JP2010173280A - Mold for molding very thin molding and method for molding very thin molding - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mold for molding a very thin molding, which can well pack a molten resin to the other end of a cavity and mold the molding in a good condition and a method for molding the molding. <P>SOLUTION: In the mold 11 of the very thin molding P in which the cavity 14 is formed between a fixed mold 13 and a movable mold 12, and a gate P3 is installed at the end of the cavity 14, the cavity 14 which can mold the very thin molding P in which a plate thickness T is 0.2-0.5% of the flow length L between a gage adjoining part P4 and the farthest other end P5 is provided. On the surface side of blocks 18, 22, 39, and 42 which form the cavity 14 or a runner P2, a thermal barriers 51 and 57 having heat conductivity lower than that of the base material of the blocks 18, 22, 39, and 42 are formed. On the surface side of the thermal barriers 51 and 57, heat insulating layers 52 and 58 having heat conductivity higher than that of the thermal barriers 51 and 57 are formed. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

    The present invention relates to a molding die and a molding method for an ultra-thin molded product used for injection molding.

  As a molding die for molding a thin plate molded product such as a light guide plate by an injection molding machine, the one described in Patent Document 1 is known. However, a recent light guide plate has a diagonal size of 3.5 inches, a thickness of 0.25 mm, a diagonal size of 8 inches, a thickness of 0.6 mm, a diagonal size of 14 inches, and a thickness of 1 as an example. The thickness has been further reduced to 0.0 mm, etc., and in the conventional molding die as in Patent Document 1, the other end portion (flow end portion) of the cavity cannot be filled or the thickness is not uniform. There was a case. On the other hand, there are cases where the molten resin can be filled up to the other end of the cavity by increasing the injection speed to, for example, 1000 mm / sec or more, but the cost due to internal stress defects and burrs, and the increase in the size of the injection device. There was a problem such as up.

  On the other hand, a molding die described in Patent Document 2 is known as a molding die for improving transferability of a light guide plate or the like. Patent Document 2 relates to a molding die such as a light guide plate, and describes that a heat insulating layer having a thermal conductivity of 20 W / m · K or less is provided on a cavity forming surface, and a metal layer is further formed on the surface. Yes. However, since Patent Document 2 is not a molding die for performing compression molding, there is a problem that the cavity interval is constant, and it is difficult to fill the molten resin when molding an extremely thin molded product. Patent Document 2 does not disclose the resin material to be used, the molding conditions of the injection molding machine or the molding die, the thickness of the heat insulating layer or the metal layer of the molding die, etc. It cannot be said that it has been disclosed, and the corresponding effect was also unknown.

  Further, Patent Document 3 discloses that a metal sprayed layer is provided on a cavity forming surface of a molding die for a disk substrate. However, the disc substrate has a thickness of 0.6 mm even in the case of a DVD, and the flow length of the molten resin from the gate adjacent portion to the farthest other end is also relatively short, around 52.5 mm. It could not be diverted immediately to form the product. Further, although molding conditions such as injection speed are different between the molding of the disk substrate and the molding of the ultra-thin molded product, Patent Document 3 discloses the molding conditions for satisfactory injection-filling of the ultra-thin molded product. Since it was not, it was not a reference when molding ultra-thin molded products.

JP 2008-307882 A (0017, FIG. 2) JP 2006-44246 A (Claim 2, FIG. 2) JP 2008-183765 A (Claim 1, FIG. 1, FIG. 2)

  In the present invention, in view of the above problems, when forming an ultra-thin molded product, the molten resin can be satisfactorily filled up to the other end of the cavity, and the ultra-thin molded product can be molded in a good state. An object is to provide a molding die and a molding method for a molded product.

  The molding die of the ultra-thin molded product of the present invention is a molding die of an ultra-thin molded product in which a cavity is disposed between a stationary mold and a movable mold, and a gate is provided at an end of the cavity. A cavity capable of forming an ultra-thin molded product having a plate thickness dimension of 0.2% to 0.5% with respect to the flow length dimension from the adjacent gate portion to the farthest other end portion is provided to form the cavity or runner. A heat insulating layer having a lower thermal conductivity than the base material of the block is formed on the surface side of the block, and a heat insulating layer having a higher thermal conductivity than the heat insulating layer is formed on the surface side of the heat insulating layer. It is characterized by that.

  The method for molding an ultra-thin molded product according to the present invention is the method for molding an ultra-thin molded product using the molding die according to claim 1, wherein at least the thickness of the cavity at the time of injection is greater than the thickness of the ultra-thin molded product. Further, the molten resin is injected in a spread state, and the molten resin in the cavity is compressed during or after the injection.

  The ultra-thin molded product molding die and ultra-thin molded product molding method according to the present invention includes an ultra-thin mold in which a cavity is disposed between a fixed mold and a movable mold, and a gate is provided at an end of the cavity. In the mold of the molded product, there is provided a cavity capable of molding an ultra-thin molded product having a plate thickness of 0.2% to 0.5% with respect to the flow length from the gate adjacent portion to the farthest other end. A heat insulating layer having a lower thermal conductivity than the base material of the block is formed on the surface side of the block forming the cavity or runner, and a higher thermal conductivity than the heat insulating layer is formed on the surface side of the heat insulating layer. Since the heat insulating layer is formed, the molten resin is particularly excellent in fluidity, and an ultra-thin molded product can be molded in a good state.

FIG. 1 is a horizontal sectional view of a molding die for an ultra-thin molded product of Example 1, showing a state before the start of injection. FIG. 2 is a horizontal sectional view of the molding die of the ultra-thin molded product of Example 1 and shows a state after completion of compression. FIG. 3 is a horizontal sectional view of the main part of FIG. FIG. 4 is a perspective view of an ultrathin light guide plate molded with the molding die of the ultrathin molded product of Example 1. FIG. FIG. 5 is a diagram showing the temperature transition of the runner formation surface in the molding die of the ultra-thin molded product when acrylic is used. FIG. 6 is a diagram showing the temperature transition of the cavity forming surface in the molding die for an ultra-thin molded product when acrylic is used. FIG. 7 is a diagram showing a temperature transition of a cavity forming surface in a molding die of an ultra-thin molded product when polycarbonate is used.

  Molds for ultra-thin molded products that are mounted on injection molding machines (including injection compression molding machines capable of injection compression molding and injection press molding in one field) are placed between fixed molds and movable molds. A cavity having a gate provided in the part is formed. The cavity of the molding die is an ultra-thin molded product (ultra-thin) having a plate thickness of 0.2% to 0.5% with respect to the flow length from the gate adjacent portion to the farthest other end (flow end). Resin plate) can be molded. On the surface side of the cavity forming block or runner forming block that forms the cavity (the surface of the base material or the surface through a separate member from the base material), as a heat insulating layer having a lower thermal conductivity than the base material of the block, A metal spray layer of 0.1 mm to 1.0 mm is formed by thermal spraying. And on the surface side of the metal sprayed layer (the surface of the metal sprayed layer or the surface through a separate member from the metal sprayed layer), a heat retaining layer having a higher thermal conductivity than the heat insulating layer has a thickness of 0.01 mm to 0.50 mm. The metal layer is formed by a method such as plating.

  The thickness of at least the cavity can be changed, and the molten resin is injected in a state where the thickness of the cavity is wider than the plate thickness of the ultra-thin molded product at the time of injection. The injection speed at this time is more preferably 300 mm / sec to 900 mm / sec, which is relatively high. The resin used is an olefin resin such as acrylic resin (PMMA), polycarbonate resin (PC), cycloolefin polymer, or a mixture thereof in an optical ultra-thin molded product. Among them, acrylic resin (especially light guide plate grade) is excellent in fluidity and satisfies optical performance, so that it is used for forming an ultrathin light guide plate. When the acrylic resin is used, the temperature of the cooling medium for cooling the cavity forming surface of the molding die is set to 40 ° C to 100 ° C.

  The molding die 11 for the ultrathin light guide plate, which is the molding die for the ultrathin molded product shown in FIGS. 1 to 4, will be described. The molding die 11 for the ultra-thin light guide plate includes a movable die 12 as a first die and a fixed die 13 as a second die. A cavity 14 having a variable volume and thickness is formed. In the cavity 14, it is possible to form an ultra-thin molded product having a thickness T of 0.2% to 0.5% with respect to the flow length L from the gate adjacent portion P4 to the farthest other end P5 shown in FIG. It has become. In the above description, the thickness T of the ultra-thin light guide plate P is the thickness of the main surface (transfer surface) of the ultra-thin light guide plate P and is the average thickness when a pattern is formed. In the case where the gate adjoining portion P4 is a wide gate, it is a portion closest to the farthest other end portion P5. The dimension of the ultra-thin light guide plate P is measured when the shrinkage or the like is completed after a certain period of time has elapsed after completion of molding. However, the cavity thickness at the time of completion of mold clamping of the molding die 11 (how far the cavity 14 can be thinned in a state where the molten resin is not injected and filled) includes those thinner than the plate thickness dimension T.

The movable mold 12 of the molding die 11 includes a main body portion 15 (mother mold), a core block 16 including a cavity forming block 22, a movable frame block 17, a runner forming block 18, a gate cutter 19, a protruding pin 20, and the like. ing. The gate cutter 19 and the protruding pin 20 are not essential but are provided as necessary. The core block 16 is fixed to the main body 15, and the movable frame block 17 is attached to the main body 15 via a spring. Therefore, the position of the core block 16 and the movable frame block 17 can be relatively changed in the mold opening / closing direction. The movable frame block 17 may also be replaceable depending on the ultrathin light guide plate P to be formed, or the light incident surface forming block 17a may be provided independently and replaceable. In the first embodiment, the core block 16 includes a spacer block 21 on the main body 15 side and a cavity forming block 22 (block) on the front surface side. SUS420J2 (13Cr-0.3C), which is martensitic stainless steel, is used as the base material of the main part including the cavity forming block 22 of the molding die 11, and its thermal conductivity is 21 W / (m · k). ), The coefficient of thermal expansion is about 11 × 10 ⁻⁶ / ° C.

  As particularly shown in FIG. 3, the front surface portion of the cavity forming block 22 is cut to a depth of 0.4 mm, and a thermal spray bonding surface 23 is formed at the bottom. The sprayed joint surface 23 may be processed by shot blasting or the like, or may be coated with another member so that the adhesion with the metal sprayed layer 51 described later is good. A metal sprayed layer 51 having a thickness of 0.3 mm is first formed on the sprayed joint surface 23 as a heat insulating layer. In the present invention, the “metal spray layer” means “a fine particle in a molten or semi-molten state by introducing a metal (a material containing a certain amount of ceramic as a secondary material) into a high-temperature gas flame or plasma environment. And a film formed by spraying on the substrate surface.

The metal material used as the metal sprayed layer 51 in Example 1 is a nichrome alloy of metco 700 (material model number), is made of Ni20 10W 9Mo 4Cu 1C 1B 1Fe, and has a particle diameter of 125 to 16 μm. With respect to metco700 (material model number), the thermal conductivity is about 13 W / (m · k), the coefficient of thermal expansion is about 13.2 × 10 ⁻⁶ / ° C., and the hardness is HV446 to 471 (all around normal temperature). However, as the thermal spray material, AMRRY625 ((material model number) Ni 21.5Cr 8.5Mo 3Fe 0.5Co), diaphragm 1005 ((material model number) Ni 21.5Cr 8.5Mo 3Fe 0.5Co), diaphragm4004NS ((material model number) Ni 14Cr 9.5Co 5Ti 4Mo 4W 3Al), diaphragm 1006 ((material model number) Ni 19Cr 18Fe 3Mo 1Co 1Ti), AMRRY964 ((material model number) Ni 31Cr 11Al 0.6Y), and the like are used. In addition, Monel, which is an alloy made of Ni, Cu, Fe, Al, Mn, C, Si, Hastelloy made by adding Mo, Cr to Ni, Inconel, Nimonic, which is an alloy made of Ni, Cr, Fe, Cu, Mo Are similarly used for thermal spray materials. Furthermore, a nichrome alloy such as 80Ni 20Cr or 85Ni 15Cr may be used as the thermal spray material, and the ratio of Ni and Cr is appropriately selected. In addition to Ni and Cr, the material model may be a Nichrome alloy appropriately added with W, Mo, Co, Ti, Al, B, Si, CTa, Hf, Nb, Zr, Y, etc. Further, those containing other compositions than the above are not excluded. These nichrome alloys themselves have a thermal conductivity of about 12 to 17 W / (m · k), and a thermal expansion coefficient of about 9.5 to 14 × 10 ⁻⁶ / ° C. Further, the thermal spray material may be a nickel-based alloy that does not contain Cr or that has a very small amount of Cr and does not fall within the category of nichrome. These nichrome alloys or nickel-base alloys are desirable because they are inexpensive as compared with other ceramic materials or titanium alloys described later as the thermal spray material.

  Furthermore, as the metal spray material, a titanium alloy, a zirconium alloy, a chromium alloy, or the like may be used in addition to the nichrome alloy. Moreover, even if it is stainless steel, it is good also considering the stainless steel (SUS420J2) which forms the cavity formation block 22 as a metal spraying material stainless steel whose heat conductivity is lower than heat conductivity. Furthermore, in the present invention, the thermal spraying of the cermet material is not excluded, but it is desirable to have excellent bondability with a metal and have a thermal expansion coefficient not significantly different from that of stainless steel, except for those with poor impact resistance. . Therefore, it is desirable that the ratio of the ceramic material made of carbide, nitride, and oxide is not more than a certain value (less than 40 wt%, desirably not more than 30 wt%). However, compared to thermal spray materials consisting only of metal materials, those containing ceramic materials are inferior in bondability (affinity) with metals and are expensive, so thermal spray materials made of metals with lower thermal conductivity than stainless steel are more expensive. This is desirable.

  The thermal conductivity of the metal material (bulk material) constituting the metal spray layer 51 is higher than that of 21 W / (m · k), which is the thermal conductivity of stainless steel (SUS420J2) forming the cavity forming block 22. Those having a low rate are mainly used, and as a result, the thermal conductivity of the entire metal sprayed layer 51 is also lower than that of the base material. However, in the present invention, when the molten resin is cooled by the cooling medium flowing through the cooling medium passage 55 of the cavity forming block 22, good thermal conductivity is required, so that the thermal conductivity is too low (for example, 4 W / When (lower than (m · k)) is used, depending on the thickness of the metal spray layer 51, there may be a case where heat insulation and thermal conductivity cannot be compatible. Further, when the exemplified metal material is used, the thickness of the metal sprayed layer 51 can be increased to a certain level (for example, 150 μm or more), which is desirable in terms of durability.

As for the thermal conductivity of the entire metal sprayed layer 51 having pores, the following description is made in “Spraying Technology Manual” edited by Masakatsu Magome.
That is, the thermal conductivity k can be expressed by the following empirical formula.
k≈kc (1-βP)
Kc = thermal conductivity of bulk material P = porosity (porosity) (%)
β = factor due to the microstructure of the substance and material.
According to the same book, a comparison between a cast material of copper and aluminum and a hot wire flame sprayed coating shows an example (table) in which the thermal conductivity of the same metal is 50% or less.
Also in the present invention, the metal sprayed layer 51 is assumed to be formed with a metal sprayed layer having a porosity of 0.5 to 10% with some exceptions as described later. It is assumed that the entire metal sprayed layer 51 having the pores has a thermal conductivity of about 50% of the metal material (bulk material). Therefore, even if the thermal conductivity of the nichrome alloy used in this embodiment is 13 W / (m · k), the thermal conductivity of the metal sprayed layer itself having pores is 13 W / (m · k) or less, for example, It is assumed that it is 5 to 13 W / (m · k).

In order to prevent the metal sprayed layer 51 from peeling off from the base material, it is desirable that the coefficient of thermal expansion of the metal sprayed layer 51 as a heat insulating layer is not largely different from that of the metal constituting the cavity forming block 22. . Specifically, the thermal expansion coefficient of stainless steel (SUS420J2) mainly constituting the cavity forming block 22 is 11.5 × 10 ⁻⁶ / ° C., and the heat of stainless steel used as the cavity forming block 22 is also used. Since the expansion coefficient is also about 11 × 10 ⁻⁶ / ° C. to 17 × 10 ⁻⁶ / ° C., the thermal expansion coefficient of the metal sprayed layer 51 is also about 9.5 × 10 ⁻⁶ / ° C. to about 18 × 10 ⁻⁶ / ° C. It is desirable that

  The hardness of the metal sprayed layer 51 is not less than 400 HV, even if it is slightly inferior to the hardness (500 to 520 HV) of the stainless steel (SUS420J2) that mainly constitutes the cavity forming block 22, and the metal sprayed layer of nickel-based alloy. The hardness of 51 is usually around 450 HV. Therefore, it can be said that the metal sprayed layer 51 of the present invention has higher durability against physical force generated during molding including impact, as compared with the heat insulating layer of the prior art.

  Nichrome alloy (metco 700) is sprayed by plasma spraying. In the present embodiment, the thermal spraying of metco 700 is performed on the sprayed joint surface 23 in which the cavity forming block 22 is cut at an injection point temperature of 1300 ° C., an injection device internal temperature (particle temperature) of 2000 ° C., and a workpiece temperature of 150 ° C. And the porosity of the metal sprayed layer sprayed by plasma spraying is 0.5 to 8%. However, in the present invention, since the heat insulating layer is formed by the metal sprayed layer 51, it is desirable that the porosity is high, and it is more desirable that the porosity is 2% or more. The size of the pores and the particle diameter are almost the same as the material diameter, and most of them are 125 to 16 μm. However, the porosity can also be changed by changing the spraying state, such as changing the spraying distance. Further, as the formation of the metal sprayed layer 51, a metal sprayed layer having a porosity of 5 to 10% can be formed by using a spraying method that increases the porosity such as powder flame spraying or arc spraying. When a thermal spray material having a lower thermal conductivity than that of the metco 700 is used, the porosity may be set to about 0 to 2% by the plasma spraying or the high-speed flame spraying. Further, after forming the metal spray layer having pores, the pores may be impregnated with other highly heat-insulating members.

  In forming the metal spray layer 51 by plasma spraying, the metal spray layer 51 of nichrome alloy is initially formed with a thickness of about 0.5 to 0.8 mm on the sprayed joint surface 23 of the cavity forming block 22. Then, the metal spray layer 51 is thinned by polishing to form a 0.3 mm metal spray layer 51. The reason why the thermal spraying is thicker than the thickness of the metal sprayed layer 51 that is finally required and then the polishing is performed is that the surface as-sprayed is uneven, so that the surface 51a is mirror-finished by polishing. It is to make it. The thickness of the metal spray layer 51 is, for example, 0.1 to 1.0 mm (more desirably 0.2 to 0.5 mm). In the case where the heat insulating layer is formed only with conventional zirconia or tin, it is extremely difficult to polish the surface, but in the present invention, such a problem is eliminated, and reprocessing by respraying becomes easy. .

  In addition, the heat insulation layer which consists of the metal sprayed layer 51 formed in the surface side (surface of a base material or the surface through a different member from the base material) of the cavity formation block 22 may be formed in two or more layers. In that case, holes on the surface 51a side become inconspicuous by forming different thermal sprays having a low porosity on the surface 51a side of the metal spray layer having a high porosity. In addition, the metal material may form two or more metal sprayed layers with the same metal material, or may form two or more metal sprayed layers with different metal materials. The metal spray layer 51 does not exclude a layer using a spray layer such as ceramic.

  A metal layer 52 having a thickness of 0.1 mm is formed as a heat retaining layer on the surface 51a side of the metal sprayed layer 51 which is a heat insulating layer. The metal material used as the metal layer 52 in Example 1 is nickel phosphorus, and the thermal conductivity is about 90 to 120 W / (m · k) although it varies depending on the phosphorus content. Note that the heat insulating layer can achieve its purpose if the heat conductivity of the heat insulating layer is higher than the heat conductivity of the heat insulating layer, and may be stainless steel or the like, but more preferably the nickel phosphorus, nickel alloy, etc. A nickel base or a metal (including various alloys) having a thermal conductivity of about 70 to 120 W / (m · k) such as hard chromium is used.

The metal layer 52 as the heat retaining layer is formed by a method other than spraying so that there are almost no pores, and is generally formed by a plating process such as electroless plating. The thickness of the metal layer 52 such as a nickel phosphorus plating layer is more preferably 0.01 mm to 0.50 mm. The metal layer 52 may be formed by any method other than plating as long as it can form a metal layer having no pores in the thickness. The purpose of forming the metal layer 52 as the heat retaining layer on the surface 51a side of the metal spray layer 51 as the heat insulating layer is as follows. The first purpose is to suddenly increase the surface temperature of the cavity forming surface 53a of the cavity forming block 22 when the molten resin comes into contact with the molten resin so that it can be maintained for a certain period of time. Next, as a second purpose, the metal sprayed layer 51 is polished, but fine pores remain on the surface thereof, so that the surface is smoothed by forming the metal layer 52 such as the nickel phosphorous plating layer. It is because it can be made. At this time, generally, the surface of the metal layer 52 is also polished. Next, the third purpose is also performed for protecting the surface of the cavity forming surface 53a. For example, when a hard chromium layer (thermal conductivity 93.7 W / (m · k), thermal expansion coefficient 17 × 10 ⁻⁶ / ° C.) is used as the metal layer 52, it is particularly advantageous for surface protection. Next, as a fourth object, a metal plating layer is formed as a base material layer when the pattern 59 is engraved on the cavity forming surface 58a as shown on the fixed mold 13 side described later. When the pattern 59 is engraved, a nickel phosphorus plating layer having a relatively low hardness is preferably used. In this method of forming the pattern 59 on the metal layer 58 or the like, it is not necessary to attach a stamper at the time of transfer, and if there is a problem with the luminance distribution or the like, the pattern is formed after the plating layer is polished or formed again. It is excellent in that it can be engraved again.

  In Example 1, Wc-co having a thickness of 0.001 mm to 0.01 mm (thermal conductivity 60 W / (m · k)) for the purpose of increasing wear resistance and obtaining smoothness in the upper layer of the heat retaining layer. The coating layer 53 is laminated. The surface of the coating layer 53 is a cavity forming surface 53a. The coating layer 53 may be a coating layer of other materials such as DLC and Tin. Further, when a coating layer such as DLC or Tin is formed by vapor deposition, the thermal conductivity is about 1 to 2 W / (m · k), but the thickness is about 0.001 mm. The degree to which the temperature rises is not so much affected, and surface smoothness can be obtained particularly when DLC is used. The coating layer is not essential, and the metal layer 52 that is a heat retaining layer may be the surface of the cavity 14.

  In the first embodiment, the stamping die 11 is not provided with a stamper, but a stamper may be provided. In that case, a stamper having a plate thickness of about 0.3 mm and a relatively high thermal conductivity such as nickel may be used as the heat retaining layer, and a stamper may be further disposed on the metal layer 52 as the heat retaining layer.

  Also, as shown in FIG. 3, on the surface side of the cavity forming block 22, a heat insulating layer made of a metal sprayed layer 51 of a nichrome alloy and a heat insulating layer made of a metal layer 52 of a nickel phosphorus plating layer are formed. Although it is almost the entire surface of the cavity forming block 22 on the cavity side, the cavity forming block 22 is not formed in a portion having a width of about 0.5 mm adjacent to the movable frame block 17. This is because the end portion (substantially the entire circumference) of the cavity forming block 22 is moved relative to the movable frame block 17 so that the metal spray layer 51 and the metal layer 52 may be peeled off by sliding. Because there is. A Wc-co coating layer 54 and the like are formed on the side surface portion of the cavity forming block 22 facing the movable frame block 17 to enhance the slidability. The Wc-co coating layer 54 is formed so that the coating layer 53 on the cavity surface and the side surface portion are continuously continuous at the same time.

  A cooling medium flow path 55 through which the cooling medium flows is disposed inside the cavity forming block 22. The cavity forming block 22 can be changed according to the ultra-thin light guide plate P to be molded. Further, the thickness of the cavity 14 may be adjusted by forming a metal plating layer on the back surface of the cavity forming block 22 or sandwiching a thin plate such as a shim. Furthermore, the core block may be individually controlled and moved forward by a hydraulic cylinder or the like provided individually in the molding die 11.

  A runner forming block 18 (block) that forms a runner forming surface 56 on the movable mold 12 side is integrally fixed to the central portion of the main body 15. At the center of the runner forming block 18, a protruding pin 20 is provided so as to be able to advance and retreat, and a hydraulic cylinder 27, which is a drive mechanism for the protruding pin 20, is provided in the movable plate 26. Further, a cooling medium flow path 28 through which a cooling medium for cooling the runner P2 and the sprue P1 is sent is formed in the runner forming block 18 or in the surrounding blocks. On the runner forming surface 56 of the runner forming block 18, a heat insulating layer having a lower thermal conductivity than the base material of the runner forming block 18 is formed like the cavity forming block 22, and the heat insulating layer is formed on the surface side of the heat insulating layer. Although a heat insulating layer having a higher thermal conductivity than the cavity forming block 22 is formed in detail, the description is omitted. Note that the position of the runner forming block 18 may be changed relative to the core block 16 by a spring, similarly to the movable frame block 17.

  A gate cutter 19 is provided in the clearance between the core block 16 and the runner forming block 18 so as to be freely advanced and retracted by a hydraulic cylinder 33. The gate of Example 1 is a film gate suitable for filling molten resin into the cavity 14 for the ultrathin light guide plate P. And the part adjacent to the edge part of the gate cutter 19 respond | corresponds to the gate adjacent part P4 of the ultra-thin light-guide plate P shown by FIG.

  Next, the fixed mold 13 of the molding mold 11 of Example 1 will be described. As shown in FIGS. 1 and 2, the stationary mold 13 attached to the stationary platen 34 includes a main body 35 (mother mold), a core block 36, a contact block 37, a mescutter 38, a runner forming block 39, and a sprue bush. 40 mag. The core block 36, the contact block 37, the runner forming block 39, and the like are fixed to the main body portion 35. The core block 36 includes a spacer block 41 and a cavity forming block 42 (block) that constitutes a cavity forming surface 58a. Similar to the movable mold 12, the surface side of the stainless steel that is the base material of the cavity forming block 42 (the surface of the base material or the surface through a separate member from the base material) is more than the base material of the cavity forming block 42. A heat insulating layer composed of a metal sprayed layer 57 having a low thermal conductivity is formed, and the surface of the heat insulating layer (the surface of the metal sprayed layer 57 or a surface through a separate member from the metal sprayed layer 57) is heated more than the heat insulating layer. A heat insulating layer made of the metal layer 58 having high conductivity is formed. Since these details are almost the same as those of the cavity forming block 22, they are omitted. However, in Example 1, a pattern 59 for transferring to the ultrathin light guide plate P is formed on the cavity forming surface 58a of the metal layer 58 of the fixed mold 13. The pattern 59 is not essential and may be formed on at least one mold. The combination of the heat insulating layer and the heat insulating layer may be provided only on the mold on the side where the pattern is engraved.

  Further, the runner forming surface 60 of the runner forming block 39 (block) of the fixed mold 13 is also heated on the surface side (the surface of the base material or the surface through a separate member from the base material) than the base material of the runner forming block 39. A heat insulating layer made of a metal spray layer having a low conductivity is formed, and a heat insulating layer made of a metal layer having a higher thermal conductivity than the heat insulating layer is formed on the surface side of the heat insulating layer. In some cases, a heat insulating layer and a heat retaining layer may be similarly formed on the inner surface of the sprue bush 40. Further, in the vicinity of the runner forming surface 60 inside the runner forming block 39, a cooling medium flow path 29 is formed through which a cooling medium for cooling the runner P2 and the sprue P1 is sent.

  In the first embodiment, the movable frame block 17 whose position can be changed relative to the core block 16 is a molding die 11 of a type called a flat die that comes into contact with the contact block 37 of the fixed die 13. As described above, the present invention can also be applied to a type called an inlay mold in which a convex portion of one mold is fitted into a concave portion of the other mold and a volume variable cavity is formed therebetween. . In the present invention, a compression mold in which at least the thickness of the cavity 14 is changed is desirable, but not limited thereto.

  The injection molding machine 24 to which the molding die 11 of the ultrathin light guide plate of the first embodiment is attached is an injection compression molding machine capable of injection compression molding (including injection press molding in one field thereof). And a mold clamping device 25 composed of a movable plate 26, an injection device 44, and the like. The mold clamping device 25 can control the position of the movable platen 26 with high accuracy. The injection device 44 can perform high-speed injection.

  Next, a molding method (injection molding method) of the ultrathin light guide plate P, which is an ultrathin molded product, by the injection molding machine 24 to which the molding die 11 for the ultrathin light guide plate is attached will be described with reference to FIGS. To do. In Example 1, an ultrathin light guide plate P having a diagonal thickness of 8 inches and a uniform thickness of 0.6 mm is molded using acrylic resin (PMMA). In the present invention, as shown in FIG. 4, for example, when the diagonal dimension is 3.5 inches (flow length L of the cavity 14 is L = 7.5 cm), the plate thickness is 0.15 mm to 0.375 mm, and the diagonal dimension is 8 inches. (Cavity flow length dimension L = 17.5 cm), plate thickness 0.35 mm to 0.875 mm, Diagonal dimension 14 inches (Cavity flow length dimension L = 29.7 cm), plate thickness 0.594 mm to 1.485 mm As described above, an ultra-thin light guide plate P, which is an ultra-thin molded product having a plate thickness dimension T of 0.2% to 0.5% with respect to the flow length dimension L from the gate adjacent portion P4 to the other end portion P5, is formed. It is. The flow length L of the ultrathin light guide plate P varies depending on the shape, gate width, gate position, and the like of the ultrathin light guide plate P.

  Generally, the ultra-thin light guide plate P formed of acrylic resin (grade for exclusive use of light guide plate) has a medium to large size with a long flow length L. An acrylic resin is excellent in optical properties, but has a property of being easily broken by internal stress. Therefore, an injection speed higher than 900 mm / sec is not preferable because the internal stress of the ultrathin light guide plate P is deteriorated. The temperature of the front portion of the heating cylinder of the injection molding machine 24 is 250 ° C. (more preferably 230 ° C. to 320 ° C.), and a cooling medium that cools the cavity forming surfaces 53a and 58a of the fixed mold 13 and the movable mold 12. The temperature of each is set to 60 ° C. (preferably 40 ° C. to 100 ° C. as an example), and the temperature of the cooling medium for cooling the sprue P1 and runner P2 is also set to 60 ° C. (more preferably 40 ° C. to 100 ° C.). To do.

  When the mold clamping device 25 of the injection molding machine 24 is driven and the mold is closed, the movable platen 26 and the cavity 26 are moved to a position where the cavity interval of the cavity 14 before the mold clamping is completed is slightly opened (position where the volume is slightly expanded). The movable mold 12 is temporarily stopped. (Or, once the movable mold 12 is advanced to the mold clamping completion position and then retracted to the stop position), the mold clamping force at that time is a relatively low value, and the movable platen 26 and the like are in the mold clamping direction and the mold opening direction. The oil is sealed in the mold clamping cylinder of the mold clamping device 25 so as not to move to both. Alternatively, in the case of a mold clamping device using a servo motor, the servo lock state is set. Then, the screw of the injection device 44 of the injection molding machine 24 is advanced to inject molten resin toward the respective cavities 14 through the sprue P1, the runner P2, and the gate P3. The injection speed at this time is 500 mm / sec (desirably 300 to 900 mm / sec, more desirably 300 to 700 mm / sec).

  At this time, as shown in FIG. 5, the temperature of the heat retaining layer of the runner forming surfaces 56, 60 is about 60 ° C. which is the cooling medium temperature due to the heat insulating effect of the heat insulating layer. The temperature is rapidly raised to near (decrease). The temperature rise curves of the runner forming surfaces 56 and 60 are raised with a sharper curve than a conventional mold without a heat insulating layer and a heat retaining layer. Therefore, the formation of the skin layer on the surfaces of the runner forming surfaces 56 and 60 is delayed, and the fluidity of the molten resin is ensured. Further, when the cooling heat is transmitted from the mold side having a large heat capacity to the heat retaining layer side through the heat insulating layer after the injection filling is completed, the runner P2 is rapidly cooled because the heat retaining layer has a high thermal conductivity. In forming the ultra-thin light guide plate P, the runner P2 or the sprue P1 is thicker than the molded product. Therefore, the rapid cooling of the runner P2 or the sprue P1 contributes to shortening the molding cycle time. To do.

  Further, in the injection press molding of the first embodiment, the runner forming block 18 and the cavity forming block 22 are in the retracted positions before the injection starts, so that the injection is performed into the cavity 14 with the cross-sectional areas of the runner P2 and the gate P3 widened. Filling can be performed. (In the case of injection compression molding, a similar effect is obtained because the runner and the gate are expanded by the injection pressure.) And the timing at which a part of the molten resin flows into the cavity 14 by the injection is detected by the advance position of the screw. The mold clamping device 25 is re-driven (boosted). Then, the core block 16 of the movable mold 12 is advanced toward the core block 36 of the fixed mold 13, the molten resin in the cavity 14 is compressed, and the molten resin is fed from the gate P 3 of the cavity 14 to the other end (flow end portion). ).

  At this time, during the injection process, the molten resin is supplied into the cavity 14 through the gate P3 and the like by the screw advance. However, when the injection process is completed and the pressure holding process is completed and the pressure from the injection device 44 side is rapidly reduced, the compression of the molten resin by the mold clamping device 25 is still continued. The molten resin flows backward to the runner P2 side through the gate P3. At the start of backflow, the injection speed, injection pressure, holding pressure, holding pressure switching timing, clamping speed, clamping force, and clamping start timing are not constant depending on the cavity volume, etc. From the time immediately before the pressure switching to the completion of pressurization of the mold clamping device 25. By causing the molten resin to flow backward in this way, it is possible to prevent the thickness of the ultrathin light guide plate P on the gate side from becoming thicker than the farthest other end P5 side.

  At this time, as shown in FIG. 6, the temperature of the metal layers 52 and 58 as the heat retaining layers of the cavity forming blocks 22 and 42 is the temperature of the cooling medium due to the heat insulating effect of the metal spray layers 51 and 57 as the heat insulating layers. The temperature is rapidly raised from about 60 ° C. to near the temperature of the flowing molten resin. The temperature rise curves of the cavity forming surfaces 53a and 58a are raised more rapidly than the conventional molding die without the heat insulating layer and the heat retaining layer. Therefore, the formation of a skin layer on the surfaces of the cavity forming surfaces 53a and 58a is delayed, and the fluidity of the molten resin is ensured, and the compression by the mold clamping device 25 is added to transfer the pattern 59 to the ultrathin light guide plate P. Will also be good. Further, when cooling heat is transmitted from the mold side having a large heat capacity to the heat retaining layer side through the heat insulating layer after the injection filling is completed, the heat retaining layer is rapidly cooled because of its high thermal conductivity, and the inside of the cavity 14 Promotes cooling of the molten resin. Alternatively, if the temperature of the initial cavity forming surfaces 53a and 58a is set to a temperature close to 80 ° C. as before, the molding cycle time cannot be shortened, but the fluidity of the molten resin in the cavity 14 is further improved. Can do.

  When the timer detects that a predetermined time has elapsed from the start of injection or mold clamping, the drive mechanism of the gate cutter 19 is activated and the gate is cut. At this time, the molten resin in the reverse flow is blocked by the advancement of the gate cutter 19, so that the plate thickness accuracy of the ultrathin light guide plate P can be further improved as described above. When cooling of the molten resin is completed in the cavity 14, the ultrathin light guide plate P with good plate thickness accuracy is taken out and sent to a subsequent process.

  In Example 2 shown in FIG. 7, the temperature of the cavity forming surface 53a or 58a when injection molding is performed using polycarbonate resin (PC) by the same molding die 11 and injection molding machine 24 as in Example 1 and the like. Is shown. In general, the ultra-thin light guide plate P formed of polycarbonate resin (grade only for light guide plate) is often small for mobile phones and the like. And the temperature of the heating cylinder front part of the injection molding machine 24 shall be 330 degreeC-395 degreeC, and the temperature of the cooling medium which cools the cavity formation surfaces 53a and 58a is 90 degreeC-130 degreeC (in Example 2, 115 degreeC). Set. Similarly to the above, the polycarbonate resin is injected at an injection speed of 300 to 900 mm / sec.

  Then, the temperature of the metal layer 58 directly constituting the cavity forming surface 58a or the metal layer 52 on the back side of the cavity forming surface 53a is rapidly raised by the injected molten resin during injection, and the conventional heat insulating layer and The temperature becomes higher than that of a molding die without a heat insulating layer. Therefore, the fluidity and transferability of the molten resin in the cavity 14 are ensured. When the cooling heat is transmitted from the matrix side having a large heat capacity to the metal layers 52 and 58 as the heat retaining layer via the metal spray layers 51 and 57 as the heat insulating layers after the injection filling is completed, 58 is rapidly cooled because of its high thermal conductivity, which contributes to shortening of the molding cycle time. Alternatively, by keeping the initial temperature close to 135 ° C., the fluidity of the molten resin can be further improved, although the molding cycle time is not shortened. In the second embodiment, similarly to the cavity 14, the sprue P1 and the runner P2 can also be provided with a heat insulating layer and a heat insulating layer to rapidly raise the temperature of the heat insulating layer.

  Although the illustration of the molding die of Example 3 is omitted, the mold is opened and closed up and down and a sprue bush is formed on the parting surface. A heat insulating layer and a heat insulating layer are formed on the sprue bush, the runner forming surface, and the cavity forming surface. In that case, since the sprue bush straddles both molds and is divided, the work of forming the heat insulating layer and the heat insulating layer becomes easy. Also, when the sprue is cut in the sprue bush, it is easy to take out without damaging the heat insulating layer or the like. Furthermore, since the sprue bush, runner, and cavity can be continuously formed on the flat surface or a parting surface close to the flat surface, the flow loss of the injected molten resin is small. When a plurality of cavities are formed, the flow loss can be further reduced by arranging the runner in a Y shape (the injection side is the lower side of the Y shape).

  The present invention applies to all molding dies for molding ultra-thin molded products, regardless of the type of light diffusion plate, lens, resin glass, vehicle resin window material, SD card case, battery case, etc. in addition to the ultra-thin light guide plate. Used. Further, the ultra-thin molded product is not limited to a plate having a uniform pressure, and the flow length dimension and the plate thickness described also in a part having a thick part, a part having a curved surface, a box-shaped part, etc. As long as it falls within the ratio of. Furthermore, the material for molding the ultra-thin molded product is not limited to the resin described in the examples, and may be various resin materials.

11 Mold for light guide plate (mold for ultra-thin molded product)
12 Movable mold 13 Fixed mold 14 Cavity 18, 39 Runner forming block (block)
22, 42 Cavity forming block (block)
24 Light guide plate injection molding machine (Ultra-thin molded product injection molding machine)
25 Clamping device 51, 57 Metal sprayed layer (heat insulation layer)
52,58 Metal layer (heat insulation layer)
53a, 58a Cavity forming surface L Flow length P Ultrathin light guide plate P2 Runner T Thickness

Claims (6)

In a molding die of an ultra-thin molded product in which a cavity is disposed between a fixed die and a movable die, and a gate is provided at an end of the cavity,
A cavity capable of forming an ultra-thin molded product having a plate thickness dimension of 0.2% to 0.5% with respect to the flow length dimension from the gate adjacent part to the farthest other end part is provided,
On the surface side of the block forming the cavity or runner, a heat insulating layer having a lower thermal conductivity than the base material of the block is formed,
A molding die for an ultra-thin molded product, wherein a heat insulating layer having a higher thermal conductivity than the heat insulating layer is formed on the surface side of the heat insulating layer. The heat insulating layer is a metal sprayed layer having a thickness of 0.1 mm to 1.0 mm, and the heat retaining layer is a metal layer having a thickness of 0.01 mm to 0.50 mm formed by a method other than spraying. The molding die for an ultra-thin molded product according to claim 1. 3. The molding die for an ultra-thin molded product according to claim 1, wherein the thickness of at least the cavity can be changed. In the molding method of an ultra-thin molded product using the molding die according to claim 1,
Ultra-thin molded product characterized by injecting molten resin at the time of injection with at least the thickness of the cavity wider than the plate thickness of the ultra-thin molded product, and compressing the molten resin in the cavity during or after injection Molding method. The molding method of the ultra-thin molded product according to claim 4, wherein an injection speed at the time of injection is set to 300 mm / sec to 900 mm / sec. 6. The ultra-thin molded article according to claim 4 or 5, wherein the molding material of the ultra-thin molded article is acrylic, and the temperature of the medium for cooling the cavity forming block is 40 ° C to 100 ° C. Molding method.

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