JP6460285B1 - Plate material and plate material manufacturing method - Google Patents

Abstract

The plate material (1) includes a first layer (11) made of Cu, Cu alloy, Al or Al alloy, and a second layer (12) and a third layer made of stainless steel, Ti or Ti alloy ( 13) and a clad material (10) having a thickness of 2 mm or less. The clad material includes groove-like depressions (14, 15) in which the first layer is depressed with respect to the second layer and the third layer on the side surfaces (10a, 10b) orthogonal to the lamination direction of the clad material. .

Description

  The present invention relates to a plate material and a method for manufacturing the plate material.

  Conventionally, a plate material in which a pair of metal layers are bonded to both surfaces in the stacking direction of metal layers having excellent thermal conductivity is known. Such a plate material is disclosed in, for example, Japanese Patent Application Laid-Open No. 2000-60737.

  Japanese Patent Application Laid-Open No. 2000-60737 is composed of a clad material comprising a copper core (metal layer) excellent in thermal conductivity and a pair of stainless steel outer layers diffusion-bonded to both surfaces in the stacking direction of the copper core. In addition, a baking sheet (plate material) is disclosed. In the clad material described in Japanese Patent Laid-Open No. 2000-60737, the copper core is diffusion bonded to the entire surface of the pair of stainless steel outer layers.

Japanese Patent Laid-Open No. 2000-60737

  However, since the clad material described in Japanese Patent Laid-Open No. 2000-60737 has a copper core diffused and bonded to the entire surface of a pair of stainless steel outer layers, the heat of welding is reduced when the clad material is welded to another member. It quickly diffuses throughout the clad through a copper core with high thermal conductivity. For this reason, since the temperature of a welding location cannot be made high enough due to the copper core excellent in heat conductivity, there exists a problem that weldability may deteriorate, such as becoming inadequate welding.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to suppress deterioration of weldability due to a metal layer having excellent thermal conductivity. It is providing the board | plate material which can be manufactured, or the manufacturing method of the board | plate material.

The plate material according to the first aspect of the present invention is composed of a first layer composed of Cu, Cu alloy, Al or Al alloy, and laminated on one surface side of the first layer, and composed of stainless steel, Ti or Ti alloy. A second layer and a third layer laminated on the other surface side of the first layer and made of stainless steel, Ti or Ti alloy, and comprising a clad material having a thickness of 2 mm or less, On the side surface orthogonal to the laminating direction of the clad material, the first layer is recessed with respect to the second layer and the third layer, and includes a groove-shaped recess extending in the direction in which the side surface extends . “Cu alloy”, “Al alloy”, and “Ti alloy” mean alloys containing 50% by mass or more of Cu, Al, and Ti as main components, respectively.

As described above, the plate material according to the first aspect of the present invention is made of Cu, Cu alloy, Al or Al alloy with respect to the second layer and the third layer on the side surface orthogonal to the laminating direction of the clad material. The first layer is recessed and a groove-shaped recess extending in the direction in which the side surface extends is provided. As a result, the first layer composed of Cu, Cu alloy, Al, or Al alloy having excellent thermal conductivity is not located in the recess, so that the second layer and the third layer corresponding to the recess are other than the first layer. When welding this member, it can suppress that the heat | fever at the time of welding diffuses along a 1st layer. As a result, since the temperature of the welded portion can be sufficiently increased, it is possible to suppress deterioration of weldability due to the first layer (metal layer) excellent in thermal conductivity.

  Further, in the plate material according to the first aspect of the present invention, the clad material provided with the groove-like recesses in which the first layer made of Cu, Cu alloy, Al or Al alloy is recessed, the first layer, A first layer laminated on one surface side of the first layer and made of stainless steel, Ti or Ti alloy, and a second layer laminated on the other surface side of the first layer and made of stainless steel, Ti or Ti alloy. It is configured to include three layers. Thereby, it can suppress that the 1st layer corrodes because the 2nd layer and 3rd layer which pinch | interpose the 1st layer are comprised from stainless steel, Ti, or Ti alloy with high corrosion resistance. .

  In the plate material according to the first aspect, preferably, the depth of the recess on the side surface is larger than the thickness of the first layer. Thereby, since the length of the part corresponding to the recessed part of a 2nd layer and a 3rd layer can fully be ensured, another member can be easily used for the 2nd layer and 3rd layer of the part corresponding to a recessed part. Can be welded to. In addition, when bending the second layer and the third layer corresponding to the recess, the length of the second layer and the third layer corresponding to the recess can be sufficiently secured, The second layer and the third layer corresponding to the depression can be easily bent.

  In the plate material according to the first aspect, the thickness of the clad material is preferably 0.5 mm or less. In such a very thin plate having a thickness of 0.5 mm or less and heat diffusion due to the first layer, deterioration of weldability due to the first layer (metal layer) having excellent thermal conductivity can be suppressed. The effect of the present invention that it is possible is particularly effective.

In the plate material according to the first aspect, the recess is formed in a groove shape extending along the direction in which the side surface extends. If comprised in this way, in the side surface of a clad material, since the recessed part which a 1st layer dents can be formed in a wide range, another member is applied to the 2nd layer and the 3rd layer of the part corresponding to a dent. Can be easily welded.

  In the plate material according to the first aspect, preferably, the side surface includes a first side surface on one side in a direction orthogonal to the stacking direction and a second side surface on the other side in a direction orthogonal to the stacking direction, and the recess is A first recess in which the first layer is recessed with respect to the second layer and the third layer on the first side surface; and a first recess in which the first layer is recessed with respect to the second layer and the third layer on the second side surface. 2 recesses. If comprised in this way, another member can be easily welded to the 2nd layer and 3rd layer of the part corresponding to a hollow part in any of the both side surfaces of the direction orthogonal to a lamination direction.

  In the plate material according to the first aspect, preferably, the first layer is covered with at least one of the second layer and the third layer in a portion corresponding to the recess. According to this structure, at least one of the second layer and the third layer having high corrosion resistance covers not only the one surface and the other surface of the first layer but also the first layer exposed at the portion corresponding to the recess. Therefore, the first layer can be reliably prevented from corroding.

  In this case, preferably, the first layer is covered with one of the second layer and the third layer in a portion corresponding to the recess, and the other of the second layer and the third layer covers the first layer. Bonded to one of the second layer and the third layer. If comprised in this way, since it can suppress reliably that a 1st layer is exposed outside by joining a 2nd layer and a 3rd layer in the state which coat | covered the 1st layer, it is 1st It can suppress more reliably that a layer corrodes.

The method for producing a plate material according to the second aspect of the present invention includes a first layer composed of Cu, Cu alloy, Al or Al alloy, and one surface side of the first layer formed by rolling joining, and stainless steel, A clad material having a thickness of 2 mm or less, including a second layer made of Ti or Ti alloy and a third layer made of stainless steel, Ti or Ti alloy, laminated on the other surface side of the first layer In the side surface orthogonal to the laminating direction of the clad material, the clad material is immersed in an etching solution to dissolve the portion of the first layer exposed on the side surface orthogonal to the laminating direction of the clad material. A groove-like recess is formed in the cladding material, the first layer being recessed with respect to the layer and the third layer, and extending in the direction in which the side faces extend .

In the plate material manufacturing method according to the second aspect of the present invention, as described above, the first layer is recessed and the side surfaces extend with respect to the second layer and the third layer on the side surface orthogonal to the laminating direction of the clad material. A groove-like recess extending in the direction is formed in the clad material. Thereby, it can suppress that weldability deteriorates resulting from the 1st layer (metal layer) excellent in thermal conductivity.

  In the plate material manufacturing method according to the second aspect, as described above, the cladding material having a thickness of 2 mm or less is immersed in an etching solution, and the first layer exposed on the side surface perpendicular to the lamination direction of the cladding material is exposed. By dissolving the portion, a groove-like depression in which the first layer is depressed on the side surface is formed in the clad material. As a result, compared to a case where precise mechanical processing such as cutting the first layer is performed on a clad material having a thickness of 2 mm or less, a groove-like recess in which the first layer is recessed on the side surface easily and reliably. The part can be formed.

The method of manufacturing a sheet according to the second aspect, so that the groove extending along the direction of extension of the side surface to form a recess in the side surface. If comprised in this way, in the side surface of a clad material, since the recessed part which a 1st layer dents can be formed in a wide range, another member is applied to the 2nd layer and the 3rd layer of the part corresponding to a dent. Can be easily welded.

  In the method for manufacturing a plate material according to the second aspect, preferably, after forming the recesses on the side surfaces, the second layer and the third layer corresponding to the recesses are bent. If comprised in this way, another member can be easily welded to the bent 2nd layer and 3rd layer of the part corresponding to a hollow part. In addition, when the second layer and the third layer corresponding to the recess are folded so as to cover the first layer corresponding to the recess, the second layer and the third layer having high corrosion resistance are used. The first layer exposed in the portion corresponding to the recess can be covered. Thereby, it can suppress reliably that a 1st layer corrodes.

  In the method for manufacturing a plate material according to the second aspect, preferably, a first recess in which the first layer is recessed with respect to the second layer and the third layer on the first side surface in one direction orthogonal to the stacking direction; In the second side surface on the other side in the direction orthogonal to the stacking direction, a second recess portion in which the first layer is recessed with respect to the second layer and the third layer is formed on the side surface as a recess portion. If comprised in this way, another member can be easily welded to the 2nd layer and 3rd layer of the part corresponding to a hollow part in any of the side surface of the both sides of the direction orthogonal to a lamination direction.

  In the method for manufacturing a plate material according to the second aspect, preferably, at least one of the second layer and the third layer is bent to cover a portion corresponding to the recess of the first layer. According to this structure, at least one of the second layer and the third layer having high corrosion resistance covers not only the one surface and the other surface of the first layer but also the first layer exposed at the portion corresponding to the recess. Therefore, the first layer can be reliably prevented from corroding.

  In this case, preferably, one of the second layer and the third layer is bent to cover a portion corresponding to the depression of the first layer, and the other of the second layer and the third layer and the first layer are covered. One of the second layer and the third layer is joined. If comprised in this way, since it can suppress reliably that a 1st layer is exposed outside by joining a 2nd layer and a 3rd layer in the state which coat | covered the 1st layer, it is 1st It can suppress more reliably that a layer corrodes.

  According to the present invention, as described above, a plate material capable of suppressing deterioration of weldability due to the first layer (metal layer) excellent in thermal conductivity or a method for manufacturing the plate material is provided. can do.

It is the perspective view which showed the board | plate material by 1st Embodiment of this invention. It is sectional drawing which showed an example of the bending board | plate material which bent the board | plate material by 1st Embodiment of this invention. It is sectional drawing which showed an example of the bending board | plate material which bent the board | plate material by 1st Embodiment of this invention. It is sectional drawing which showed an example of the bending board | plate material which bent the board | plate material by 1st Embodiment of this invention. It is sectional drawing which showed an example of the bending board | plate material which bent the board | plate material by 1st Embodiment of this invention. It is a schematic diagram for demonstrating the manufacturing process of the board | plate material by the 1st Embodiment of this invention and the 1st modification of 1st Embodiment. It is a schematic diagram for demonstrating the manufacturing process of the board | plate material by 1st Embodiment of this invention. It is a perspective sectional view for explaining an example of a bending board material by a 1st embodiment of the present invention. It is the perspective view which showed the board | plate material by the 1st modification of 1st Embodiment of this invention. It is the perspective sectional view showing an example of the bending board which bent the board by the 1st modification of a 1st embodiment of the present invention. It is a schematic diagram for demonstrating the manufacturing process of the board | plate material by the 1st modification of 1st Embodiment of this invention. It is a cross-sectional photograph of the board | plate material of a comparative example. It is a cross-sectional photograph of the board | plate material of Example 1 of this invention. It is a cross-sectional photograph of the board | plate material of Example 2 of this invention. It is the perspective view which showed the board | plate material by 2nd Embodiment of this invention. It is sectional drawing which showed the board | plate material by the 2nd modification of 1st Embodiment of this invention.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings.

(First embodiment)
First, with reference to FIGS. 1-5, the structure of the board | plate material 1 by the 1st Embodiment of this invention and the bending board | plate materials 101-103 is demonstrated.

  The plate 1 according to the first embodiment of the present invention is composed of a clad material 10 having a three-layer structure as shown in FIG. Specifically, the clad material 10 includes a Cu layer 11 made of Cu or a Cu alloy, and a SUS layer made of stainless steel (SUS) that is laminated and bonded to one surface 11a on the Z1 side of the Cu layer 11. 12 is a clad material 10 having a three-layer structure, which is laminated and bonded to the other surface 11b on the Z2 side of the Cu layer 11 and a SUS layer 13 made of stainless steel. That is, at the interface Ia between the Cu layer 11 and the SUS layer 12 and at the interface Ib between the Cu layer 11 and the SUS layer 13, the elements constituting each other layer are diffused and bonded at the atomic level by rolling bonding with diffusion annealing. Has been. And the bending board | plate materials 101-104 each shown in FIGS. 2-5 are produced by bending the board | plate material 1. As shown in FIG. The Cu layer 11, the SUS layer 12, and the SUS layer 13 are examples of “first layer”, “second layer”, and “third layer” in the claims, respectively.

  Note that the plate material 1 shown in FIG. 1 and the bent plate materials 101 to 104 shown in FIGS. 2 to 5 can be used for, for example, a conductive material, a leaf spring, a terminal, or a heat dissipation board. In particular, since the plate 1 has a Cu layer 11 made of Cu or Cu alloy having higher conductivity than stainless steel, high conductivity is required such as a conductive material, a leaf spring accompanied by conductivity, and a terminal. It is suitable for the intended use. Moreover, since the board | plate material 1 has Cu layer 11 comprised from Cu or Cu alloy with high heat conductivity compared with stainless steel, it is suitable also for the use as which high heat conductivity is requested | required, such as a thermal radiation board | substrate. It is.

  Moreover, as Cu which comprises the Cu layer 11, C1000 type | system | groups, such as C1020 (oxygen-free copper) prescribed | regulated to JISH3100, C1100 (tough pitch copper), and C1220 (phosphorus deoxidized copper), can be used. Further, as the Cu alloy constituting the Cu layer 11, C2000 series defined in JIS H3100 can be used.

  Examples of the stainless steel constituting the SUS layers 12 and 13 include austenitic stainless steel (for example, SUS304, SUS316, and SUS301 specified in JIS G4304) and ferritic stainless steel (for example, SUS430 specified in JIS G4304). Etc. can be used. Stainless steels other than austenitic and ferritic may be used. Moreover, the SUS layer 12 and the SUS layer 13 may be comprised from the same stainless steel, and may be comprised from the different stainless steel.

  Here, the clad material 10 constituting the plate material 1 according to the first embodiment includes the SUS layer 12 and the SUS layer on the side surface 10a on one side (Y1 side) in the Y direction orthogonal to the stacking direction (Z direction) of the clad material 10. The Cu layer 11 is formed with respect to the SUS layer 12 and the SUS layer 13 in the groove-like recess 14 in which the Cu layer 11 is recessed in the Y2 direction with respect to the layer 13 and the side surface 10b on the other side (Y2 side) in the Y direction. And a groove-like recess 15 that is recessed in the Y1 direction. In other words, on one side (Y1 side) of the clad material 10 in the Y direction, the end surface of the Cu layer 11 is located more in the center in the width direction (Y direction) of the clad material 10 than the end surface of the SUS layer 12 and the end surface of the SUS layer 13. The end face of the Cu layer 11 is located closer to the other side in the Y direction (Y2 side) of the clad material 10 than the end face of the SUS layer 12 and the end face of the SUS layer 13 in the center of the clad material 10 in the width direction (Y direction). Located close to.

  The recesses 14 and 15 are formed in the side surface 10a over the entire laminating direction of the clad material 10. That is, the Cu layer 11 is substantially removed in the recesses 14 and 15. More specifically, the lower surface (Z2 side surface) of the SUS layer 12 (non-stacked portion 12a) corresponding to the recess 14 and the SUS layer 13 (non-stacked portion 13a) corresponding to the recess 14 are provided. A groove-like recess 14 is formed by the upper surface (the surface on the Z1 side) and the side surface 11c on the Y1 side of the Cu layer 11. Similarly, the lower surface (Z2 side surface) of the SUS layer 12 (the non-stacked portion 12b) corresponding to the recess 15 and the upper surface of the SUS layer 13 (the non-stacked portion 13b) corresponding to the recess 15 A groove-like recess 15 is formed by the (Z1 side surface) and the Y2 side surface 11d of the Cu layer 11. The recess 14 and the recess 15 are examples of the “first recess” and the “second recess” in the claims, respectively, and the side surface 10 a and the side surface 10 b are respectively in the claims. It is an example of “first side surface” and “second side surface”.

  The recesses 14 and 15 are each formed in a groove shape so as to extend in the X direction in which the side surfaces 10a and 10b extend. The recesses 14 and 15 are formed so as to extend from one end in the X direction to the other end.

  The recesses 14 and 15 are formed to be recessed by a depth D in the Y2 direction and the Y1 direction, respectively. In the case of the plate 1, the depth D is larger than the thickness t <b> 2 of the Cu layer 11, but is not limited thereto.

  Further, as shown in FIG. 1, the plate 1 is formed in a thin plate shape having a thickness (length in the stacking direction (Z direction)) t1 of 2 mm or less. If comprised in this way, it is suitable for the use as which a weight reduction is requested | required, such as a heat sink. In addition, it is preferable that the board | plate material 1 is a foil shape which has thickness t1 of 0.5 mm or less from a viewpoint of weight reduction, and it is more preferable that it is a foil shape which has thickness t1 of 0.15 mm or less. In addition, the thickness t1 of the plate 1 is preferably 50 μm or more because welding may become difficult if it is too thin.

  In the plate material 1 (cladding material 10), the thickness ratio of the Cu layer 11, the SUS layer 12 and the SUS layer 13 is not particularly limited. For example, for applications that require a large thermal conductivity such as a heat dissipation substrate or applications that require a small electrical resistance such as a conductive material, the thickness t2 of the Cu layer 11 is equal to or greater than the thickness t3 of the SUS layer 12, and The thickness of the SUS layer 13 is preferably not less than t4. For example, when it is desired to reduce the warpage of the plate material 1 or to make the front / back discrimination unnecessary, the thickness t3 of the SUS layer 12 is preferably substantially equal to the thickness t4 of the SUS layer 13.

  Further, as shown in FIG. 1, in the clad material 10 having the three-layer structure, the corrosion resistance of the plate material 1 is improved by sandwiching the Cu layer 11 having a relatively low corrosion resistance in the Z direction between the SUS layers 12 and 13 having a high corrosion resistance. It is possible to make it.

  In the plate 1 of FIG. 1, by bending any one or more of the non-laminated portions 12a, 12b, 13a, and 13b, for example, bent plate members 101 to 104 shown in FIGS. Is possible. Specifically, as shown in FIG. 2, the non-stacked portions 12a and 12b are bent in the Z2 direction so as to cover the side surfaces 11c and 11d in the Y direction of the Cu layer 11, respectively. The folded plate member 101 can be produced by bending the non-laminated portions 13a and 13b in the Z1 direction so as to cover the folded non-laminated portions 12a and 12b, respectively. In this bent plate material 101, the side surface 11c is covered with the non-laminated portions 12a and 13a, and the side surface 11d is covered with the non-laminated portions 12b and 13b. When the side surfaces 11c and 11d are covered, the presence / absence of the gap between the non-laminated portion and the Cu layer 11 in the covered portion and the size of the gap may be appropriately selected depending on the application. Thereby, since the side surfaces 11c and 11d of the Cu layer 11 in the Y direction are covered with the SUS layers 12 and 13, the corrosion resistance of the bent plate material 101 is further improved.

  In the bent plate material 101, for example, a welding target (other member) can be welded to the non-laminated portion 13a located on the outermost side in the Y direction by laser welding or the like. At this time, the diffusion of heat by the Cu layer 11 is suppressed, so that heat concentrates at the welding location, and it is possible to reliably weld the non-laminated portion 13a and another member. In addition, according to the welding with the welding target, for example, the folded portion of the non-laminated portion 12a and the overlapped portion of the non-laminated portion 13a are welded together to stably maintain the shape of the bent plate material 101. It becomes possible.

  Further, as shown in FIG. 3, the folded plate member 102 can be produced by bending the non-stacked portions 12a and 12b in the Z1 direction and bending the non-stacked portions 13a and 13b in the Z2 direction. is there. In this bent plate member 102, the side surfaces 11c and 11d are not covered with the non-laminated portions 12a, 12b, 13a and 13b. In the bent plate member 102, for example, it is possible to weld a welding target (other member) to the non-laminated portions 12a and 13a by laser welding or the like. At this time, since the welded portion is greatly separated from the Cu layer 11, heat diffusion by the Cu layer 11 is reliably suppressed. Thereby, heat concentrates more in a welding location and it is possible to weld the non-lamination part 12a and 13a and another member more reliably.

  Further, as shown in FIG. 4, the non-stacked portions 12a and 12b are bent in the Z2 direction so as to cover the side surfaces 11c and 11d in the Y direction of the Cu layer 11, and the non-stacked portions 13a and 13b are bent in the Z2 direction. It is possible to produce the bent plate material 103 by bending it into two. In the bent plate member 103, the side surface 11c is covered with the non-laminated portion 12a, and the side surface 11d is covered with the non-laminated portion 12b. Thereby, since the side surfaces 11c and 11d of the Cu layer 11 in the Y direction are covered with the SUS layers 12 and 13, the corrosion resistance of the bent plate member 103 is further improved. In the bent plate 103, for example, it is possible to weld a welding target (other member) to the non-laminated portion 13a by laser welding or the like. At this time, since the welded portion is greatly separated from the Cu layer 11, heat diffusion by the Cu layer 11 is reliably suppressed. Thereby, heat concentrates more in a welding location and it is possible to weld the non-lamination part 13a and another member more reliably.

  Further, as shown in FIG. 5, the non-laminate portions 12a and 12b are bent in the Z2 direction so as to cover the Y-direction side surfaces 11c and 11d of the Cu layer 11, respectively, and the non-laminate portions 12a and 13a Are welded by laser welding, and the non-laminated portion 12b and the non-laminated portion 13b are welded by laser welding, whereby the bent plate member 104 can be produced. In this bent plate member 104, the side surface 11c is covered with the non-laminated portion 12a, and the side surface 11d is covered with the non-laminated portion 12b. Furthermore, by joining the SUS layer 12 and the SUS layer 13 by welding, it is possible to maintain a state in which the side surfaces 11c and 11d in the Y direction of the Cu layer 11 are covered. As a result, it is possible to further suppress corrosion of the side surfaces 11c and 11d of the Cu layer 11 exposed in the Y direction.

  Further, in FIG. 5, the position in the Y direction of the outer surface of the non-stacked portion 12a and the position of the end portion in the Y direction of the non-stacked portion 13a substantially coincide with each other, and the position in the Y direction of the outer surface of the non-stacked portion 12b. The position substantially coincides with the position of the end of the non-stacked portion 13b. In addition, since the welding location is away from the Cu layer 11 by being the outer surface of the non-laminated portion 12a of the SUS layer 12 and the end portion of the non-laminated portion 13a on the SUS layer 13 side, heat diffusion by the Cu layer 11 is prevented. It is suppressed. Thereby, since it is suppressed that a heat | fever escapes from a welding location, it is possible to weld the SUS layer 12 and the SUS layer 13 reliably.

  As described above, the depth D of the recesses 14 and 15 is preferably larger than the thickness t2 of the Cu layer 11, and the non-laminated portions 12a, 12b, 13a and 13b can be easily bent. It is. Furthermore, the folding plate material 101 of FIG. 2 and the folding plate material 103 of FIG. 4 can ensure a sufficient crushing allowance.

  Next, with reference to FIGS. 2-8, the manufacturing process of the board | plate material 1 (bending board | plate materials 101-103) in 1st Embodiment is demonstrated.

  First, as shown in FIG. 6, a strip-shaped (plate-shaped) Cu material 111 made of Cu or a Cu-based alloy and strip-shaped SUS materials 112 and 113 made of stainless steel are prepared. In addition, the length of the width direction (Y direction) of Cu material 111 and SUS materials 112 and 113 is substantially equal. Then, the SUS material 112 is disposed (laminated) on one surface of the Cu material 111 on the Z1 side, and the SUS plate 113 is disposed (laminated) on the other surface of the Cu material 111 on the Z2 side, and continuously with the rolling roller 201. Are rolled and joined (rolling process). In addition, intermediate annealing can be performed as needed during the rolling process. Thereby, the SUS layer 12, the Cu layer 211, and the SUS layer 13 are laminated in this order, and the band-shaped clad material 110 having a thickness of 2 mm or less (preferably, a thickness of 0.5 mm or less) is produced. Then, continuous annealing is performed on the strip-shaped clad material 110 in the annealing furnace 202 to continuously perform diffusion annealing (diffusion annealing step). As a result, a band-like and plate-like clad material 110a is produced in which the Cu layer 211 and the SUS layer 12 are diffusion bonded at the atomic level, and the Cu layer 211 and the SUS layer 13 are diffusion bonded at the atomic level. The The clad material 110 has a three-layer structure.

  The band-shaped clad materials 110 and 110a are both overlay type clad materials. That is, the SUS layer 13 is diffusion bonded on the entire surface of the one surface 211a on the Z1 side of the Cu layer 211, and the SUS layer 13 is diffusion bonded on the entire surface of the other surface 211b of the Cu layer 211 on the Z2 side.

  In the manufacturing method according to the first embodiment, as shown in FIG. 7, wet etching processing is continuously performed on the strip-shaped clad material 110a using the wet etching apparatus 203 (wet etching processing step). The wet etching apparatus 203 stores an etching solution S, an etching tank 203a in which the etching solution S can be heated by the heater 203b, an electrode 203c disposed in the etching solution S, and the electrode 203c and the clad material 110a. An energizing device 203d for supplying a current and a plurality of conveying rollers 203e for conveying the belt-like clad material 110a into the etching tank 203a are included.

  Here, the etching solution S is composed of an acidic solution in which Cu or Cu alloy constituting the Cu layer 211 is easier to dissolve than the stainless steel constituting the SUS layers 12 and 13. The etching solution S is, for example, a strong acid solution containing sulfuric acid. Note that the etching solution S may be an alkaline solution capable of dissolving Cu. Further, the etching solution S is maintained at a predetermined temperature higher than room temperature (for example, about 80 ° C.) by being heated by the heater 203b.

  The belt-like clad material 110a is immersed in the etching solution S by being conveyed into the etching solution S in a state where a direct current of a predetermined magnitude is passed by the energization device 203d. As a result, the exposed portions of the Cu layer 211 (see FIG. 6) are dissolved on both side surfaces in the Y direction perpendicular to the laminating direction (Z direction) of the clad material 110a and the transport direction (X direction) of the clad material 110a. At this time, in Cu or Cu alloy constituting the Cu layer 211 in which the current easily flows, the acid of the etching solution S and Cu (Cu alloy) react and ionize preferentially over stainless steel, so that the Y direction The portions of the Cu layer 211 exposed on both side surfaces are dissolved.

  In the wet etching process, the acidity (sulfuric acid concentration) of the etching solution S, the temperature of the etching solution S, the magnitude of the current, the conveyance speed (dipping time) of the clad material 110a, and the like are set as appropriate. It is possible to produce the recesses 14 and 15 having a depth D (see FIG. 1).

  Thereby, the clad material 10 as shown in FIG. 1 is produced. That is, in the side surface 10a on one side (Y1 side) in the Y direction orthogonal to the stacking direction (Z direction) of the clad material 10, the recessed portion in which the Cu layer 11 is recessed in the Y2 direction with respect to the SUS layer 12 and the SUS layer 13. 14 and a clad material 10 including a recess 15 in which the Cu layer 11 is recessed in the Y1 direction with respect to the SUS layer 12 and the SUS layer 13 on the side surface 10b on the other side (Y2 side) in the Y direction (see FIG. 1). Is produced.

  Thereafter, bending is continuously performed as necessary (bending process). The bending process can be performed by a general bending process. For example, if necessary, the non-laminated portions 12a and 12b corresponding to the recesses 14 and 15 are conveyed while being bent by a bending roller 204 disposed at a predetermined position as shown in FIG. Are folded in either direction (Z1 direction or Z2 direction). Thereafter, if necessary, the non-laminated portions 13a and 13b corresponding to the recesses 14 and 15 are conveyed while being folded by the folding roller 205 disposed at a predetermined position, thereby being in any direction (Z1) in the Z direction. Direction or Z2 direction). Thereby, the strip | belt-shaped bending board | plate materials 101-103 shown in FIGS. 2-4 are produced. When the folded plate member 104 shown in FIG. 5 is manufactured, the non-laminated portions 12a and 12b are conveyed while being bent by a bending roller 204 arranged at a predetermined position as shown in FIG. While it is bent in the direction, the non-laminated portions 13a and 13b are not bent.

  Thereafter, when the folded plate material 104 shown in FIG. 5 is produced from the folded plate material 104a before welding in which the non-laminated portions 12a and 12b are folded as shown in FIG. 8, laser welding is performed as shown in FIG. Performed continuously (laser welding process). Laser welding can be performed using a general laser welding machine 206. At this time, as shown in FIG. 8, the contact portion (welded portion) between the end portion on the Z2 side of the non-stacked portion 12a and the end portion on the Z2 side of the non-stacked portion 12a of the non-stacked portion 13a is continuously formed. Weld to. Similarly, the contact portion between the end portion on the Z2 side of the non-stacked portion 12b and the end portion on the Z2 side of the non-stacked portion 12b of the non-stacked portion 13b is continuously welded. At this time, since the heat of the welded portion is suppressed from being diffused due to the Cu layer 11, the SUS layer 12 and the SUS layer 13 are reliably welded. Note that the welding method is not limited to laser welding, and may be, for example, electron beam welding.

  When the bent plate member 104 shown in FIG. 5 is manufactured, trimming is continuously performed as necessary after the laser welding process (trimming process). The trimming process can be performed using, for example, a trimming roller 207. Specifically, the trimming roller 207 is moved along the outer surface of the non-stacked portions 12a and 12b, and unnecessary portions of the non-stacked portions 13a and 13b of the SUS layer 13 and raised portions of the welded portions (trimming portions, see FIG. 8). ) To remove. Accordingly, the trimming roller 207 substantially matches the position of the outer surface of the non-laminated portion 12a in the Y direction with the position of the end portion of the non-laminated portion 13a in the Y direction, and the outer surface of the non-laminated portion 12b. The trimming portion is removed so that the position in the Y direction substantially coincides with the position of the end of the non-stacked portion 13b.

  Thereby, the belt-like bent plate member 104 of FIG. 5 is produced. The trimming process may be performed before the laser welding process.

  Finally, by using the cutting machine 208, the strip-shaped clad material 10 is cut so as to have a predetermined length in the X direction (conveyance direction), thereby the plate material 1 shown in FIG. 1 (FIGS. 2 to 5). (Folded plate materials 101-104) are produced. If necessary, a finishing step such as a step of removing burrs mechanically or chemically, a heat treatment (annealing) step, or the like may be appropriately added.

(Effect of 1st Embodiment)
In the first embodiment, the following effects can be obtained.

  In the first embodiment, as described above, the clad material 10 is laminated and bonded to the Cu layer 11 made of Cu or Cu alloy and the one surface 11a on the Z1 side of the Cu layer 11, and stainless steel (SUS). Is a clad material 10 having a three-layer structure of a SUS layer 12 made of stainless steel and a SUS layer 13 laminated and bonded to the other surface 11b on the Z2 side of the Cu layer 11 and made of stainless steel. As a result, the SUS layer 12 and the SUS layer 13 sandwiching the Cu layer 11 are both made of stainless steel having high corrosion resistance, so that the Cu layer 11 can be prevented from corroding.

  Moreover, in 1st Embodiment, Cu layer of the board | plate material 1 with respect to the SUS layer 12 and the SUS layer 13 in the side surface 10a of the one side (Y1 side) of the Y direction orthogonal to the lamination direction (Z direction) of the clad material 10. The Cu layer 11 of the plate 1 is recessed in the Y1 direction with respect to the SUS layer 12 and the SUS layer 13 in the groove-like recess 14 in which 11 is recessed in the Y2 direction and the side surface 10b on the other side (Y2 side) in the Y direction. The clad material 10 includes a groove-like recess 15. Accordingly, the clad material 10 has the recesses 14 and 15 where the Cu layer 11 made of Cu or Cu alloy having excellent thermal conductivity is not located, so that the SUS layers 12 and 13 corresponding to the recess 14 are formed. When other members are welded to the SUS layers 12 and 13 (non-laminated portion 12b (13b)) corresponding to the recess 15 (non-laminated portion 12a (13a)), the heat during welding is caused by the Cu layer 11 It is possible to suppress the diffusion through. As a result, since the temperature of the welded portion can be sufficiently increased, it is possible to suppress deterioration of weldability due to the Cu layer 11 (metal layer) having excellent thermal conductivity. Further, in both the side surfaces 10a and 10b in the Y direction orthogonal to the stacking direction, other members can be easily welded to the non-stacked portion 12a (12b) and the non-stacked portion 13a (13b).

  Moreover, the non-laminated part 12a (12b) and the non-laminated part 13a (13b) can be provided continuously by providing the groove-like depressions 14 and 15 in which the Cu layer 11 is depressed in the clad material 10. Thus, when the non-laminate portion 12a (12b) and the non-laminate portion 13a (13b) are bent, the continuously formed non-laminate portion 12a (12b) and the non-laminate portion 13a (13b) Can be bent.

  In the first embodiment, the lower surface (the surface on the Z2 side) of the SUS layer 12 (non-laminated portion 12a) corresponding to the recess 14 and the (non-laminated) of the SUS layer 13 corresponding to the recess 14 are provided. A groove-like depression 14 is formed by the upper surface (the surface on the Z1 side) of the portion 13a) and the side surface 11c on the Y1 side of the Cu layer 11. Similarly, the lower surface (Z2 side surface) of the SUS layer 12 (non-laminated portion 12b) corresponding to the recess 15 and the upper surface of the SUS layer 13 (non-stacked portion 13b) corresponding to the recess 15 ( A groove-like recess 15 is formed by the surface on the Z1 side) and the side surface 11d on the Y2 side of the Cu layer 11. Thereby, in the side surfaces 10a and 10b of the clad material 10, the recesses 14 and 15 can be formed over a wide range of the Cu layer 11, so that the non-laminated portion 12a (12b) and the non-laminated portion 13a (13b) The members can be easily welded.

  In the first embodiment, the depth D of the recesses 14 and 15 in the side surfaces 10 a and 10 b is set larger than the thickness t <b> 2 of the Cu layer 11. Accordingly, the lengths of the non-stacked portion 12a (12b) in the SUS layer 12 and the non-stacked portion 13a (13b) in the SUS layer 13 can be sufficiently ensured. Another member can be easily welded to the portion 13a (13b). Moreover, when bending the non-laminate portion 12a (12b) and the non-laminate portion 13a (13b), the length of the non-laminate portion 12a (12b) and the non-laminate portion 13a (13b) can be sufficiently secured. Therefore, the non-laminate portion 12a (12b) and the non-laminate portion 13a (13b) can be easily bent.

  Moreover, in 1st Embodiment, the thickness t1 of the board | plate material 1 (cladding material 10) shall be 2 mm or less. If comprised in this way, it is suitable for the use as which a weight reduction is requested | required, such as a heat sink. In addition, Preferably, thickness t1 of the board | plate material 1 shall be 0.5 mm or less. If comprised in this way, in the board | plate material 1 which is easy to produce the spreading | diffusion of the heat | fever by not only weight reduction but 0.5 mm or less and Cu layer 11 easily, it originates in Cu layer 11 excellent in thermal conductivity. It can suppress that sex deteriorates. In addition, if the thickness t1 of the plate material 1 becomes too thin, formation of the groove-like depressions 14 and 15 or welding using the groove-like depressions 14 and 15 may be difficult. t1 is 50 μm or more.

  In the first embodiment, preferably, the Cu layer 11 in the portions (side surfaces 11 c and 11 d) corresponding to the recesses 14 and 15 is covered with at least one of the SUS layers 12 and 13. With this configuration, at least one of the SUS layers 12 and 13 having high corrosion resistance can cover not only the one surface 11a and the other surface 11b of the Cu layer 11 but also the exposed side surfaces 11c and 11d. Corrosion of the layer 11 can be reliably suppressed.

  In the first embodiment, preferably, the Cu layer 11 in the portions (side surfaces 11 c and 11 d) corresponding to the recesses 14 and 15 is covered with the SUS layer 12, and the SUS layer 13 is covered with the Cu layer 11. Bonded (welded) to the SUS layer 12. If comprised in this way, since it can suppress reliably that Cu layer 11 is exposed outside by joining SUS layer 12 and SUS layer 13 in the state where Cu layer 11 was covered, Cu layer It can suppress more reliably that 11 corrodes.

  In the manufacturing method of the first embodiment, the wet etching process 203 is continuously performed on the strip-shaped clad material 110a having a thickness of 2 mm or less (preferably, a thickness of 0.5 mm or less) using the wet etching apparatus 203. By performing, the Cu layer 11 is depressed in the Y2 direction with respect to the SUS layer 12 and the SUS layer 13 on the side surface 10a on one side (Y1 side) in the Y direction orthogonal to the stacking direction (Z direction) of the clad material 10. In the recess 14 (see FIG. 1) and the side surface 10b on the other side (Y2 side) in the Y direction, the recess 15 in which the Cu layer 11 is recessed in the Y1 direction with respect to the SUS layer 12 and the SUS layer 13 (see FIG. 1). Are formed on the clad material 10. Thereby, compared to a case where precise mechanical processing such as cutting the Cu layer 11 is performed on the clad material 110a having a small thickness of 2 mm or less, the Cu layer is easily and reliably formed on the side surfaces 10a and 10b of the clad material 10. Groove-shaped recesses 14 and 15 in which 11 is recessed can be formed. The smaller the thickness of the clad material 110a, for example, 1.5 mm, 1 mm, 0.8 mm, 0.6 mm, 0.4 mm, etc., the more effective the application of the present invention. Easy plate material 1 (folded plate materials 101-104) can be obtained.

  Moreover, in the manufacturing method of 1st Embodiment, a bending process is performed continuously as needed. For example, the non-laminated portions 12a and 12b corresponding to the recesses 14 and 15 are conveyed while being bent by the bending roller 204 disposed at a predetermined position, so that any direction in the Z direction (Z1 direction or Z2 direction). Bend it. Thereafter, the non-laminated portions 13a and 13b corresponding to the recesses 14 and 15 are conveyed while being bent by the bending roller 205 disposed at a predetermined position, thereby being in any direction in the Z direction (Z1 direction or Z2 direction). Bend it. Thereby, another member can be easily welded to the non-laminated portion 12a (12b) in the bent SUS layer 12 and the non-laminated portion 13a (13b) in the SUS layer 13. In addition, when the non-laminated portion 12a (12b) and the non-laminated portion 13a (13b) are bent so as to cover the side surfaces 11c and 11d of the Cu layer 11, the side surfaces 11c and 11a are formed by the SUS layers 12 and 13 having high corrosion resistance. The Cu layer 11 exposed at 11d can be coated. As a result, corrosion of the Cu layer 11 can be reliably suppressed.

  Moreover, in the manufacturing method of 1st Embodiment, the part corresponding to the recessed parts 14 and 15 of the Cu layer 11 is coat | covered by bend | folding at least one of the SUS layers 12 and 13 as needed. If comprised in this way, Cu exposed by not only one surface 11a and the other surface 11b of Cu layer 11 but the part corresponding to the recessed parts 14 and 15 by at least one of SUS layer 12 and SUS layer 13 with high corrosion resistance. Since the layer 11 can also be coated, the corrosion of the Cu layer 11 can be reliably suppressed.

  In the manufacturing method according to the first embodiment, the SUS layer 12 is bent as necessary to cover portions corresponding to the recesses 14 and 15 of the Cu layer 11, and the SUS layer 13 and the Cu layer 11 are covered. The SUS layer 12 is joined. If comprised in this way, since it can suppress reliably that Cu layer 11 is exposed outside by joining SUS layer 12 and SUS layer 13 in the state where Cu layer 11 was covered, Cu layer It can suppress more reliably that 11 corrodes.

(First modification of the first embodiment)
Next, with reference to FIGS. 6 and 9 to 11, the configuration of the plate member 301 according to the first modification of the first embodiment of the present invention will be described. In the plate material 301 (see FIG. 9) of the first modification of the first embodiment, unlike the plate material 1 of the first embodiment, recesses 316 and 317 are also provided on the side surfaces 310c and 310d on both sides in the X direction, respectively. An example will be described. In addition, about the structure similar to the said 1st Embodiment, while attaching | subjecting the same code | symbol, description is abbreviate | omitted.

  A plate material 301 according to a first modification of the first embodiment of the present invention is composed of a clad material 310 having a three-layer structure as shown in FIG. Specifically, the clad material 310 is a clad material having a three-layer structure of the Cu layer 311, the SUS layer 12, and the SUS layer 13. The Cu layer 311 is an example of the “first layer” in the claims.

  Here, the clad material 310 constituting the plate material 301 according to the first modification of the first embodiment includes the SUS layer 12 and the SUS layer on the four side surfaces 310a to 310d orthogonal to the stacking direction (Z direction) of the clad material 310. Groove-shaped recesses 314 to 317 in which the Cu layer 311 is recessed with respect to the layer 13 are included. Specifically, the recesses 314 and 315 are formed on the side surface 310a on the Y1 side and the side surface 310b on the Y2 side of the clad material 310, respectively. The recesses 316 and 317 are formed on the side surface 310c on the X1 side and the side surface 310d on the X2 side of the clad material 310, respectively.

  The recesses 314 and 315 are each formed in a groove shape so as to extend in the X direction in which the side surfaces 310a and 310b extend. The recesses 316 and 317 are formed in a groove shape so as to extend in the Y direction in which the side surfaces 310c and 310d extend. The Cu layer 311 is surrounded by the recesses 314 to 317. As a result, the SUS layer 12 (non-stacked portion 312a) corresponding to the recesses 314 to 317 and the SUS layer 13 (non-stacked portion 313a) corresponding to the recesses 314 to 317 are both formed in a circumferential shape. ing.

  The recesses 314 and 315 are formed so as to be recessed in the Y2 direction and the Y1 direction, respectively. The recesses 316 and 317 are formed so as to be recessed in the X2 direction and the X1 direction, respectively. The depth of the recesses 314 to 317 is preferably larger than the thickness of the Cu layer 311 in the stacking direction.

  Also in the plate material 301 of the first modified example of the first embodiment, the non-stacked portion 312a and the non-stacked portion 313a are bent as in the folded plate materials 101 to 103 of the first embodiment shown in FIGS. May be.

  Further, in the plate 301 shown in FIG. 9, the non-stacked portion 312a is bent in the Z2 direction so as to cover the side surfaces 310a to 310d of the Cu layer 311 and the non-stacked portion 312a and the non-stacked portion 313a are laser-welded. The bent plate material 304 shown in FIG. 10 can be produced by welding in a circumferential shape. In addition, in FIG. 10, although the welding location is illustrated only in a part, it is actually welded over the entire circumference of the plate material 301. In the bent plate material 304, the entire side surface is covered with the non-laminated portion 312a, and the SUS layer 12 and the SUS layer 13 are joined by welding. As a result, it is possible to maintain a state in which the entire Cu layer 311 is completely covered. As a result, it is possible to further suppress corrosion of the Cu layer 311. Further, since the welded portion is away from the Cu layer 311 by being the outer surface of the non-laminated portion 312a of the SUS layer 12 and the end portion of the non-laminated portion 313a of the SUS layer 13, the diffusion of heat by the Cu layer 311 is suppressed. Is done. Thereby, since it is suppressed that a heat | fever escapes from a welding location, it is possible to weld the SUS layer 12 and the SUS layer 13 reliably.

  In addition, the other structure of the board | plate material 301 of the 1st modification of 1st Embodiment is the same as that of the board | plate material 1 of the said 1st Embodiment.

  Next, the manufacturing method of the board | plate material 301 of the 1st modification of 1st Embodiment is demonstrated. Note that the manufacturing process up to the production of the three-layer structure shown in FIG.

  In the manufacturing method of the first modified example of the first embodiment, as shown in FIG. 11, the strip-shaped clad material 110 a is made to have a predetermined length in the X direction (conveyance direction) using a cutting machine 506. By cutting (cutting step), a plurality of clad materials 410a are produced. Thereafter, wet etching processing is performed on the plurality of cut clad materials 410a using the wet etching apparatus 503 (wet etching processing step). The wet etching apparatus 503 stores an etching solution S, a batch tank 503a capable of heating the etching solution S by a heater 503b, an electrode 503c disposed in the etching solution S, and between the electrode 503c and the clad material 410a. An energizing device 503d for flowing current and a gripping portion 503e for arranging a plurality of clad materials 410a in the batch tank 503a are included.

  The plurality of clad materials 410a are immersed in the etching solution S in a state where a direct current of a predetermined magnitude is passed by the energization device 503d. Thereby, the portion of the Cu layer 311 exposed on both side surfaces 310a to 310d in the X direction and the Y direction orthogonal to the stacking direction (Z direction) of the clad material 410a is dissolved. At this time, the recesses 314 to 317 having a desired depth are prepared by appropriately setting the acidity (sulfuric acid concentration) of the etching solution S, the temperature of the etching solution S, the magnitude of the current, the immersion time, and the like. It is possible.

  Thereby, the clad material 310 as shown in FIG. 9 is produced. That is, the clad material 310 including the recesses 314 to 317 in which the Cu layer 311 is recessed with respect to the SUS layer 12 and the SUS layer 13 on the side surfaces 310a to 310d in the direction orthogonal to the stacking direction (Z direction) of the clad material 310. Produced.

  Thereafter, a bending process, a laser welding process, a trimming process, a finishing process, a heat treatment process, and the like are additionally performed as necessary. In this case, the laser welding process and the trimming process are different from the first embodiment in which the band-shaped clad material 310 is bent or the like, and a press machine (not shown) is used for the individual clad material 310. Used to perform bending and trimming. In addition, the effect of the 1st modification of 1st Embodiment is the same as the effect of the said 1st Embodiment.

(Example)
Next, with reference to FIG. 9 and FIGS. 11-14, the Example performed in order to confirm the effect of this invention is described. In this example, based on the manufacturing method of the first modified example of the first embodiment, the plate materials 301 of Examples 1 and 2 with different immersion times were produced, and cross-sectional observation was performed.

  Specifically, a clad material 110a (see FIG. 11) having a thickness of 150 μm in the stacking direction (Z direction) was produced. In the clad material 110a, the thickness of the Cu layer 311 in the stacking direction, the thickness of the SUS layer 12 in the stacking direction, and the thickness of the SUS layer 13 in the stacking direction were made equal. And as shown in FIG. 11, the wet etching process was performed with respect to the clad material 410a cut | disconnected by the predetermined magnitude | size.

  In the wet etching process, a strong acid solution containing sulfuric acid was used as the etchant S. Further, the temperature of the etching solution S was set to 80 ° C. The immersion time was 30 minutes. Thereby, the clad material 310 (plate material 301) of Example 1 in which the recesses 314 to 317 shown in FIG. 9 were formed was produced.

  Moreover, the clad material 310 (plate material 301) of Example 2 in which the recessed parts 314-317 were formed was produced similarly to Example 1 except the point which made immersion time 120 minutes.

  Further, as a reference example, an untreated clad material 410a that is not subjected to wet etching is used as it is.

  And the cladding material of the reference example and Example 1 and 2 was cut | disconnected, and the cross section was observed. Cross-sectional photographs of the clad materials of the reference example and examples 1 and 2 are shown in FIGS. 12, 13 and 14, respectively.

  As shown in FIGS. 12 to 14, in the case of the untreated (reference example), Examples 1 and 2 in which no recess was formed in the Cu layer and wet etching treatment was performed for 30 minutes and 120 minutes, respectively. Then, in the side surface of the clad material, it was confirmed that a hollow portion in which the Cu layer was recessed was formed with respect to the pair of SUS layers sandwiching the Cu layer. In Example 2 with a long immersion time, a recess having a depth (393 μm) larger than the depth (151 μm) of the recess in Example 1 was formed. Thereby, it has confirmed that the depth of a hollow part could be adjusted by adjusting at least immersion time. It is considered that the depth of the recess can be adjusted also by the acidity (sulfuric acid concentration) of the wet etching solution, the temperature of the wet etching solution, the magnitude of the current, and the like.

  Moreover, in Example 2 with a long immersion time, the interface side between the Cu layer and the SUS layer was greatly depressed compared to the center side in the stacking direction of the Cu layer. That is, it has been found that the dissolution of Cu is more likely to proceed on the interface side between the Cu layer and the SUS layer than on the center side in the stacking direction of the Cu layer.

(Second Embodiment)
Next, a plate material 601 according to a second embodiment of the present invention will be described with reference to FIG. In the second embodiment of the present invention, an example in which the plate material 601 is configured from a clad material 610 using an Al layer 611 made of Al or an Al alloy instead of the Cu layer 11 is shown in the first embodiment. The Al layer 611 is an example of the “first layer” in the claims.

  A plate member 601 according to the second embodiment of the present invention is composed of a clad member 610 having a three-layer structure as shown in FIG. Specifically, the clad material 610 includes an Al layer 611 made of Al or an Al alloy, a SUS layer 12 laminated and bonded to one surface 611a on the Z1 side of the Al layer 611, and the Z2 side of the Al layer 611. This is a clad material having a three-layer structure with the SUS layer 13 laminated and bonded to the other surface 611b.

  Further, the plate material 601 can be used for, for example, a conductive material, a leaf spring, a terminal, a heat dissipation board, or the like. In particular, the plate member 601 has an Al layer 611 made of Al or Al alloy that is lighter than Cu or Cu alloy, and thus is suitable for applications that require weight reduction such as a heat dissipation board.

  Moreover, as Al which comprises the Al layer 611, A1000 type | system | groups, such as A1085 and A1050 prescribed | regulated to JISH4000, can be used. Further, as an Al alloy constituting the Al layer 611, it is possible to use A2000 series defined in JIS H4000.

  Here, the clad material 610 constituting the plate material 601 according to the second embodiment includes the SUS layers 12 and 13 on the side surface 10a on one side (Y1 side) in the Y direction orthogonal to the stacking direction (Z direction) of the clad material 610. In contrast, a recess 614 in which the Al layer 611 is recessed in the Y2 direction and a recess in which the Al layer 611 is recessed in the Y1 direction with respect to the SUS layers 12 and 13 on the side surface 10b on the other side (Y2 side) in the Y direction. 615. The recess 614 and the recess 615 are examples of the “first recess” and the “second recess” in the claims, respectively.

  Also in the plate member 601, as shown in FIGS. 2 to 4 of the first embodiment, the SUS layer 12 (non-laminated portion 12 a (12 b)) and the recessed portion corresponding to the recessed portion 614 (615). The portion of the SUS layer 13 (non-laminated portion 13a (13b)) corresponding to 614 (615) may be bent. If necessary, a laser welding process, a trimming process, a finishing process, a heat treatment process, and the like may be additionally performed as appropriate. In addition, the other structure of the board | plate material 601 of 2nd Embodiment is the same as that of the said 1st Embodiment.

  In addition, the manufacturing method of the plate material 601 of the second embodiment uses a strip-shaped Al material made of Al or an Al-based alloy instead of the Cu material 111, and adjusts the composition of the wet etching solution, etc. Except for making Al or Al alloy easier to dissolve than stainless steel, it is the same as the manufacturing method of the plate 1 of the first embodiment.

(Effect of 2nd Embodiment)
In the second embodiment, the following effects can be obtained.

  In the second embodiment, as described above, the clad material 610 is formed with respect to the SUS layers 12 and 13 on the side surface 10a on one side (Y1 side) in the Y direction orthogonal to the stacking direction (Z direction) of the clad material 610. A recess 614 in which the Al layer 611 is recessed in the Y2 direction, and a recess 615 in which the Al layer 611 is recessed in the Y1 direction with respect to the SUS layers 12 and 13 on the side surface 10b on the other side (Y2 side) in the Y direction. including. Thereby, similarly to 1st Embodiment, it can suppress that weldability deteriorates due to the Al layer 611 excellent in thermal conductivity. The remaining effects of the second embodiment are similar to those of the aforementioned first embodiment.

[Modification]
The embodiments and examples disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments and examples but by the scope of claims for patent, and includes all modifications (modifications) within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the said 1st (2nd) embodiment, with respect to the SUS layer 12 (2nd layer) and the SUS layer 13 (3rd layer) in the side surfaces 10a and 10b orthogonal to the lamination direction of the clad material 10 (610). The groove-like recesses 14 and 15 (the recesses 614 and 615) into which the Cu layer 11 (Al layer 611 made of Al or Al alloy, the first layer) made of Cu or Cu alloy is recessed are clad. The example provided in the material 10 (610) was shown. In the first modification of the first embodiment, the SUS layer 12 (second layer) and the SUS layer 13 (third layer) are formed on the four side surfaces 310a to 310d orthogonal to the stacking direction of the clad material 310. On the other hand, the example which provided the clad material 310 with the groove-shaped recessed parts 314-317 where the Cu layer 311 (1st layer) comprised from Cu or Cu alloy recessed was shown. However, the present invention is not limited to these. In the present invention, on one to four side surfaces orthogonal to the laminating direction of the clad material, groove-like depressions in which the first layer is depressed with respect to the second layer and the third layer can be provided in the clad material. . For example, like the plate material 701 of the second modified example of the first embodiment shown in FIG. 16, only the side surface 10b on the Y2 side orthogonal to the stacking direction of the clad material 710 is Cu with respect to the SUS layer 12 and the SUS layer 13. Alternatively, a groove-like recess 715 in which a Cu layer 711 made of a Cu alloy is recessed may be provided in the clad material 710. In this case, the wet etching process is performed in a state where the mask is formed so as to cover the Y1 side surface of the Cu layer 711, thereby suppressing the Cu layer 711 from dissolving from the Y1 side surface of the Cu layer 711. Is possible.

  Further, in the first and second embodiments and the first and second modifications of the first embodiment, the “second layer” and the “third layer” in the claims are both made of stainless steel. Although shown, the present invention is not limited to this. In the present invention, at least one of the second layer and the third layer may be composed of Ti or a Ti alloy. As a result, at least one of the second layer and the third layer is made of Ti or Ti alloy that is lighter than stainless steel and has high corrosion resistance. It is possible to improve the corrosion resistance. The second layer and the third layer are preferably made of the same material (for example, both are austenitic stainless steel).

  In the first and second embodiments and the first and second modifications of the first embodiment, the clad material is wet-etched with a direct current of a predetermined magnitude applied to the clad material. However, the present invention is not limited to this. In the present invention, no current needs to flow through the clad material. In this case, it is necessary to lengthen the dipping time (conveying time) in order to form a recess having a desired depth as compared with the case where a current is passed.

  The plate material of the present invention is not limited to welding applications. For example, like the folding plate materials 101 and 103 shown in FIGS. 2 and 4, respectively, a folded plate material in which the first layer is covered with the second layer or the third layer can be used alone without being welded to other members, or You may use in the state joined to other components by mechanical joining. In this case, since the corrosion resistance is improved by the second layer and the third layer covering the first layer, the bent plate material can be suitably used in an environment that requires corrosion resistance.

  Moreover, although the said 1st Embodiment showed the example which welds another member to the folded non-laminated part 12a, 12b, 13a, and 13b (part corresponding to the hollow part of a 2nd layer and a 3rd layer). The present invention is not limited to this. In this invention, you may weld another member to the part corresponding to the hollow part of the 2nd layer and 3rd layer of the state which is not bent.

  Further, in the bent plate member 104 of the first embodiment, trimming is performed to remove unnecessary portions of the non-laminated portions 13a and 13b of the SUS layer 13 and raised portions of the welded portions along the outer surfaces of the non-laminated portions 12a and 12b. Although the example which performs a process was shown, this invention is not limited to this. In the present invention, the outer surfaces of the non-laminate portions 12a and 12b, the unnecessary portions of the non-laminate portions 13a and 13b of the SUS layer 13 and the raised portions of the welded portions are removed, and the non-laminate portions 12a and 12b are bent. A so-called shaving process may be performed in which a part of the bent portion is removed to reduce the thickness of the bent portion.

  Further, in the first and second embodiments and the first and second modifications of the first embodiment, the example in which the plate material is configured by the clad material having the three-layer structure is shown, but the present invention is not limited thereto. . In the present invention, the plate material may have four or more layers. For example, between the first layer and the second layer, between the first layer and the third layer, on the surface of the second layer opposite to the first layer, on the opposite side of the third layer from the first layer The plate material may be composed of four or more layers of clad material by bonding a separate layer to any one or a plurality of locations on the surface. In addition, for example, another layer is disposed by plating or the like on one or a plurality of locations on the surface of the second layer opposite to the first layer and on the surface of the third layer opposite to the first layer. By doing so, you may comprise a board | plate material from the laminated material of a clad material and a layer (for example, plating layer) different from a clad material.

1,301,601,701 Plate material 10, 110a, 310, 410a, 610, 710 Clad material 10a Side surface (first side surface)
10b Side surface (second side surface)
11, 311 Cu layer (first layer)
11a, 611a One surface 11b, 611b The other surface 12 SUS layer (second layer)
12a, 12b, 312a Non-laminated portion (second layer corresponding to the recess)
13 SUS layer (third layer)
13a, 13b, 313a Non-laminated portion (third layer of the portion corresponding to the recess)
14, 614 recess (first recess)
15, 615 depression (second depression)
310a, 310b, 310c, 310d Side surface 314, 315, 316, 317, 715 Recess 611 Al layer (first layer)

Claims (11)

A first layer composed of Cu, Cu alloy, Al or Al alloy;
Laminated on one front side of the first layer, a second layer composed of stainless steel, Ti or Ti alloy,
Is laminated on the other table surface side of the first layer, stainless steel, and a third layer composed of Ti or a Ti alloy, and includes a thickness is 2mm or less cladding material,
The clad material, the Oite on the side surface perpendicular to the stacking direction of the clad material, together with the first layer is recessed with respect to said second layer and said third layer groove-shaped extending in the extending direction of the side surface it includes a recess, the plate member.   The depth of the said recessed part in the said side is a board | plate material of Claim 1 larger than the thickness of a said 1st layer.   The board | plate material of Claim 1 whose thickness of the said cladding material is 0.5 mm or less. The side includes a first side surface of one side in the direction perpendicular to the stacking direction, and a second side surface of the other side in the direction perpendicular to the stacking direction,
The recess, in the first aspect, the first recess portion in which the first layer is recessed with respect to the second layer and the third layer, in the second aspect, the second layer and the third The board | plate material of Claim 1 containing the 2nd hollow part in which the said 1st layer dents with respect to a layer.   2. The plate according to claim 1, wherein the first layer is covered with at least one of the second layer and the third layer in a portion corresponding to the recess. The first layer is covered with one of the second layer and the third layer in a portion corresponding to the recess,
The plate material according to claim 5 , wherein the other of the second layer and the third layer is bonded to one of the second layer and the third layer covering the first layer. The roll-bonding, Cu, a first layer composed of a Cu alloy, Al or Al alloy, laminated on one front side of the first layer, and stainless steel, a second layer composed of Ti or Ti alloys , is laminated on the other table surface side of the first layer, stainless steel, and a third layer composed of Ti or a Ti alloy, to prepare a thickness is 2mm or less cladding material,
The clad material is immersed in an etching solution, by dissolving the portion of the first layer exposed on the side surface perpendicular to the stacking direction of the clad material in the side orthogonal to the stacking direction of the clad material the together with the first layer is recessed with respect to the second layer and the third layer to form a groove-shaped recess extending in the direction of extension of the side surface to the cladding material, the manufacturing method of the plate material. The method for manufacturing a plate material according to claim 7 , wherein the second layer and the third layer in a portion corresponding to the recess are bent after the recess is formed on the side surface. A first recess portion which is recessed with respect to the second layer and the third layer to the first side surface of one side in the direction perpendicular to the stacking direction, a second side of the direction of the other side orthogonal to the stacking direction Oite the surface to form a second recess portion which is recessed with respect to the second layer and the third layer on the side as the recess, the production method of the sheet material of claim 7. The manufacturing method of the board | plate material of Claim 7 which coat | covers the part corresponding to the said recessed part of the said 1st layer by bend | folding at least one of the said 2nd layer and the said 3rd layer. Covering a portion of the first layer corresponding to the recess by bending one of the second layer and the third layer,
The manufacturing method of the board | plate material of Claim 10 which joins the other of the said 2nd layer and the said 3rd layer, and one of the said 2nd layer and the said 3rd layer which coat | cover the said 1st layer.

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