JP6448899B2 - Component holding head of component mounter - Google Patents

Component holding head of component mounter Download PDF

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JP6448899B2
JP6448899B2 JP2013240030A JP2013240030A JP6448899B2 JP 6448899 B2 JP6448899 B2 JP 6448899B2 JP 2013240030 A JP2013240030 A JP 2013240030A JP 2013240030 A JP2013240030 A JP 2013240030A JP 6448899 B2 JP6448899 B2 JP 6448899B2
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circuit board
core
head
parts
vertical axis
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JP2015099879A (en
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緒方　雄二
雄二 緒方
達也 大村
達也 大村
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Hanwha Aerospace Co Ltd
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Hanwha Aerospace Co Ltd
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Priority to JP2013240030A priority Critical patent/JP6448899B2/en
Priority to KR1020140004053A priority patent/KR102208494B1/en
Priority to CN201410575197.1A priority patent/CN104661507B/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Combinations Of Printed Boards (AREA)

Description

本発明は、基板に部品を実装するための部品実装機の部品保持ヘッドに関する。 The present invention relates to a component holding head of a component mounter for mounting components on a substrate.

一般的に部品実装機は、ノズル等の保持具を有する部品保持ヘッドにより、部品を部品供給部からピックアップし保持して基板上に移送し、基板上の所定位置に実装するように構成されている。   In general, a component mounter is configured to pick up and hold a component from a component supply unit, transfer it onto a substrate, and mount it at a predetermined position on the substrate by a component holding head having a holder such as a nozzle. Yes.

かかる部品保持ヘッドの一つとして、そのヘッド本体に、複数の保持具を有するロータリーヘッドが垂直軸周りに回転可能に取り付けられた、ロータリー式の部品保持ヘッドが知られており、特許文献１には、非接触式のエネルギ・データ伝達手段を備えたロータリー式の部品保持ヘッドが開示されている（段落００３４〜段落００３６及び図１参照）。   As one of such component holding heads, there is known a rotary type component holding head in which a rotary head having a plurality of holders is attached to the head body so as to be rotatable around a vertical axis. Discloses a rotary type component holding head provided with a non-contact type energy data transmission means (see paragraphs 0034 to 0036 and FIG. 1).

このような部品保持ヘッドは、ヘッド本体からの制御信号を受信してノズル等の動作を制御したり、ヘッド本体との間でデータのやり取りをしたりするために、多数の電子部品を具備しており、これらの電子部品は回路基板に搭載されるのが一般的である。また、回路基板に搭載すべき電子部品は多数に上ることから、回路基板が複数枚必要になることも多い。従来、このように回路基板が複数枚必要である場合は、例えば図４に示すように、回路基板１０１〜１０３を上下方向に複数段配置した回路基板構造とするのが一般的であった。   Such a component holding head includes a large number of electronic components in order to receive control signals from the head body and control the operation of nozzles and the like and to exchange data with the head body. In general, these electronic components are mounted on a circuit board. In addition, since there are many electronic components to be mounted on the circuit board, a plurality of circuit boards are often required. Conventionally, when a plurality of circuit boards are required as described above, for example, as shown in FIG. 4, a circuit board structure in which a plurality of circuit boards 101 to 103 are arranged in the vertical direction is generally used.

このような回路基板を上下方向に複数段配置する回路基板構造においては、回路基板１０１〜１０３に搭載された電子部品が相互に干渉しないように、回路基板１０１〜１０３を上下方向に間隔をおいて配置する必要があり、図４の回路基板構造では、複数の支持バー１０４及び基板間コネクタ１０４を用いることによって回路基板１０１〜１０３を上下方向に間隔をおいて配置している。しかし、この回路基板構造では、回路基板１０１〜１０３のほかに基板間コネクタ１０５が必要であり、図４のように回路基板１０１〜１０３のそれぞれの基板間に基板間コネクタ１０５を設けた場合、回路基板１０１〜１０３に電子部品を搭載できる実効面積（以下、単に「実効面積」という。）が小さくなる。更このように回路基板１０１〜１０３の実効面積が小さくなると、必要な実効面積を確保するために回路基板の枚数を増やさざるを得ず、ますます回路基板構造の大型化を招く。   In such a circuit board structure in which a plurality of circuit boards are arranged in the vertical direction, the circuit boards 101 to 103 are spaced apart in the vertical direction so that electronic components mounted on the circuit boards 101 to 103 do not interfere with each other. In the circuit board structure of FIG. 4, the circuit boards 101 to 103 are arranged at intervals in the vertical direction by using a plurality of support bars 104 and inter-board connectors 104. However, this circuit board structure requires the board-to-board connector 105 in addition to the circuit boards 101 to 103. When the board-to-board connector 105 is provided between the circuit boards 101 to 103 as shown in FIG. The effective area (hereinafter simply referred to as “effective area”) on which electronic components can be mounted on the circuit boards 101 to 103 is reduced. Further, if the effective area of the circuit boards 101 to 103 is reduced in this way, the number of circuit boards must be increased in order to secure a necessary effective area, and the circuit board structure is further increased in size.

特表２００６−５１５７１５号公報JP-T-2006-515715

本発明が解決しようとする課題は、複数枚の回路基板を有する部品実装機の回路基板構造の小型化を図ることにある。   The problem to be solved by the present invention is to reduce the size of the circuit board structure of a component mounter having a plurality of circuit boards.

本発明の一観点によれば、以下の部品実装機の部品保持ヘッドが提供される。
基板に部品を実装するための部品実装機の部品保持ヘッドであって、
固定配置されたヘッド本体と、このヘッド本体に対して垂直軸周りに回転可能に取り付けられたロータリーヘッドと、前記ヘッド本体から前記ロータリーヘッドに非接触式で電力を伝送すると共に前記ヘッド本体と前記ロータリーヘッドとの間で非接触式で信号を伝送する非接触伝送装置と、前記ロータリーヘッド側に配置された回路基板構造とを備え、
前記回路基板構造は、複数の回路基板部とこれらの回路基板部を連結する連結部とを１枚の連続したフレキシブル回路基板で構成され、前記複数の回路基板部をそれぞれ前記連結部に対して相対的に折り返すことにより、前記複数の回路基板部が上下方向に間隔をおいて平板状で積層されており、前記複数の回路基板部は平面視で同一の外郭形状を有しており、さらに前記複数の回路基板部のそれぞれの中心部には前記垂直軸が挿通されており、
前記非接触伝送装置は、前記垂直軸周りに配置された第１コアと、前記垂直軸周りに前記第１コアの下方に対向配置された第２コアと、前記第１コアに巻回された電力伝送のための第１コイルと、前記第２コアに巻回された電力伝送のための第２コイルと、前記第１コアに巻回された信号伝送のための第３コイルと、前記第２コアに巻回された信号伝送のための第４コイルとを有し、前記第１コア及び前記第２コアのそれぞれの中心部には前記垂直軸が挿通されており、
前記回路基板構造は前記第２コアと一体的に前記垂直軸周りに回転可能であり、
前記非接触伝送装置及び前記回路基板構造の外郭形状は平面視で同じ大きさの円である、部品実装機の部品保持ヘッド。 According to one aspect of the present invention, the following component holding head for a component mounter is provided.
A component holding head of a component mounter for mounting components on a board,
A fixedly arranged head body, a rotary head attached to the head body so as to be rotatable around a vertical axis , power is transmitted from the head body to the rotary head in a non-contact manner, and the head body and the head body A non-contact transmission device that transmits signals in a non -contact manner with a rotary head, and a circuit board structure disposed on the rotary head side,
In the circuit board structure, a plurality of circuit board parts and a connecting part that connects these circuit board parts are configured by one continuous flexible circuit board, and the plurality of circuit board parts are respectively connected to the connecting parts. The plurality of circuit board portions are laminated in a flat plate shape with a space in the vertical direction by being relatively folded, and the plurality of circuit board portions have the same outer shape in plan view, and The vertical axis is inserted through the center of each of the plurality of circuit board portions,
The non-contact transmission device is wound around the first core, a first core disposed around the vertical axis, a second core disposed below the first core around the vertical axis, and the first core. A first coil for power transmission; a second coil for power transmission wound around the second core; a third coil for signal transmission wound around the first core; A fourth coil for signal transmission wound around two cores, and the vertical axis is inserted through the center of each of the first core and the second core,
The circuit board structure is rotatable about the vertical axis integrally with the second core;
The component holding head of the component mounting machine, wherein the outer shapes of the non-contact transmission device and the circuit board structure are circles having the same size in plan view.

本発明において回路基板構造は、前記回路基板部が３以上あり、これらの回路基板部を連結する連結部の長さを変えることにより、前記３以上の回路基板部が上下方向に間隔をおいて平板状で積層されるようにしている回路基板構造とすることができる。 In the present invention, the circuit board structure has three or more circuit board parts, and the length of the connecting part connecting these circuit board parts is changed so that the three or more circuit board parts are spaced apart in the vertical direction. It can be set as the circuit board structure made to laminate | stack by flat form.

本発明では、上下方向に間隔をおいて平板状で積層される複数の回路基板部が連結部によって連結されており、回路基板部と連結部は１枚の連続したフレキシブル回路基板で構成されているので、複数の回路基板部間の電気的接続はもともと連結部でなされている。すなわち、本発明によれば、複数の回路基板部間を電気的に接続するために別途に基板間コネクタを設置する必要がなくなる。これにより、基板間コネクタの設置スペースが不要となるとともに従来基板間コネクタが占めていた領域にも電子部品を搭載できるので、回路基板部の実効面積を大きくでき、結果として回路基板構造を小型化することができる。   In the present invention, a plurality of circuit board portions stacked in a flat plate shape with an interval in the vertical direction are connected by a connecting portion, and the circuit board portion and the connecting portion are constituted by one continuous flexible circuit board. Therefore, the electrical connection between the plurality of circuit board portions is originally made by the connecting portion. That is, according to the present invention, it is not necessary to separately install a board-to-board connector in order to electrically connect a plurality of circuit board parts. This eliminates the need for a board-to-board connector installation space and allows electronic components to be mounted in areas previously occupied by board-to-board connectors, increasing the effective area of the circuit board and resulting in a smaller circuit board structure. can do.

本発明に係る回路基板構造を適用した部品実装機の部品保持ヘッドの構成を概念的に示す図である。It is a figure which shows notionally the structure of the component holding head of the component mounting machine to which the circuit board structure based on this invention is applied. 図１で使用した回路基板構造の構成を示し、（ａ）はその正面図、（ｂ）は展開図である。The structure of the circuit board structure used in FIG. 1 is shown, (a) is a front view thereof, and (b) is a development view. 本発明に係る回路基板構造の他の実施例を示す説明図である。It is explanatory drawing which shows the other Example of the circuit board structure based on this invention. 従来の部品実装機の回路基板構造の構成を概念的に示す図である。It is a figure which shows notionally the structure of the circuit board structure of the conventional component mounting machine.

以下、本発明に係る回路基板構造を部品実装機の部品保持ヘッドに適用した実施例に基づき本発明の実施の形態を説明する。図１は、その部品実装機の部品保持ヘッドの構成を概念的に示す図である。   Hereinafter, an embodiment of the present invention will be described based on an example in which a circuit board structure according to the present invention is applied to a component holding head of a component mounter. FIG. 1 is a diagram conceptually showing the configuration of a component holding head of the component mounter.

図１に示す部品保持ヘッドは、部品実装機において部品供給部から電子部品をピックアップし保持してプリント基板上に移送し、プリント基板上の所定位置に実装する。この部品保持ヘッドは、固定配置されたヘッド本体１０と、このヘッド本体１０に対して垂直軸２０周りに回転可能に取り付けられたロータリーヘッド３０と、ヘッド本体１０からロータリーヘッド３０に非接触式で電力を伝送すると共にヘッド本体１０とロータリーヘッド３０との間で非接触式で信号を伝送する非接触伝送装置４０と、ロータリーヘッド３０側に配置された回路基板構造５０とを備える。 The component holding head shown in FIG. 1 picks up and holds an electronic component from a component supply unit in a component mounting machine, transfers it to the printed circuit board, and mounts it on a predetermined position on the printed circuit board. The component holding head includes a head body 10 that is fixedly arranged, a rotary head 30 that is rotatably attached to the head body 10 around a vertical axis 20, and a non-contact type from the head body 10 to the rotary head 30. A non-contact transmission device 40 that transmits electric power in a non-contact manner between the head main body 10 and the rotary head 30 and a circuit board structure 50 disposed on the rotary head 30 side are provided.

ヘッド本体１０は、ロータリーヘッド３０を回転させるサーボモータ１１及びロータリーヘッド３０に配置されているノズル３１の昇降を制御するサーボモータ１２を内蔵している。また、図１では省略しているが、ヘッド本体１０は、サーボモータ１１、１２やロータリーヘッド３０の回転動作を制御するメインコントローラも内蔵している。   The head main body 10 includes a servo motor 11 that rotates the rotary head 30 and a servo motor 12 that controls the raising and lowering of the nozzles 31 arranged in the rotary head 30. Although omitted in FIG. 1, the head main body 10 also incorporates a main controller that controls the rotation operations of the servo motors 11 and 12 and the rotary head 30.

ロータリーヘッド３０は外形が略円柱状のバレル形状を有し、その中心を垂直軸２０が貫通している。サーボモータ１１の回転によりロータリーヘッド３０は、ヘッド本体１０に対して垂直軸２０周りのＲ方向に回転する。また、ロータリーヘッド３０には、電子部品を保持する保持具としてのノズル３１が、周方向に沿って複数配置されている。各ノズル３１は、ロータリーヘッド３０に内蔵されたサーボモータ等からなるアクチュエータ（図示省略）により、それぞれ軸線周りのＴ方向に回転可能であり、サーボモータ１２により軸線方向に沿ったＺ方向に移動可能に装着されている。   The rotary head 30 has a barrel shape whose outer shape is substantially cylindrical, and the vertical shaft 20 passes through the center thereof. The rotation of the servo motor 11 causes the rotary head 30 to rotate in the R direction around the vertical axis 20 with respect to the head body 10. The rotary head 30 is provided with a plurality of nozzles 31 as holders for holding electronic components along the circumferential direction. Each nozzle 31 can be rotated in the T direction around the axis by an actuator (not shown) made of a servo motor or the like built in the rotary head 30, and can be moved in the Z direction along the axis by the servo motor 12. It is attached to.

非接触伝送装置４０は、第１コア４１及び第２コア４２と、電力伝送のためのコイルとして第１コイル４３及び第２コイル４４と、信号伝送のためのコイルとして第３コイル４５及び第４コイル４６とを備えている。第１コア４１はヘッド本体１０側に一体的に配置され、第２コア４２はロータリーヘッド３０側に一体的に配置されている。第１コア４１及び第２コア４２は同一の形状を有し、上下対称となるように一定のギャップＧを持って対向配置されている。   The non-contact transmission device 40 includes a first core 41 and a second core 42, a first coil 43 and a second coil 44 as coils for power transmission, and a third coil 45 and a fourth coil as coils for signal transmission. And a coil 46. The first core 41 is integrally disposed on the head body 10 side, and the second core 42 is integrally disposed on the rotary head 30 side. The first core 41 and the second core 42 have the same shape and are opposed to each other with a certain gap G so as to be vertically symmetrical.

このような構成において非接触伝送装置４０は、第１コイル４３と第２コイル４４との間の電磁誘導により、ヘッド本体１０からロータリーヘッド３０に非接触式で電力を伝送し、また、第３コイル４５と第４コイル４６との間の電磁誘導により、ヘッド本体１０とロータリーヘッド３０との間で電磁誘導により非接触式で信号を伝送する。なお、非接触式で電力及び信号を伝送する方式としては電磁誘導方式のほかに電界誘導方式を採用することもできる。   In such a configuration, the non-contact transmission device 40 transmits electric power from the head body 10 to the rotary head 30 in a non-contact manner by electromagnetic induction between the first coil 43 and the second coil 44, and the third By electromagnetic induction between the coil 45 and the fourth coil 46, a signal is transmitted between the head body 10 and the rotary head 30 in a non-contact manner by electromagnetic induction. In addition to the electromagnetic induction method, an electric field induction method can be adopted as a method for transmitting power and signals in a non-contact manner.

次に、回路基板構造５０の構成を説明する。図２は図１で使用した回路基板構造５０の構成を示し、（ａ）はその正面図、（ｂ）は展開図である。   Next, the configuration of the circuit board structure 50 will be described. 2 shows the configuration of the circuit board structure 50 used in FIG. 1, wherein (a) is a front view thereof and (b) is a development view.

回路基板構造５０は、３つの回路基板部５１〜５３とこれらの回路基板部５１〜５３を連結する連結部５４，５５とを有し、回路基板部５１〜５３及び連結部５４，５５は１枚の連続したフレキシブル回路基板（以下「ＦＰＣ」という。）で構成されている。回路基板部５１〜５３は同一の外郭形状（円形）を有している。連結部５４の長さＬ１は連結部５５の長さＬ２より小さく設定されている。   The circuit board structure 50 includes three circuit board parts 51 to 53 and connecting parts 54 and 55 that connect these circuit board parts 51 to 53, and the circuit board parts 51 to 53 and the connecting parts 54, 55 are one. It is composed of a continuous flexible circuit board (hereinafter referred to as “FPC”). The circuit board portions 51 to 53 have the same outer shape (circular shape). The length L1 of the connecting portion 54 is set smaller than the length L2 of the connecting portion 55.

このような構成において、図２（ｂ）の展開した状態から回路基板部５１〜５３をそれぞれ連結部５４，５５に対して相対的に折り返すことにより、図２（ａ）に示す回路基板構造５０が得られる。すなわち、回路基板部５１，５２を連結部５４に対して相対的に折り返し、回路基板部５１，５３を連結部５５に対して相対的に折り返す。このとき連結部５４の長さＬ１が連結部５５の長さＬ２より小さく設定されているので、回路基板部５１の上方にＬ１の間隔をおいて回路基板部５２が積層され、更に回路基板部５２の上方にＬ２−Ｌ１の間隔をおいて回路基板部５３が積層された回路基板構造５０が得られる。   In such a configuration, the circuit board portions 51 to 53 are folded back relative to the connecting portions 54 and 55 from the developed state of FIG. Is obtained. That is, the circuit board portions 51 and 52 are folded back relative to the connecting portion 54, and the circuit board portions 51 and 53 are folded back relative to the connecting portion 55. At this time, since the length L1 of the connecting portion 54 is set to be smaller than the length L2 of the connecting portion 55, the circuit board portion 52 is laminated above the circuit board portion 51 with an interval of L1, and further the circuit board portion. A circuit board structure 50 in which the circuit board portion 53 is laminated above the 52 with an interval of L2-L1 is obtained.

積層された回路基板部５１〜５３はいずれも平板状で平行に配置されており、その上面及び／又は下面に電子部品が搭載される。この電子部品の搭載のイメージを図２（ａ）において破線で示している。このように電子部品の高さを考慮して立体的に嵌り合うように電子部品を配置することで、回路基板部５１〜５３間の円筒状のスペースに電子部品を無駄なく搭載することができる。   The laminated circuit board parts 51 to 53 are all flat and arranged in parallel, and electronic components are mounted on the upper surface and / or the lower surface thereof. An image of mounting the electronic component is indicated by a broken line in FIG. By arranging the electronic components so as to fit three-dimensionally in consideration of the height of the electronic components in this way, the electronic components can be mounted without waste in the cylindrical space between the circuit board portions 51 to 53. .

また、回路基板部５１〜５３にはそれぞれ、これらの回路基板部５１〜５３が図２（ａ）のように積層された状態において図１で説明したロータリーヘッド３０の回転中心軸としての垂直軸２０を挿通可能な円形の貫通孔５１ａ，５２ａ，５３ａが形成されている。貫通孔５１ａ，５２ａ，５３ａの中心は垂直軸２０の中心軸線上に位置し、直径は垂直軸２０の直径より若干大きい。これらの貫通孔５１ａ，５２ａ，５３ａに垂直軸２０を挿通させることで、回路基板構造５０はロータリーヘッド５２とともに垂直軸２０周りに回転可能となる。   The circuit board portions 51 to 53 are each a vertical axis as the rotation center axis of the rotary head 30 described with reference to FIG. 1 in a state in which these circuit board portions 51 to 53 are stacked as shown in FIG. Circular through-holes 51a, 52a, 53a through which 20 can be inserted are formed. The centers of the through holes 51a, 52a, 53a are located on the central axis of the vertical shaft 20, and the diameter is slightly larger than the diameter of the vertical shaft 20. By inserting the vertical shaft 20 into the through holes 51 a, 52 a, and 53 a, the circuit board structure 50 can rotate around the vertical shaft 20 together with the rotary head 52.

以上のように、回路基板構造５０では回路基板部５１〜５３が連結部５４，５５によって連結されており、回路基板部５１〜５３と連結部５４，５５は１枚の連続したＦＰＣで構成されているので、回路基板部５１〜５３間の電気的接続はもともと連結部５４，５５でなされている。したがって回路基板構造５０では、回路基板部５１〜５３間を電気的に接続するために別途に基板間コネクタを設置する必要がない。これにより、基板間コネクタの設置スペースが不要となるとともに従来基板間コネクタが占めていた領域にも電子部品を搭載できるので、回路基板部５１〜５３の実効面積を大きくでき、結果として回路基板構造を小型化することができる。   As described above, in the circuit board structure 50, the circuit board parts 51 to 53 are connected by the connecting parts 54 and 55, and the circuit board parts 51 to 53 and the connecting parts 54 and 55 are configured by one continuous FPC. Therefore, the electrical connection between the circuit board portions 51 to 53 is originally made by the connecting portions 54 and 55. Therefore, in the circuit board structure 50, it is not necessary to separately install a board-to-board connector in order to electrically connect the circuit board portions 51 to 53. As a result, an installation space for the board-to-board connector is not required and an electronic component can be mounted in an area occupied by the board-to-board connector, so that the effective area of the circuit board portions 51 to 53 can be increased. Can be miniaturized.

図３は、本発明に係る回路基板構造の他の実施例を示す。図３では展開図とともに回路基板部と連結部との相対的な折り返しの方向を示している。   FIG. 3 shows another embodiment of the circuit board structure according to the present invention. FIG. 3 shows a relative folding direction of the circuit board portion and the connecting portion together with the development view.

図３の回路基板構造６０は、５つの回路基板部６１〜６５とこれらの回路基板部６１〜６５を連結する４つの連結部６６〜６９とを有し、回路基板部６１〜６５及び連結部６６〜６９は１枚の連続したＦＰＣで構成されている。このように多数の回路基板部６１〜６５を有する回路基板構造６０においても、連結部６６〜６９の長さ、及び回路基板部６１〜６５と連結部６６〜６９との相対的な折り返しの方向を適宜設定することにより、回路基板部６１〜６５が上下方向に間隔をおいて平板状で平行に積層され、回路基板部６１〜６５間に基板間コネクタがない回路基板構造６０を得ることができる。回路基板部の数は更に増やすことも可能である。   The circuit board structure 60 of FIG. 3 includes five circuit board parts 61 to 65 and four connection parts 66 to 69 that connect these circuit board parts 61 to 65, and the circuit board parts 61 to 65 and the connection parts. 66 to 69 are composed of one continuous FPC. Thus, also in the circuit board structure 60 having a large number of circuit board parts 61 to 65, the lengths of the connecting parts 66 to 69 and the relative folding directions of the circuit board parts 61 to 65 and the connecting parts 66 to 69 are provided. By appropriately setting the circuit board portions 61 to 65, the circuit board portions 61 to 65 are stacked in parallel in a flat plate shape at intervals in the vertical direction, and the circuit board structure 60 having no inter-board connector between the circuit board portions 61 to 65 can be obtained. it can. The number of circuit board portions can be further increased.

ここで、図３に示すように最下段に位置する回路基板部６２の下面には、図１で説明したロータリーヘッド３０側の機器につながるコネクタ７０ａに回路基板構造６０を電気的に接続するためのコネクタ７０ｂが設けられている。コネクタ７０ａをコネクタ７０ｂに連結する際には回路基板部６２に厚み方向の力が作用するが、回路基板部６２はＦＰＣで構成されているので撓みやすく、コネクタの連結不良や回路基板部の損傷を生じるおそれがある。そこで、図３の回路基板構造６０では、回路基板部６２の上面に補強板６２ａを一体的に積層し、コネクタ７０ｂを有する回路基板部６２を補強している。なお、図２の回路基板構造５０においても、回路基板部５１の上面又は下面に同様に補強板を一体的に積層することができる。   Here, as shown in FIG. 3, the circuit board structure 60 is electrically connected to the connector 70 a connected to the device on the rotary head 30 side described in FIG. Connector 70b is provided. When connecting the connector 70a to the connector 70b, a force in the thickness direction acts on the circuit board 62. However, since the circuit board 62 is made of FPC, it is easily bent, and the connector is poorly connected or the circuit board is damaged. May occur. Therefore, in the circuit board structure 60 of FIG. 3, a reinforcing plate 62a is integrally laminated on the upper surface of the circuit board part 62, and the circuit board part 62 having the connector 70b is reinforced. Also in the circuit board structure 50 of FIG. 2, a reinforcing plate can be integrally laminated on the upper surface or the lower surface of the circuit board portion 51 in the same manner.

１０ ヘッド本体
１１，１２ サーボモータ
２０ 垂直軸
３０ ロータリーヘッド
３１ ノズル（保持具）
４０ 非接触伝送装置
４１ 第１コア
４２ 第２コア
４３ 第１コイル
４４ 第２コイル
４５ 第３コイル
４６ 第４コイル
５０，６０ 回路基板構造
５１〜５３，６１〜６５ 回路基板部
５４，５５，６６〜６９ 連結部
６２ａ 補強板
７０ａ，７０ｂ コネクタ 10 Head body 11, 12 Servo motor 20 Vertical axis 30 Rotary head 31 Nozzle (holder)
40 Non-contact transmission device 41 1st core 42 2nd core 43 1st coil 44 2nd coil 45 3rd coil 46 4th coil 50, 60 Circuit board structure 51-53, 61-65 Circuit board part 54, 55, 66 -69 Connecting part 62a Reinforcing plate 70a, 70b Connector

Claims (2)

基板に部品を実装するための部品実装機の部品保持ヘッドであって、
固定配置されたヘッド本体と、このヘッド本体に対して垂直軸周りに回転可能に取り付けられたロータリーヘッドと、前記ヘッド本体から前記ロータリーヘッドに非接触式で電力を伝送すると共に前記ヘッド本体と前記ロータリーヘッドとの間で非接触式で信号を伝送する非接触伝送装置と、前記ロータリーヘッド側に配置された回路基板構造とを備え、
前記回路基板構造は、複数の回路基板部とこれらの回路基板部を連結する連結部とを１枚の連続したフレキシブル回路基板で構成され、前記複数の回路基板部をそれぞれ前記連結部に対して相対的に折り返すことにより、前記複数の回路基板部が上下方向に間隔をおいて平板状で積層されており、前記複数の回路基板部は平面視で同一の外郭形状を有しており、さらに前記複数の回路基板部のそれぞれの中心部には前記垂直軸が挿通されており、
前記非接触伝送装置は、前記垂直軸周りに配置された第１コアと、前記垂直軸周りに前記第１コアの下方に対向配置された第２コアと、前記第１コアに巻回された電力伝送のための第１コイルと、前記第２コアに巻回された電力伝送のための第２コイルと、前記第１コアに巻回された信号伝送のための第３コイルと、前記第２コアに巻回された信号伝送のための第４コイルとを有し、前記第１コア及び前記第２コアのそれぞれの中心部には前記垂直軸が挿通されており、
前記回路基板構造は前記第２コアと一体的に前記垂直軸周りに回転可能であり、
前記非接触伝送装置及び前記回路基板構造の外郭形状は平面視で同じ大きさの円である、部品実装機の部品保持ヘッド。 A component holding head of a component mounter for mounting components on a board,
A fixedly arranged head body, a rotary head attached to the head body so as to be rotatable around a vertical axis , power is transmitted from the head body to the rotary head in a non-contact manner, and the head body and the head body A non-contact transmission device that transmits signals in a non -contact manner with a rotary head, and a circuit board structure disposed on the rotary head side,
In the circuit board structure, a plurality of circuit board parts and a connecting part that connects these circuit board parts are configured by one continuous flexible circuit board, and the plurality of circuit board parts are respectively connected to the connecting parts. The plurality of circuit board portions are laminated in a flat plate shape with a space in the vertical direction by being relatively folded, and the plurality of circuit board portions have the same outer shape in plan view, and The vertical axis is inserted through the center of each of the plurality of circuit board portions,
The non-contact transmission device is wound around the first core, a first core disposed around the vertical axis, a second core disposed below the first core around the vertical axis, and the first core. A first coil for power transmission; a second coil for power transmission wound around the second core; a third coil for signal transmission wound around the first core; A fourth coil for signal transmission wound around two cores, and the vertical axis is inserted through the center of each of the first core and the second core,
The circuit board structure is rotatable about the vertical axis integrally with the second core;
The component holding head of the component mounting machine, wherein the outer shapes of the non-contact transmission device and the circuit board structure are circles having the same size in plan view. 前記回路基板部が３以上あり、これらの回路基板部を連結する連結部の長さを変えることにより、前記３以上の回路基板部が上下方向に間隔をおいて平板状で積層されるようにしている、請求項１に記載の部品実装機の部品保持ヘッド。 There are three or more circuit board parts, and by changing the length of the connecting part that connects these circuit board parts, the three or more circuit board parts are stacked in a flat plate shape with an interval in the vertical direction. The component holding head of the component mounting machine according to claim 1.
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