JP6418868B2 - カルコゲニド層を洗浄およびパッシベーションする方法 - Google Patents
カルコゲニド層を洗浄およびパッシベーションする方法 Download PDFInfo
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- JP6418868B2 JP6418868B2 JP2014194842A JP2014194842A JP6418868B2 JP 6418868 B2 JP6418868 B2 JP 6418868B2 JP 2014194842 A JP2014194842 A JP 2014194842A JP 2014194842 A JP2014194842 A JP 2014194842A JP 6418868 B2 JP6418868 B2 JP 6418868B2
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- 150000004770 chalcogenides Chemical class 0.000 title claims description 92
- 238000000034 method Methods 0.000 title claims description 41
- 238000004140 cleaning Methods 0.000 title claims description 11
- UYJXRRSPUVSSMN-UHFFFAOYSA-P ammonium sulfide Chemical compound [NH4+].[NH4+].[S-2] UYJXRRSPUVSSMN-UHFFFAOYSA-P 0.000 claims description 43
- 239000004065 semiconductor Substances 0.000 claims description 28
- 239000012298 atmosphere Substances 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 17
- 239000012535 impurity Substances 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000011701 zinc Substances 0.000 claims description 8
- 229910052717 sulfur Inorganic materials 0.000 claims description 6
- SIXIBASSFIFHDK-UHFFFAOYSA-N indium(3+);trisulfide Chemical compound [S-2].[S-2].[S-2].[In+3].[In+3] SIXIBASSFIFHDK-UHFFFAOYSA-N 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- YOXKVLXOLWOQBK-UHFFFAOYSA-N sulfur monoxide zinc Chemical compound [Zn].S=O YOXKVLXOLWOQBK-UHFFFAOYSA-N 0.000 claims description 2
- 239000010949 copper Substances 0.000 description 55
- 239000000243 solution Substances 0.000 description 30
- 238000011282 treatment Methods 0.000 description 24
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 21
- 230000008901 benefit Effects 0.000 description 13
- 238000002161 passivation Methods 0.000 description 12
- 239000000126 substance Substances 0.000 description 11
- 238000005530 etching Methods 0.000 description 10
- 239000010408 film Substances 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000008367 deionised water Substances 0.000 description 7
- 229910021641 deionized water Inorganic materials 0.000 description 7
- 229910052733 gallium Inorganic materials 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 229910052738 indium Inorganic materials 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 150000004771 selenides Chemical class 0.000 description 5
- 229910052711 selenium Inorganic materials 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 239000000969 carrier Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000010549 co-Evaporation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000006798 recombination Effects 0.000 description 3
- 238000005215 recombination Methods 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 239000003440 toxic substance Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- DVRDHUBQLOKMHZ-UHFFFAOYSA-N chalcopyrite Chemical compound [S-2].[S-2].[Fe+2].[Cu+2] DVRDHUBQLOKMHZ-UHFFFAOYSA-N 0.000 description 2
- 229910052951 chalcopyrite Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- -1 film Chemical compound 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 231100001231 less toxic Toxicity 0.000 description 2
- 239000013074 reference sample Substances 0.000 description 2
- 238000004626 scanning electron microscopy Methods 0.000 description 2
- IRPLSAGFWHCJIQ-UHFFFAOYSA-N selanylidenecopper Chemical compound [Se]=[Cu] IRPLSAGFWHCJIQ-UHFFFAOYSA-N 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 231100000167 toxic agent Toxicity 0.000 description 2
- 229910021617 Indium monochloride Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- PDYXSJSAMVACOH-UHFFFAOYSA-N [Cu].[Zn].[Sn] Chemical compound [Cu].[Zn].[Sn] PDYXSJSAMVACOH-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 238000006388 chemical passivation reaction Methods 0.000 description 1
- 238000000224 chemical solution deposition Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 description 1
- ZZEMEJKDTZOXOI-UHFFFAOYSA-N digallium;selenium(2-) Chemical compound [Ga+3].[Ga+3].[Se-2].[Se-2].[Se-2] ZZEMEJKDTZOXOI-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- APHGZSBLRQFRCA-UHFFFAOYSA-M indium(1+);chloride Chemical compound [In]Cl APHGZSBLRQFRCA-UHFFFAOYSA-M 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000005424 photoluminescence Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- MFIWAIVSOUGHLI-UHFFFAOYSA-N selenium;tin Chemical compound [Sn]=[Se] MFIWAIVSOUGHLI-UHFFFAOYSA-N 0.000 description 1
- 238000010129 solution processing Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000003463 sulfur Chemical class 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- AFNRRBXCCXDRPS-UHFFFAOYSA-N tin(ii) sulfide Chemical compound [Sn]=S AFNRRBXCCXDRPS-UHFFFAOYSA-N 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
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- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- H01L31/0264—Inorganic materials
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- H01L31/0326—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising AIBIICIVDVI kesterite compounds, e.g. Cu2ZnSnSe4, Cu2ZnSnS4
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Description
Claims (9)
- Cu含有カルコゲニド層を化学的に洗浄およびパッシベーションする方法であって、Cu含有カルコゲニド層を硫化アンモニウム含有雰囲気に接触させる工程を含み、
Cu含有カルコゲニド層は、I 2 −II−IV−VI 4 族材料であり、
Cu含有カルコゲニド層を硫化アンモニウム含有雰囲気に接触させる工程は、雰囲気温度中で硫化アンモニウムを含む溶液中にCu含有カルコゲニド層を浸漬する工程を含む方法。 - Cu含有カルコゲニド層を化学的に洗浄およびパッシベーションする方法であって、Cu含有カルコゲニド層を硫化アンモニウム含有雰囲気に接触させる工程を含み、
Cu含有カルコゲニド層は、I 2 −II−IV−VI 4 族材料またはI−III−VI 2 族材料であり、
Cu含有カルコゲニド層を硫化アンモニウム含有雰囲気に接触させる工程は、硫化アンモニウム蒸気を含む雰囲気中にCu含有カルコゲニド層を持ち込む工程を含む方法。 - 溶液は、1重量%〜50重量%の硫化アンモニウムを水中に有する溶液である請求項1に記載の方法。
- カルコゲニド層は、カルコゲニド半導体層である請求項1〜3のいずれかに記載の方法。
- 太陽電池の製造方法であって、
基板上にCu含有カルコゲニド半導体層を形成する工程と、
Cu含有カルコゲニド半導体層を硫化アンモニウム((NH4)2S)含有雰囲気に接触させて、これにより、Cu含有カルコゲニド半導体層から不純物を除去し、Cu含有カルコゲニド半導体層をパッシベーションする工程と、
その後に、Cu含有カルコゲニド半導体層の上にバッファ層を形成する工程と、を含み、
Cu含有カルコゲニド半導体層は、I 2 −II−IV−VI 4 族材料であり、
Cu含有カルコゲニド半導体層を硫化アンモニウム含有雰囲気に接触させる工程は、雰囲気温度中で硫化アンモニウムを含む溶液中にCu含有カルコゲニド半導体層を浸漬する工程を含む方法。 - 太陽電池の製造方法であって、
基板上にCu含有カルコゲニド半導体層を形成する工程と、
Cu含有カルコゲニド半導体層を硫化アンモニウム((NH 4 ) 2 S)含有雰囲気に接触させて、これにより、Cu含有カルコゲニド半導体層から不純物を除去し、Cu含有カルコゲニド半導体層をパッシベーションする工程と、
その後に、Cu含有カルコゲニド半導体層の上にバッファ層を形成する工程と、を含み、
Cu含有カルコゲニド半導体層は、I 2 −II−IV−VI 4 族材料またはI−III−VI 2 族材料であり、
Cu含有カルコゲニド半導体層を硫化アンモニウム含有雰囲気に接触させる工程は、硫化アンモニウム蒸気を含む雰囲気中にCu含有カルコゲニド半導体層を持ち込む工程を含む方法。 - 溶液は、1重量%〜50重量%の硫化アンモニウムを水中に有する溶液である請求項5に記載の方法。
- バッファ層は、CdS層、亜鉛酸硫化物(Zn(O、S))層、または硫化インジウム(In2S3)層である請求項5〜7のいずれかに記載の方法。
- 更に、カルコゲニド半導体層を形成する前に、バッファ層の上にウインドウ層を形成する工程と、表面コンタクト層を形成する工程と、表面コンタクトグリッドを形成する工程とを含む請求項5〜8のいずれかに記載の方法。
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EP13191997 | 2013-11-07 | ||
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