JPWO2018220891A1 - Sheet material and method of manufacturing sheet material - Google Patents

Abstract

The plate material (1) includes a first layer (11) made of Cu, Cu alloy, Al or Al alloy, and a second layer (12) and a third layer (made of stainless steel, Ti or Ti alloy) 13) and a clad material (10) having a thickness of 2 mm or less. The cladding material includes groove-like depressions (14, 15) in which the first layer is recessed with respect to the second layer and the third layer on the side surfaces (10a, 10b) orthogonal to the laminating direction of the cladding material .

Description

  The present invention relates to a plate material and a method of manufacturing the plate material.

  DESCRIPTION OF RELATED ART Conventionally, the board | plate material in which a pair of metal layer was joined to both surfaces of the lamination direction of the metal layer excellent in heat conductivity is known. Such a plate material is disclosed, for example, in Japanese Patent Application Laid-Open No. 2000-60737.

  JP-A-2000-60737 comprises a clad material including a copper core (metal layer) excellent in thermal conductivity and a pair of stainless steel outer layers diffusion bonded to both surfaces in the lamination direction of the copper core. Also, a grilled plate (plate material) is disclosed. In the clad material described in JP-A-2000-60737, the copper core is diffusion bonded to the entire surface of the pair of stainless steel outer layers.

Japanese Patent Laid-Open No. 2000-60737

  However, in the clad material described in JP-A-2000-60737, since the copper core is diffusion bonded to the entire surface of the pair of stainless steel outer layers, the welding heat is generated when welding the clad material to another member. It rapidly diffuses through the clad material along the highly thermally conductive copper core. For this reason, since the temperature of a welding part can not be made high enough due to the copper core excellent in thermal conductivity, there exists a problem that there exists a possibility that weldability may deteriorate, for example, it becomes inadequate welding.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to suppress deterioration of weldability due to a metal layer having excellent thermal conductivity. It is an object of the present invention to provide a plate material that can be

  The plate material according to the first aspect of the present invention is formed of stainless steel, Ti or a Ti alloy, laminated on a first layer made of Cu, a Cu alloy, Al or an Al alloy, and one surface side of the first layer. A clad material including a second layer and a third layer laminated on the other surface side of the first layer and made of stainless steel, Ti or a Ti alloy, and having a thickness of 2 mm or less; And a groove-like recess in which the first layer is recessed relative to the second layer and the third layer on the side surface orthogonal to the stacking direction of the clad material. In addition, "Cu alloy", "Al alloy", and "Ti alloy" mean the alloy which contains Cu, Al, and Ti as a main component 50 mass% or more, respectively.

  In the plate material according to the first aspect of the present invention, as described above, the second layer and the third layer are made of Cu, Cu alloy, Al or Al alloy on the side surface orthogonal to the laminating direction of the clad material A groove-like recess is provided in which the first layer is recessed. As a result, since the first layer made of Cu, Cu alloy, Al or Al alloy excellent in thermal conductivity is not positioned in the recess, the second layer and the third layer of the portion corresponding to the recess are When welding the members of (1), it is possible to suppress the heat at the time of welding from diffusing through the first layer. As a result, since the temperature of the welded portion can be sufficiently raised, it is possible to suppress the deterioration of the weldability due to the first layer (metal layer) excellent in thermal conductivity.

  Further, in the plate material according to the first aspect of the present invention, a clad material provided with a groove-like recess in which a first layer composed of Cu, Cu alloy, Al or Al alloy is provided is a first layer; A second layer laminated on one surface side of the first layer and made of stainless steel, Ti or Ti alloy, and a second layer laminated on the other surface side of the first layer made of stainless steel, Ti or Ti alloy It is configured to include three layers. Thus, corrosion of the first layer can be suppressed by the second layer and the third layer sandwiching the first layer being both made of high corrosion resistant stainless steel, Ti or Ti alloy. .

  In the plate material according to the first aspect, preferably, the depth of the recess in the side surface is larger than the thickness of the first layer. As a result, the length of the portion corresponding to the recess of the second layer and the third layer can be sufficiently secured, so that other members can be easily used for the second layer and the third layer of the portion corresponding to the recess. Can be welded to In addition, when the second layer and the third layer in the portion corresponding to the recess are bent, the lengths of the second layer and the third layer in the portion corresponding to the recess can be sufficiently secured. The second and third layers of the portion corresponding to the recess can be easily bent.

  In the plate material according to the first aspect, preferably, the thickness of the cladding material is 0.5 mm or less. In such a very thin plate having a thickness of 0.5 mm or less, in which the diffusion of heat by the first layer is apt to occur, the deterioration of weldability caused by the first layer (metal layer) excellent in thermal conductivity is suppressed The effect of the present invention that it can do is particularly effective.

  In the plate material according to the first aspect, preferably, the recess is formed in a groove shape extending in the direction in which the side surface extends. According to this structure, the recess portion in which the first layer is recessed can be formed in a wide range on the side surface of the clad material, so other members are used for the second layer and the third layer in the portion corresponding to the recess portion. It can be easily welded.

  In the plate material according to the first aspect, preferably, the side surface includes a first side surface on one side in a direction orthogonal to the stacking direction and a second side surface on the other side in a direction orthogonal to the stacking direction A first recess in which the first layer is recessed with respect to the second layer and the third layer in the first side surface; and a first layer in which the first layer is recessed with respect to the second layer and the third layer in the second side surface; Including 2 hollows. According to this structure, it is possible to easily weld another member to the second layer and the third layer of the portion corresponding to the recess on any of both side surfaces in the direction orthogonal to the stacking direction.

  In the plate material according to the first aspect, preferably, the first layer is covered with at least one of the second layer and the third layer in a portion corresponding to the recess. According to this structure, at least one of the second layer and the third layer having high corrosion resistance covers not only one surface and the other surface of the first layer but also the first layer exposed in a portion corresponding to the recess. As a result, corrosion of the first layer can be reliably suppressed.

  In this case, preferably, the first layer is covered with one of the second layer and the third layer in a portion corresponding to the recess, and the other of the second layer and the third layer covers the first layer. Bonded to one of the second and third layers. According to this structure, by joining the second layer and the third layer while covering the first layer, it is possible to reliably suppress the exposure of the first layer to the outside. Corrosion of the layer can be further reliably suppressed.

  In the method of manufacturing a plate material according to the second aspect of the present invention, a stainless steel is laminated by rolling bonding on a first layer composed of Cu, Cu alloy, Al or Al alloy, and one surface side of the first layer. A clad material including a second layer made of Ti or Ti alloy and a third layer made of stainless steel, Ti or Ti alloy laminated on the other surface side of the first layer and having a thickness of 2 mm or less By immersing the cladding material in an etching solution and dissolving the portion of the first layer exposed on the side surface orthogonal to the stacking direction of the cladding material, whereby the second surface on the side orthogonal to the stacking direction of the cladding material A groove-like recess in which the first layer is recessed relative to the layer and the third layer is formed in the cladding material.

  In the method of manufacturing a plate material according to the second aspect of the present invention, as described above, the groove-like recess in which the first layer is recessed with respect to the second layer and the third layer on the side surface orthogonal to the laminating direction of the cladding material The part is formed in the clad material. Thereby, it can suppress that weldability worsens resulting from the 1st layer (metal layer) excellent in heat conductivity.

  In the method of manufacturing a plate material according to the second aspect, as described above, the clad material having a thickness of 2 mm or less is immersed in the etching solution, and the first layer of the first layer exposed on the side surface orthogonal to the clad direction By dissolving the portion, a groove-like recess in which the first layer is recessed on the side surface is formed in the cladding material. A groove-like recess in which the first layer is recessed on the side surface easily and reliably, as compared to the case where the first layer is cut with a small thickness of 2 mm or less. The part can be formed.

  In the method of manufacturing a plate material according to the second aspect, the recess is preferably formed on the side surface so as to be in the form of a groove extending along the direction in which the side surface extends. According to this structure, the recess portion in which the first layer is recessed can be formed in a wide range on the side surface of the clad material, so other members are used for the second layer and the third layer in the portion corresponding to the recess portion. It can be easily welded.

  In the method of manufacturing a plate material according to the second aspect, preferably, after the depressions are formed on the side surface, the second layer and the third layer of the portion corresponding to the depressions are bent. According to this structure, other members can be easily welded to the folded second and third layers in the portion corresponding to the recess. When the second and third layers in the portion corresponding to the recess are bent to cover the first layer in the portion corresponding to the recess, the second layer and the third layer having high corrosion resistance The exposed first layer can be coated at a portion corresponding to the recess. Thereby, corrosion of the first layer can be reliably suppressed.

  In the method of manufacturing a plate material according to the above-mentioned second aspect, preferably, on a first side surface on one side in a direction orthogonal to the stacking direction, a first recess in which the first layer is recessed with respect to the second layer and the third layer In the second side surface on the other side in the direction orthogonal to the stacking direction, a second recess in which the first layer is recessed with respect to the second layer and the third layer is formed on the side surface as a recess. According to this structure, it is possible to easily weld another member to the second layer and the third layer of the portion corresponding to the recess on any of the side surfaces in the direction orthogonal to the stacking direction.

  In the method of manufacturing a plate material according to the second aspect, a portion corresponding to the recess of the first layer is preferably covered by bending at least one of the second layer and the third layer. According to this structure, at least one of the second layer and the third layer having high corrosion resistance covers not only one surface and the other surface of the first layer but also the first layer exposed in a portion corresponding to the recess. As a result, corrosion of the first layer can be reliably suppressed.

  In this case, preferably, by bending one of the second layer and the third layer, the portion corresponding to the recess of the first layer is covered, and the other of the second layer and the third layer and the first layer are covered. Bonding one of the second and third layers. According to this structure, by joining the second layer and the third layer while covering the first layer, it is possible to reliably suppress the exposure of the first layer to the outside. Corrosion of the layer can be further reliably suppressed.

  According to the present invention, as described above, a plate material or a method of manufacturing the plate material capable of suppressing deterioration of weldability due to the first layer (metal layer) excellent in thermal conductivity is provided. can do.

It is the perspective view which showed the board | plate material by 1st Embodiment of this invention. It is sectional drawing which showed an example of the bending board material which bend-processed the board material by 1st Embodiment of this invention. It is sectional drawing which showed an example of the bending board material which bend-processed the board material by 1st Embodiment of this invention. It is sectional drawing which showed an example of the bending board material which bend-processed the board material by 1st Embodiment of this invention. It is sectional drawing which showed an example of the bending board material which bend-processed the board material by 1st Embodiment of this invention. It is a schematic diagram for demonstrating the manufacturing process of the board | plate material by 1st Embodiment of this invention, and the 1st modification of 1st Embodiment. It is a schematic diagram for demonstrating the manufacturing process of the board | plate material by 1st Embodiment of this invention. It is a perspective sectional view for explaining an example of a bending board material by a 1st embodiment of the present invention. It is the perspective view which showed the board | plate material by the 1st modification of 1st Embodiment of this invention. It is the perspective view sectional drawing which showed an example of the bending board material which bent-processed the board material by the 1st modification of 1st Embodiment of this invention. It is a schematic diagram for demonstrating the manufacturing process of the board | plate material by the 1st modification of 1st Embodiment of this invention. It is a cross-sectional photograph of the board material of a comparative example. It is a cross-sectional photograph of the board | plate material of Example 1 of this invention. It is a cross-sectional photograph of the board | plate material of Example 2 of this invention. It is the perspective view which showed the board | plate material by 2nd Embodiment of this invention. It is sectional drawing which showed the board | plate material by the 2nd modification of 1st Embodiment of this invention.

  Hereinafter, an embodiment of the present invention will be described based on the drawings.

First Embodiment
First, with reference to FIGS. 1-5, the structure of the board | plate material 1 by 1st Embodiment of this invention and the bending board | plates 101-103 is demonstrated.

  The board | plate material 1 by 1st Embodiment of this invention is comprised from the clad material 10 of 3 layer structure, as shown in FIG. Specifically, the clad material 10 is laminated and joined to the Cu layer 11 made of Cu or Cu alloy and the one surface 11 a on the Z1 side of the Cu layer 11, and is a SUS layer made of stainless steel (SUS) 12 is a clad material 10 of a three-layer structure of 12 and a SUS layer 13 made of stainless steel, laminated and bonded to the other surface 11 b on the Z 2 side of the Cu layer 11. That is, at the interface Ia between the Cu layer 11 and the SUS layer 12 and at the interface Ib between the Cu layer 11 and the SUS layer 13, the elements constituting each other are diffused by rolling and joining accompanied by diffusion annealing to join at the atomic level It is done. The bent plates 101 to 104 shown in FIGS. 2 to 5 are manufactured by bending the plate 1. The Cu layer 11, the SUS layer 12, and the SUS layer 13 are examples of the "first layer", the "second layer", and the "third layer" in the claims respectively.

  The plate material 1 shown in FIG. 1 and the bent plate materials 101 to 104 shown in FIGS. 2 to 5 can be used, for example, as a conductive material, a plate spring, a terminal or a heat dissipation substrate. In particular, since the plate material 1 has the Cu layer 11 composed of Cu or Cu alloy, which has higher conductivity than stainless steel, high conductivity such as a conductive material, a plate spring with conductivity, a terminal, etc. is required. Are suitable for the intended use. In addition, since the plate material 1 has the Cu layer 11 composed of Cu or Cu alloy having high thermal conductivity compared to stainless steel, it is also suitable for applications requiring high thermal conductivity such as a heat dissipation substrate. It is.

  Further, as Cu constituting the Cu layer 11, it is possible to use C1000 series such as C1020 (oxygen-free copper), C1100 (tough pitch copper) and C1220 (phosphorus-deoxidized copper) specified in JIS H3100. In addition, as a Cu alloy constituting the Cu layer 11, it is possible to use C2000 series or the like defined in JIS H3100.

  Austenitic stainless steels (for example, SUS304, SUS316 and SUS301 specified in JIS G4304) and ferritic stainless steels (for example SUS430 specified in JIS G4304) as stainless steels constituting the SUS layers 12 and 13 Etc. can be used. Note that stainless steels other than austenitic and ferritic steels may be used. The SUS layer 12 and the SUS layer 13 may be made of the same stainless steel or may be made of different stainless steels.

  Here, the cladding material 10 constituting the plate member 1 according to the first embodiment is the SUS layer 12 and SUS on the side surface 10 a on one side (Y1 side) in the Y direction orthogonal to the stacking direction (Z direction) of the cladding material 10. In the groove-like recess 14 in which the Cu layer 11 is recessed in the Y2 direction with respect to the layer 13 and the side surface 10b on the other side (Y2 side) in the Y direction, the Cu layer 11 is And a groove-like recess 15 which is recessed in the Y1 direction. In other words, on one side (Y1 side) of the clad material 10 in the Y direction, the end face of the Cu layer 11 is closer to the center of the clad material 10 in the width direction (Y direction) than the end face of the SUS layer 12 and the end face of the SUS layer 13 The end face of the Cu layer 11 is closer to the other side (Y2 side) of the clad material 10 in the Y direction than the end face of the SUS layer 12 and the end face of the SUS layer 13 and the center in the width direction (Y direction) of the clad material 10 It is located near to.

  The depressions 14 and 15 are formed on the side surface 10 a along the entire stacking direction of the clad material 10. That is, in the recessed portions 14 and 15, the Cu layer 11 is substantially removed. More specifically, the lower surface (surface on the Z2 side) of the SUS layer 12 (non-laminated portion 12a) of the portion corresponding to the recess 14 and the SUS layer 13 (non-laminated portion 13a) of the portion corresponding to the recess 14 A groove-shaped recess 14 is formed by the upper surface (the surface on the Z1 side) and the side surface 11 c on the Y1 side of the Cu layer 11. Similarly, the lower surface (surface on the Z2 side) of (the non-laminated portion 12b of) the SUS layer 12 of the portion corresponding to the recess 15 and the upper surface of the SUS layer 13 (the non-laminated portion 13b) of the portion corresponding to the recess 15 A groove-shaped recess 15 is formed by (the surface on the Z1 side) and the side surface 11 d on the Y2 side of the Cu layer 11. The recess portion 14 and the recess portion 15 are examples of the “first recess portion” and the “second recess portion” in the claims respectively, and the side surface 10 a and the side surface 10 b are respectively in the claims. It is an example of a "1st side" and a "2nd side."

  Recesses 14 and 15 are formed in a groove shape so as to extend in the X direction in which side surfaces 10a and 10b extend. The recesses 14 and 15 are formed to extend from one end to the other end in the X direction.

  The recesses 14 and 15 are formed so as to be recessed by a depth D in the Y2 direction and the Y1 direction, respectively. In addition, in the case of the board | plate material 1, although the depth D is larger than thickness t2 of the Cu layer 11, it does not restrict to this.

  Further, as shown in FIG. 1, the plate material 1 is formed in a thin plate shape having a thickness (length in the stacking direction (Z direction)) t1 of 2 mm or less. If comprised in this way, it is suitable for the use for which weight reduction is required, such as a thermal radiation board. The plate material 1 is preferably in the form of a foil having a thickness t1 of 0.5 mm or less, and more preferably in the form of a foil having a thickness t1 of 0.15 mm or less, from the viewpoint of weight reduction. Further, the thickness t1 of the plate material 1 is preferably 50 μm or more, as welding may become difficult if the thickness is too thin.

  In the plate member 1 (cladding material 10), the thickness ratio of the Cu layer 11, the SUS layer 12, and the SUS layer 13 is not particularly limited. For example, in applications requiring large thermal conductivity such as a heat dissipation substrate or applications requiring small electrical resistance such as a conductive material, thickness t2 of Cu layer 11 is at least thickness t3 of SUS layer 12 and The thickness of the SUS layer 13 is preferably equal to or greater than t4. Further, for example, when it is desired to reduce the warpage of the plate 1 or to make the front / back distinction unnecessary, it is preferable that the thickness t3 of the SUS layer 12 be substantially equal to the thickness t4 of the SUS layer 13.

  Further, as shown in FIG. 1, in the clad material 10 having a three-layer structure, the corrosion resistance of the plate 1 is improved by sandwiching the Cu layer 11 having relatively low corrosion resistance in the Z direction by the SUS layers 12 and 13 having high corrosion resistance. It is possible to

  By bending any one or more of the non-laminated portions 12a, 12b, 13a and 13b in the plate material 1 of FIG. 1, for example, it is possible to produce the folded plate members 101 to 104 shown in FIGS. It is possible. Specifically, as shown in FIG. 2, the non-laminated portions 12a and 12b are bent in the Z2 direction so as to cover the side surfaces 11c and 11d of the Cu layer 11 in the Y direction. Then, by bending the non-laminated portions 13a and 13b in the Z1 direction so as to cover the folded non-laminated portions 12a and 12b, respectively, the folded plate material 101 can be manufactured. In the folded plate material 101, the side surface 11c is covered with the non-laminated portions 12a and 13a, and the side surface 11d is covered with the non-laminated portions 12b and 13b. When the side surfaces 11c and 11d are coated, the presence or absence of the gap between the non-laminated portion in the coated portion and the Cu layer 11 and the size of the gap may be appropriately selected depending on the application and the like. As a result, the side surfaces 11c and 11d in the Y direction of the Cu layer 11 are covered with the SUS layers 12 and 13, so that the corrosion resistance of the bent plate material 101 is further improved.

  In addition, in the bending plate material 101, for example, the welding target (another member) can be welded by laser welding or the like to the non-laminated portion 13a located at the outermost side in the Y direction. At this time, since the diffusion of heat by the Cu layer 11 is suppressed, the heat is concentrated at the welding portion, and it is possible to weld the non-laminated portion 13a and other members reliably. In addition, the shape of the bent plate material 101 can be stably maintained by, for example, putting together and overlapping overlapping portions of the non-laminated portion 12a and the non-laminated portion 13a which are bent and processed in accordance with the welding with the welding object. It becomes possible.

  Further, as shown in FIG. 3, it is possible to produce the bent plate material 102 by bending the non-laminated portions 12a and 12b in the Z1 direction and bending the non-laminated portions 13a and 13b in the Z2 direction. is there. In the folded plate material 102, the side surfaces 11c and 11d are not covered by the non-laminated portions 12a, 12b, 13a and 13b. In addition, in the bending plate material 102, for example, the welding target (another member) can be welded to the non-laminated portions 12a and 13a by laser welding or the like. Under the present circumstances, since the welding location leaves | separates from the Cu layer 11 largely, the spreading | diffusion of the heat by the Cu layer 11 is suppressed reliably. As a result, heat is more concentrated at the welds, and it is possible to weld the non-laminated portions 12a and 13a with other members more reliably.

  Further, as shown in FIG. 4, the non-laminated portions 12a and 12b are bent in the Z2 direction so as to respectively cover the side surfaces 11c and 11d of the Cu layer 11 in the Y direction, and the non-laminated portions 13a and 13b are Z2 direction The bending plate material 103 can be manufactured by bending it into In the folded plate member 103, the side surface 11c is covered with the non-laminated portion 12a, and the side surface 11d is covered with the non-laminated portion 12b. Thereby, the side surfaces 11c and 11d in the Y direction of the Cu layer 11 are covered with the SUS layers 12 and 13, so that the corrosion resistance of the bent plate material 103 is further improved. In addition, in the bending plate material 103, for example, it is possible to weld a welding target (another member) to the non-laminated portion 13a by laser welding or the like. Under the present circumstances, since the welding location leaves | separates from the Cu layer 11 largely, the spreading | diffusion of the heat by the Cu layer 11 is suppressed reliably. As a result, heat is more concentrated at the welded portion, and it is possible to weld the non-laminated portion 13a and other members more reliably.

  Further, as shown in FIG. 5, the non-laminated portions 12a and 12b are bent in the Z2 direction so as to cover the side surfaces 11c and 11d of the Cu layer 11 in the Y direction, respectively. And the non-laminated portion 12b and the non-laminated portion 13b are welded by laser welding, whereby the bent plate material 104 can be manufactured. In the folded plate member 104, the side surface 11c is covered with the non-laminated portion 12a, and the side surface 11d is covered with the non-laminated portion 12b. Furthermore, by joining the SUS layer 12 and the SUS layer 13 by welding, it is possible to maintain the state in which the side surfaces 11c and 11d of the Cu layer 11 in the Y direction are covered. As a result, it is possible to further suppress corrosion of the side surfaces 11c and 11d of the Cu layer 11 exposed in the Y direction.

  Further, in FIG. 5, the position of the outer surface of the non-laminated portion 12a in the Y direction substantially coincides with the position of the end portion of the non-laminated portion 13a in the Y direction. The position and the position of the end of the non-laminated portion 13b substantially coincide with each other. Since the welding point is away from the Cu layer 11 by being the outer surface of the non-laminated portion 12a of the SUS layer 12 and the end portion of the non-laminated portion 13a on the SUS layer 13 side, the heat is diffused by the Cu layer 11 Be suppressed. As a result, heat escape from the welded portion is suppressed, so that the SUS layer 12 and the SUS layer 13 can be reliably welded.

  As described above, the depth D of the recesses 14 and 15 is preferably larger than the thickness t2 of the Cu layer 11, and the non-laminated portions 12a, 12b, 13a and 13b can be easily bent. It is. Furthermore, in the bending plate material 101 of FIG. 2 and the bending plate material 103 of FIG. 4, it is possible to secure a sufficient crushing margin.

  Next, with reference to FIGS. 2-8, the manufacturing process of the board | plate material 1 (folding board | plate material 101-103) in 1st Embodiment is demonstrated.

  First, as shown in FIG. 6, a strip-like (plate-like) Cu material 111 composed of Cu or a Cu-based alloy, and strip-like SUS materials 112 and 113 composed of stainless steel are prepared. The lengths in the width direction (Y direction) of the Cu material 111 and the SUS materials 112 and 113 are substantially equal. Then, the SUS material 112 is disposed (laminated) on one surface of the Cu material 111 on the Z1 side, and the SUS roller 113 is disposed (laminated) on the other surface of the Cu material 111 on the Z2 side. Perform rolling bonding (rolling process). In the middle of a rolling process, intermediate annealing can be performed if needed. Thereby, the SUS layer 12, the Cu layer 211, and the SUS layer 13 are laminated in this order, and a strip-like clad material 110 having a thickness of 2 mm or less (preferably, 0.5 mm or less) is produced. Then, the strip-shaped clad material 110 is continuously subjected to heat treatment in the annealing furnace 202 to perform continuous diffusion annealing (diffusion annealing step). As a result, the Cu layer 211 and the SUS layer 12 are diffusion-bonded at the atomic level, and the Cu layer 211 and the SUS layer 13 are diffusion-bonded at the atomic level. Ru. The cladding material 110 has a three-layer structure.

  The strip-like clad materials 110 and 110a are both overlay type clad materials. That is, the SUS layer 13 is diffusion bonded on the entire surface of the one surface 211 a of the Cu layer 211 on the Z1 side, and diffusion bonding is performed on the entire surface of the other surface 211 b on the Z2 side of the Cu layer 211.

  Then, in the manufacturing method of the first embodiment, as shown in FIG. 7, the wet etching process is continuously performed on the strip-like clad material 110a using the wet etching apparatus 203 (wet etching process step). In the wet etching apparatus 203, an etching solution S is stored, and an etching tank 203a capable of heating the etching solution S by a heater 203b, an electrode 203c disposed in the etching solution S, and between the electrode 203c and the cladding material 110a. It includes an electrification device 203d for supplying current, and a plurality of transport rollers 203e for transporting the strip-like clad material 110a into the etching tank 203a.

  Here, the etching solution S is composed of an acidic solution in which the Cu or Cu alloy constituting the Cu layer 211 is more easily dissolved than the stainless steel constituting the SUS layers 12 and 13. The etching solution S is, for example, a solution of a strong acid containing sulfuric acid. The etching solution S may be an alkaline solution capable of dissolving Cu. Further, the etching solution S is maintained at a predetermined temperature (for example, about 80 ° C.) higher than room temperature by heating with the heater 203 b.

  Then, the strip-like clad material 110 a is immersed in the etching solution S by being transported inside the etching solution S in a state where a direct current of a predetermined size is caused to flow by the energization device 203 d. As a result, the exposed Cu layer 211 (see FIG. 6) dissolves on both side surfaces in the Y direction orthogonal to the stacking direction (Z direction) of the cladding material 110a and the transport direction (X direction) of the cladding material 110a. At this time, in the Cu or Cu alloy constituting the Cu layer 211 in which the current easily flows, the acid of the etching solution S and Cu (Cu alloy) preferentially react with and ionize the stainless steel, whereby The portion of the Cu layer 211 exposed on both sides dissolves.

  In the wet etching process, the acidity (concentration of sulfuric acid) of the etching solution S, the temperature of the etching solution S, the magnitude of the current, the transport speed (immersion time) of the cladding material 110a, etc. It is possible to produce recesses 14 and 15 having a depth D (see FIG. 1) of

  Thereby, the clad material 10 as shown in FIG. 1 is produced. That is, on the side surface 10a on one side (Y1 side) in the Y direction orthogonal to the stacking direction (Z direction) of the clad material 10, the recess in which the Cu layer 11 is recessed in the Y2 direction with respect to the SUS layer 12 and the SUS layer 13. 14 and a clad material 10 including a recess 15 in which the Cu layer 11 is recessed in the Y1 direction with respect to the SUS layer 12 and the SUS layer 13 on the side surface 10b on the other side (Y2 side) in the Y direction (see FIG. 1) Is made.

  Thereafter, the bending process is continuously performed as needed (a bending process step). In addition, it is possible to perform bending process by general bending process. For example, if necessary, the non-laminated portions 12a and 12b corresponding to the recessed portions 14 and 15 are conveyed while being bent by the bending roller 204 disposed at a predetermined position, as shown in FIG. Bend in any direction (Z1 direction or Z2 direction). Thereafter, if necessary, the non-laminated portions 13a and 13b corresponding to the recessed portions 14 and 15 are conveyed while being bent by the bending roller 205 disposed at a predetermined position, in either direction of the Z direction (Z1 Bend in the direction or Z2 direction). Thereby, the strip | belt-shaped bending | flexion board | plate materials 101-103 shown in FIGS. 2-4 are produced. In addition, when producing the bending board material 104 shown in FIG. 5, as shown in FIG. 7, Z2 is carried out by bending and conveying by the bending roller 204 arrange | positioned in the predetermined position, as shown in FIG. While bending in the direction, the non-laminated portions 13a and 13b are not bent.

  Then, when producing the bending plate material 104 shown in FIG. 5 from the bending plate material 104a before welding where the non-laminated portions 12a and 12b are bent as shown in FIG. 8, laser welding processing is performed as shown in FIG. It is continuously performed (laser welding process). Note that laser welding can be performed using a general laser welder 206. Under the present circumstances, as shown in FIG. 8, the contact part (welding location) of the edge part by the side of Z2 of the non-lamination part 12a and the edge part by the side of Z2 of the non-lamination part 12a of the non-lamination part 13a is continuous. Weld to Similarly, the end on the Z2 side of the non-laminated portion 12b and the abutting portion between the end on the Z2 side of the non-laminated portion 12b of the non-laminated portion 13b are welded continuously. Under the present circumstances, since it is suppressed that the heat of a welding location originates in the Cu layer 11 and is diffused, the SUS layer 12 and the SUS layer 13 are welded reliably. The welding method is not limited to laser welding, and may be electron beam welding, for example.

  And when producing the bending board material 104 shown in FIG. 5, trimming process is continuously performed as needed after a laser welding process (trimming process process). The trimming process can be performed, for example, using a trimming roller 207. Specifically, along the outer surface of the non-laminated portions 12a and 12b, the trimming roller 207 is an unnecessary portion of the non-laminated portions 13a and 13b of the SUS layer 13 and a raised portion of the welding portion (trimmed portion; see FIG. 8) Arrange to remove). As a result, the position of the outer surface of the non-laminated portion 12a in the Y direction substantially matches the position of the end of the non-laminated portion 13a in the Y direction by the trimming roller 207, and the outer surface of the non-laminated portion 12b The trimming portion is removed such that the position in the Y direction substantially matches the position of the end of the non-laminated portion 13b.

  Thereby, the strip | belt-shaped bending board | plate material 104 of FIG. 5 is produced. The trimming process may be performed before the laser welding process.

  Finally, by using the cutting machine 208, the strip-like clad material 10 is cut so as to have a predetermined length in the X direction (conveying direction), as shown in FIG. 1 (FIGS. 2 to 5). (Bold plates 101 to 104) are manufactured. If necessary, a finishing process such as a process of removing burrs mechanically or chemically and a heat treatment (annealing) process may be appropriately added.

(Effect of the first embodiment)
In the first embodiment, the following effects can be obtained.

  In the first embodiment, as described above, the clad material 10 is laminated and bonded to the Cu layer 11 made of Cu or a Cu alloy and the one surface 11 a on the Z1 side of the Cu layer 11, stainless steel (SUS) And the other surface 11b of the Cu layer 11 on the Z2 side, and is a clad material 10 of a three-layer structure of a SUS layer 13 composed of stainless steel. As a result, since the SUS layer 12 and the SUS layer 13 sandwiching the Cu layer 11 are both made of stainless steel having high corrosion resistance, corrosion of the Cu layer 11 can be suppressed.

  Further, in the first embodiment, the Cu layer of the plate material 1 with respect to the SUS layer 12 and the SUS layer 13 on the side surface 10a on one side (Y1 side) in the Y direction orthogonal to the stacking direction (Z direction) of the cladding material 10 The Cu layer 11 of the plate material 1 is recessed in the Y1 direction with respect to the SUS layer 12 and the SUS layer 13 in the groove-like recess 14 in which 11 is recessed in the Y2 direction and the side surface 10b on the other side (Y2 side) in the Y direction. The clad material 10 includes the groove-like recess 15. As a result, the cladding material 10 has the depressions 14 and 15 where the Cu layer 11 made of Cu or Cu alloy excellent in thermal conductivity is not located, whereby the SUS layers 12 and 13 of the portion corresponding to the depression 14 are obtained. When welding other members to (the non-laminated portion 12a (13a)) and the SUS layers 12 and 13 (the non-laminated portion 12b (13b)) of the portion corresponding to the recess 15, the heat at the time of welding is the Cu layer 11 Can be controlled to spread along the As a result, the temperature of the welded portion can be made sufficiently high, so that the deterioration of the weldability due to the Cu layer 11 (metal layer) excellent in thermal conductivity can be suppressed. In addition, other members can be easily welded to the non-laminated portion 12a (12b) and the non-laminated portion 13a (13b) on any of both side surfaces 10a and 10b in the Y direction orthogonal to the stacking direction.

  Further, by providing groove-like recessed portions 14 and 15 in which the Cu layer 11 is recessed in the clad material 10, the non-laminated portion 12a (12b) and the non-laminated portion 13a (13b) can be provided continuously. Thereby, when the non-laminated portion 12a (12b) and the non-laminated portion 13a (13b) are to be bent, the non-laminated portion 12a (12b) and the non-laminated portion 13a (13b) formed continuously can be reliably made. It can be bent.

  In the first embodiment, the lower surface (surface on the Z2 side) of the SUS layer 12 (non-laminated portion 12a) in the portion corresponding to the recess 14 and (non-stacked in the SUS layer 13 in the portion corresponding to the recess 14) A groove-like recess 14 is formed by the upper surface (surface on the Z1 side) of the portion 13a) and the side surface 11c on the Y1 side of the Cu layer 11. Similarly, the lower surface (surface on the Z2 side) of the SUS layer 12 (non-laminated portion 12b) in the portion corresponding to the recess 15 and the upper surface (non-laminated portion 13b) in the portion corresponding to the recess 15 A groove-shaped recess 15 is formed by the surface on the Z1 side and the side surface 11 d on the Y2 side of the Cu layer 11. Thereby, in the side surfaces 10a and 10b of the clad material 10, the recessed portions 14 and 15 can be formed in a wide range of the Cu layer 11, and therefore, the non-laminated portion 12a (12b) and the non-laminated portion 13a (13b) The members can be easily welded.

  Further, in the first embodiment, the depth D of the recessed portions 14 and 15 on the side surfaces 10 a and 10 b is made larger than the thickness t 2 of the Cu layer 11. As a result, the lengths of the non-laminated portion 12a (12b) in the SUS layer 12 and the non-laminated portion 13a (13b) in the SUS layer 13 can be sufficiently secured, so that the non-laminated portion 12a (12b) and the non-laminated portion Other members can be easily welded to the portion 13a (13b). Further, when the non-laminated portion 12a (12b) and the non-laminated portion 13a (13b) are bent, the lengths of the non-laminated portion 12a (12b) and the non-laminated portion 13a (13b) can be sufficiently secured. Therefore, the non-laminated portion 12a (12b) and the non-laminated portion 13a (13b) can be easily bent.

  In the first embodiment, the thickness t1 of the plate 1 (cladding material 10) is 2 mm or less. If comprised in this way, it is suitable for the use for which weight reduction is requested | required, such as a thermal radiation board | substrate. Preferably, the thickness t1 of the plate 1 is 0.5 mm or less. With this configuration, welding is caused not only by the reduction in weight but also by the Cu layer 11 having excellent thermal conductivity in the plate material 1 which is very thin not more than 0.5 mm and in which diffusion of heat by the Cu layer 11 easily occurs. It is possible to suppress the deterioration of the sex. Also, if the thickness t1 of the plate material 1 becomes too thin, it may be difficult to form the groove-like recesses 14 and 15 or to weld using the groove-like recesses 14 and 15. Therefore, preferably, the thickness of the plate 1 is t1 is 50 μm or more.

  Further, in the first embodiment, preferably, the Cu layer 11 of the portion (side surfaces 11 c and 11 d) corresponding to the recessed portions 14 and 15 is covered with at least one of the SUS layers 12 and 13. According to this structure, not only the one surface 11a and the other surface 11b of the Cu layer 11 but also the exposed side surfaces 11c and 11d can be covered with at least one of the SUS layers 12 and 13 having high corrosion resistance. Corrosion of the layer 11 can be reliably suppressed.

  Further, in the first embodiment, preferably, the Cu layer 11 of the portions (side surfaces 11c and 11d) corresponding to the recessed portions 14 and 15 is covered with the SUS layer 12 and the SUS layer 13 is covered on the Cu layer 11. Join (weld) to the SUS layer 12. According to this structure, by joining the SUS layer 12 and the SUS layer 13 in the state of covering the Cu layer 11, the Cu layer 11 can be reliably suppressed from being exposed to the outside, so the Cu layer can be prevented. Corrosion of 11 can be suppressed more reliably.

  Further, in the manufacturing method of the first embodiment, the wet etching process is continuously performed using the wet etching apparatus 203 on the strip-like clad material 110 a having a thickness of 2 mm or less (preferably, 0.5 mm or less). As a result, the Cu layer 11 is recessed in the Y2 direction with respect to the SUS layer 12 and the SUS layer 13 on the side surface 10a on one side (Y1 side) in the Y direction orthogonal to the stacking direction (Z direction) of the cladding material 10 In the recess 14 (see FIG. 1) and the side surface 10b on the other side (Y2 side) in the Y direction, the recess 15 (see FIG. 1) in which the Cu layer 11 is recessed in the Y1 direction with respect to the SUS layer 12 and the SUS layer 13. And is formed in the clad material 10. Thereby, the Cu layer on the side surfaces 10a and 10b of the clad material 10 is more easily and reliably compared to the case where the small clad material 110a having a thickness of 2 mm or less is subjected to precise mechanical processing such as scraping the Cu layer 11 Groove-shaped depressions 14 and 15 in which 11 is depressed can be formed. The smaller the thickness of the clad material 110a is, for example, 1.5 mm, 1 mm, 0.8 mm, 0.6 mm, 0.4 mm, etc., the application of the present invention is effective, and welding is performed even if the thickness is small. The easy board material 1 (bent board materials 101 to 104) can be obtained.

  Further, in the manufacturing method of the first embodiment, the bending process is continuously performed as needed. For example, by conveying the non-laminated portions 12a and 12b corresponding to the recessed portions 14 and 15 while bending them by the bending roller 204 disposed at a predetermined position, any direction in the Z direction (Z1 direction or Z2 direction) Bent. Thereafter, the non-laminated portions 13a and 13b corresponding to the recessed portions 14 and 15 are conveyed while being bent by the bending roller 205 disposed at a predetermined position, in either direction (Z1 direction or Z2 direction) in the Z direction. Bent. Thereby, other members can be easily welded to the non-laminated portion 12 a (12 b) of the bent SUS layer 12 and the non-laminated portion 13 a (13 b) of the SUS layer 13. When non-laminated portion 12a (12b) and non-laminated portion 13a (13b) are bent so as to cover side surfaces 11c and 11d of Cu layer 11, side surfaces 11c and 13c have high corrosion resistance. The Cu layer 11 exposed at 11 d can be coated. As a result, corrosion of the Cu layer 11 can be reliably suppressed.

  Further, in the manufacturing method of the first embodiment, at least one of the SUS layers 12 and 13 is bent as needed to cover the portions corresponding to the recessed portions 14 and 15 of the Cu layer 11. According to this structure, at least one of the SUS layer 12 and the SUS layer 13 having high corrosion resistance exposes Cu at portions corresponding to the depressions 14 and 15 as well as the one surface 11 a and the other surface 11 b of the Cu layer 11. Since the layer 11 can also be coated, corrosion of the Cu layer 11 can be reliably suppressed.

  Further, in the manufacturing method of the first embodiment, the SUS layer 12 is bent as needed to cover the portions corresponding to the recessed portions 14 and 15 of the Cu layer 11 and cover the SUS layer 13 and the Cu layer 11. And the SUS layer 12 to be bonded. According to this structure, by joining the SUS layer 12 and the SUS layer 13 in the state of covering the Cu layer 11, the Cu layer 11 can be reliably suppressed from being exposed to the outside, so the Cu layer can be prevented. Corrosion of 11 can be suppressed more reliably.

First Modified Example of First Embodiment
Next, the configuration of the plate member 301 according to the first modification of the first embodiment of the present invention will be described with reference to FIGS. 6 and 9 to 11. Unlike the plate 1 of the first embodiment, in the plate 301 (see FIG. 9) of the first modification of the first embodiment, the concave portions 316 and 317 are also provided on the side surfaces 310 c and 310 d on both sides in the X direction. An example will be described. In addition, about the structure similar to the said 1st Embodiment, while attaching | subjecting the same code | symbol, description is abbreviate | omitted.

  The board | plate material 301 by the 1st modification of 1st Embodiment of this invention is comprised from the clad material 310 of 3 layer structure, as shown in FIG. Specifically, the clad material 310 is a clad material having a three-layer structure of the Cu layer 311, the SUS layer 12, and the SUS layer 13. The Cu layer 311 is an example of the “first layer” in the claims.

  Here, the clad material 310 constituting the plate member 301 according to the first modification of the first embodiment includes the SUS layer 12 and the SUS at four side surfaces 310a to 310d orthogonal to the stacking direction (Z direction) of the clad material 310. Groove-like depressions 314 to 317 in which the Cu layer 311 is depressed with respect to the layer 13 are included. Specifically, the depressions 314 and 315 are respectively formed on the side surface 310 a on the Y1 side of the cladding material 310 and the side surface 310 b on the Y2 side. The recesses 316 and 317 are formed on the side surface 310 c on the X1 side of the cladding material 310 and the side surface 310 d on the X2 side, respectively.

  The recessed portions 314 and 315 are formed in a groove shape so as to extend in the extending X direction of the side surfaces 310a and 310b, respectively. In addition, the recessed portions 316 and 317 are formed in a groove shape so as to extend in the Y direction in which the side surfaces 310c and 310d extend. The Cu layer 311 is surrounded by the depressions 314 to 317. As a result, the SUS layer 12 (non-laminated portion 312a) in the portion corresponding to the recess 314 to 317 and the SUS layer 13 (non-laminated portion 313a) in the portion corresponding to the recess 314 to 317 are both formed circumferentially. ing.

  The recesses 314 and 315 are formed to be recessed in the Y2 direction and the Y1 direction, respectively. The recesses 316 and 317 are formed to be recessed in the X2 direction and the X1 direction, respectively. The depths of the depressions 314 to 317 are preferably larger than the thickness in the stacking direction of the Cu layer 311.

  Also in the plate member 301 of the first modified example of the first embodiment, as in the bent plate members 101 to 103 of the first embodiment shown in FIGS. You may

  Further, in the plate member 301 shown in FIG. 9, the non-laminated portion 312a is bent in the Z2 direction so as to cover the side surfaces 310a to 310d of the Cu layer 311, and the non-laminated portion 312a and the non-laminated portion 313a are laser welded. By welding circumferentially, it is possible to produce a bent plate member 304 shown in FIG. In FIG. 10, although only a part of the welding portion is shown, welding is actually performed over the entire periphery of the plate member 301. In the bent plate member 304, the entire side surface is covered with the non-laminated portion 312a, and the SUS layer 12 and the SUS layer 13 are joined by welding. As a result, it is possible to keep the entire Cu layer 311 completely covered. As a result, corrosion of the Cu layer 311 can be further suppressed. Further, since the welded portion is away from the Cu layer 311 by being the outer surface of the non-laminated portion 312a of the SUS layer 12 and the end portion of the non-laminated portion 313a of the SUS layer 13, heat diffusion by the Cu layer 311 is suppressed. Be done. As a result, heat escape from the welded portion is suppressed, so that the SUS layer 12 and the SUS layer 13 can be reliably welded.

  The remaining structure of the plate member 301 according to the first modification of the first embodiment is similar to that of the plate member 1 according to the aforementioned first embodiment.

  Next, a method of manufacturing the plate member 301 of the first modified example of the first embodiment will be described. The manufacturing process up to the fabrication of the band-like clad material 110a having the three-layer structure shown in FIG. 6 is the same as that of the first embodiment, and thus the description thereof is omitted.

  In the manufacturing method of the first modification of the first embodiment, as shown in FIG. 11, the strip-like clad material 110a is made to have a predetermined length in the X direction (conveying direction) using the cutting machine 506. A plurality of clad members 410a are manufactured by cutting (cutting step). Thereafter, a wet etching process is performed on the plurality of cut clad materials 410 a using a wet etching apparatus 503 (wet etching process step). In the wet etching apparatus 503, an etching solution S is stored, and a batch tank 503a capable of heating the etching solution S by the heater 503b, an electrode 503c disposed in the etching solution S, and between the electrode 503c and the cladding material 410a. It includes an electrification device 503d for supplying a current, and a gripping portion 503e for arranging a plurality of clad materials 410a in the batch tank 503a.

  Then, the plurality of clad materials 410 a are immersed in the etching solution S in a state where a direct current of a predetermined magnitude is caused to flow by the energization device 503 d. As a result, the portion of the Cu layer 311 exposed on the side surfaces 310a to 310d in the X and Y directions orthogonal to the stacking direction (Z direction) of the cladding material 410a is dissolved. At this time, depressions 314 to 317 having a desired depth are produced by appropriately setting the acidity (concentration of sulfuric acid) of the etching solution S, the temperature of the etching solution S, the magnitude of the current, the immersion time, and the like. It is possible.

  Thereby, a clad material 310 as shown in FIG. 9 is manufactured. That is, in the side surfaces 310a to 310d in the direction orthogonal to the stacking direction (Z direction) of the cladding material 310, the cladding material 310 including the recessed portions 314 to 317 in which the Cu layer 311 is recessed with respect to the SUS layer 12 and the SUS layer 13. It is made.

  Thereafter, a bending process, a laser welding process, a trimming process, a finishing process, a heat treatment process, and the like are appropriately performed as needed. In this case, unlike the first embodiment in which the band-like clad material 310 is subjected to bending and the like, the laser welding process and the trimming process are different from the first embodiment in which the piece-like clad material 310 is not shown. Bending and trimming are performed using this. The effects of the first modification of the first embodiment are the same as the effects of the first embodiment.

(Example)
Next, with reference to FIG. 9 and FIGS. 11 to 14, an embodiment carried out to confirm the effect of the present invention will be described. In the present example, based on the manufacturing method of the first modified example of the first embodiment, the plate members 301 of the first example and the second example in which the immersion time is made different are manufactured, and the cross-sectional observation is performed.

  Specifically, a clad material 110a (see FIG. 11) having a thickness of 150 μm in the stacking direction (Z direction) was produced. In the clad material 110a, the thickness in the stacking direction of the Cu layer 311, the thickness in the stacking direction of the SUS layer 12, and the thickness in the stacking direction of the SUS layer 13 are equal. Then, as shown in FIG. 11, the wet etching process was performed on the clad material 410a cut into a predetermined size.

  In the wet etching process, a solution of a strong acid containing sulfuric acid was used as the etching solution S. Further, the temperature of the etching solution S was set to 80.degree. In addition, the immersion time was 30 minutes. Thereby, the clad material 310 (plate material 301) of Example 1 in which the depressions 314 to 317 shown in FIG. 9 were formed was produced.

  Moreover, except for having made immersion time into 120 minutes, it carried out similarly to Example 1, and produced clad material 310 (plate material 301) of Example 2 in which hollow parts 314-317 were formed.

  In addition, as a reference example, an unprocessed clad material 410 a not subjected to the wet etching process was used as it is.

  And the clad material of the reference example and Example 1 and 2 was cut | disconnected, and the cross section was observed. Photographs of cross sections of the clad materials of the reference example and the examples 1 and 2 are shown in FIG. 12, FIG. 13 and FIG. 14, respectively.

  As shown in FIG. 12 to FIG. 14, in the case of the non-treatment (reference example), while the recess is not formed in the Cu layer, Examples 1 and 2 in which the wet etching treatment was performed for 30 minutes and 120 minutes respectively Then, it has been confirmed that in the side surface of the clad material, a recessed portion in which the Cu layer is recessed is formed with respect to the pair of SUS layers sandwiching the Cu layer. In Example 2 in which the immersion time was long, a recess having a depth (393 μm) larger than the depth (151 μm) of the recess in Example 1 was formed. Thereby, it was confirmed that the depth of the recess can be adjusted by adjusting at least the immersion time. In addition, it is considered that the depth of the recess can be adjusted also by the acidity (concentration of sulfuric acid) of the wet etching solution, the temperature of the wet etching solution, the magnitude of the current, and the like.

  Further, in Example 2 in which the immersion time was long, the interface side between the Cu layer and the SUS layer was significantly recessed as compared with the center side in the stacking direction of the Cu layer. That is, it was found that the dissolution of Cu is more likely to progress on the side of the interface between the Cu layer and the SUS layer, as compared with the center side in the stacking direction of the Cu layer.

Second Embodiment
Next, a plate 601 according to a second embodiment of the present invention will be described with reference to FIG. In the second embodiment of the present invention, an example of forming the plate member 601 from a clad material 610 using an Al layer 611 made of Al or an Al alloy instead of the Cu layer 11 will be described. The Al layer 611 is an example of the “first layer” in the claims.

  The plate member 601 according to the second embodiment of the present invention is, as shown in FIG. 15, composed of a clad material 610 having a three-layer structure. Specifically, the clad material 610 includes an Al layer 611 made of Al or an Al alloy, a SUS layer 12 laminated and joined to one surface 611 a of the Al layer 611 on the Z1 side, and the Z2 side of the Al layer 611. And a clad material of a three-layer structure with the SUS layer 13 laminated and joined to the other surface 611 b of

  The plate member 601 can be used, for example, as a conductive material, a plate spring, a terminal, a heat dissipation substrate, or the like. In particular, since the plate member 601 has the Al layer 611 made of Al or Al alloy which is lighter than Cu or Cu alloy, the plate member 601 is suitable for applications requiring weight reduction such as a heat dissipation substrate.

  As Al constituting the Al layer 611, it is possible to use A1000 series such as A1085 and A1050 specified in JIS H4000. In addition, as an Al alloy constituting the Al layer 611, it is possible to use A2000 series or the like defined in JIS H4000.

  Here, in the clad material 610 constituting the plate member 601 according to the second embodiment, the SUS layers 12 and 13 are provided on the side surface 10a on one side (Y1 side) in the Y direction orthogonal to the stacking direction (Z direction) of the clad material 610. On the other hand, in the recess portion 614 in which the Al layer 611 is recessed in the Y2 direction and the side surface 10b on the other side (Y2 side) in the Y direction, the recess portion in which the Al layer 611 is recessed in the Y1 direction with respect to the SUS layers 12 and 13. And 615. The recess 614 and the recess 615 are examples of the “first recess” and the “second recess” in the claims respectively.

  Also in the plate member 601, as illustrated in FIGS. 2 to 4 of the first embodiment, the SUS layer 12 (non-laminated portion 12a (12b)) and the recess corresponding to the recess 614 (615) A portion of the SUS layer 13 (non-laminated portion 13a (13b)) corresponding to 614 (615) may be bent. In addition, if necessary, a laser welding process, a trimming process, a finishing process, a heat treatment process, and the like may be appropriately added. The remaining structure of the plate member 601 of the second embodiment is similar to that of the aforementioned first embodiment.

  Further, in the method of manufacturing the plate member 601 of the second embodiment, a strip-like Al material made of Al or an Al-based alloy is used instead of the Cu material 111, and the composition of the wet etching solution is adjusted. The manufacturing method is the same as that of the plate material 1 of the first embodiment except that Al or an Al alloy is more easily dissolved than stainless steel.

(Effect of the second embodiment)
In the second embodiment, the following effects can be obtained.

  In the second embodiment, as described above, the cladding material 610 is opposed to the SUS layers 12 and 13 at the side surface 10a on one side (Y1 side) in the Y direction orthogonal to the stacking direction (Z direction) of the cladding material 610. And the recess 615 in which the Al layer 611 is recessed in the Y1 direction with respect to the SUS layers 12 and 13 in the recess 614 in which the Al layer 611 is recessed in the Y2 direction and the side surface 10b on the other side (Y2 side) in the Y direction. including. Thus, as in the first embodiment, the deterioration of the weldability due to the Al layer 611 having excellent thermal conductivity can be suppressed. The remaining effects of the second embodiment are similar to those of the aforementioned first embodiment.

[Modification]
It should be understood that the embodiments and examples disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is indicated not by the description of the embodiments and examples described above but by the claims, and further includes all modifications (variations) within the meaning and scope equivalent to the claims.

  For example, in the first (second) embodiment, in the side surfaces 10a and 10b orthogonal to the stacking direction of the clad material 10 (610), the SUS layer 12 (second layer) and the SUS layer 13 (third layer) are used. Grooves 14 and 15 (recesses 614 and 615) in which the Cu layer 11 (Al layer 611 composed of Al or Al alloy, first layer) composed of Cu or Cu alloy is recessed The example provided in the material 10 (610) was shown. In the first modification of the first embodiment, the SUS layer 12 (second layer) and the SUS layer 13 (third layer) are formed on the four side surfaces 310a to 310d orthogonal to the stacking direction of the cladding material 310. On the other hand, the example which provided the groove-like recess parts 314-317 in which the Cu layer 311 (1st layer) comprised from Cu or Cu alloy is dented in the cladding material 310 was shown. However, the present invention is not limited to these. In the present invention, it is possible to provide the clad material with groove-like depressions in which the first layer is recessed relative to the second layer and the third layer on one to four side surfaces orthogonal to the stacking direction of the clad material. . For example, as in the plate member 701 of the second modified example of the first embodiment shown in FIG. 16, the SUS layer 12 and the SUS layer 13 are Cu only on the side surface 10b on the Y2 side orthogonal to the stacking direction of the cladding material 710. Alternatively, the clad material 710 may be provided with a groove-like recess 715 in which the Cu layer 711 made of a Cu alloy is recessed. In this case, while the mask is formed to cover the side surface of the Cu layer 711 on the Y1 side, the wet etching process is performed to suppress the dissolution of the Cu layer 711 from the side surface of the Cu layer 711 on the Y1 side. Is possible.

  In the first and second embodiments of the first and second embodiments and the first and second modifications of the first embodiment, an example in which the "second layer" and the "third layer" in the claims are both made of stainless steel Although shown, the present invention is not limited to this. In the present invention, at least one of the second layer and the third layer may be configured to be made of Ti or Ti alloy. Thus, the plate material can be reduced in weight by making at least one layer of the second layer and the third layer lighter in weight than stainless steel and having high corrosion resistance, as well as reducing the thickness of the plate material. It is possible to improve the corrosion resistance of The second layer and the third layer are preferably made of the same material (for example, both austenitic stainless steels).

  In the first and second embodiments of the first and second embodiments and the first embodiment, the cladding material is wet-etched in a state where a direct current of a predetermined magnitude is supplied to the cladding material. Although the example which was made to immerse is shown, this invention is not limited to this. In the present invention, no current may be supplied to the clad material. In this case, it is necessary to make the immersion time (transport time) longer in order to form a recess of a desired depth as compared to the case where a current is supplied.

  The plate material of the present invention is not limited to welding applications. For example, as shown in FIG. 2 and FIG. 4 respectively, a bent plate coated with the first layer by the second layer or the third layer alone or without welding to another member, as shown by the bent plates 101 and 103 respectively. You may use in the state joined to the other components by mechanical joining etc. In this case, since the corrosion resistance is improved by the second layer and the third layer which covers the first layer, the bent plate material can be suitably used in an environment requiring the corrosion resistance.

  In the first embodiment, an example is shown in which another member is welded to the bent non-laminated portions 12a, 12b, 13a and 13b (portions corresponding to the depressions of the second and third layers). The present invention is not limited to this. In the present invention, other members may be welded to portions corresponding to the depressions of the second and third layers in the unfolded state.

  Further, in the bent plate material 104 of the first embodiment, trimming is performed along the outer side surfaces of the non-laminated portions 12a and 12b to remove unnecessary portions of the non-laminated portions 13a and 13b of the SUS layer 13 and bulging portions of welds. Although the example which processes is shown, this invention is not limited to this. In the present invention, the outer side surfaces of the non-laminated portions 12a and 12b, the unnecessary portions of the non-laminated portions 13a and 13b of the SUS layer 13 and the raised portions of the welded portion are removed and the non-laminated portions 12a and 12b are bent. A so-called shaving process may be performed to remove a part of the broken portion to reduce the thickness of the bent portion.

  In the first and second embodiments and the first and second modifications of the first embodiment, the plate material is formed of a clad material having a three-layer structure, but the present invention is not limited to this. . In the present invention, the plate material may have a configuration of four or more layers. For example, between the first layer and the second layer, between the first layer and the third layer, on the surface of the second layer opposite to the first layer, opposite to the first layer of the third layer The plate material may be composed of four or more layers of cladding materials by joining separate layers at any one or more locations on the surface of the plate. Further, for example, another layer is disposed by plating or the like on any one or a plurality of locations on the surface of the second layer opposite to the first layer and on the surface of the third layer opposite to the first layer. By doing this, the plate material may be formed of a laminated material of a clad material and a layer (for example, a plating layer) different from the clad material.

1, 301, 601, 701 Plate material 10, 110 a, 310, 410 a, 610, 710 Clad material 10 a Side surface (first side surface)
10b side (second side)
11, 311 Cu layer (first layer)
11a, 611a one surface 11b, 611b other surface 12 SUS layer (second layer)
12a, 12b, 312a non-laminated portion (second layer of the portion corresponding to the recess)
13 SUS layer (third layer)
13a, 13b, 313a non-laminated portion (third layer of the portion corresponding to the recess)
14, 614 recess (first recess)
15, 615 depression (second depression)
310a, 310b, 310c, 310d side surfaces 314, 315, 316, 317, 715 depressions 611 Al layer (first layer)

The plate material according to the first aspect of the present invention is formed of stainless steel, Ti or a Ti alloy, laminated on a first layer made of Cu, a Cu alloy, Al or an Al alloy, and one surface side of the first layer. A clad material including a second layer and a third layer laminated on the other surface side of the first layer and made of stainless steel, Ti or a Ti alloy, and having a thickness of 2 mm or less; The side surface perpendicular to the laminating direction of the clad material includes a groove-like recess portion in which the first layer is recessed with respect to the second layer and the third layer and extends in the direction in which the side surface extends . In addition, "Cu alloy", "Al alloy", and "Ti alloy" mean the alloy which contains Cu, Al, and Ti as a main component 50 mass% or more, respectively.

In the plate material according to the first aspect of the present invention, as described above, the second layer and the third layer are made of Cu, Cu alloy, Al or Al alloy on the side surface orthogonal to the laminating direction of the clad material The first layer is recessed and a groove-like recess extending in the direction in which the side surface extends is provided. As a result, since the first layer made of Cu, Cu alloy, Al or Al alloy excellent in thermal conductivity is not positioned in the recess, the second layer and the third layer of the portion corresponding to the recess are When welding the members of (1), it is possible to suppress the heat at the time of welding from diffusing through the first layer. As a result, since the temperature of the welded portion can be sufficiently raised, it is possible to suppress the deterioration of the weldability due to the first layer (metal layer) excellent in thermal conductivity.

In the plate material according to the first aspect, the recess is formed in a groove shape extending along the direction in which the side surface extends. According to this structure, the recess portion in which the first layer is recessed can be formed in a wide range on the side surface of the clad material, so other members are used for the second layer and the third layer in the portion corresponding to the recess portion. It can be easily welded.

In the method of manufacturing a plate material according to the second aspect of the present invention, a stainless steel is laminated by rolling bonding on a first layer composed of Cu, Cu alloy, Al or Al alloy, and one surface side of the first layer. A clad material including a second layer made of Ti or Ti alloy and a third layer made of stainless steel, Ti or Ti alloy laminated on the other surface side of the first layer and having a thickness of 2 mm or less By immersing the cladding material in an etching solution and dissolving the portion of the first layer exposed on the side surface orthogonal to the stacking direction of the cladding material, whereby the second surface on the side orthogonal to the stacking direction of the cladding material The first layer is recessed with respect to the layer and the third layer, and a groove-like recess extending in the direction in which the side surface extends is formed in the cladding material.

In the method of manufacturing a plate material according to the second aspect of the present invention, as described above, the first layer is recessed with respect to the second layer and the third layer on the side surface orthogonal to the laminating direction of the clad material and the side surface is extended A groove-like recess extending in the direction is formed in the cladding material. Thereby, it can suppress that weldability worsens resulting from the 1st layer (metal layer) excellent in heat conductivity.

The method of manufacturing a sheet according to the second aspect, so that the groove extending along the direction of extension of the side surface to form a recess in the side surface. According to this structure, the recess portion in which the first layer is recessed can be formed in a wide range on the side surface of the clad material, so other members are used for the second layer and the third layer in the portion corresponding to the recess portion. It can be easily welded.

Claims (13)

A first layer (11) composed of Cu, Cu alloy, Al or Al alloy;
A second layer (12) laminated on one surface (11a) side of the first layer and made of stainless steel, Ti or Ti alloy;
A clad material (10) including a third layer (13) laminated on the other surface (11b) side of the first layer and made of stainless steel, Ti or a Ti alloy, and having a thickness of 2 mm or less ,
The cladding material is a groove-like recess (14, 15) in which the first layer is recessed with respect to the second layer and the third layer on the side surfaces (10a, 10b) orthogonal to the laminating direction of the cladding material. Plates containing (1).   The board | plate material of Claim 1 whose depth of the said hollow part in the said side is larger than the thickness of the said 1st layer.   The board | plate material of Claim 1 whose thickness of the said clad material is 0.5 mm or less.   The plate member according to claim 1, wherein the recess is formed in a groove shape extending along a direction in which the side surface extends. The side surface includes a first side surface (10a) on one side in a direction orthogonal to the stacking direction, and a second side surface (10b) on the other side in a direction orthogonal to the stacking direction.
The recess is a first recess (14) in which the first layer is recessed with respect to the second layer and the third layer in the first side, and the second layer in the second side The board | plate material of Claim 1 including the 2nd recessed part (15) which the said 1st layer is dented with respect to the said 3rd layer.   The plate material according to claim 1, wherein the first layer is covered with at least one of the second layer and the third layer in a portion corresponding to the recess. The first layer is covered with one of the second layer and the third layer at a portion corresponding to the recess.
The board | plate material of Claim 6 in which the other of the said 2nd layer and the said 3rd layer is joined to one of the said 2nd layer which coats the said 1st layer, and the said 3rd layer. The first layer (211) made of Cu, Cu alloy, Al or Al alloy, and one side (11a) of the first layer are laminated by rolling bonding, and made of stainless steel, Ti or Ti alloy A second layer (12) and a third layer (13) laminated on the other surface (11b) side of the first layer and made of stainless steel, Ti or a Ti alloy, and having a thickness of 2 mm or less Produce a cladding material (10),
The cladding material is immersed in an etching solution, and the portion of the first layer exposed on the side surface (10a, 10b) orthogonal to the stacking direction of the cladding material is melted to cross the lamination direction of the cladding material at right angles The manufacturing method of a board material (1) which forms in the clad material a slot-like depression (14, 15) in which the first layer is recessed with respect to the second layer and the third layer on the side surface.   The method for manufacturing a plate material according to claim 8, wherein the recess is formed in the side surface so as to be a groove shape extending along the direction in which the side surface extends.   The manufacturing method of the board | plate material of Claim 8 which bends the said 2nd layer and 3rd layer of the part corresponding to the said recessed part after forming the said recessed part in the said side.   The first recess (14) recessed relative to the second layer and the third layer on the first side surface (10a) on one side in the direction orthogonal to the stacking direction, and the other in the direction orthogonal to the stacking direction The plate material according to claim 8, wherein a second recess (15) recessed relative to the second layer and the third layer is formed on the side surface as the recess in the second side surface (10b) on the side. Manufacturing method.   The manufacturing method of the board | plate material of Claim 8 which covers the part corresponding to the said hollow part of a said 1st layer by bend | folding at least one of a said 2nd layer and a said 3rd layer. Covering one portion of the first layer corresponding to the recess by bending one of the second layer and the third layer;
The manufacturing method of the board | plate material of Claim 12 which joins the other of said 2nd layer and said 3rd layer, and one of said 2nd layer which coats said 1st layer, and said 3rd layer.

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