JP6429407B2 - イオン装置で利用する磁石およびイオン装置 - Google Patents
イオン装置で利用する磁石およびイオン装置 Download PDFInfo
- Publication number
- JP6429407B2 JP6429407B2 JP2016519682A JP2016519682A JP6429407B2 JP 6429407 B2 JP6429407 B2 JP 6429407B2 JP 2016519682 A JP2016519682 A JP 2016519682A JP 2016519682 A JP2016519682 A JP 2016519682A JP 6429407 B2 JP6429407 B2 JP 6429407B2
- Authority
- JP
- Japan
- Prior art keywords
- fluid coolant
- magnet
- annular
- core portion
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/3002—Details
- H01J37/3007—Electron or ion-optical systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F7/00—Magnets
- H01F7/06—Electromagnets; Actuators including electromagnets
- H01F7/20—Electromagnets; Actuators including electromagnets without armatures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
- H01J37/1472—Deflecting along given lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
- H01J37/1472—Deflecting along given lines
- H01J37/1474—Scanning means
- H01J37/1475—Scanning means magnetic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
- H01F27/10—Liquid cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/002—Cooling arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/15—Means for deflecting or directing discharge
- H01J2237/152—Magnetic means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/15—Means for deflecting or directing discharge
- H01J2237/152—Magnetic means
- H01J2237/1526—For X-Y scanning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/303—Electron or ion optical systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31701—Ion implantation
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Particle Accelerators (AREA)
- Physical Vapour Deposition (AREA)
- Hall/Mr Elements (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361835089P | 2013-06-14 | 2013-06-14 | |
| US61/835,089 | 2013-06-14 | ||
| US13/966,611 US9177708B2 (en) | 2013-06-14 | 2013-08-14 | Annular cooling fluid passage for magnets |
| US13/966,611 | 2013-08-14 | ||
| PCT/US2014/042321 WO2014201363A1 (en) | 2013-06-14 | 2014-06-13 | Annular cooling fluid passage for magnets |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016521913A JP2016521913A (ja) | 2016-07-25 |
| JP2016521913A5 JP2016521913A5 (enExample) | 2017-04-27 |
| JP6429407B2 true JP6429407B2 (ja) | 2018-11-28 |
Family
ID=52018423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016519682A Active JP6429407B2 (ja) | 2013-06-14 | 2014-06-13 | イオン装置で利用する磁石およびイオン装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9177708B2 (enExample) |
| JP (1) | JP6429407B2 (enExample) |
| KR (1) | KR102161231B1 (enExample) |
| CN (1) | CN105283975B (enExample) |
| TW (1) | TWI624856B (enExample) |
| WO (1) | WO2014201363A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9177708B2 (en) * | 2013-06-14 | 2015-11-03 | Varian Semiconductor Equipment Associates, Inc. | Annular cooling fluid passage for magnets |
| US10486232B2 (en) * | 2015-04-21 | 2019-11-26 | Varian Semiconductor Equipment Associates, Inc. | Semiconductor manufacturing device with embedded fluid conduits |
| EP3707756B1 (en) | 2017-11-07 | 2022-08-24 | Gallium Enterprises Pty Ltd | Buried activated p-(al,in)gan layers |
| CN110300487A (zh) * | 2019-07-12 | 2019-10-01 | 兰州科近泰基新技术有限责任公司 | 一种多通道冷却真空四极磁铁装置 |
| US10971327B1 (en) * | 2019-12-06 | 2021-04-06 | Applied Materials, Inc. | Cryogenic heat transfer system |
| CN111601449B (zh) * | 2020-05-28 | 2023-01-10 | 兰州科近泰基新技术有限责任公司 | 真空内超大型四极透镜的制造方法 |
| US12100541B2 (en) * | 2020-09-14 | 2024-09-24 | Intel Corporation | Embedded cooling channel in magnetics |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB167916A (en) * | 1920-06-12 | 1921-08-25 | Giulio Schroeder | Improvements in electrical transformers |
| JPS56108216U (enExample) * | 1980-01-21 | 1981-08-22 | ||
| US4883968A (en) | 1988-06-03 | 1989-11-28 | Eaton Corporation | Electron cyclotron resonance ion source |
| JP3231342B2 (ja) * | 1991-01-30 | 2001-11-19 | 株式会社日立製作所 | 電磁コイル |
| JPH04323811A (ja) * | 1991-04-23 | 1992-11-13 | Toshiba Corp | ギャップ付鉄心形ガス絶縁リアクトル |
| JPH05190345A (ja) * | 1992-01-17 | 1993-07-30 | Toshiba Corp | ギャップ付鉄心形リアクトル |
| JPH0864426A (ja) * | 1994-08-19 | 1996-03-08 | Toshiba Corp | 静止誘導電気機器 |
| US5554857A (en) * | 1995-10-19 | 1996-09-10 | Eaton Corporation | Method and apparatus for ion beam formation in an ion implanter |
| EP1040077B1 (en) * | 1997-12-09 | 2003-03-19 | Imi Vision Limited | Valve |
| US6053241A (en) * | 1998-09-17 | 2000-04-25 | Nikon Corporation | Cooling method and apparatus for charged particle lenses and deflectors |
| JP3979823B2 (ja) * | 2001-07-31 | 2007-09-19 | ギガフォトン株式会社 | 巻線機器および巻線機器を用いた高電圧パルス発生装置並びに高電圧パルス発生装置を備えた放電励起ガスレーザ装置 |
| US6933507B2 (en) * | 2002-07-17 | 2005-08-23 | Kenneth H. Purser | Controlling the characteristics of implanter ion-beams |
| JP3767820B2 (ja) * | 2003-01-22 | 2006-04-19 | 第一高周波工業株式会社 | 磁束照射装置 |
| GB2397691B (en) * | 2003-01-24 | 2005-08-10 | Leica Microsys Lithography Ltd | Cooling of a device for influencing an electron beam |
| CN100555483C (zh) * | 2003-06-26 | 2009-10-28 | 伊顿动力品质公司 | 混合空芯/磁芯电感器 |
| US7342236B2 (en) | 2004-02-23 | 2008-03-11 | Veeco Instruments, Inc. | Fluid-cooled ion source |
| CN1979749B (zh) * | 2005-12-05 | 2011-10-19 | 北京中科信电子装备有限公司 | 均匀磁场平行束透镜系统 |
| US20070176123A1 (en) * | 2006-01-31 | 2007-08-02 | Axcelis Technologies, Inc. | Ion implanter having a superconducting magnet |
| JP5154152B2 (ja) | 2007-07-04 | 2013-02-27 | ルネサスエレクトロニクス株式会社 | 昇圧電源回路 |
| CN201077592Y (zh) * | 2007-08-03 | 2008-06-25 | 乔士军 | 打包支架 |
| US20090084988A1 (en) | 2007-09-27 | 2009-04-02 | Varian Semiconductor Equipment Associates, Inc. | Single wafer implanter for silicon-on-insulator wafer fabrication |
| JP4363479B2 (ja) * | 2007-11-09 | 2009-11-11 | トヨタ自動車株式会社 | 回転電機および駆動装置 |
| US7908736B2 (en) | 2007-11-21 | 2011-03-22 | Black & Decker Inc. | Method of making an armature |
| JP2009164326A (ja) * | 2008-01-07 | 2009-07-23 | Fuji Electric Systems Co Ltd | 磁気コア |
| US8022582B2 (en) | 2008-12-30 | 2011-09-20 | Caterpillar Inc. | Liquid cooled permanent magnet rotor |
| EP2209128B1 (en) * | 2009-01-20 | 2015-03-04 | ABB Research Ltd. | Gapped magnet core |
| JP2010258244A (ja) * | 2009-04-27 | 2010-11-11 | Toyota Industries Corp | 誘導機器 |
| EP2251875A1 (de) * | 2009-05-16 | 2010-11-17 | ABB Technology AG | Transformatorkern |
| FI8758U1 (fi) * | 2010-03-02 | 2010-06-10 | Abb Oy | Elektroniikkalaitteen käämirakenne |
| CN201820573U (zh) * | 2010-04-26 | 2011-05-04 | 廊坊英博电气有限公司 | 带有冷却风道的谐波滤波电抗器 |
| US20120023969A1 (en) * | 2010-07-28 | 2012-02-02 | General Electric Company | Cooling system of an electromagnet assembly |
| WO2012044445A1 (en) * | 2010-10-01 | 2012-04-05 | Franklin Electric Company, Inc. | Solenoid pump |
| JP5854550B2 (ja) * | 2011-06-09 | 2016-02-09 | トクデン株式会社 | 静止誘導機器、金属管誘導加熱装置及びインボリュート鉄心冷却構造 |
| CN103714948A (zh) * | 2012-10-08 | 2014-04-09 | 佛山市国电电器有限公司 | 一种水冷变压器铁芯冷却方法 |
| US9524820B2 (en) * | 2012-11-13 | 2016-12-20 | Raytheon Company | Apparatus and method for thermal management of magnetic devices |
| US9177708B2 (en) * | 2013-06-14 | 2015-11-03 | Varian Semiconductor Equipment Associates, Inc. | Annular cooling fluid passage for magnets |
-
2013
- 2013-08-14 US US13/966,611 patent/US9177708B2/en active Active
-
2014
- 2014-06-13 TW TW103120424A patent/TWI624856B/zh active
- 2014-06-13 CN CN201480033457.0A patent/CN105283975B/zh active Active
- 2014-06-13 WO PCT/US2014/042321 patent/WO2014201363A1/en not_active Ceased
- 2014-06-13 JP JP2016519682A patent/JP6429407B2/ja active Active
- 2014-06-13 KR KR1020167000777A patent/KR102161231B1/ko active Active
-
2015
- 2015-10-02 US US14/873,284 patent/US9852882B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US9177708B2 (en) | 2015-11-03 |
| TWI624856B (zh) | 2018-05-21 |
| KR20160021204A (ko) | 2016-02-24 |
| CN105283975B (zh) | 2018-05-04 |
| JP2016521913A (ja) | 2016-07-25 |
| KR102161231B1 (ko) | 2020-10-05 |
| US20140367583A1 (en) | 2014-12-18 |
| CN105283975A (zh) | 2016-01-27 |
| TW201506979A (zh) | 2015-02-16 |
| US20160027610A1 (en) | 2016-01-28 |
| US9852882B2 (en) | 2017-12-26 |
| WO2014201363A1 (en) | 2014-12-18 |
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