CN104661506B - 组件贴装机的电路板结构 - Google Patents
组件贴装机的电路板结构 Download PDFInfo
- Publication number
- CN104661506B CN104661506B CN201410571649.9A CN201410571649A CN104661506B CN 104661506 B CN104661506 B CN 104661506B CN 201410571649 A CN201410571649 A CN 201410571649A CN 104661506 B CN104661506 B CN 104661506B
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- Prior art keywords
- circuit board
- circuit
- board
- board structure
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011469 building brick Substances 0.000 description 12
- 230000005540 biological transmission Effects 0.000 description 10
- 238000010276 construction Methods 0.000 description 9
- 230000005611 electricity Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 238000009877 rendering Methods 0.000 description 3
- 230000005674 electromagnetic induction Effects 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 240000001439 Opuntia Species 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-240027 | 2013-11-20 | ||
JP2013240027A JP6448898B2 (ja) | 2013-11-20 | 2013-11-20 | 部品実装機の部品保持ヘッド |
KR10-2014-0002089 | 2014-01-07 | ||
KR1020140002089A KR101932203B1 (ko) | 2013-11-20 | 2014-01-07 | 부품 실장기의 부품 유지 헤드 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104661506A CN104661506A (zh) | 2015-05-27 |
CN104661506B true CN104661506B (zh) | 2019-05-03 |
Family
ID=53252051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410571649.9A Active CN104661506B (zh) | 2013-11-20 | 2014-10-23 | 组件贴装机的电路板结构 |
Country Status (1)
Country | Link |
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CN (1) | CN104661506B (zh) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005197493A (ja) * | 2004-01-08 | 2005-07-21 | Ihi Aerospace Co Ltd | 回路基板組立体 |
JP4926919B2 (ja) * | 2007-11-14 | 2012-05-09 | ヤマハ発動機株式会社 | 実装システム |
JP2009277784A (ja) * | 2008-05-13 | 2009-11-26 | Toshiba Corp | 部品内蔵プリント配線板、同配線板の製造方法および電子機器 |
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2014
- 2014-10-23 CN CN201410571649.9A patent/CN104661506B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN104661506A (zh) | 2015-05-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: Gyeongnam Changwon City, South Korea Applicant after: HANWHA TECHWIN Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Applicant before: Samsung Techwin Co.,Ltd. |
|
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: Free format text: CORRECT: APPLICANT; FROM: SAMSUNG TAI KEWEI CO., LTD. TO: HANWHA TECHWIN CO., LTD. |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: Gyeongnam Changwon City, South Korea Applicant after: HANWHA AEROSPACE Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Applicant before: HANWHA TECHWIN Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20190404 Address after: Gyeongnam Changwon City, South Korea Applicant after: Hanwha Precision Machinery Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Applicant before: HANWHA AEROSPACE Co.,Ltd. |
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GR01 | Patent grant | ||
GR01 | Patent grant |