JP2014162943A - Automotive terminal material and method for producing the same - Google Patents

Automotive terminal material and method for producing the same Download PDF

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JP2014162943A
JP2014162943A JP2013034006A JP2013034006A JP2014162943A JP 2014162943 A JP2014162943 A JP 2014162943A JP 2013034006 A JP2013034006 A JP 2013034006A JP 2013034006 A JP2013034006 A JP 2013034006A JP 2014162943 A JP2014162943 A JP 2014162943A
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plating
layer
plating layer
film
matte
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Kazuo Yoshida
和生 吉田
Akira Tachibana
昭頼 橘
Yoshiaki Kobayashi
良聡 小林
Shuichi Kitagawa
秀一 北河
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Furukawa Electric Co Ltd
Furukawa Automotive Systems Inc
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Furukawa Automotive Systems Inc
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Abstract

PROBLEM TO BE SOLVED: To provide an automotive terminal material having excellent bendability and weldability by achieving the optimization of an Ni plating film as base plating formed on a brass sheet, and a method for producing the same.SOLUTION: The automotive terminal material is composed of composite layer plating in which the surface of a brass sheet 2 is provided with: an Ni plating film 3 as base plating; a Cu plating film 6 as intermediate plating; and an Sn plating film 7 as surface layer plating, where the Ni plating film 3 is formed by alternately laminating at least one glossy Ni plating layer 4 and at least one dull Ni plating layer 5 one by one.

Description

本発明は、黄銅板上に、下地めっきとしてのNiめっき皮膜、中間めっきとしてのCuめっき皮膜、および表層めっきとしてのSnめっき皮膜を有する、曲げ加工性と溶接性に優れた自動車端子材料に関する。   The present invention relates to an automobile terminal material having a Ni plating film as a base plating, a Cu plating film as an intermediate plating, and an Sn plating film as a surface layer plating on a brass plate and excellent in bending workability and weldability.

金属材料自体が有する特性に加えて、さらに表面硬さ、耐食性、耐熱性、導電性、溶接性などの所望の物理的特性を付与ないし向上させるため、通常は、金属基材の表面に、金属基材とは異なる組成のめっき皮膜を形成してめっき材料として使用する場合が多く、このようなめっき材料は、缶用材料、電気製品、端子やコネクタなどの電子部品などの広い技術分野にわたって汎用されている。   In order to impart or improve desired physical properties such as surface hardness, corrosion resistance, heat resistance, conductivity, weldability, etc. in addition to the properties of the metal material itself, the surface of the metal substrate is usually made of metal. In many cases, a plating film having a composition different from that of the base material is formed and used as a plating material. Such a plating material is widely used in a wide range of technical fields such as can materials, electrical products, and electronic parts such as terminals and connectors. Has been.

この中で、端子、特に自動車等の車両で使用される自動車端子は、例えば特許文献1および2に記載されているように、黄銅のような銅合金基材上に、下地めっき層としてのNi層、中間めっき層としてのCu層、表面めっき層としてのSn層を順次形成した後、通常はリフロー処理を施すことにより得られためっき材料から製造されるのが一般的である。   Among these, terminals, particularly automobile terminals used in vehicles such as automobiles, are described in Patent Documents 1 and 2, for example, Ni as a base plating layer on a copper alloy substrate such as brass. In general, it is generally manufactured from a plating material obtained by forming a layer, a Cu layer as an intermediate plating layer, and an Sn layer as a surface plating layer in order, and then performing a reflow treatment.

また、最近では、自動車内のスペースの狭小化に伴う端子の小型化や、電線導体と端子で形成される接続構造体の耐久性を改善する等の観点から、自動車端子は、所定の板形状に打ち抜いためっき材料を、筒状に曲げ加工を施してコネクタ部の形成と、筒状圧着部の仮形成を行い、その後、曲げ加工を施しためっき材料の両端をレーザ溶接することにより筒状圧着部を形成する試みがなされつつある。   In addition, recently, from the viewpoint of reducing the size of the terminal due to the narrowing of the space in the automobile and improving the durability of the connection structure formed by the wire conductor and the terminal, the automobile terminal has a predetermined plate shape. The plated material is punched into a cylindrical shape, the connector is formed, and the tubular crimped portion is temporarily formed. Then, both ends of the bent plated material are laser welded to form a tubular shape Attempts are being made to form a crimped part.

この自動車端子は、筒状圧着部に、電線の導体露出部分を挿入し圧着することにより、密閉構造を有する接続構造体を形成することができ、この密閉構造には水分が浸入しにくいため、電線導体と端子との間で、いわゆる異種金属間腐食を抑制することができ、これにより、電線導体と端子間で長期間にわたって安定した電気導通を確保することができるという利点がある。   This automobile terminal can form a connection structure having a sealed structure by inserting the conductor exposed portion of the electric wire into the cylindrical crimped portion and crimping, and moisture does not easily enter the sealed structure. So-called dissimilar metal corrosion can be suppressed between the electric wire conductor and the terminal, and there is an advantage that stable electric conduction can be ensured between the electric wire conductor and the terminal for a long period of time.

このような密閉構造を有する接続構造体の形成が可能な自動車端子は、軽量化の観点から、電線に、アルミニウムまたはアルミニウム合金からなる電線(以下、単に「アルミニウム電線」という。)を用いて接続構造体を形成した場合に、特に異種金属間腐食を抑制できる点で好ましい。   From the viewpoint of weight reduction, an automobile terminal capable of forming a connection structure having such a sealed structure is connected to an electric wire using an electric wire made of aluminum or an aluminum alloy (hereinafter simply referred to as “aluminum electric wire”). When a structure is formed, it is particularly preferable in that corrosion between different metals can be suppressed.

また、自動車端子に用いるめっき材料の基材としては、強度やコストの点から、黄銅基材を用いることが好ましい。   Moreover, as a base material of the plating material used for the automobile terminal, it is preferable to use a brass base material from the viewpoint of strength and cost.

しかしながら、上記のように管状圧着部を有する端子の形成は、板状のめっき材料から筒状に曲げ加工されるとともに、その後に、レーザ溶接を行うため、厳しい曲げ加工条件と、レーザ溶接時に発生する溶接熱の双方に耐え得るようなめっき材料を使用することが必要とされる。   However, as described above, the terminal having the tubular crimping portion is bent from a plate-like plating material into a cylindrical shape and then laser-welded, so that it occurs during severe bending conditions and laser welding. Therefore, it is necessary to use a plating material that can withstand both of the welding heat.

このとき、特許文献1や2に記載されたようなめっき層構造を有する従来のめっき材料を用いて端子の管状圧着部を形成するためのレーザ溶接を行うと、銅合金基材中の銅が溶接熱によって表層めっきのSnめっき層中に熱拡散する傾向があり、Snめっき層中にSn−Cu合金層が形成される結果、電気接触抵抗が上昇するという問題がある。   At this time, when laser welding is performed to form a tubular crimping portion of a terminal using a conventional plating material having a plating layer structure as described in Patent Documents 1 and 2, the copper in the copper alloy base material is There is a tendency that heat welding diffuses into the Sn plating layer of the surface plating due to welding heat, and as a result of the formation of the Sn-Cu alloy layer in the Sn plating layer, there is a problem that the electrical contact resistance increases.

加えて、銅合金基材が黄銅基材である場合、非特許文献1及び2に記載されているように、黄銅基材中の亜鉛が溶接熱によって蒸発しやすく、亜鉛が蒸発した黄銅基材の溶接性が劣化するという問題もあった。黄銅を溶解する場合、1000℃程度の温度が必要となるのに対し、黄銅に多く含有されるZnの沸点は一気圧下において約907℃であるため、黄銅が溶融する温度領域ではZnが気化して体積膨張する。結果、黄銅材料をレーザ溶接すると、大量のブローホール、溶接表面の荒れ、割れ、などの溶接欠陥が多発するという問題が発生する。 In addition, when the copper alloy base material is a brass base material, as described in Non-Patent Documents 1 and 2, the brass base material in which zinc in the brass base material is easily evaporated by welding heat and zinc is evaporated. There was also a problem that the weldability of the steel deteriorated. When brass is melted, a temperature of about 1000 ° C. is required, whereas the boiling point of Zn contained in a large amount of brass is about 907 ° C. under one atmospheric pressure. And volume expansion. As a result, when the brass material is laser-welded, there arises a problem that a lot of welding defects such as a large amount of blowholes, a rough weld surface, and cracks occur.

銅合金基材中の成分が、溶接熱によって熱拡散や蒸発するのを抑制するための従来の手段としては、例えば、下地めっきとしてのニッケルめっき皮膜を1μm以上と厚く形成することが有用である。   As a conventional means for suppressing heat diffusion and evaporation of components in the copper alloy base material due to welding heat, for example, it is useful to form a nickel plating film as a base plating as thick as 1 μm or more. .

しかしながら、通常のNiめっき皮膜は、皮膜中の内部応力が高く、皮膜硬さが高いため、1μm超えの厚さのNiめっき皮膜を銅合金基材上に形成すると、曲げ加工時にNiめっき皮膜に割れが生じやすくなり、場合によってはめっき皮膜で生じた割れが基材にまで伝播するおそれもあるという問題があり、特に上述したような厳しい曲げ加工条件の場合には、この問題は顕著になると考えられる。   However, a normal Ni plating film has a high internal stress in the film and a high film hardness. Therefore, when a Ni plating film with a thickness exceeding 1 μm is formed on a copper alloy substrate, the Ni plating film is formed during bending. There is a problem that cracks are likely to occur, and in some cases there is a possibility that cracks generated in the plating film may propagate to the base material, especially in the case of severe bending conditions as described above, Conceivable.

特許文献1及び2には、いずれも溶接熱に伴う銅合金基材、特に黄銅基材中の成分の熱拡散や蒸発については記載がなく、また、Niめっき皮膜の厚さがいずれも1μm以下と薄いため、銅合金基材中の成分が、溶接熱によって熱拡散や蒸発するのを十分に抑制することはできない。   Patent Documents 1 and 2 do not describe the thermal diffusion and evaporation of components in a copper alloy base material, particularly a brass base material, which accompanies welding heat, and the thickness of each Ni plating film is 1 μm or less. Therefore, it is not possible to sufficiently suppress the components in the copper alloy base material from being thermally diffused and evaporated by welding heat.

特開2003−171790号公報JP 2003-171790 A 特開2004−68026号公報JP 2004-68026 A

西尾安弘、外2名、「銅および銅合金の溶接」、溶接学会誌、溶接学会、1969年、第38巻、第9号、p.18−27Yasuhiro Nishio and two others, “Welding of copper and copper alloys”, Journal of the Japan Welding Society, Japan Welding Society, 1969, Vol. 38, No. 9, p. 18-27 「銅および銅合金の基礎と工業技術(改訂版)」、日本伸銅協会、平成6年、p.358“Basics and Industrial Technology of Copper and Copper Alloys (Revised Version)”, Japan Copper and Brass Association, 1994, p. 358

本発明の目的は、黄銅板上に形成する下地めっきとしてのNiめっき皮膜の適正化を図ることにより、曲げ加工性と溶接性に優れた自動車端子材料およびその製造方法を提供することにある。   An object of the present invention is to provide an automobile terminal material excellent in bending workability and weldability by providing an appropriate Ni plating film as a base plating formed on a brass plate, and a method for producing the same.

上記目的を達成するため、本発明の要旨構成は以下の通りである。
(1)黄銅板上に、下地めっきとしてのNiめっき皮膜、中間めっきとしてのCuめっき皮膜、および表層めっきとしてのSnめっき皮膜を有する自動車端子材料において、Niめっき皮膜が、少なくとも1層の光沢Niめっき層と、少なくとも1層の無光沢Niめっき層とを、1層ずつ交互に積層して形成した複層めっきからなることを特徴とする自動車端子材料。
In order to achieve the above object, the gist of the present invention is as follows.
(1) In an automobile terminal material having a Ni plating film as a base plating, a Cu plating film as an intermediate plating, and a Sn plating film as a surface plating on a brass plate, the Ni plating film has at least one layer of bright Ni An automotive terminal material comprising a multilayer plating formed by alternately laminating a plating layer and at least one matte Ni plating layer one by one.

(2)前記複層めっきを構成する、光沢めっき層の無光沢めっき層に対する厚さの比は、1層ずつで対比して0.1〜10の範囲である上記(1)に記載のめっき材料。 (2) The plating according to the above (1), wherein the ratio of the thickness of the bright plating layer to the matte plating layer constituting the multilayer plating is in the range of 0.1 to 10 in comparison with each layer. material.

(3)前記複層めっきを構成する光沢めっき層と無光沢めっき層は、いずれも1層あたりの厚さが1μm以下であり、かつ、前記複層めっきの厚さが1μm超えである上記(1)または(2)に記載のめっき材料。 (3) The bright plating layer and the matte plating layer constituting the multilayer plating each have a thickness of 1 μm or less per layer, and the thickness of the multilayer plating exceeds 1 μm. The plating material as described in 1) or (2).

(4)Niめっき皮膜が、1層の光沢めっき層と、該光沢めっき層上に位置する1層の無光沢めっき層との複層めっきからなる上記(1)、(2)または(3)に記載の自動車端子材料。 (4) The above (1), (2) or (3), wherein the Ni plating film is composed of a multi-layer plating of one bright plating layer and one non-gloss plating layer located on the bright plating layer. Automotive terminal materials described in 1.

(5)Niめっき皮膜が、1層の無光沢めっき層と、該無光沢めっき層上に位置する1層の光沢めっき層との複層めっきからなる上記(1)、(2)または(3)に記載の自動車端子材料。 (5) The above (1), (2) or (3), wherein the Ni plating film is composed of a multi-layer plating of one matte plating layer and one glossy plating layer located on the matte plating layer. Automotive terminal materials described in).

(6)黄銅板上に、下地めっきとしてのNiめっき皮膜、中間めっきとしてのCuめっき皮膜、および表層めっきとしてのSnめっき皮膜を順次形成する工程を含む自動車端子材料の製造方法において、Niめっき皮膜は、電析法により、少なくとも1層の光沢Niめっき層と少なくとも1層の無光沢Niめっき層とを、1層ずつ交互に積層して複層めっきとして形成し、次いで、電析法により、Cuめっき皮膜およびSnめっき皮膜を順次形成した後、リフロー処理を施すことを特徴とする自動車端子材料の製造方法。 (6) In a method for manufacturing an automobile terminal material, comprising a step of sequentially forming a Ni plating film as a base plating, a Cu plating film as an intermediate plating, and a Sn plating film as a surface plating on a brass plate, the Ni plating film Is formed as a multi-layer plating by alternately laminating at least one glossy Ni plating layer and at least one matte Ni plating layer one by one, and then by the electrodeposition method, A method for producing an automobile terminal material, comprising sequentially forming a Cu plating film and a Sn plating film and then performing a reflow treatment.

本発明によれば、黄銅板上に形成する下地めっきとしてのNiめっき皮膜の適正化を図ることにより、曲げ加工性と溶接性に優れた自動車端子材料およびその製造方法を提供することが可能になった。   According to the present invention, it is possible to provide an automobile terminal material excellent in bending workability and weldability and a manufacturing method thereof by optimizing a Ni plating film as a base plating formed on a brass plate. became.

図1は、本発明に従う代表的なめっき材料の断面図である。FIG. 1 is a cross-sectional view of a typical plating material according to the present invention. 図2は、本発明の別のめっき材料の断面図である。FIG. 2 is a cross-sectional view of another plating material of the present invention. 図3は、本発明の他のめっき材料の断面図である。FIG. 3 is a cross-sectional view of another plating material of the present invention. 図4は、本発明の他のめっき材料の断面図である。FIG. 4 is a cross-sectional view of another plating material of the present invention.

次に、本発明の実施形態について図面を参照しながら以下で説明する。
図1は、本発明に従う代表的な自動車端子材料の断面構成を模式的に示したものである。図1に示す自動車端子材料1は、基材としての黄銅板2上に、下地めっきとしてのNiめっき皮膜3、中間めっきとしてのCuめっき皮膜6、および表層めっきとしてのSnめっき皮膜7を順次形成した構成となっている。
Next, embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 schematically shows a cross-sectional configuration of a typical automobile terminal material according to the present invention. An automobile terminal material 1 shown in FIG. 1 sequentially forms a Ni plating film 3 as a base plating, a Cu plating film 6 as an intermediate plating, and an Sn plating film 7 as a surface plating on a brass plate 2 as a base material. It has become the composition.

自動車端子材料の基材として黄銅に限定した理由は、コスト性に優れるためであって、特に亜鉛含有量が30質量%前後と多量に含まれているので、レーザ溶接に伴う溶接熱によって黄銅板中から亜鉛が容易に蒸発しやすい状況にあるため、レーザ溶接性の改善効果が顕著に認められるためである。   The reason why the base material of the automobile terminal material is limited to brass is that it is excellent in cost. Particularly, since the zinc content is contained in a large amount of about 30% by mass, the brass plate is generated by the welding heat accompanying laser welding. This is because the effect of improving laser weldability is remarkably recognized because zinc is easily evaporated from the inside.

そして、本発明の構成上の主な特徴は、黄銅板2上に形成する下地めっきとしてのNiめっき皮膜3の適正化を図ること、より具体的には、Niめっき皮膜3が、少なくとも1層の光沢Niめっき層4と、少なくとも1層の無光沢Niめっき層5とを、1層ずつ交互に積層して形成した複層めっきからなることにあり、この構成を採用することによって、自動車端子材料1の曲げ加工性と溶接性とを高いレベルで満足させることができる。   The main feature of the configuration of the present invention is to optimize the Ni plating film 3 as the base plating formed on the brass plate 2, more specifically, the Ni plating film 3 has at least one layer. Of the Ni plating layer 4 and the at least one non-glossy Ni plating layer 5 are formed by alternately laminating one layer at a time. The bending workability and weldability of the material 1 can be satisfied at a high level.

すなわち、本発明者らは、端子の圧着部を、厳しい条件下での曲げ加工性と、レーザ溶接時の溶接熱による黄銅板2中の銅成分の熱拡散や亜鉛成分の蒸発を抑制することによるレーザ溶接性との双方を高いレベルで満足させるための手段について鋭意検討した結果、意外にも、下地めっきとしてのNiめっき皮膜3を、内部応力が高く比較的硬質の光沢Niめっき層4と、内部応力が低く比較的軟質の無光沢Niめっき層5とを積層して複層Niめっきとして形成すると、Niめっき皮膜3の全体の内部応力が経時的に小さくなり、Niめっき皮膜3の硬さが大幅に低下することを見出した。   That is, the inventors suppress the crimping of the terminal by bending workability under severe conditions, thermal diffusion of the copper component in the brass plate 2 due to welding heat during laser welding, and evaporation of the zinc component. As a result of earnestly examining means for satisfying both of the laser weldability by the high level, unexpectedly, the Ni plating film 3 as the base plating is formed with a relatively hard glossy Ni plating layer 4 having a high internal stress. When the multi-layer Ni plating is formed by laminating the relatively soft matte Ni plating layer 5 having a low internal stress, the overall internal stress of the Ni plating film 3 decreases with time, and the Ni plating film 3 is hardened. Has been found to decrease significantly.

このため、本発明の自動車端子1は、黄銅板2上に、下地めっきとしての複層NiめっきからなるNiめっき皮膜3を形成することにより、Niめっき皮膜3の厚さを1μm超えにしたとしても、良好な曲げ加工性が得られ、しかも、Niめっき皮膜3を厚く形成したことにより、レーザ溶接時の溶接熱による黄銅板中の銅成分の熱拡散や、亜鉛成分の蒸発についても有効に抑制することができ、この結果、曲げ加工性と溶接性の双方を高いレベルで満足させることに成功したものである。   For this reason, in the automobile terminal 1 of the present invention, the thickness of the Ni plating film 3 exceeds 1 μm by forming the Ni plating film 3 made of the multilayer Ni plating as the base plating on the brass plate 2. In addition, good bending workability is obtained, and the Ni plating film 3 is formed thick, so that it is effective for the thermal diffusion of the copper component in the brass plate by the welding heat during laser welding and the evaporation of the zinc component. As a result, it has succeeded in satisfying both bending workability and weldability at a high level.

なお、本発明の自動車端子材料1を構成するNiめっき皮膜3の全体の内部応力が経時的に小さくなるメカニズムについては定かではないが、内部応力が高い光沢Niめっき層4と、内部応力が低い無光沢Niめっき層5とをそれらの界面で接触するように積層することによってめっき層境界で再結晶粒を発生させ、最終的には、内部応力の低いNiめっきの結晶粒になっていくためと推定される。   In addition, although it is not certain about the mechanism in which the overall internal stress of the Ni plating film 3 constituting the automobile terminal material 1 of the present invention decreases with time, the bright Ni plating layer 4 having a high internal stress and the internal stress is low. By laminating the matte Ni plating layer 5 so as to be in contact with each other at the interface between them, recrystallized grains are generated at the boundary of the plated layer, and eventually the Ni plating crystal grains with low internal stress are formed. It is estimated to be.

また、Niめっき皮膜3を厚く形成したことにより、レーザ溶接時の溶接熱による黄銅板2中の亜鉛成分の蒸発が抑制されるメカニズムは、おそらく、黄銅板2中の亜鉛がNiめっき皮膜3中のNiと化合物を形成し、Niめっき皮膜3を厚く形成することで亜鉛と化合物を形成するために必要なNi量が存在するようになるためと考えられる。   The mechanism by which the zinc component in the brass plate 2 is prevented from evaporating due to the welding heat during laser welding by forming the Ni plating film 3 thick is probably because zinc in the brass plate 2 is contained in the Ni plating film 3. It is considered that the amount of Ni necessary for forming the compound with zinc is present by forming a compound with Ni and forming the Ni plating film 3 thick.

さらに、Niめっき皮膜3を、光沢Niめっき層4と無光沢Niめっき層5とを積層して複層Niめっきとして形成すると、このNiめっき皮膜3の硬さは、比較的硬質な光沢Niめっき層4の硬さと、比較的軟質な無光沢Niめっき層5の硬さの間にはならず、意外にも、無光沢Niめっき層5の硬さよりもさらに小さくなることも判明した。例えば、自動車端子材料1を構成するNiめっき皮膜3のヌープ硬さHKは、250以下であることが好ましく、より好ましくは100〜200の範囲である。なお、ヌープ硬さの測定は、JIS Z2251:2009に規定されている「ヌープ硬さ試験−試験方法」に準拠して行い、試験条件は、5gf、15秒とした。   Further, when the Ni plating film 3 is formed as a multilayer Ni plating by laminating the bright Ni plating layer 4 and the matte Ni plating layer 5, the hardness of the Ni plating film 3 is a relatively hard glossy Ni plating. It has also been found that it does not fall between the hardness of the layer 4 and the hardness of the relatively soft matte Ni plating layer 5 and is surprisingly even smaller than the hardness of the matte Ni plating layer 5. For example, the Knoop hardness HK of the Ni plating film 3 constituting the automobile terminal material 1 is preferably 250 or less, and more preferably in the range of 100 to 200. In addition, the measurement of Knoop hardness was performed based on "Knoop hardness test-test method" prescribed | regulated to JISZ2251: 2009, and test conditions were 5 gf and 15 seconds.

また、光沢Niめっき層4と無光沢Niめっき層5の区別については、例えば、これらのめっき層4、5を電析法によって形成する場合、めっき層を形成する際に、表面光沢を生じさせるために用いる光沢剤等の添加剤をめっき浴組成に添加して形成するめっき層を、光沢Niめっき層4といい、表面光沢を生じさせるための添加剤をめっき浴組成に添加しないで形成するめっき層を無光沢Niめっき層5として両者を区別することとした。   In addition, regarding the distinction between the glossy Ni plating layer 4 and the matte Ni plating layer 5, for example, when these plating layers 4 and 5 are formed by an electrodeposition method, surface gloss is generated when the plating layer is formed. A plating layer formed by adding an additive such as a brightening agent to the plating bath composition is referred to as a bright Ni plating layer 4 and is formed without adding an additive for generating surface gloss to the plating bath composition. The plating layer was made the matte Ni plating layer 5 to distinguish them.

また、本発明では、Niめっき皮膜3を構成する光沢Niめっき層4と無光沢めっき層5とが接触するように積層されていればよいため、例えば、Niめっき皮膜3を、図2に示すように、図1とはめっき層4,5の積層順が反対、すなわち、Niめっき皮膜3を、黄銅板2側から、無光沢Niめっき層5と光沢Niめっき層4の順に積層された、1層の光沢Niめっき層4と1層の無光沢Niめっき層5との複層Niめっきで構成し、また、図3に示すように、黄銅板2側から、光沢Niめっき層4a,無光沢Niめっき層5および光沢Niめっき層4bの順に積層された、2層の光沢Niめっき層4a、4bと1層の無光沢Niめっき層5との複層Niめっきで構成し、あるいは、図4に示すように、めっき皮膜3を、黄銅板2側から、無光沢Niめっき層5a、光沢Niめっき層4および無光沢Niめっき層5bの順に積層された、1層の光沢Niめっき層と2層の無光沢Niめっき層との複層Niめっきで構成してもよい。   Further, in the present invention, since the bright Ni plating layer 4 and the matte plating layer 5 constituting the Ni plating film 3 may be laminated so as to be in contact with each other, for example, the Ni plating film 3 is shown in FIG. 1, the order of lamination of the plating layers 4 and 5 is opposite, that is, the Ni plating film 3 is laminated in the order of the matte Ni plating layer 5 and the bright Ni plating layer 4 from the brass plate 2 side. It consists of a multilayer Ni plating of one glossy Ni plating layer 4 and one matte Ni plating layer 5, and, as shown in FIG. 3, from the brass plate 2 side, the glossy Ni plating layer 4a, It is composed of a multilayer Ni plating of two glossy Ni plating layers 4a and 4b and one matte Ni plating layer 5 laminated in the order of the bright Ni plating layer 5 and the bright Ni plating layer 4b, or FIG. As shown in FIG. 4, the plating film 3 is formed from the brass plate 2 side. Consists of a multilayer Ni plating of one glossy Ni plating layer and two matte Ni plating layers laminated in the order of the bright Ni plating layer 5a, the bright Ni plating layer 4 and the matte Ni plating layer 5b. Also good.

なお、光沢Niめっき層4と無光沢Niめっき層5の層数は、Niめっき皮膜の内部応力を有効に低減させる観点からは、光沢Niめっき層4および無光沢めっき層5の各めっき層の厚さをできるだけ薄くして配設層数を多くすることが、再結晶の成長を促進する上で好ましいが、配設層数の上限は、製造上の点から実質的に制限される。   In addition, the number of layers of the bright Ni plating layer 4 and the matte Ni plating layer 5 is different from that of each of the bright Ni plating layer 4 and the matte plating layer 5 from the viewpoint of effectively reducing the internal stress of the Ni plating film. Although it is preferable to reduce the thickness as much as possible to increase the number of arranged layers in order to promote the growth of recrystallization, the upper limit of the number of arranged layers is substantially limited from the viewpoint of manufacturing.

また、本発明では、複層Niめっき3を構成する、光沢Niめっき層4の無光沢Niめっき層5に対する厚さの比は、1層ずつで対比して0.1〜10の範囲であることが好ましく、より好ましくは0.3〜3であり、さらに好ましくは、0.8〜1.2である。前記厚さの比が0.1〜10の範囲外だと、光沢Niめっき層4と無光沢Niめっき層5のいずれかの層が厚くなりすぎるため、これらのめっき層4、5間で生じる再結晶粒が、厚さが厚い方のめっき層全体にまでは生じにくい傾向があり、Niめっき皮膜3を十分に軟質にすることができなくなる傾向があるからである。   In the present invention, the ratio of the thickness of the bright Ni plating layer 4 to the non-gloss Ni plating layer 5 constituting the multilayer Ni plating 3 is in the range of 0.1 to 10 in comparison with each layer. More preferably, it is 0.3-3, More preferably, it is 0.8-1.2. If the thickness ratio is out of the range of 0.1 to 10, either the bright Ni plating layer 4 or the matte Ni plating layer 5 becomes too thick, and thus occurs between these plating layers 4 and 5. This is because the recrystallized grains tend not to be generated up to the entire plating layer having a larger thickness, and the Ni plating film 3 tends not to be sufficiently soft.

さらに、本発明では、複層Niめっき3を構成する光沢Niめっき層4と無光沢Niめっき層5は、いずれも1層あたりの厚さが1μm以下であり、かつ、複層Niめっき3の厚さが1μm超えであることが好ましい。光沢Niめっき層4と無光沢Niめっき層5の一方又は双方の1層あたりの厚さが1μm超えであると、めっき層4、5間で生じる再結晶が、1μm超えの厚さのめっき層で十分に生じにくい傾向があり、Niめっき皮膜3を十分に軟質にすることができなくなる傾向があるからである。また、複層Niめっき3の厚さが1μm以下では、良好な曲げ加工性については得られるものの、溶接時に、黄銅板2中の金属成分である、銅成分がSnめっき層7中に熱拡散したり、亜鉛成分が蒸発するのを十分に抑制することができなくなるおそれがあるからである。   Furthermore, in the present invention, each of the bright Ni plating layer 4 and the matte Ni plating layer 5 constituting the multilayer Ni plating 3 has a thickness of 1 μm or less per layer, and the multilayer Ni plating 3 The thickness is preferably more than 1 μm. When the thickness per layer of one or both of the bright Ni plating layer 4 and the dull Ni plating layer 5 is more than 1 μm, the recrystallization generated between the plating layers 4 and 5 is a plating layer having a thickness exceeding 1 μm. This is because there is a tendency that the Ni plating film 3 cannot be made sufficiently soft. Moreover, when the thickness of the multilayer Ni plating 3 is 1 μm or less, good bending workability is obtained, but the copper component, which is a metal component in the brass plate 2, is thermally diffused into the Sn plating layer 7 during welding. This is because it may not be possible to sufficiently suppress the evaporation of the zinc component.

なお、下地Niめっき層の厚さは、0.1μm〜6.0μmの範囲が望ましく、より望ましくは0.8〜3.0μm以下が望ましい。Niめっき厚が薄すぎる場合は、レーザ溶接性を向上させる効果が得ることが出来ない。厚すぎる場合は、めっき層自体を溶接することに対するエネルギー量が必要となるため、レーザ溶接性が低下する。   The thickness of the underlying Ni plating layer is preferably in the range of 0.1 μm to 6.0 μm, more preferably 0.8 to 3.0 μm or less. If the Ni plating thickness is too thin, the effect of improving laser weldability cannot be obtained. If it is too thick, the amount of energy for welding the plating layer itself is required, so that laser weldability is reduced.

また、本発明の自動車端子材料は、耐熱性と接触信頼性とが求められる理由から、Niめっき皮膜3の上に、図1〜4に示すように、中間めっきとしてのCuめっき層6と、表層めっきとしてのSnめっき層7を順に積層形成したものである。   Moreover, the automotive terminal material of the present invention has a Cu plating layer 6 as an intermediate plating, as shown in FIGS. 1 to 4 on the Ni plating film 3 because heat resistance and contact reliability are required. The Sn plating layer 7 as the surface layer plating is sequentially laminated.

なお、上述した実施形態では、Niめっき皮膜3を構成する光沢Niめっき層4および無光沢Niめっき層5を電析法で形成する場合を例示して説明してきたが、無電解めっき法のような他の湿式めっき法や、蒸着法のような乾式めっき法によって形成することも可能である。   In the above-described embodiment, the case where the bright Ni plating layer 4 and the matte Ni plating layer 5 constituting the Ni plating film 3 are formed by the electrodeposition method has been described as an example. Other wet plating methods and dry plating methods such as vapor deposition can also be used.

次に、本発明のめっき材料の製造方法の一例を以下で説明する。
本発明の自動車端子材料の製造方法は、常法による脱脂、酸洗を順次行った後、黄銅板2上に、電析法により、直接、少なくとも1層の光沢めっき層4と少なくとも1層の無光沢めっき層5とを、1層ずつ交互に積層して形成し、次いで、電析法により、Cuめっき層6とSnめっき層7の双方を順に形成した後、リフロー処理を施すことによって、本発明の自動車端子材料を製造することができる。
Next, an example of the manufacturing method of the plating material of this invention is demonstrated below.
The manufacturing method of the automobile terminal material of the present invention is such that after degreasing and pickling are sequentially performed by a conventional method, at least one bright plating layer 4 and at least one layer are directly deposited on the brass plate 2 by electrodeposition. The matte plating layer 5 is formed by alternately laminating one layer at a time, and then, by forming both the Cu plating layer 6 and the Sn plating layer 7 in order by an electrodeposition method, by performing a reflow process, The automobile terminal material of the present invention can be manufactured.

本発明の自動車端子材料を構成する、光沢Niめっき層4、無光沢Niめっき層5、Cuめっき層6およびSnめっき層7を形成するのに好適なめっき浴およびめっき条件を、一例として表1に示す。めっき層の厚さの調整はめっき時間によって調整を図った。めっき層の厚さの確認は、たとえば蛍光X線にめっき厚分析等の測定によって確認することができる。   Table 1 shows, as an example, plating baths and plating conditions suitable for forming the bright Ni plating layer 4, the matte Ni plating layer 5, the Cu plating layer 6 and the Sn plating layer 7 constituting the automobile terminal material of the present invention. Shown in The thickness of the plating layer was adjusted according to the plating time. Confirmation of the thickness of the plating layer can be confirmed, for example, by measuring the fluorescent X-ray with a plating thickness analysis or the like.

Figure 2014162943
Figure 2014162943

なお、上述したところは、この発明の実施形態の例を示したにすぎず、特許請求の範囲において種々の変更を加えることができる。   In addition, the place mentioned above only showed the example of embodiment of this invention, and can change a various change in a claim.

次に、この発明に従う自動車端子材料を試作し、性能評価を行ったので、以下で説明する。
発明例1〜8は、金属基材として、厚さ0.25mmの黄銅(古河電気工業(株)製、JIS C2600)を用い、この黄銅板上に、表1に示すめっき浴組成及びめっき条件の下、表2に示す皮膜構成のめっき皮膜を形成し、その後、表2に示す条件でリフロー処理を行い、めっき材料を試作した。
Next, an automobile terminal material according to the present invention was prototyped and performance evaluation was performed, which will be described below.
Inventive Examples 1 to 8 use brass having a thickness of 0.25 mm (manufactured by Furukawa Electric Co., Ltd., JIS C2600) as the metal substrate, and the plating bath composition and plating conditions shown in Table 1 are provided on this brass plate. Then, a plating film having a film structure shown in Table 2 was formed, and then a reflow treatment was performed under the conditions shown in Table 2 to produce a plating material.

比較のため、Niめっき皮膜を、1層の無光沢Niめっき層または1層の光沢Niめっき層で形成した比較例1および2についても併せて試作したので、発明例と同様に性能を評価した。   For comparison, a Ni-plated film was also prototyped for Comparative Examples 1 and 2 formed with one matte Ni-plated layer or one glossy Ni-plated layer, so performance was evaluated in the same manner as the inventive examples. .

各試作材の性能評価は、レーザ溶接性について行った。   The performance evaluation of each prototype was performed for laser weldability.

(性能評価)
・レーザ溶接性
めっき皮膜が形成された各金属基材を筒状に変形させ、その両端をレーザ溶接することで、端子の筒状圧着部を形成した。レーザとして、古河電気工業(株)製のファイバレーザ(型番:ASF1J23、レーザ波長:1084nm)を使用した。レーザ光出力を400Wに固定し、貫通溶接可能な速度でレーザ溶接性を評価した。ここで、速度と時間の関係から、速度が速い=時間が短い=レーザ溶接に必要なエネルギー量が少ないと考えることができる。評価基準は、◎:400mm/sec以上で貫通溶接、○:300mm/sec以上で貫通溶接、×:200mm/secより遅い、とした。
測定条件を以下のとおりである。
・使用レーザ光源:古河電気工業製 500W CWファイバレーザ
ASF1J233(波長1084nmシングルモード発振レーザ光)
・レーザ光出力:400W
・掃引距離:10mm
・全条件ジャストフォーカスでレーザ光照射(スポットサイズ:0.02mm)
(Performance evaluation)
-Laser weldability Each metal base material in which the plating film was formed was deformed into a cylindrical shape, and both ends thereof were laser-welded to form a cylindrical crimp portion of the terminal. A fiber laser (model number: ASF1J23, laser wavelength: 1084 nm) manufactured by Furukawa Electric Co., Ltd. was used as the laser. The laser beam output was fixed at 400 W, and laser weldability was evaluated at a speed at which penetration welding was possible. Here, from the relationship between speed and time, it can be considered that the speed is fast = the time is short = the amount of energy required for laser welding is small. Evaluation criteria were as follows: ◎: through welding at 400 mm / sec or more, ○: through welding at 300 mm / sec or more, ×: slower than 200 mm / sec.
The measurement conditions are as follows.
-Laser light source: Furukawa Electric 500W CW fiber laser ASF1J233 (wavelength 1084nm single mode oscillation laser light)
・ Laser light output: 400W
・ Sweep distance: 10mm
・ Laser beam irradiation with all conditions just focus (spot size: 0.02mm)

Figure 2014162943
Figure 2014162943

表2に示す評価結果から、発明例1〜8は、いずれもレーザ溶接性および曲げ加工性に優れていた。
これに対し、比較例1および2は、いずれもレーザ溶接性が劣っていた。
From the evaluation results shown in Table 2, Invention Examples 1 to 8 were all excellent in laser weldability and bending workability.
On the other hand, Comparative Examples 1 and 2 were inferior in laser weldability.

本発明によれば、黄銅板上に形成する下地めっきとしてのNiめっき皮膜の適正化を図ることにより、曲げ加工性と溶接性に優れた自動車端子材料およびその製造方法を提供することが可能になった。   According to the present invention, it is possible to provide an automobile terminal material excellent in bending workability and weldability and a manufacturing method thereof by optimizing a Ni plating film as a base plating formed on a brass plate. became.

1、1A、1B、1C 自動車端子材料
2 黄銅板
3 Niめっき皮膜(またはNi複層めっき)
4、4a、4b 光沢Niめっき層
5、5a、5b 無光沢Niめっき層
6 Cuめっき層
7 Snめっき層
1, 1A, 1B, 1C Automotive terminal material 2 Brass plate 3 Ni plating film (or Ni multilayer plating)
4, 4a, 4b Glossy Ni plating layer 5, 5a, 5b Matte Ni plating layer 6 Cu plating layer 7 Sn plating layer

Claims (6)

黄銅板上に、下地めっきとしてのNiめっき皮膜、中間めっきとしてのCuめっき皮膜、および表層めっきとしてのSnめっき皮膜を有する自動車端子材料であって、
Niめっき皮膜が、少なくとも1層の光沢Niめっき層と、少なくとも1層の無光沢Niめっき層とを、1層ずつ交互に積層して形成した複層めっきからなることを特徴とする自動車端子材料。
An automotive terminal material having a Ni plating film as a base plating, a Cu plating film as an intermediate plating, and a Sn plating film as a surface plating on a brass plate,
An automobile terminal material, wherein the Ni plating film comprises a multilayer plating formed by alternately laminating at least one glossy Ni plating layer and at least one matte Ni plating layer one by one .
前記複層めっきを構成する、光沢めっき層の無光沢めっき層に対する厚さの比は、1層ずつで対比して0.1〜10の範囲である請求項1に記載の自動車端子材料。   2. The automobile terminal material according to claim 1, wherein the ratio of the thickness of the bright plating layer to the matte plating layer constituting the multilayer plating is in a range of 0.1 to 10 in comparison with each other. 前記複層めっきを構成する光沢めっき層と無光沢めっき層は、いずれも1層あたりの厚さが1μm以下であり、かつ、前記複層めっきの厚さが1μm超えである請求項1または2に記載の自動車端子材料。   3. The bright plating layer and the matte plating layer constituting the multilayer plating each have a thickness of 1 μm or less per layer, and the thickness of the multilayer plating exceeds 1 μm. Automotive terminal materials described in 1. Niめっき皮膜が、1層の光沢めっき層と、該光沢めっき層上に位置する1層の無光沢めっき層との複層めっきからなる請求項1、2または3に記載の自動車端子材料。   The automobile terminal material according to claim 1, 2 or 3, wherein the Ni plating film comprises a multilayer plating of one gloss plating layer and one matte plating layer located on the gloss plating layer. Niめっき皮膜が、1層の無光沢めっき層と、該無光沢めっき層上に位置する1層の光沢めっき層との複層めっきからなる請求項1、2または3に記載の自動車端子材料。   4. The automobile terminal material according to claim 1, wherein the Ni plating film comprises a multilayer plating of one matte plating layer and one gloss plating layer located on the matte plating layer. 黄銅板上に、下地めっきとしてのNiめっき皮膜、中間めっきとしてのCuめっき皮膜、および表層めっきとしてのSnめっき皮膜を順次形成する工程を含む自動車端子材料の製造方法であって、
Niめっき皮膜は、電析法により、少なくとも1層の光沢Niめっき層と少なくとも1層の無光沢Niめっき層とを、1層ずつ交互に積層して複層めっきとして形成し、次いで、電析法により、Cuめっき皮膜およびSnめっき皮膜を順次形成した後、リフロー処理を施すことを特徴とする自動車端子材料の製造方法。
A method of manufacturing an automobile terminal material including a step of sequentially forming a Ni plating film as a base plating, a Cu plating film as an intermediate plating, and a Sn plating film as a surface layer plating on a brass plate,
The Ni plating film is formed as a multilayer plating by alternately laminating at least one glossy Ni plating layer and at least one matte Ni plating layer one by one by an electrodeposition method, and then electrodeposition A method for producing an automobile terminal material, comprising sequentially forming a Cu plating film and a Sn plating film by a method and then performing a reflow treatment.
JP2013034006A 2013-02-23 2013-02-23 Automotive terminal material and method for producing the same Pending JP2014162943A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107611631A (en) * 2017-09-01 2018-01-19 张启建 The copper aluminium connection sheet and its production technology drawn for battery module both positive and negative polarity

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107611631A (en) * 2017-09-01 2018-01-19 张启建 The copper aluminium connection sheet and its production technology drawn for battery module both positive and negative polarity

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