduced. As a result, the mold plate is cooled relatively uniformly, the temperature distribution in the mold surface during cooling after resin injection or the like can be reduced, and a resin molded product with high optical performance can be molded with a high yield.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front view conceptually illustrating a molding apparatus incorporating a molding die according to a first embodiment. (A) is sectional drawing explaining the structure of a fixed mold among the shaping | molding dies shown in FIG. 1, (B) is a figure explaining the end surface of a fixed mold. It is sectional drawing explaining the structure of a stationary mold among the shaping | molding dies of 2nd Embodiment. It is sectional drawing explaining the structure of a fixed mold among the shaping molds of 3rd Embodiment. (A) is sectional drawing explaining the modification (4th Embodiment) of the flow path of a heat carrier, (B) is a type | mold end view explaining arrangement | positioning of the flow path of (A). (A) is sectional drawing explaining the modification (5th Embodiment) of the flow path of a thermal medium, (B) is a type | mold end view explaining the arrangement | positioning of the flow path of (A).

[First Embodiment]
Hereinafter, a molding apparatus incorporating a molding die according to a first embodiment of the present invention will be described with reference to the drawings.

  As shown in FIG. 1, the injection molding machine 10 includes a fixed platen 11, a movable platen 12, a mold clamping plate 13, an opening / closing drive device 15, an injection device 16, and a mold temperature controller 17. The injection molding machine 10 enables molding by sandwiching a fixed mold 41 and a movable mold 42 between the movable platen 12 and the fixed platen 11 and clamping both molds. Here, the fixed mold 41 and the movable mold 42 together form a molding mold.

  The fixed platen 11 is a support base on the fixed side, and is fixed on the support frame 14 so as to face the movable platen 12. The stationary platen 11 detachably supports the stationary mold 41. The fixed platen 11 is fixed to the mold clamping plate 13 via a tie bar 18 so that it can withstand the pressure of mold clamping during molding. The movable platen 12 is a movable-side support base and can move forward and backward with respect to the fixed platen 11. The movable platen 12 detachably supports the movable mold 42. The mold clamping machine 13 is fixed to the end of the support frame 14. The mold clamping machine 13 supports the movable board 12 from the back via the power transmission part 15d of the opening / closing drive device 15 at the time of mold clamping.

  The opening / closing drive device 15 moves the movable platen 12 forward and backward with respect to the fixed platen 11. That is, the opening / closing drive device 15 expands and contracts the power transmission unit 15 d under the control of the opening / closing control unit 21. As a result, the movable platen 12 can move forward and backward freely with respect to the mold clamping plate 13, and as a result, the movable platen 12 and the fixed platen 11 can be moved toward and away from each other. The mold 41 and the movable mold 42 can be clamped and opened.

  The injection device 16 can inject the molten resin from the resin injection nozzle 16d in a temperature controlled state. In the state where the fixed mold 41 and the movable mold 42 are clamped, the injection device 16 brings the resin injection nozzle 16d into contact with the sprue bush 77 (see FIG. 2A) provided on the fixed platen 11, and the flow path The molten resin in the cylinder 16a can be supplied to the FP (see FIG. 2A) at a desired timing.

  The mold temperature controller 17 supplies and circulates a temperature-controlled heat medium into the fixed mold 41 and the movable mold 42. Thereby, the temperature of the fixed mold 41 and the movable mold 42 can be maintained at an appropriate temperature during molding.

  2A is a side sectional view for explaining the structure of the fixed mold 41, and FIG. 2B is a mold end view of the fixed mold 41, that is, a front view. The movable mold 42 is driven by the opening / closing drive device 15 shown in FIG. 1 and can be moved back and forth in the ± Z directions. A mold space for injection molding can be formed by matching the fixed mold 41 and the movable mold 42 with the parting surfaces PS1 and PS2 and clamping the mold.

  As shown in FIG. 2 (A) and the like, the fixed mold 41 includes a parting surface PS1 side, that is, an inner mold plate 71, a mounting plate 72 that supports the mold plate 71 from behind, a mounting plate 72, and a fixed platen. 11 and a plate-shaped heat equalizing member 83 disposed between the mounting plate 72 and the heat insulating plate 82. Note that through holes 71a, 72a, 82a, and 83a are formed in the template 71, the mounting plate 72, the heat insulating plate 82, and the heat equalizing member 83, respectively. Among these, the sprue bush 77 is inserted and fixed to the through hole 71a of the template 71 and the through hole 72a of the mounting plate 72 from the outside. A locate ring 81 is disposed around the rear end of the sprue bush 77 and fixed to the mounting plate 72. The locating ring 81 is inserted from the inside into the nozzle insertion port 11a formed in the stationary platen 11 through the through hole 82a of the heat insulating plate 82 and the through hole 83a of the heat equalizing member 83, and the mounting plate 72 and the like It can be positioned and fixed to the fixed platen 11.

  The template 71 has a core hole 71 h that holds the core 74. On the parting surface PS1 side of the template 71, a runner recess 71b connected to a flow path FP extending along a hole 77a formed in the sprue bush 77 and branching radially is connected to a tip end side of the runner recess 71b. The core 74 is provided with a lens recess 74d connected to the gate surface 71c. The runner recess 71b, the gate surface 71c, and the lens recess 74d constitute a mold inner surface 71i and are connected to a mold inner surface 171i provided on the mold plate 171 and the like of the movable mold 42 at the time of clamping. A space filled with resin is formed. In particular, the lens recess 74d constituting the mold inner surface 71i on the fixed mold 41 side is a first transfer surface corresponding to a first optical surface of a lens (not shown) to be molded, and is on the movable mold 42 side. The lens recess 174d constituting the mold inner surface 171i is a second transfer surface corresponding to the second optical surface of the lens to be molded, and the mold corresponding to the molded product between the opposed first and second transfer surfaces. A space is formed.

  A jacket 78 is formed inside the mold plate 71 and the mounting plate 72 as a flow path for circulating a heat medium in order to keep the temperature of the mold at an appropriate temperature during molding. Further, a temperature sensor 79 for measuring the temperature of the fixed mold 41, more specifically, the temperature of the mold inner surface 71i of the mold plate 71 and the vicinity thereof is embedded in the mold plate 71.

  Hereinafter, the heat insulating plate 82 and the heat uniformizing member 83 in the fixed mold 41 will be described. The heat insulating plate 82 has a lower thermal conductivity than both the template 71 and the mounting plate 72, for example, 0.05 [W / m · K] or more and 1.5 [W / m · K] or less. Yes. The thermal conductivity of the mold plate 71 and the mounting plate 72 as the mold member is, for example, 10 [W / m · K] or more and 60 [W / m · K] or less, and the thermal conductivity of the heat uniformizing member 83. Is, for example, 100 [W / m · K] or more. The fixed platen 11 is, for example, 30 [W / m · K] or more.

  A specific material will be described. The template 71 and the mounting plate 72 are, for example, pre-hardened steel having a thermal conductivity of about 33 [W / m · K] or a thermal conductivity of about 23 [W / m · K]. Stainless steel having a thermal conductivity, carbon steel having a thermal conductivity of about 40 [W / m · K], and the like. The heat insulating plate 82 is, for example, a heat-resistant epoxy resin material having a thermal conductivity of about 0.59 [W / m · K] and based on glass fiber, and a heat of about 0.3 [W / m · K]. Silicon-based binder material having conductivity and glass fiber as a base material, iso-unsaturated polyester material having thermal conductivity of about 0.13 [W / m · K] and glass fiber as a base material, etc. For example, it has a thickness of about 5 to 15 mm. The heat equalizing member 83 is, for example, a copper alloy having a thermal conductivity of about 171 [W / m · K], an aluminum alloy having a thermal conductivity of about 101,112 [W / m · K], or a thermal conductivity of 317 [ W / m · K] and tellurium steel, and has a thickness of 5 mm, for example. The heat uniformizing member 83 may be formed of, for example, beryllium copper having a thermal conductivity of about 90 [W / m · K] or a zinc alloy having a thermal conductivity of about 97 [W / m · K]. The stationary platen 11 is made of cast iron having a thermal conductivity of about 40 [W / m · K], for example.

  Table 1 below summarizes the characteristics of specific examples of various materials capable of forming the fixed mold 41 for reference.

  Here, the roles of the heat insulating plate 82 and the heat uniformizing member 83 will be described. The fixed platen 11 is firmly fixed to the support frame 14, and heat radiation to the support frame 14 is increased. For this reason, a large heat distribution is formed on the fixed platen 11 in the vertical direction, with the upper side being a high temperature and the lower side being a low temperature. As a result, the heat insulating plate 82 also tends to have a high temperature on the upper side and a low temperature on the lower side. Here, if the heat insulating plate 82 is thickened, the temperature distribution in the XY plane on the surface side of the heat insulating plate 82, that is, the mounting plate 72 side can be reduced, and the temperature difference can be eliminated. There arises a problem that strength and accuracy are lowered. Therefore, by inserting the heat homogenizing member 83 between the mounting plate 72 and the heat insulating plate 82, the heat is diffused in the heat homogenizing member 83, and the temperature in the XY plane on the surface side of the heat homogenizing member 83. Reduce the distribution to eliminate temperature differences. As a result, the temperature distribution of the mounting plate 72 and the template 71 is also reduced, and the temperatures at various locations on the surface of the template 71 can be made substantially the same.

  In the movable mold 42, the above-described problems are unlikely to occur. This is because the movable platen 12 is supported via the tie bars 18, so that the movable platen 12 is relatively thermally isolated, and the temperature distribution is hardly generated above and below the movable platen 12.

  Hereinafter, manufacturing of a lens using the injection molding machine 10 of FIG. 1 will be described. First, the mold temperature controller 17 heats the fixed mold 41 and the movable mold 42 to a temperature suitable for molding. Next, the opening / closing drive device 15 is operated to advance the movable platen 12 to start mold closing. Even when the movable platen 12 moves to the fixed platen 11 side and the mold closing is completed until the fixed die 41 and the movable die 42 come into contact with each other, the closing operation of the opening / closing drive device 15 is further continued. Then, mold clamping is performed to clamp the fixed mold 41 and the movable mold 42 with a necessary pressure. Next, the injection device 16 is operated to inject the molten resin into the mold space between the clamped fixed mold 41 and the movable mold 42 with a necessary pressure. At this time, the mold temperature controller 17 moderately heats the fixed mold 41 and the movable mold 42, and the molten resin supplied from the injection device 16 is slowly cooled. When the molten resin is cooled and solidified sufficiently, the opening / closing drive device 15 is operated to open the mold to retract the movable platen 12. Along with this, the movable mold 42 moves backward, and the fixed mold 41 and the movable mold 42 are separated. As a result, the resin molded product can be taken out from between the fixed mold 41 and the movable mold 42.

  Hereinafter, a specific experimental example using the fixed mold 41 and the movable mold 42 shown in FIG. In FIG. 2B, regions A1 to A8 on the fixed mold 41 indicate temperature measurement points on the template 71 in the experiment. The injection molding machine 10 shown in FIG. 1 was operated under the same conditions as during molding. When the temperature of the fixed mold 41 shown in FIG. 2A and the like is measured a plurality of times with a set temperature of 133.5 ° C., the temperatures of the regions A1 to A8 are averaged at 128.8 ° C. and 128.8 ° C., respectively. 128.5 ° C., 128.3 ° C., 128.3 ° C., 128.4 ° C., 128.1 ° C., and 128.2 ° C., and the maximum temperature difference was 0.7 ° C. In addition, when the board | plate material formed with the material similar to the attachment board 72 grade | etc., Except the heat equalization member 83 is arrange | positioned, set temperature is 125 degreeC and the temperature of each area | region A1-A8 is 117.5 on average, respectively. , 117.1 ° C, 115.9 ° C, 115.9 ° C, 116.8 ° C, 117.6 ° C, 118.0 ° C, 117.9 ° C, and the maximum temperature difference was 2.1 ° C. It was. That is, by disposing the heat equalizing member 83 between the mounting plate 72 and the heat insulating plate 82, the temperature distribution on the surface of the template 71 can be reduced and the temperature difference can be eliminated. Further, when the Newton error of the lens molded using the injection molding machine 10 shown in FIG. 1 was measured, the relative difference in Newton error obtained with each lens corresponding to the four lens recesses 74d was 0. The number was 5 or less. In addition, when the same prehardened steel plate material as the template 71 was disposed instead of the heat uniformizing member 83, the relative difference (runout width) of the Newton error as described above was about 2.0. .

  As described above, according to the fixed mold 41 and the movable mold 42 of the present embodiment, in the fixed mold 41 that is the first mold, the mold is disposed between the mounting plate 72 and the heat insulating plate 82. Since the heat uniformizing member 83 having a higher thermal conductivity than the plate 71, the mounting plate 72, and the heat insulating plate 82 is provided, the heat uniformizing member 83 is a mounting plate having a temperature difference generated in the heat insulating plate 82. The influence on 72 etc. will be suppressed. That is, even when a temperature distribution is generated in the heat insulating plate 82 itself that prevents heat flow to the stationary platen 11 that is the support base during molding injection or cooling, the influence of the heat insulating plate 82 on the mounting plate 72 and the like is reduced. Is done. Thereby, the mold plate 71 and the mounting plate 72 are cooled relatively uniformly, the temperature distribution of the mold inner surface 71i at the time of cooling after the injection of the resin can be reduced, and a resin molded product with high optical performance can be molded with a high yield.

[Second Embodiment]
Hereinafter, a method for producing a molding die and a resin molded product according to the second embodiment will be described. In addition, the manufacturing method of the molding die and the resin molded product according to the second embodiment is a modification of the first embodiment, and parts that are not particularly described are the same as those in the first embodiment.

  As shown in FIG. 3, in the case of the fixed die 141 constituting the molding die according to the present embodiment, the die plate 71 is not a space between the mounting plate 72 and the heat insulating plate 82 but two stacked die members. The heat equalizing member 83 is inserted between the mounting plate 72 and the mounting plate 72.

  According to the molding die of this embodiment, the fixed die 141 is disposed between the mold plate 71 and the mounting plate 72, and has a higher heat than the mold plate 71, the mounting plate 72, and the heat insulating plate 82. Since the heat homogenizing member 83 having conductivity is provided, the heat homogenizing member 83 suppresses the influence of the temperature difference generated in the heat insulating plate 82 on the mounting plate 72 and the like. Thereby, the mold plate 71 is cooled relatively uniformly, the temperature distribution of the mold inner surface 71i at the time of cooling after injection of the resin can be reduced, and a resin molded product with high optical performance can be molded with a high yield.

  In the present embodiment, an additional heat uniformizing member 83 can be disposed between the mounting plate 72 and the heat insulating plate 82.

[Third Embodiment]
Hereinafter, a method for manufacturing a molding die and a resin molded product according to the third embodiment will be described. The method for manufacturing a molding die and a resin molded product according to the third embodiment is a modification of the first embodiment, and parts that are not particularly described are the same as those in the first embodiment.

  As shown in FIG. 4, in the case of the fixed mold 241 constituting the molding mold according to the present embodiment, the heat equalizing member 83 is not disposed between the mounting plate 272 and the heat insulating plate 82, but the mounting plate 272 itself is a heat uniformizing member. That is, the template 71 alone is a mold member.

  According to the molding die of the present embodiment, the fixed die 241 is disposed between the mold plate 71 and the heat insulating plate 82 and has a heat conductivity higher than that of the mold plate 71 and the heat insulating plate 82. Since the mounting plate 272 as a uniformizing member is provided, the mounting plate 272 suppresses the influence of the temperature difference generated in the heat insulating plate 82 and the like on the template 71. Thereby, the mold plate 71 is cooled relatively uniformly, the temperature distribution of the mold inner surface 71i at the time of cooling after injection of the resin can be reduced, and a resin molded product with high optical performance can be molded with a high yield.

[Fourth Embodiment]
Hereinafter, a method for manufacturing a molding die and a resin molded product according to the fourth embodiment will be described. The method for manufacturing a molding die and a resin molded product according to the fourth embodiment is a modification of the first embodiment, and parts not specifically described are the same as those of the first embodiment.

  As shown in FIGS. 5 (A) and 5 (B), the fixed mold 41 constituting the molding mold according to the present embodiment is a jacket 378 formed of a linearly extending portion of the mold plate 71 and the mounting plate 72. Is forming. In the case of this embodiment as well, a heat uniformizing member 83 having a relatively high thermal conductivity can be disposed between the template 71 and the mounting plate 72. Further, the heat uniformizing member 83 can be removed to make the mounting plate 72 itself a heat uniformizing member having a relatively high thermal conductivity.

[Fifth Embodiment]
Hereinafter, a method for manufacturing a molding die and a resin molded product according to the fifth embodiment will be described. In addition, the manufacturing method of the molding die and the resin molded product according to the fifth embodiment is a modification of the first embodiment, and parts that are not particularly described are the same as those in the first embodiment.

  As shown in FIGS. 6 (A) and 6 (B), the fixed mold 41 constituting the molding die according to the present embodiment forms a rectangular frame-shaped jacket 478 in the mold plate 71 and the mounting plate 72. Yes. In the case of this embodiment as well, a heat uniformizing member 83 having a relatively high thermal conductivity can be disposed between the template 71 and the mounting plate 72. Further, the heat uniformizing member 83 can be removed to make the mounting plate 72 itself a heat uniformizing member having a relatively high thermal conductivity.

  Although the present invention has been described based on the above embodiments, the present invention is not limited to the above embodiments, and various modifications are possible. For example, aluminum or pure copper can be used as the heat uniformizing member 83 and the mounting plate 272.

  In addition, as the heat uniformizing member 83 and the mounting plate 272, stainless steel or other plate-like body incorporating a heat pipe can be used. In this case, the temperature equalizing effect by the heat equalizing member 83 can be enhanced.

  Further, as the heat uniformizing member 83 and the mounting plate 272, a stainless steel or other plate-like body incorporating a heat lane can be used. The heat lane is a steel material with a built-in flow path filled with an organic medium such as pure water, alternative chlorofluorocarbon, or butane, and the temperature equalizing effect by the heat equalizing member 83 can be enhanced.

  In addition, as at least part of the heat uniformizing member 83 and the mounting plate 272, a material composed of aluminum and carbon nanofiber, a material composed of aluminum or copper and carbon material, aluminum and ceramics such as Al-SiC A cemented carbide that is a composite material obtained by sintering carbides of group IVa, Va, and VIa group metals with an iron-based metal such as Fe, Co, and Ni, a graphite sheet formed of carbon, and the like Can be used.

  Moreover, the arrangement | positioning location of the jacket 78 for distribute | circulating a thermal medium is not restricted to the template 71, the attachment plate 72, or these, but can be various places. Further, the jacket 78 is not limited to oil temperature control and water temperature control, but can be replaced with various systems such as a cartridge heater, a casting heater, and a hot plate. Here, the temperature adjusting means such as the jacket 78 is not limited to the arrangement pattern illustrated in FIG. 2B, FIG. 5B, FIG. 6B, and the like, and includes various patterns including straight lines, curves, and the like. it can.

  Moreover, in the said embodiment, although the heat equalization member 83 is provided only in the fixed metal mold | die 41,141,241 side, the same heat equalization member 83 can also be provided in the movable metal mold | die 42 side. When the heat equalizing member 83 is provided only on the movable mold 42 side supported by the movable platen 12, the movable plate 12 movable mold 42 becomes the first mold and the fixed mold 41 supported by the fixed platen 11. Is the second mold.

  Moreover, in the said embodiment, although the four cores 74 are hold | maintained at the template 71, this invention is not restricted to this, The template which hold | maintains two, three, or five or more cores 74 71.

  In the above embodiment, the injection molding machine 10 is a horizontal type, that is, the fixed mold 41 and the movable mold 42 are horizontally opposed to each other, but the present invention is not limited to this. That is, a vertical injection molding machine in which the fixed mold 41 and the movable mold 42 are arranged to face each other in the vertical direction can be used.

  In the above embodiment, the injection molding machine 10 is an apparatus for molding a thermoplastic resin. However, an apparatus for molding a thermosetting resin by appropriately modifying the injection molding machine 10. It can be. Also in this case, the uniformity of the surface temperature of the fixed mold 41 and the like can be improved.

  Further, the fixed mold 41 and the movable mold 42 of the above-described embodiment can be used not only for resin molding but also for glass molding, silicone rubber molding, magnesium alloy molding, and the like.

  Moreover, in the said embodiment, although the movable board 12 is supported via the tie bar 18, it can also be set as the structure where the movable board 12 is supported via a slide guide.

DESCRIPTION OF SYMBOLS 10 Injection molding machine 11 Fixed platen 11a Nozzle insertion slot 12 Movable platen 13 Clamping plate 15 Opening / closing drive device 16 Injection device 16a Cylinder 16d Resin injection nozzle 17 Mold temperature controller 21 Opening / closing control part 41,141,241 Fixed mold 42 Movable mold 71 Template 71 b Runner recess 71 c Gate surface 71 h Core hole 71 i Mold inner surface 72 Mounting plate 74 Core 74 d Lens recess 77 Sprue bush 78 Jacket 79 Temperature sensor 81 Locate ring 82 Heat insulation plate 83 Heat equalization member FP flow path PS1, PS2 Parting surface

Claims (6)

A molding comprising a first mold having a first transfer surface and a second mold having a second transfer surface, and forming a mold space between the first transfer surface and the second transfer surface by closing the mold. Mold,
The first mold is
Supported by the support base,
A template holding a core having the first transfer surface ;
A mounting plate for supporting the template together with the core from behind;
A heat insulating plate disposed between the mounting plate and the support base;
Said mold plates being disposed between the heat insulating plate and the mounting plate, the mounting plate and forming die and having a heat uniformizing member having a high thermal conductivity as compared with the heat insulating plate . A molding comprising a first mold having a first transfer surface and a second mold having a second transfer surface, and forming a mold space between the first transfer surface and the second transfer surface by closing the mold. Mold,
The first mold is
Supported by the support base,
A template holding a core having the first transfer surface;
A mounting plate for supporting the template together with the core from behind;
A heat insulating plate disposed between the mounting plate and the support base;
A molding die having a heat uniformizing member disposed between the template and the mounting plate and having a higher thermal conductivity than the template, the mounting plate, and the heat insulating plate. . A molding comprising a first mold having a first transfer surface and a second mold having a second transfer surface, and forming a mold space between the first transfer surface and the second transfer surface by closing the mold. Mold,
The first mold is
Supported by the support base,
A template holding a core having the first transfer surface;
A mounting plate for supporting the template together with the core from behind;
A heat insulating plate disposed between the mounting plate and the support base,
The molding die according to claim 1, wherein the mounting plate is a heat uniformizing member having a higher thermal conductivity than the mold plate and the heat insulating plate . The said 1st metal mold | die is attached to the said support base | substrate which is a stationary platen, The said 2nd metal mold | die is attached to a movable board, The any one of Claim 1 to 3 characterized by the above-mentioned. Molding mold. Wherein the first mold is mounted to the support base is movable platen, said second mold according to any one of claims 1, characterized in that attached to the stationary platen to claim 3 Molding mold. A method for producing a resin molded product, wherein the molding die according to any one of claims 1 to 5 is used.