JP6412585B2 - 液状ソルダーレジスト組成物及び被覆プリント配線板 - Google Patents
液状ソルダーレジスト組成物及び被覆プリント配線板 Download PDFInfo
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- JP6412585B2 JP6412585B2 JP2016563292A JP2016563292A JP6412585B2 JP 6412585 B2 JP6412585 B2 JP 6412585B2 JP 2016563292 A JP2016563292 A JP 2016563292A JP 2016563292 A JP2016563292 A JP 2016563292A JP 6412585 B2 JP6412585 B2 JP 6412585B2
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- Prior art keywords
- solder resist
- resist composition
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- monomer
- photopolymerization initiator
- Prior art date
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- 229910000679 solder Inorganic materials 0.000 title claims description 182
- 239000000203 mixture Substances 0.000 title claims description 130
- 239000007788 liquid Substances 0.000 title claims description 110
- 239000000178 monomer Substances 0.000 claims description 116
- 239000003999 initiator Substances 0.000 claims description 89
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 76
- 150000001875 compounds Chemical class 0.000 claims description 76
- -1 maleimide compound Chemical class 0.000 claims description 56
- 229920005989 resin Polymers 0.000 claims description 56
- 239000011347 resin Substances 0.000 claims description 56
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 33
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 26
- 239000004593 Epoxy Substances 0.000 claims description 24
- 125000003118 aryl group Chemical group 0.000 claims description 23
- 125000000217 alkyl group Chemical group 0.000 claims description 21
- 239000001257 hydrogen Substances 0.000 claims description 17
- 229910052739 hydrogen Inorganic materials 0.000 claims description 17
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 12
- 229920001610 polycaprolactone Polymers 0.000 claims description 12
- 239000004632 polycaprolactone Substances 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 10
- 239000007787 solid Substances 0.000 claims description 10
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 9
- 150000002431 hydrogen Chemical class 0.000 claims description 8
- 125000000962 organic group Chemical group 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 8
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 7
- 230000000379 polymerizing effect Effects 0.000 claims description 5
- MKRBAPNEJMFMHU-UHFFFAOYSA-N 1-benzylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CC1=CC=CC=C1 MKRBAPNEJMFMHU-UHFFFAOYSA-N 0.000 claims description 2
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 claims description 2
- UJTRCPVECIHPBG-UHFFFAOYSA-N 3-cyclohexylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C2CCCCC2)=C1 UJTRCPVECIHPBG-UHFFFAOYSA-N 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 86
- 239000011248 coating agent Substances 0.000 description 57
- 238000000576 coating method Methods 0.000 description 57
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 48
- 239000003960 organic solvent Substances 0.000 description 34
- 239000000047 product Substances 0.000 description 32
- 238000012360 testing method Methods 0.000 description 28
- 238000000034 method Methods 0.000 description 27
- 239000003822 epoxy resin Substances 0.000 description 21
- 229920000647 polyepoxide Polymers 0.000 description 21
- 239000000243 solution Substances 0.000 description 21
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 18
- 239000003795 chemical substances by application Substances 0.000 description 16
- 229920000642 polymer Polymers 0.000 description 16
- 230000008859 change Effects 0.000 description 14
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 12
- 239000007864 aqueous solution Substances 0.000 description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 11
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 10
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 10
- 238000006116 polymerization reaction Methods 0.000 description 10
- 239000002994 raw material Substances 0.000 description 10
- 239000002344 surface layer Substances 0.000 description 10
- 238000002845 discoloration Methods 0.000 description 9
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000000016 photochemical curing Methods 0.000 description 8
- 239000003505 polymerization initiator Substances 0.000 description 8
- 125000004432 carbon atom Chemical group C* 0.000 description 7
- 238000001723 curing Methods 0.000 description 7
- 125000000524 functional group Chemical group 0.000 description 7
- 229920001187 thermosetting polymer Polymers 0.000 description 7
- 238000004383 yellowing Methods 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 229920000298 Cellophane Polymers 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 229920000877 Melamine resin Polymers 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000002390 adhesive tape Substances 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000012670 alkaline solution Substances 0.000 description 5
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 239000011574 phosphorus Substances 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 4
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical group C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 4
- 238000004040 coloring Methods 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 4
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 4
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine powder Natural products NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- JIHQDMXYYFUGFV-UHFFFAOYSA-N 1,3,5-triazine Chemical group C1=NC=NC=N1 JIHQDMXYYFUGFV-UHFFFAOYSA-N 0.000 description 3
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- 239000004640 Melamine resin Substances 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 238000007259 addition reaction Methods 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical class C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 3
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 2
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- HHOJVZAEHZGDRB-UHFFFAOYSA-N 2-(4,6-diamino-1,3,5-triazin-2-yl)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC1=NC(N)=NC(N)=N1 HHOJVZAEHZGDRB-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 2
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- SEILKFZTLVMHRR-UHFFFAOYSA-N 2-phosphonooxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOP(O)(O)=O SEILKFZTLVMHRR-UHFFFAOYSA-N 0.000 description 2
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 2
- ZXLYUNPVVODNRE-UHFFFAOYSA-N 6-ethenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=C)=N1 ZXLYUNPVVODNRE-UHFFFAOYSA-N 0.000 description 2
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 150000005215 alkyl ethers Chemical class 0.000 description 2
- 239000001099 ammonium carbonate Substances 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 125000005395 methacrylic acid group Chemical group 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000001579 optical reflectometry Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 150000003021 phthalic acid derivatives Chemical class 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
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Classifications
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- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
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- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
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- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
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- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
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- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/322—Aqueous alkaline compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
カルボキシル基含有樹脂は、モノマー組成物の重合によって得られる。カルボキシル基含有樹脂は、塗膜の強度を高めることができる。カルボキシル基含有樹脂は、塗膜の耐熱性を高めることができる。カルボキシル基含有樹脂は、液状ソルダーレジスト組成物から形成される塗膜に、アルカリ性溶液による現像性、すなわちアルカリ現像性を付与することができる。
光重合性化合物は、液状ソルダーレジスト組成物に光硬化性を付与する。光重合性化合物は、光重合性モノマー及び光重合性プレポリマーからなる群から選択される1種以上の化合物を含有する。
光重合開始剤は、上記光重合性化合物の重合を速やかに開始させることができる。光重合開始剤としては、アシルフォスフィンオキサイド系光重合開始剤、アルキルフェノン系光重合開始剤、チタノセン系光重合開始剤、オキシムエステル系光重合開始剤、カチオン系光重合開始剤が例示される。光重合開始剤は、アシルフォスフィンオキサイド系光重合開始剤と、アルキルフェノン系光重合開始剤とから選ばれる1種以上を含むことが好ましい。アシルフォスフィンオキサイド系光重合開始剤は、ビスアシルフォスフィンオキサイド系光重合開始剤を含むことが好ましい。アルキルフェノン系光重合開始剤は、α−ヒドロキシアルキルフェノン系光重合開始剤を含むことが好ましい。光重合開始剤は、アシルフォスフィンオキサイド系光重合開始剤と、アルキルフェノン系光重合開始剤との両方を含むことがさらに好ましい。
組成物を得ることができる。光重合開始剤は、ビスアシルフォスフィンオキサイド系光重合開始剤と、α−ヒドロキシアルキルフェノン系光重合開始剤とを含有することがさらに好ましい。なお、α−ヒドロキシアルキルフェノン系光重合開始剤は、α−ヒドロキシアルキルフェノンと、α−ヒドロキシアルキルフェノンのアルキルエステルとのうち、少なくとも一方を含有する。
エポキシ化合物は、液状ソルダーレジスト組成物に熱硬化性を付与することができる。エポキシ化合物は、環状エーテル骨格を有する。エポキシ化合物の使用により、硬化性の高い塗膜を得ることができる。
酸化チタンは、塗膜を白色化させることができる。酸化チタンは、液状ソルダーレジスト組成物から形成されるソルダーレジスト層を白色に着色することで、ソルダーレジスト層に高い光反射性を付与することができる。酸化チタンは、例えばルチル型酸化チタンとアナターゼ型酸化チタンのうち、一方又は両方を含有することができる。特に酸化チタンがルチル型酸化チタンを含有することが好ましい。ルチル型酸化チタンは工業的には塩素法又は硫酸法で製造される。ルチル型酸化チタンは、塩素法で製造されたルチル型酸化チタンと硫酸法で製造されたルチル型酸化チタンとのうち一方又は両方を含有することができる。
液状ソルダーレジスト組成物は、有機溶剤を含有してもよい。有機溶剤により、液状ソルダーレジスト組成物は、塗布が容易になる。
液状ソルダーレジスト組成物中の成分の量は、液状ソルダーレジスト組成物が光硬化性を有するように、適宜調整される。液状ソルダーレジスト組成物中の成分の量は、レジスト層がアルカリ性溶液で現像可能であるように、適宜調整される。
上記のような液状ソルダーレジスト組成物の原料が配合され、例えば三本ロール、ボールミル、サンドミル等を用いる公知の混練方法によって混練されることにより、液状ソルダーレジスト組成物が調製され得る。
液状ソルダーレジスト組成物は、例えばプリント配線板にソルダーレジスト層を形成することに適用される。
以下、実施例について説明する。ただし、本開示の液状ソルダーレジスト組成物は、下記の実施例のみに制限されることはない。
還流冷却器、温度計、窒素置換基用ガラス管及び攪拌機を取り付けた四つ口フラスコ中に、後掲の表1に記載される原料を、表1の配合割合で加えた。なお、有機溶剤は、ジプロピレングリコールモノメチルエーテルを使用し、重合開始剤は、アゾビスイソブチロニトリルを使用した。ω−カルボキシ−ポリカプロラクトンモノアクリレートは、ω−カルボキシポリカプロラクトン(n≒2)モノアクリレートを使用した。この四つ口フラスコ内の液を窒素気流下で80℃で5時間加熱して重合反応を進行させることで、共重合体溶液を得た。これにより、カルボキシル基含有樹脂溶液A−1〜A−14が得られた。なお、表1の配合割合の単位は「質量部」である。
後掲の表1に記載される原料から、上記と同様の操作によって、共重合体溶液を調製し、この共重合体溶液に、ハイドロキノン0.1部、グリシジルメタクリレート70部、ジメチルベンジルアミン4.0部を加え、80℃で24時間付加反応を行うことで、光重合性を有する樹脂溶液a−1を得た。
後掲の表2Aに示す成分を配合して得られる混合物を3本ロールで混練することで、液状ソルダーレジスト組成物を得た。表2Aにおいて、A−1〜A−14は上記のカルボキシル基含有樹脂溶液を表し、a−1〜a−4は上記の樹脂溶液を表す。表2Aの配合割合の単位は「質量部」である。
・光重合性モノマー(DPHA);ジペンタエリスリトールペンタ及びヘキサアクリレート(日本化薬社製)
・光重合開始剤(IRGACURE819);ビス(2,4,6−トリメチルベンゾイル)−フェニルフォスフィンオキサイド、BASF社製、品番IRGACURE819。
・光重合開始剤(IRGACURE184);1−ヒドロキシ−シクロヘキシル−フェニル−ケトン、BASF社製、25℃で固体、品番IRGACURE184。
・光重合開始剤(DAROCUR1173);2−ヒドロキシ−2−メチル−1−フェニル−プロパン−1−オン、BASF社製、25℃で液体、品番DAROCUR1173。
・光重合開始剤(IRGACURE TPO):2,4,6−トリメチルベンゾイル−ジフェニル−フォスフィンオキサイド、BASF社製、品番IRGACURE TPO。
・エポキシ化合物;トリグリシジルイソシアネート、日産化学社製、品番TEPIC−SP。
・ルチル型酸化チタンCR−90;塩素法で製造されたルチル型酸化チタン、石原産業株式会社製、品番CR−90。
・ルチル型酸化チタンR−79;硫酸法により製造されたルチル型酸化チタン、堺化学工業株式会社製、品番R−79。
・メラミン;日産化学工業株式会社製、微粉メラミン。
・消泡剤(シリコーン);信越シリコーン株式会社製、品番KS−66。
<テストピースの作製>
厚み35μmの銅箔を備えるガラスエポキシ銅張積層板を用意した。このガラスエポキシ銅張積層板にエッチングを施して導体配線を形成することで、プリント配線基板を得た。このプリント配線板の一面全体にソルダーレジスト用樹脂組成物をスクリーン印刷により塗布することで、塗膜を形成した。この塗膜を80℃で20分加熱することで乾燥させた。乾燥後の塗膜(乾燥塗膜)の厚みは20μmであった。この乾燥塗膜の表面上にネガマスクを直接当てた状態で、ネガマスクに向けて紫外線を照射することで、露光量450mJ/cm2の条件で乾燥塗膜を選択的に露光した。続いて、乾燥塗膜からネガマスクを取り外してから、乾燥塗膜に炭酸ナトリウム水溶液を用いて現像処理を施すことで、乾燥塗膜のうち露光により硬化した部分を、プリント配線板上にソルダーレジスト層として残存させた。このソルダーレジスト層を更に150℃で60分間加熱して熱硬化させた。これによりソルダーレジスト層を備えるテストピースを得た。
テストピースを室温下で10%の硫酸溶液に30分浸漬してから、引き上げた。続いて、セロハン粘着テープによるピーリング試験後の剥がれの状態を目視で観察することで、剥離、レジストの変色等の変化の有無を確認し、その結果を次のように評価した。
A:外観に変化は認められない。
B:外観に少し変化が認められる。
C:外観に大きな変化が認められる。
テストピースを室温下で10%の水酸化ナトリウム水溶液に1時間浸漬してから、引き上げた。続いて、テストピースにおけるソルダーレジスト層の外観を目視で観察することで、剥離の変化の有無を確認し、その結果を次のように評価した。
A:外観に変化は認められない。
B:外観に少し変化が認められる。
C:外観に大きな変化が認められる。
JIS D0202の試験方法に従って、テストピースのソルダーレジスト層に碁盤目状にクロスカットを入れ、次いでセロハン粘着テープによるピーリング試験後の剥がれの状態を目視により観察した。その結果を次に示すように評価した。
A:100個のクロスカット部分のうちの全てに全く変化が見られない。
B:100個のクロスカット部分のうち1箇所に僅かに浮きを生じた。
C:100個のクロスカット部分のうち2〜10箇所に剥がれを生じた。
D:100個のクロスカット部分のうち11〜100箇所に剥がれを生じた。
テストピースを温度121℃の飽和水蒸気中に、圧力2atmにて8時間維持した後、常温、常圧へ戻した。完全に常温常圧になったことを確認した後、テストピースを引き上げた。続いて、このテストピースにおけるソルダーレジスト層の外観を目視で観察することで、ふくれ、剥離、レジストの変色等の変化の有無を確認し、その結果を次のように評価した。
A:外観に変化は認められない。
B:外観に少し変化が認められる。
C:外観に大きな変化が認められる。
テストピースをカッターで切断し、続いて切断面付近でソルダーレジスト層に対してセロハン粘着テープ剥離試験を行い、ソルダーレジスト層の観察を行った。その結果を次に示すように評価した。
A:ソルダーレジスト層にクラックが確認されず、セロハン粘着テープ剥離試験によるソルダーレジスト層の剥離も確認されない。
B:ソルダーレジスト層にクラックが確認されるが、セロハン粘着テープ剥離試験によるソルダーレジスト層の剥離は確認されない。
C:ソルダーレジスト層にクラックが確認され、セロハン粘着テープ剥離試験によるソルダーレジスト層の剥離が確認される。
フラックスとしてLONCO 3355−11(ロンドンケミカル社製の水溶性フラックス)を用い、まずテストピースにフラックスを塗布し、次いでこれを260℃の溶融はんだ浴に10秒間浸漬し、その後、水洗した。このサイクルを3回おこなった後のソルダーレジスト層の外観を観察し、その結果を次に示すように評価した。
A:異常が見られない。
B:少し変化が見られる。
C:ソルダーレジスト層に剥がれ等の大きな変化が見られる。
テストピースのソルダーレジスト層の鉛筆硬度を、三菱ハイユニ(三菱鉛筆社製)を用いて、JIS K5400に準拠して測定した。
テストピースにおけるソルダーレジスト層の、L*a*b*表色系におけるb*値を、コニカミノルタセンシング株式会社製の分光測色計(型番CM−600d)を用いて測定した。続いて、テストピースにおけるソルダーレジスト層にメタハライドランプにて20J/cm2の条件で照射した後、紫外線処理後のソルダーレジスト層の、L*a*b*表色系におけるb*値を測定した。紫外線処理後のソルダーレジスト層のb*値から紫外線処理前のソルダーレジスト層のb*値を減じて得られる値(Δb*)を算出し、その結果を次に示すように評価した。
A:Δb*値が1.5未満。
B:Δb*値が1.5以上2.0未満。
C:Δb*値が2.0以上2.5未満。
D:Δb*値が2.5以上。
テストピースにおけるソルダーレジスト層の、L*a*b*表色系におけるb*値を、コニカミノルタセンシング株式会社製の分光測色計(型番CM−600d)を用いて測定した。続いて、テストピースを250℃、2分の条件で熱処理した後、再びソルダーレジスト層のb*値を測定した。熱処理後のソルダーレジスト層のb*値から熱処理前のソルダーレジスト層のb*値を減じて得られる値(Δb*)を算出し、その結果を次に示すように評価した。
A:Δb*値が1.5未満。
B:Δb*値が1.5以上2.0未満。
C:Δb*値が2.0以上2.5未満。
D:Δb*値が2.5以上。
テストピースにおけるソルダーレジスト層の、X,Y,Z表色系におけるY値を、コニカミノルタセンシング株式会社製の分光測色計(型番CM−600d)を用いて測定し、反射率を求めた。
表2Bに示すように、実施例の液状ソルダーレジスト組成物から形成されたレジスト層は、基本的性能が高いことに加え、耐紫外線変色(黄変)及び耐熱変色(黄変)が少ない。なお、比較例2、4では現像不良が発生し、いくつかの項目の評価ができなかった。
Claims (10)
- カルボキシル基含有樹脂と、光重合性モノマー及び光重合性プレポリマーからなる群から選択される1種以上の化合物を含有する光重合性化合物と、光重合開始剤と、エポキシ化合物と、酸化チタンとを含有し、
前記カルボキシル基含有樹脂は、下記式(1)で表されるカルボキシル基含有モノマーと、下記式(2)で表されるマレイミド化合物とを含むモノマー組成物を重合させて得られ、光重合性官能基を有さない、
液状ソルダーレジスト組成物。
- 前記モノマー組成物は、モノマー全体に対する前記マレイミド化合物の含有量が1〜30質量%である、
請求項1に記載の液状ソルダーレジスト組成物。 - 前記マレイミド化合物は、N−フェニルマレイミド、N−ベンジルマレイミド及びシクロヘキシルマレイミドから選ばれる1種以上を含む、
請求項1又は2に記載の液状ソルダーレジスト組成物。 - 前記カルボキシル基含有モノマーは、メタクリル酸、アクリル酸、ω−カルボキシ−ポリカプロラクトンモノメタクリレート、及びω−カルボキシ−ポリカプロラクトンモノアクリレートから選ばれる1種以上を含む、
請求項1乃至3のいずれか1項に記載の液状ソルダーレジスト組成物。 - 前記モノマー組成物は、前記カルボキシル基含有モノマー及び前記マレイミド化合物以外のモノマーを含む、
請求項1乃至4のいずれか1項に記載の液状ソルダーレジスト組成物。 - 前記光重合開始剤は、アシルフォスフィンオキサイド系光重合開始剤と、α−ヒドロキシアルキルフェノン系光重合開始剤とを含有する、
請求項1乃至5のいずれか1項に記載の液状ソルダーレジスト組成物。 - 前記α−ヒドロキシアルキルフェノン系光重合開始剤は、25℃で液体であるα−ヒドロキシアルキルフェノン系光重合開始剤と、25℃で固体であるα−ヒドロキシアルキルフェノン系光重合開始剤とを含有する、
請求項6に記載の液状ソルダーレジスト組成物。 - 前記カルボキシル基含有樹脂の酸価は100〜150mgKOH/gの範囲である、
請求項1乃至7のいずれか1項に記載の液状ソルダーレジスト組成物。 - 前記酸化チタンはルチル型酸化チタンを含有する、
請求項1乃至8のいずれか1項に記載の液状ソルダーレジスト組成物。 - プリント配線板と、前記プリント配線板を被覆するソルダーレジスト層とを備え、
前記ソルダーレジスト層は、請求項1乃至9のいずれか1項に記載の液状ソルダーレジスト組成物から形成されている、
被覆プリント配線板。
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Application Number | Priority Date | Filing Date | Title |
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PCT/JP2014/006159 WO2016092597A1 (ja) | 2014-12-10 | 2014-12-10 | 液状ソルダーレジスト組成物及び被覆プリント配線板 |
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EP (1) | EP3232269B1 (ja) |
JP (1) | JP6412585B2 (ja) |
KR (1) | KR101898970B1 (ja) |
CN (1) | CN107003611B (ja) |
TW (1) | TWI656163B (ja) |
WO (1) | WO2016092597A1 (ja) |
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WO2016092596A1 (ja) * | 2014-12-10 | 2016-06-16 | 互応化学工業株式会社 | 液状ソルダーレジスト組成物及び被覆プリント配線板 |
KR102366344B1 (ko) * | 2017-12-18 | 2022-02-23 | 가부시키가이샤 닛폰 쇼쿠바이 | 중합체, 경화성 수지 조성물, 및 그 용도 |
JP2020164759A (ja) * | 2019-03-29 | 2020-10-08 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品 |
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US20090141505A1 (en) * | 2007-11-30 | 2009-06-04 | Taiyo Ink Mfg., Co,. Ltd. | White heat-hardening resin composition, hardened material, printed-wiring board and reflection board for light emitting device |
JP5024139B2 (ja) * | 2008-03-19 | 2012-09-12 | Jsr株式会社 | 着色層形成用感放射線性組成物、カラーフィルタおよびカラー液晶表示素子 |
TWI408150B (zh) * | 2008-10-17 | 2013-09-11 | Taiyo Ink Mfg Co Ltd | A solder resist composition and a printed circuit board using the same |
CN102844711A (zh) * | 2010-03-31 | 2012-12-26 | 太阳控股株式会社 | 阻焊剂组合物以及印刷电路板 |
JP5666868B2 (ja) * | 2010-09-30 | 2015-02-12 | 互応化学工業株式会社 | ソルダーレジスト用樹脂組成物及びプリント配線板 |
KR101443757B1 (ko) * | 2010-11-08 | 2014-09-25 | 제일모직 주식회사 | 컬러필터용 감광성 수지 조성물 및 이를 이용한 컬러필터 |
WO2012111400A1 (ja) * | 2011-02-18 | 2012-08-23 | 株式会社Adeka | 着色感光性組成物 |
JP5665615B2 (ja) * | 2011-03-14 | 2015-02-04 | 株式会社日本触媒 | カラーフィルタ用感光性樹脂組成物 |
US8703385B2 (en) * | 2012-02-10 | 2014-04-22 | 3M Innovative Properties Company | Photoresist composition |
JP5934664B2 (ja) * | 2012-03-19 | 2016-06-15 | 富士フイルム株式会社 | 着色感放射線性組成物、着色硬化膜、カラーフィルタ、着色パターン形成方法、カラーフィルタの製造方法、固体撮像素子、及び画像表示装置 |
JP6359824B2 (ja) * | 2013-03-25 | 2018-07-18 | 太陽インキ製造株式会社 | 感光性樹脂組成物、その硬化被膜およびプリント配線板 |
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- 2014-12-10 US US15/531,719 patent/US20170315443A1/en not_active Abandoned
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- 2014-12-10 KR KR1020177015862A patent/KR101898970B1/ko active IP Right Grant
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EP3232269B1 (en) | 2019-05-15 |
TW201620979A (zh) | 2016-06-16 |
TWI656163B (zh) | 2019-04-11 |
CN107003611A (zh) | 2017-08-01 |
CN107003611B (zh) | 2020-09-29 |
EP3232269A1 (en) | 2017-10-18 |
US20170315443A1 (en) | 2017-11-02 |
WO2016092597A1 (ja) | 2016-06-16 |
EP3232269A4 (en) | 2017-12-20 |
JPWO2016092597A1 (ja) | 2017-08-31 |
KR101898970B1 (ko) | 2018-09-14 |
KR20170083111A (ko) | 2017-07-17 |
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