JP6412877B2 - 押圧構造及び押圧ユニット - Google Patents
押圧構造及び押圧ユニット Download PDFInfo
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- JP6412877B2 JP6412877B2 JP2015545004A JP2015545004A JP6412877B2 JP 6412877 B2 JP6412877 B2 JP 6412877B2 JP 2015545004 A JP2015545004 A JP 2015545004A JP 2015545004 A JP2015545004 A JP 2015545004A JP 6412877 B2 JP6412877 B2 JP 6412877B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/2049—Pressing means used to urge contact, e.g. springs
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F1/00—Springs
- F16F1/02—Springs made of steel or other material having low internal friction; Wound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant
- F16F1/18—Leaf springs
- F16F1/185—Leaf springs characterised by shape or design of individual leaves
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F3/00—Spring units consisting of several springs, e.g. for obtaining a desired spring characteristic
- F16F3/02—Spring units consisting of several springs, e.g. for obtaining a desired spring characteristic with springs made of steel or of other material having low internal friction
- F16F3/023—Spring units consisting of several springs, e.g. for obtaining a desired spring characteristic with springs made of steel or of other material having low internal friction composed only of leaf springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1094—Thermal management, e.g. cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Fuel Cell (AREA)
- Springs (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Description
図1は、本発明の実施の形態1による押圧構造を用いた押圧ユニットを模式的に示す側面図である。図2Aは、図1に示す押圧構造の平面図である。図2Bは、図1に示す押圧構造の側面図である。
S1=L×B1 …(1)
また、単位面積当たりの荷重P1は、押圧構造全体のばね荷重をF0とした場合、以下の式(2)で求められる。
P1=F0/S1 …(2)
P1=5000/(100×50)=1.00[N/mm2] …(3)
P2=5000/(101.6×50)=0.98[N/mm2] …(4)
P2=5000/(103.6×50)=0.965[N/mm2] …(5)
上述したように、実施の形態1では面圧分布の均一化を図ることはできるが、単位面積当たりの荷重が低下してしまう。そこで、実施の形態2では、同一面積内に配置するばね部材の数を増加させて、単位面積当たりの荷重を低下させずに、面圧分布の均一化を実現する。
P3=(1000×9)/(101.6×50)=1.77[N/mm2] …(6)
図11は、本発明の実施の形態2の変形例によるばね部材の上面視での形状を示す平面図である。実施の形態2の変形例によるばね部材5は、実施の形態2における第1のばね部材3又は第2のばね部材4として用いることができる。
実施の形態2では、第1のばね部材3及び第2のばね部材4の位置決めを行うために、第1の被押圧体201又は第2の被押圧体102側に、位置決め溝201a及び201bを設けたが、この実施の形態3では、位置決め手段として位置決め用チューブを用いる。
図16は、本発明の実施の形態4による電力変換装置の要部の構成を示す模式図である。実施の形態4では、押圧構造の適用例として、押圧ユニットである電力変換装置を説明する。同図に示す電力変換装置400は、例えば、電気自動車用の走行モータに流す駆動電流を生成する装置である。なお、以下の例では、上述の実施の形態3の押圧構造300を備えたものとして説明するが、実施の形態1による押圧構造100又は実施の形態2による押圧構造200を用いてもよい。
図17は、本発明の実施の形態5による電気二重層キャパシタの要部の構成を示す模式図である。実施の形態5では、押圧構造の適用例として、押圧ユニットである電気二重層キャパシタを説明する。なお、以下の例では、上述の実施の形態3の押圧構造300を備えたものを説明するが、実施の形態1による押圧構造100又は実施の形態2による押圧構造200を用いてもよい。
2,4,7 第2のばね部材
5 ばね部材
8 位置決め用チューブ
9 突起
10 中空部
11,21,31,41,51,61,71 中央部
12,22,32,42,52,62,72 腕部
13,23,33,43,53,63,73 端部
100,200,300 押圧構造
101,201,301 第1の被押圧体
201a,201b 位置決め溝
102 第2の被押圧体
400 電力変換装置
402 半導体積層ユニット
404 当接板
405 筐体
421 半導体モジュール
422 冷却管
423 連結パイプ
424 冷媒導入口
425 冷媒排出口
450 電気二重層キャパシタ
451 パッケージセル
452 セル積層体
454 当接板
455 筐体
Claims (9)
- 第1の被押圧体と前記第1の被押圧体に対向配置される第2の被押圧体との間に配置され、前記第1の被押圧体及び前記第2の被押圧体に対して圧力を加える押圧構造であって、
前記第1の被押圧体に接触する中央部と、それぞれが前記第2の被押圧体に接触する2つの端部と、それぞれが前記中央部から異なる前記端部に向かって延在する2つの腕部と、を有する第1のばね部材と、
前記第2の被押圧体に接触する中央部と、それぞれが前記第1の被押圧体に接触する2つの端部と、それぞれが前記中央部から異なる前記端部に向かって延在する2つの腕部と、を有する第2のばね部材と、
を備えることを特徴とする押圧構造。 - 前記第1のばね部材と、前記第2のばね部材が、幅方向に交互に配列されることを特徴とする請求項1に記載の押圧構造。
- 前記第1のばね部材と、前記第2のばね部材が、前記第1または第2の被押圧体から見て、前記中央部において一部が重なり合うように幅方向に交互に配列され、
前記第1のばね部材及び前記第2のばね部材が、それぞれ前記腕部において、少なくとも非荷重時に互いに干渉しない形状を有することを特徴とする請求項1又は2に記載の押圧構造。 - 前記第1のばね部材及び前記第2のばね部材が、それぞれ前記腕部において、前記中央部の幅よりも狭い幅の部分を有することを特徴とする請求項1〜3のいずれか1項に記載の押圧構造。
- 前記第1のばね部材及び前記第2のばね部材が、それぞれ前記腕部の幅が前記中央部から前記端部にかけて減少する形状を有することを特徴とする請求項1〜4のいずれか1項に記載の押圧構造。
- 前記第1のばね部材及び前記第2のばね部材が、同一形状であることを特徴とする請求項1〜5のいずれか1項に記載の押圧構造。
- 前記第1のばね部材及び前記第2のばね部材の位置決めをする位置決め手段をさらに備えることを特徴とする請求項1〜6のいずれか1項に記載の押圧構造。
- 前記位置決め手段が、前記第1のばね部材の前記中央部と前記第2のばね部材の前記中央部との間に形成される空間に挿入されることを特徴とする請求項7に記載の押圧構造。
- 第1の被押圧体と、
前記第1の被押圧体に対向配置される第2の被押圧体と、
前記第1の被押圧体と前記第2の被押圧体との間に配置され、前記第1の被押圧体及び前記第2の被押圧体に対して圧力を加える請求項1〜8のいずれか1項に記載の押圧構造と、
を備えることを特徴とする押圧ユニット。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013223681 | 2013-10-28 | ||
JP2013223681 | 2013-10-28 | ||
PCT/JP2014/078631 WO2015064572A1 (ja) | 2013-10-28 | 2014-10-28 | 押圧構造及び押圧ユニット |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2015064572A1 JPWO2015064572A1 (ja) | 2017-03-09 |
JP6412877B2 true JP6412877B2 (ja) | 2018-10-24 |
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Application Number | Title | Priority Date | Filing Date |
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JP2015545004A Active JP6412877B2 (ja) | 2013-10-28 | 2014-10-28 | 押圧構造及び押圧ユニット |
Country Status (6)
Country | Link |
---|---|
US (1) | US9955611B2 (ja) |
EP (1) | EP3065170B1 (ja) |
JP (1) | JP6412877B2 (ja) |
CN (1) | CN105706232B (ja) |
CA (1) | CA2928787C (ja) |
WO (1) | WO2015064572A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6167012B2 (ja) * | 2013-10-28 | 2017-07-19 | 日本発條株式会社 | 燃料電池 |
DE102015202142A1 (de) * | 2015-02-06 | 2016-08-11 | Mahle International Gmbh | Elektrische Einrichtung |
JP2018057133A (ja) * | 2016-09-28 | 2018-04-05 | トヨタ自動車株式会社 | 電力変換装置 |
US10178813B2 (en) * | 2017-01-26 | 2019-01-08 | The United States Of America As Represented By The Secretary Of The Army | Stacked power module with integrated thermal management |
JP7014626B2 (ja) | 2018-02-07 | 2022-02-01 | 株式会社Soken | 半導体装置 |
CN108443397A (zh) * | 2018-03-02 | 2018-08-24 | 宁波工程学院 | 一种利用平面简谐波形片减震的结构 |
JP7087638B2 (ja) * | 2018-04-27 | 2022-06-21 | 株式会社デンソー | 電力変換装置 |
JP7400236B2 (ja) * | 2019-07-18 | 2023-12-19 | 株式会社アイシン | 弁開閉時期制御装置 |
WO2022091824A1 (ja) * | 2020-10-28 | 2022-05-05 | 日本発條株式会社 | ばね部材 |
WO2023210591A1 (ja) * | 2022-04-26 | 2023-11-02 | 日本発條株式会社 | ばね部材 |
JP7419613B1 (ja) | 2022-04-26 | 2024-01-22 | 日本発條株式会社 | ばね部材 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1630459A (en) * | 1923-07-21 | 1927-05-31 | Zeidler Economy Spring Pad Co | Pad for laundry and other machines |
US2277853A (en) * | 1939-03-24 | 1942-03-31 | Fritz Mommenday & Sohn | Cushion, mattress, and other resilient supports |
EP0129589B1 (en) * | 1982-12-20 | 1989-02-08 | GRAEBE, Robert H. | Constant force cushion |
GB8617540D0 (en) | 1986-07-17 | 1986-08-28 | British Petroleum Co Plc | Leaf spring |
JP3935979B2 (ja) | 1995-07-18 | 2007-06-27 | 日本発条株式会社 | 波形ばね装置 |
JPH1098140A (ja) | 1996-09-24 | 1998-04-14 | Hitachi Ltd | マルチチップ型半導体装置 |
JP2001094280A (ja) | 1999-09-27 | 2001-04-06 | Nec Eng Ltd | ばねを用いたユニット取付構造 |
JP2001358482A (ja) | 2000-04-14 | 2001-12-26 | Matsushita Refrig Co Ltd | 放熱モジュール |
JP2001250895A (ja) * | 2000-04-27 | 2001-09-14 | Showa Denko Kk | Cpu装置への放熱器固定構造 |
US6832979B1 (en) * | 2002-03-18 | 2004-12-21 | Jesse D. Yarbrough | Mobile spring board construction |
US7314125B2 (en) | 2004-09-27 | 2008-01-01 | Nike, Inc. | Impact attenuating and spring elements and products containing such elements |
JP4924750B2 (ja) * | 2010-02-05 | 2012-04-25 | 株式会社デンソー | 電力変換装置 |
DE202010015380U1 (de) * | 2010-11-11 | 2012-02-17 | Hermann Bock Gmbh | Federelement |
CN103430302B (zh) | 2011-03-17 | 2016-08-10 | 日本发条株式会社 | 按压单元 |
JP2013118334A (ja) * | 2011-12-05 | 2013-06-13 | Toyota Motor Corp | 半導体冷却器 |
-
2014
- 2014-10-28 CN CN201480058579.5A patent/CN105706232B/zh active Active
- 2014-10-28 EP EP14858612.6A patent/EP3065170B1/en active Active
- 2014-10-28 JP JP2015545004A patent/JP6412877B2/ja active Active
- 2014-10-28 WO PCT/JP2014/078631 patent/WO2015064572A1/ja active Application Filing
- 2014-10-28 US US15/032,470 patent/US9955611B2/en active Active
- 2014-10-28 CA CA2928787A patent/CA2928787C/en active Active
Also Published As
Publication number | Publication date |
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CN105706232A (zh) | 2016-06-22 |
JPWO2015064572A1 (ja) | 2017-03-09 |
EP3065170A4 (en) | 2017-07-19 |
EP3065170A1 (en) | 2016-09-07 |
WO2015064572A1 (ja) | 2015-05-07 |
CN105706232B (zh) | 2018-12-11 |
US20160286687A1 (en) | 2016-09-29 |
CA2928787C (en) | 2019-02-26 |
CA2928787A1 (en) | 2015-05-07 |
EP3065170B1 (en) | 2018-12-19 |
US9955611B2 (en) | 2018-04-24 |
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