JP6448899B2 - 部品実装機の部品保持ヘッド - Google Patents

部品実装機の部品保持ヘッド Download PDF

Info

Publication number
JP6448899B2
JP6448899B2 JP2013240030A JP2013240030A JP6448899B2 JP 6448899 B2 JP6448899 B2 JP 6448899B2 JP 2013240030 A JP2013240030 A JP 2013240030A JP 2013240030 A JP2013240030 A JP 2013240030A JP 6448899 B2 JP6448899 B2 JP 6448899B2
Authority
JP
Japan
Prior art keywords
circuit board
core
head
parts
vertical axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013240030A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015099879A (ja
Inventor
緒方　雄二
雄二 緒方
達也 大村
達也 大村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanwha Aerospace Co Ltd
Original Assignee
Hanwha Aerospace Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanwha Aerospace Co Ltd filed Critical Hanwha Aerospace Co Ltd
Priority to JP2013240030A priority Critical patent/JP6448899B2/ja
Priority to KR1020140004053A priority patent/KR102208494B1/ko
Priority to CN201410575197.1A priority patent/CN104661507B/zh
Publication of JP2015099879A publication Critical patent/JP2015099879A/ja
Application granted granted Critical
Publication of JP6448899B2 publication Critical patent/JP6448899B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Combinations Of Printed Boards (AREA)
JP2013240030A 2013-11-20 2013-11-20 部品実装機の部品保持ヘッド Active JP6448899B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013240030A JP6448899B2 (ja) 2013-11-20 2013-11-20 部品実装機の部品保持ヘッド
KR1020140004053A KR102208494B1 (ko) 2013-11-20 2014-01-13 부품 실장기의 부품 유지 헤드
CN201410575197.1A CN104661507B (zh) 2013-11-20 2014-10-24 组件贴装机的电路板结构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013240030A JP6448899B2 (ja) 2013-11-20 2013-11-20 部品実装機の部品保持ヘッド

Publications (2)

Publication Number Publication Date
JP2015099879A JP2015099879A (ja) 2015-05-28
JP6448899B2 true JP6448899B2 (ja) 2019-01-09

Family

ID=53376306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013240030A Active JP6448899B2 (ja) 2013-11-20 2013-11-20 部品実装機の部品保持ヘッド

Country Status (2)

Country Link
JP (1) JP6448899B2 (ko)
KR (1) KR102208494B1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3324720B1 (en) * 2015-07-13 2020-04-01 FUJI Corporation Head unit of component mounter
CN105357950A (zh) * 2015-12-17 2016-02-24 吴志远 用于pcb电路板的可调速且带闪烁灯的固定柱装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5972757U (ja) * 1982-11-08 1984-05-17 松下電器産業株式会社 プリント配線基板
JPH0513967A (ja) * 1991-07-03 1993-01-22 Mitsubishi Electric Corp 半導体記憶制御装置及びその高密度実装方法
JP2002353571A (ja) * 2001-05-29 2002-12-06 Denso Corp 配線板構造
JP2004134695A (ja) * 2002-10-15 2004-04-30 Victor Co Of Japan Ltd 実装済みプリント配線板及びそれを備えたモータ
DE10302802A1 (de) * 2003-01-24 2004-08-26 Siemens Ag Mehrfach-Bestückkopf
JP2007141931A (ja) * 2005-11-15 2007-06-07 Teikoku Tsushin Kogyo Co Ltd フレキシブル回路基板の基台への取付構造及び取付方法
JP4813315B2 (ja) * 2006-10-03 2011-11-09 ヤマハ発動機株式会社 表面実装機
JP4926919B2 (ja) * 2007-11-14 2012-05-09 ヤマハ発動機株式会社 実装システム

Also Published As

Publication number Publication date
KR20150057927A (ko) 2015-05-28
JP2015099879A (ja) 2015-05-28
KR102208494B1 (ko) 2021-01-27

Similar Documents

Publication Publication Date Title
TWI440281B (zh) 馬達定子
EP1670296B1 (en) Flexible circuit board, electronic circuit device, and mobile communication terminal
CN110635599B (zh) 使用印刷电路板的电动机及其制造方法
US11477353B2 (en) Image pickup apparatus with movable unit and control unit connected together by flexible boards
JP6448899B2 (ja) 部品実装機の部品保持ヘッド
CN113068362B (zh) 一种柔性电路板组件、驱动装置、摄像模组及电子产品
JP2018056215A (ja) 非接触伝送モジュール、撮像装置及びロボットハンド
CN102802353A (zh) 柔性板连接方法和超声波探头
JP6612657B2 (ja) 非接触充電用コイルアッシー
JP6131418B2 (ja) 電子機器
JP6448898B2 (ja) 部品実装機の部品保持ヘッド
JP6321776B2 (ja) ステッピングモータ制御装置、それを備える部品実装機およびフィーダ並びにステッピングモータ制御方法
US9733547B2 (en) Blade driving device and optical apparatus
CN105703526A (zh) 一种基于电路板的多叶准直器电机引线固定结构
CN102036463B (zh) 多层电路板
JP2009070922A (ja) 基板構造、及び電子部品実装方法
JP6271918B2 (ja) 表面実装機の部品保持ヘッド
EP4137292A1 (en) Apparatus for generating a layout for an additive manufacturing of an electric drive
CN219999484U (zh) 一种致动器及摄像装置
JP5357789B2 (ja) フレキシブル基板、そのフレキシブル基板を備える装置、フレキシブル基板の半田付け方法、およびフレキシブル基板を備える装置の製造方法
US12130493B2 (en) Lens driving device
US20220146782A1 (en) Lens driving device
CN104661507B (zh) 组件贴装机的电路板结构
CN104661506B (zh) 组件贴装机的电路板结构
JP2011165710A (ja) 制御基板とこれを用いた多軸用モータ制御装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160928

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170807

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170815

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20171115

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180508

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20181120

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20181205

R150 Certificate of patent or registration of utility model

Ref document number: 6448899

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250