JP6413784B2 - 基板処理装置及びデバイス製造方法 - Google Patents
基板処理装置及びデバイス製造方法 Download PDFInfo
- Publication number
- JP6413784B2 JP6413784B2 JP2015008107A JP2015008107A JP6413784B2 JP 6413784 B2 JP6413784 B2 JP 6413784B2 JP 2015008107 A JP2015008107 A JP 2015008107A JP 2015008107 A JP2015008107 A JP 2015008107A JP 6413784 B2 JP6413784 B2 JP 6413784B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- pattern
- substrate processing
- cylindrical member
- detection unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015008107A JP6413784B2 (ja) | 2015-01-19 | 2015-01-19 | 基板処理装置及びデバイス製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015008107A JP6413784B2 (ja) | 2015-01-19 | 2015-01-19 | 基板処理装置及びデバイス製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018172644A Division JP6680330B2 (ja) | 2018-09-14 | 2018-09-14 | パターン形成装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016133623A JP2016133623A (ja) | 2016-07-25 |
| JP2016133623A5 JP2016133623A5 (enExample) | 2017-12-07 |
| JP6413784B2 true JP6413784B2 (ja) | 2018-10-31 |
Family
ID=56426116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015008107A Active JP6413784B2 (ja) | 2015-01-19 | 2015-01-19 | 基板処理装置及びデバイス製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6413784B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI736621B (zh) * | 2016-10-04 | 2021-08-21 | 日商尼康股份有限公司 | 圖案描繪裝置及圖案描繪方法 |
| KR102630749B1 (ko) * | 2021-08-03 | 2024-01-30 | 주식회사 디에이테크놀로지 | 이차전지 제조 시스템의 전극 측정 장치 및 방법 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005197483A (ja) * | 2004-01-08 | 2005-07-21 | Nikon Corp | 撮像手段の回転誤差計測方法、及びこの回転誤差計測方法を用いた調整方法又は計測方法、及びこの回転誤差計測方法で計測された回転誤差を使用する位置計測装置、及びこの位置計測装置を備えた露光装置 |
| JP2006268032A (ja) * | 2005-02-24 | 2006-10-05 | Fuji Photo Film Co Ltd | 描画装置および描画装置の校正方法 |
| JP5210199B2 (ja) * | 2009-02-23 | 2013-06-12 | 大日本スクリーン製造株式会社 | 画像記録方法 |
| JP6123252B2 (ja) * | 2012-11-21 | 2017-05-10 | 株式会社ニコン | 処理装置及びデバイス製造方法 |
| KR101812857B1 (ko) * | 2012-08-28 | 2017-12-27 | 가부시키가이샤 니콘 | 기판 지지 장치, 및 노광 장치 |
| JP2014081452A (ja) * | 2012-10-16 | 2014-05-08 | Nikon Corp | 露光装置、およびデバイス製造方法 |
-
2015
- 2015-01-19 JP JP2015008107A patent/JP6413784B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016133623A (ja) | 2016-07-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107748486B (zh) | 基板处理装置及其调整方法、器件制造方法及直接描绘曝光装置 | |
| JP6680330B2 (ja) | パターン形成装置 | |
| JP6361273B2 (ja) | 基板処理装置及びデバイス製造方法 | |
| JP6648798B2 (ja) | パターン描画装置 | |
| JP6413784B2 (ja) | 基板処理装置及びデバイス製造方法 | |
| JP6996580B2 (ja) | 基板処理方法 | |
| JP6547879B2 (ja) | 露光装置、及びデバイス製造方法 | |
| JP6750712B2 (ja) | 基板処理装置、及びデバイス製造方法 | |
| JP6950787B2 (ja) | パターン形成装置 | |
| HK1236632A1 (en) | Substrate processing device, device manufacturing system, and device manufacturing method | |
| HK1236632B (zh) | 基板处理装置、元件制造系统及元件制造方法 | |
| HK1251046A1 (en) | Substrate processing apparatus, substrate processing apparatus adjustment method, device production system, and device production method | |
| HK1246407A1 (en) | Substrate-processing apparatus and adjusting method thereof, device manufacturing method, and direct writing exposure apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171030 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20171030 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180904 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180831 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180917 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6413784 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |