JP6410161B2 - 発光装置、発光装置の製造方法 - Google Patents
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Description
[発光装置]
図1は、発光装置を上方から示す平面図である。
続いて、実施の形態2について説明する。なお、実施の形態1と同様の作用や機能、同様の形状や機構や構造を有するもの(部分)には同じ符号を付して説明を省略する場合がある。また、以下では実施の形態1と異なる点を中心に説明し、同じ内容については説明を省略する場合がある。
図5は、本実施の形態に係る発光装置の全体光軸を含む断面の一部を省略して示す断面図である。
本実施の形態における発光装置100は、例えば、次のようにして製造することができる。
本実施の形態における発光装置100では、第一樹脂部103の表面に、第二樹脂部104および第三樹脂部105が形成されているため所望の色度の光が放射される。従って、発光装置100相互間での色度の差を可及的に少なくすることができ、安定した製品を容易に提供することが可能となる。つまり、第一樹脂部103までが形成された発光装置100について発光素子102を発光させて色度を測定し、測定した色度が所定の範囲内に入っていない場合、第二樹脂部104、加えて第三樹脂部105を形成して発光装置100の色度をシフトさせることで、発光装置100の色度を所定の範囲内に収めることが可能となる。
101 基板
102 発光素子
103 第一樹脂部
104 第二樹脂部
105 第三樹脂部
121 個別光軸
131 凹陥部
141 対称面
200 気体流
Claims (6)
- 基板と、
前記基板の表面に取り付けられる複数の発光素子と、
前記発光素子が放射する光に基づき前記光とは異なる光を放射する光変換物質を含有し、複数の前記発光素子を一括して覆う第一樹脂部と、
光変換物質を含有し、前記第一樹脂部とは光を変換する性能の異なる第二樹脂部と、
光変換物質を含有し、前記第一樹脂部、および、前記第二樹脂とは光を変換する性能の異なる第三樹脂部とを備え、
前記第二樹脂部は、前記第一樹脂部の表面上、かつ、前記発光素子の光軸である個別光軸と交差しない位置に配置され、
前記第三樹脂部は、前記第一樹脂部の表面上、かつ、前記発光素子の個別光軸と交差しない位置、かつ、前記第二樹脂部とは異なる位置に配置され、
前記基板と交差し、前記第二樹脂部、および、前記第三樹脂部の配置が面対称となる対称面を少なくとも2面有する
発光装置。 - 前記第一樹脂は、表面、かつ、前記発光素子の個別光軸と交差しない位置に複数の凹陥部を備え、
前記第二樹脂は、前記凹陥部に配置される
請求項1に記載の発光装置。 - 前記第一樹脂部の表面、および、前記第二樹脂部の表面は、略同一の面内に配置される
請求項2に記載の発光装置。 - 前記第二樹脂部は、前記第一樹脂部よりも長波長の光を放射するような光変換物質を備える
請求項1〜3のいずれか一項に記載の発光装置。 - 基板と、前記基板の表面に取り付けられる複数の発光素子と、前記発光素子が放射する光に基づき前記光とは異なる光を放射する光変換物質を含有し、複数の前記発光素子を一括して覆う第一樹脂部とを備える発光装置の製造方法であって、
凹陥部を形成する際に発生する粉塵を一方向に押し流す気体流を気体流発生装置により前記第一樹脂部表面に発生させ、
硬化した前記第一樹脂部の表面上、かつ、前記発光素子の光軸である個別光軸と交差しない位置にレーザー光を用いて前記凹陥部を前記気体流の下流から上流に向かって形成し、
光変換物質を含有し、前記第一樹脂部とは光を変換する性能の異なる第二樹脂部を前記凹陥部に形成する
発光装置の製造方法。 - 基板と、前記基板の表面に取り付けられる複数の発光素子と、前記発光素子が放射する光に基づき前記光とは異なる光を放射する光変換物質を含有し、複数の前記発光素子を一括して覆う第一樹脂部とを備える発光装置の製造方法であって、
前記発光素子を点灯させて前記基板における前記発光素子の位置を示す位置情報を作成し、
光変換物質を含有し、前記第一樹脂部とは光を変換する性能の異なる第二樹脂部を、硬化した前記第一樹脂部の表面上、かつ、前記発光素子の光軸である個別光軸と交差しない位置に前記位置情報に基づき形成する
発光装置の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2015048800 | 2015-03-11 | ||
JP2015048800 | 2015-03-11 | ||
PCT/JP2016/000751 WO2016143261A1 (ja) | 2015-03-11 | 2016-02-15 | 発光装置、発光装置の製造方法 |
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JPWO2016143261A1 JPWO2016143261A1 (ja) | 2017-11-24 |
JP6410161B2 true JP6410161B2 (ja) | 2018-10-24 |
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EP (1) | EP3270051A4 (ja) |
JP (1) | JP6410161B2 (ja) |
WO (1) | WO2016143261A1 (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5089212B2 (ja) * | 2007-03-23 | 2012-12-05 | シャープ株式会社 | 発光装置およびそれを用いたledランプ、発光装置の製造方法 |
JP5680278B2 (ja) * | 2009-02-13 | 2015-03-04 | シャープ株式会社 | 発光装置 |
JP5322728B2 (ja) * | 2009-03-27 | 2013-10-23 | シチズンホールディングス株式会社 | Led光源及びled光源の製造方法 |
JP2013197294A (ja) * | 2012-03-19 | 2013-09-30 | Toshiba Lighting & Technology Corp | 照明装置 |
WO2014030281A1 (ja) * | 2012-08-22 | 2014-02-27 | パナソニック株式会社 | 発光装置、電球形ランプ及び照明装置 |
JP2014146661A (ja) * | 2013-01-28 | 2014-08-14 | Panasonic Corp | 発光モジュール、照明装置および照明器具 |
JP2014099650A (ja) * | 2014-02-03 | 2014-05-29 | Sharp Corp | 発光装置および発光装置の製造方法 |
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2016
- 2016-02-15 WO PCT/JP2016/000751 patent/WO2016143261A1/ja active Application Filing
- 2016-02-15 JP JP2017504594A patent/JP6410161B2/ja active Active
- 2016-02-15 EP EP16761240.7A patent/EP3270051A4/en not_active Withdrawn
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Publication number | Publication date |
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JPWO2016143261A1 (ja) | 2017-11-24 |
WO2016143261A1 (ja) | 2016-09-15 |
EP3270051A4 (en) | 2018-03-07 |
EP3270051A1 (en) | 2018-01-17 |
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