KR102161231B1 - 이온 장치와 함께 사용하기 위한 자석 및 이온 장치 - Google Patents
이온 장치와 함께 사용하기 위한 자석 및 이온 장치 Download PDFInfo
- Publication number
- KR102161231B1 KR102161231B1 KR1020167000777A KR20167000777A KR102161231B1 KR 102161231 B1 KR102161231 B1 KR 102161231B1 KR 1020167000777 A KR1020167000777 A KR 1020167000777A KR 20167000777 A KR20167000777 A KR 20167000777A KR 102161231 B1 KR102161231 B1 KR 102161231B1
- Authority
- KR
- South Korea
- Prior art keywords
- coolant fluid
- magnet
- annular
- core element
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002826 coolant Substances 0.000 claims abstract description 182
- 239000012530 fluid Substances 0.000 claims abstract description 151
- 239000002184 metal Substances 0.000 claims abstract description 78
- 229910052751 metal Inorganic materials 0.000 claims abstract description 78
- 238000010884 ion-beam technique Methods 0.000 claims abstract description 36
- 238000010618 wire wrap Methods 0.000 claims abstract description 20
- 238000005468 ion implantation Methods 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 13
- 238000007493 shaping process Methods 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 1
- 150000002500 ions Chemical class 0.000 description 24
- 238000001816 cooling Methods 0.000 description 16
- 230000008878 coupling Effects 0.000 description 13
- 238000010168 coupling process Methods 0.000 description 13
- 238000005859 coupling reaction Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 239000007943 implant Substances 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 2
- 239000012809 cooling fluid Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 125000003147 glycosyl group Chemical group 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 1
- 230000003134 recirculating effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/3002—Details
- H01J37/3007—Electron or ion-optical systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F7/00—Magnets
- H01F7/06—Electromagnets; Actuators including electromagnets
- H01F7/20—Electromagnets; Actuators including electromagnets without armatures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
- H01J37/1472—Deflecting along given lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
- H01J37/1472—Deflecting along given lines
- H01J37/1474—Scanning means
- H01J37/1475—Scanning means magnetic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
- H01F27/10—Liquid cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/002—Cooling arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/15—Means for deflecting or directing discharge
- H01J2237/152—Magnetic means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/15—Means for deflecting or directing discharge
- H01J2237/152—Magnetic means
- H01J2237/1526—For X-Y scanning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/303—Electron or ion optical systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31701—Ion implantation
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Particle Accelerators (AREA)
- Physical Vapour Deposition (AREA)
- Hall/Mr Elements (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361835089P | 2013-06-14 | 2013-06-14 | |
| US61/835,089 | 2013-06-14 | ||
| US13/966,611 US9177708B2 (en) | 2013-06-14 | 2013-08-14 | Annular cooling fluid passage for magnets |
| US13/966,611 | 2013-08-14 | ||
| PCT/US2014/042321 WO2014201363A1 (en) | 2013-06-14 | 2014-06-13 | Annular cooling fluid passage for magnets |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160021204A KR20160021204A (ko) | 2016-02-24 |
| KR102161231B1 true KR102161231B1 (ko) | 2020-10-05 |
Family
ID=52018423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020167000777A Active KR102161231B1 (ko) | 2013-06-14 | 2014-06-13 | 이온 장치와 함께 사용하기 위한 자석 및 이온 장치 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9177708B2 (enExample) |
| JP (1) | JP6429407B2 (enExample) |
| KR (1) | KR102161231B1 (enExample) |
| CN (1) | CN105283975B (enExample) |
| TW (1) | TWI624856B (enExample) |
| WO (1) | WO2014201363A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9177708B2 (en) * | 2013-06-14 | 2015-11-03 | Varian Semiconductor Equipment Associates, Inc. | Annular cooling fluid passage for magnets |
| US10486232B2 (en) * | 2015-04-21 | 2019-11-26 | Varian Semiconductor Equipment Associates, Inc. | Semiconductor manufacturing device with embedded fluid conduits |
| EP3707756B1 (en) | 2017-11-07 | 2022-08-24 | Gallium Enterprises Pty Ltd | Buried activated p-(al,in)gan layers |
| CN110300487A (zh) * | 2019-07-12 | 2019-10-01 | 兰州科近泰基新技术有限责任公司 | 一种多通道冷却真空四极磁铁装置 |
| US10971327B1 (en) * | 2019-12-06 | 2021-04-06 | Applied Materials, Inc. | Cryogenic heat transfer system |
| CN111601449B (zh) * | 2020-05-28 | 2023-01-10 | 兰州科近泰基新技术有限责任公司 | 真空内超大型四极透镜的制造方法 |
| US12100541B2 (en) * | 2020-09-14 | 2024-09-24 | Intel Corporation | Embedded cooling channel in magnetics |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005533353A (ja) * | 2002-07-17 | 2005-11-04 | バリアン・セミコンダクター・イクイップメント・アソシエーツ・インコーポレーテッド | 注入装置のリボン形状イオンビームの特性制御 |
| JP2009164326A (ja) * | 2008-01-07 | 2009-07-23 | Fuji Electric Systems Co Ltd | 磁気コア |
| US20100237725A1 (en) * | 2007-11-09 | 2010-09-23 | Kazutaka Tatematsu | Rotating electric machine and drive device |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB167916A (en) * | 1920-06-12 | 1921-08-25 | Giulio Schroeder | Improvements in electrical transformers |
| JPS56108216U (enExample) * | 1980-01-21 | 1981-08-22 | ||
| US4883968A (en) | 1988-06-03 | 1989-11-28 | Eaton Corporation | Electron cyclotron resonance ion source |
| JP3231342B2 (ja) * | 1991-01-30 | 2001-11-19 | 株式会社日立製作所 | 電磁コイル |
| JPH04323811A (ja) * | 1991-04-23 | 1992-11-13 | Toshiba Corp | ギャップ付鉄心形ガス絶縁リアクトル |
| JPH05190345A (ja) * | 1992-01-17 | 1993-07-30 | Toshiba Corp | ギャップ付鉄心形リアクトル |
| JPH0864426A (ja) * | 1994-08-19 | 1996-03-08 | Toshiba Corp | 静止誘導電気機器 |
| US5554857A (en) * | 1995-10-19 | 1996-09-10 | Eaton Corporation | Method and apparatus for ion beam formation in an ion implanter |
| WO1999029619A1 (en) * | 1997-12-09 | 1999-06-17 | Imi Cornelius (Uk) Limited | Valve |
| US6053241A (en) * | 1998-09-17 | 2000-04-25 | Nikon Corporation | Cooling method and apparatus for charged particle lenses and deflectors |
| JP3979823B2 (ja) * | 2001-07-31 | 2007-09-19 | ギガフォトン株式会社 | 巻線機器および巻線機器を用いた高電圧パルス発生装置並びに高電圧パルス発生装置を備えた放電励起ガスレーザ装置 |
| JP3767820B2 (ja) * | 2003-01-22 | 2006-04-19 | 第一高周波工業株式会社 | 磁束照射装置 |
| GB2397691B (en) * | 2003-01-24 | 2005-08-10 | Leica Microsys Lithography Ltd | Cooling of a device for influencing an electron beam |
| CN100555483C (zh) * | 2003-06-26 | 2009-10-28 | 伊顿动力品质公司 | 混合空芯/磁芯电感器 |
| US7342236B2 (en) | 2004-02-23 | 2008-03-11 | Veeco Instruments, Inc. | Fluid-cooled ion source |
| CN1979749B (zh) * | 2005-12-05 | 2011-10-19 | 北京中科信电子装备有限公司 | 均匀磁场平行束透镜系统 |
| US20070176123A1 (en) * | 2006-01-31 | 2007-08-02 | Axcelis Technologies, Inc. | Ion implanter having a superconducting magnet |
| JP5154152B2 (ja) | 2007-07-04 | 2013-02-27 | ルネサスエレクトロニクス株式会社 | 昇圧電源回路 |
| CN201077592Y (zh) * | 2007-08-03 | 2008-06-25 | 乔士军 | 打包支架 |
| US20090084988A1 (en) * | 2007-09-27 | 2009-04-02 | Varian Semiconductor Equipment Associates, Inc. | Single wafer implanter for silicon-on-insulator wafer fabrication |
| US7908736B2 (en) | 2007-11-21 | 2011-03-22 | Black & Decker Inc. | Method of making an armature |
| US8022582B2 (en) | 2008-12-30 | 2011-09-20 | Caterpillar Inc. | Liquid cooled permanent magnet rotor |
| EP2209128B1 (en) * | 2009-01-20 | 2015-03-04 | ABB Research Ltd. | Gapped magnet core |
| JP2010258244A (ja) * | 2009-04-27 | 2010-11-11 | Toyota Industries Corp | 誘導機器 |
| EP2251875A1 (de) * | 2009-05-16 | 2010-11-17 | ABB Technology AG | Transformatorkern |
| FI8758U1 (fi) * | 2010-03-02 | 2010-06-10 | Abb Oy | Elektroniikkalaitteen käämirakenne |
| CN201820573U (zh) * | 2010-04-26 | 2011-05-04 | 廊坊英博电气有限公司 | 带有冷却风道的谐波滤波电抗器 |
| US20120023969A1 (en) * | 2010-07-28 | 2012-02-02 | General Electric Company | Cooling system of an electromagnet assembly |
| WO2012044445A1 (en) * | 2010-10-01 | 2012-04-05 | Franklin Electric Company, Inc. | Solenoid pump |
| JP5854550B2 (ja) * | 2011-06-09 | 2016-02-09 | トクデン株式会社 | 静止誘導機器、金属管誘導加熱装置及びインボリュート鉄心冷却構造 |
| CN103714948A (zh) * | 2012-10-08 | 2014-04-09 | 佛山市国电电器有限公司 | 一种水冷变压器铁芯冷却方法 |
| US9524820B2 (en) * | 2012-11-13 | 2016-12-20 | Raytheon Company | Apparatus and method for thermal management of magnetic devices |
| US9177708B2 (en) * | 2013-06-14 | 2015-11-03 | Varian Semiconductor Equipment Associates, Inc. | Annular cooling fluid passage for magnets |
-
2013
- 2013-08-14 US US13/966,611 patent/US9177708B2/en active Active
-
2014
- 2014-06-13 JP JP2016519682A patent/JP6429407B2/ja active Active
- 2014-06-13 WO PCT/US2014/042321 patent/WO2014201363A1/en not_active Ceased
- 2014-06-13 CN CN201480033457.0A patent/CN105283975B/zh active Active
- 2014-06-13 TW TW103120424A patent/TWI624856B/zh active
- 2014-06-13 KR KR1020167000777A patent/KR102161231B1/ko active Active
-
2015
- 2015-10-02 US US14/873,284 patent/US9852882B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005533353A (ja) * | 2002-07-17 | 2005-11-04 | バリアン・セミコンダクター・イクイップメント・アソシエーツ・インコーポレーテッド | 注入装置のリボン形状イオンビームの特性制御 |
| US20100237725A1 (en) * | 2007-11-09 | 2010-09-23 | Kazutaka Tatematsu | Rotating electric machine and drive device |
| JP2009164326A (ja) * | 2008-01-07 | 2009-07-23 | Fuji Electric Systems Co Ltd | 磁気コア |
Also Published As
| Publication number | Publication date |
|---|---|
| US9177708B2 (en) | 2015-11-03 |
| TW201506979A (zh) | 2015-02-16 |
| CN105283975B (zh) | 2018-05-04 |
| JP2016521913A (ja) | 2016-07-25 |
| US9852882B2 (en) | 2017-12-26 |
| US20160027610A1 (en) | 2016-01-28 |
| KR20160021204A (ko) | 2016-02-24 |
| TWI624856B (zh) | 2018-05-21 |
| US20140367583A1 (en) | 2014-12-18 |
| CN105283975A (zh) | 2016-01-27 |
| JP6429407B2 (ja) | 2018-11-28 |
| WO2014201363A1 (en) | 2014-12-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102161231B1 (ko) | 이온 장치와 함께 사용하기 위한 자석 및 이온 장치 | |
| JP6469682B2 (ja) | 任意の長さのリボン状ビームイオン源 | |
| TWI416572B (zh) | 多用途離子佈植器束流線組態 | |
| CN103843107B (zh) | 电感耦合等离子体离子源与不主动泵送的液体的高压隔离 | |
| CN103621187B (zh) | 用于与流体高压隔离结合使用的电极在固体介质内的封装 | |
| JP6237127B2 (ja) | イオン源、その運転方法および電子銃 | |
| CN110838427B (zh) | 一种用于熔丝增材制造的电子枪装置 | |
| US11017974B2 (en) | Ion source | |
| TW205605B (enExample) | ||
| US12267942B2 (en) | Cooling plate assembly for plasma windows positioned in a beam accelerator system | |
| US4412153A (en) | Dual filament ion source | |
| US8664619B2 (en) | Hybrid electrostatic lens for improved beam transmission | |
| JP2008524811A (ja) | 低エネルギー/高電流リボン・ビーム注入装置におけるビーム中和の改善 | |
| US6977991B1 (en) | Cooling arrangement for an X-ray tube having an external electron beam deflector | |
| JP6752449B2 (ja) | イオンビーム中和方法と装置 | |
| US12431329B2 (en) | Method of assembling drift tube assemblies in ion implantors | |
| KR102457741B1 (ko) | 진공 분위기에서 사용되는 전자석 어셈블리 및 그 제조 방법 | |
| KR20220006345A (ko) | 이온 소스 헤드 및 이를 포함하는 이온 주입 장치 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20160112 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20190520 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20200427 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20200701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20200923 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20200924 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| PR1001 | Payment of annual fee |
Payment date: 20230828 Start annual number: 4 End annual number: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20240826 Start annual number: 5 End annual number: 5 |