JP6402421B2 - 電磁波シールド部材、及び電磁波シールド構造 - Google Patents

電磁波シールド部材、及び電磁波シールド構造 Download PDF

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Publication number
JP6402421B2
JP6402421B2 JP2014061806A JP2014061806A JP6402421B2 JP 6402421 B2 JP6402421 B2 JP 6402421B2 JP 2014061806 A JP2014061806 A JP 2014061806A JP 2014061806 A JP2014061806 A JP 2014061806A JP 6402421 B2 JP6402421 B2 JP 6402421B2
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JP
Japan
Prior art keywords
electromagnetic wave
shield
circuit board
dielectric
electronic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014061806A
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English (en)
Japanese (ja)
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JP2015185741A (ja
JP2015185741A5 (enExample
Inventor
由見　英雄
英雄 由見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kitagawa Industries Co Ltd
Original Assignee
Kitagawa Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kitagawa Industries Co Ltd filed Critical Kitagawa Industries Co Ltd
Priority to JP2014061806A priority Critical patent/JP6402421B2/ja
Priority to US14/668,173 priority patent/US9510452B2/en
Publication of JP2015185741A publication Critical patent/JP2015185741A/ja
Publication of JP2015185741A5 publication Critical patent/JP2015185741A5/ja
Application granted granted Critical
Publication of JP6402421B2 publication Critical patent/JP6402421B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2014061806A 2014-03-25 2014-03-25 電磁波シールド部材、及び電磁波シールド構造 Active JP6402421B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014061806A JP6402421B2 (ja) 2014-03-25 2014-03-25 電磁波シールド部材、及び電磁波シールド構造
US14/668,173 US9510452B2 (en) 2014-03-25 2015-03-25 Electromagnetic shielding member and electromagnetic shielding structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014061806A JP6402421B2 (ja) 2014-03-25 2014-03-25 電磁波シールド部材、及び電磁波シールド構造

Publications (3)

Publication Number Publication Date
JP2015185741A JP2015185741A (ja) 2015-10-22
JP2015185741A5 JP2015185741A5 (enExample) 2017-04-27
JP6402421B2 true JP6402421B2 (ja) 2018-10-10

Family

ID=54192497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014061806A Active JP6402421B2 (ja) 2014-03-25 2014-03-25 電磁波シールド部材、及び電磁波シールド構造

Country Status (2)

Country Link
US (1) US9510452B2 (enExample)
JP (1) JP6402421B2 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6468054B2 (ja) * 2015-04-28 2019-02-13 富士通株式会社 プリント基板及びシールド板金固定方法
JP6623474B2 (ja) * 2016-03-28 2019-12-25 北川工業株式会社 熱伝導部材、熱伝導部材の製造方法、及び熱伝導構造体
CN105960157A (zh) * 2016-07-06 2016-09-21 武汉华星光电技术有限公司 电磁屏蔽保护膜与fpc
CN106211553B (zh) * 2016-07-28 2019-04-19 Oppo广东移动通信有限公司 Pcb板组件及具有其的移动终端
EP3537536A4 (en) * 2016-11-01 2020-06-10 LG Electronics Inc. -1- MOBILE DEVICE
US10477738B2 (en) * 2017-03-06 2019-11-12 Laird Technologies, Inc. Board level shields and systems and methods of applying board level shielding
JP6906045B2 (ja) * 2017-03-30 2021-07-21 日立Astemo株式会社 電子制御装置
JP6985588B2 (ja) * 2017-04-07 2021-12-22 富士通株式会社 電子装置及び電磁波吸収体
JP6642764B2 (ja) * 2017-05-19 2020-02-12 株式会社村田製作所 電子機器および通信機器
CN107454737B (zh) * 2017-09-06 2019-08-16 Oppo广东移动通信有限公司 一种电子设备及其电路板组件
WO2020040725A1 (en) * 2018-08-20 2020-02-27 Comet Ag Multi-stack cooling structure for radiofrequency component
KR102567412B1 (ko) 2018-10-31 2023-08-16 삼성전자주식회사 복수의 레이어를 포함하는 차폐 필름 및 그것을 사용하는 전자 장치
JP7215206B2 (ja) * 2019-02-19 2023-01-31 富士電機株式会社 半導体装置の製造方法
CN109922647B (zh) * 2019-03-27 2024-04-02 上海联影医疗科技股份有限公司 电磁屏蔽保护壳、探测组件及探测器
US10779395B1 (en) * 2019-04-25 2020-09-15 Microsoft Technology Licensing, Llc Electromagnetic interference shield with integrated decoupling
KR102015896B1 (ko) * 2019-05-21 2019-10-21 주식회사 유경하이테크 쉴드방열캔
US12024283B2 (en) * 2019-12-06 2024-07-02 Zipline International Inc. Unmanned aircraft system with swappable components and shielded circuit board
TWI727832B (zh) * 2020-06-17 2021-05-11 海華科技股份有限公司 無線通訊裝置
US12382575B2 (en) 2021-09-23 2025-08-05 Intel Corporation Solderless or groundless electromagnetic shielding in electronic devices
JP7588746B1 (ja) * 2024-05-22 2024-11-22 ソフトバンク株式会社 ベースプレート

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60241237A (ja) * 1984-05-15 1985-11-30 Mitsubishi Electric Corp 混成集積回路装置
JPH09283976A (ja) * 1996-04-08 1997-10-31 Kitagawa Ind Co Ltd 放熱・シールド材
JP4463390B2 (ja) 2000-07-07 2010-05-19 北川工業株式会社 熱伝導材，電磁波シールド構造，及び熱伝導材の製造方法
US6900383B2 (en) * 2001-03-19 2005-05-31 Hewlett-Packard Development Company, L.P. Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
US6744640B2 (en) * 2002-04-10 2004-06-01 Gore Enterprise Holdings, Inc. Board-level EMI shield with enhanced thermal dissipation
JP2012084599A (ja) * 2010-10-07 2012-04-26 Hitachi Ltd ヒートシンク接続体

Also Published As

Publication number Publication date
US9510452B2 (en) 2016-11-29
US20150282394A1 (en) 2015-10-01
JP2015185741A (ja) 2015-10-22

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