JP6642764B2 - 電子機器および通信機器 - Google Patents
電子機器および通信機器 Download PDFInfo
- Publication number
- JP6642764B2 JP6642764B2 JP2019519145A JP2019519145A JP6642764B2 JP 6642764 B2 JP6642764 B2 JP 6642764B2 JP 2019519145 A JP2019519145 A JP 2019519145A JP 2019519145 A JP2019519145 A JP 2019519145A JP 6642764 B2 JP6642764 B2 JP 6642764B2
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- JP
- Japan
- Prior art keywords
- electronic device
- shield layer
- antenna element
- antenna
- magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004020 conductor Substances 0.000 claims description 94
- 239000002131 composite material Substances 0.000 claims description 71
- 239000002184 metal Substances 0.000 claims description 42
- 239000000758 substrate Substances 0.000 claims description 41
- 239000011347 resin Substances 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 26
- 239000003990 capacitor Substances 0.000 claims description 25
- 238000007789 sealing Methods 0.000 claims description 20
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000006247 magnetic powder Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 81
- 239000000463 material Substances 0.000 description 14
- 239000012790 adhesive layer Substances 0.000 description 8
- 230000035699 permeability Effects 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- HEZMWWAKWCSUCB-PHDIDXHHSA-N (3R,4R)-3,4-dihydroxycyclohexa-1,5-diene-1-carboxylic acid Chemical compound O[C@@H]1C=CC(C(O)=O)=C[C@H]1O HEZMWWAKWCSUCB-PHDIDXHHSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/70—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
- H04B5/72—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes for local intradevice communication
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/3827—Portable transceivers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/40—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by components specially adapted for near-field transmission
- H04B5/43—Antennas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0075—Magnetic shielding materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Support Of Aerials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Details Of Aerials (AREA)
Description
20:筐体
21、23:金属部
30:メイン基板
40、40B、40C、40D:複合電子部品
41:ベース基板
42:表面実装部品
43、43B:樹脂封止層
44、44B、44F:金属シールド層
45、45B:磁性シールド層
46、47:キャパシタ
50、50A、50E、50H:アンテナ素子
51、51A、51E:フレキシブル基材
52、52A、52C、52D、52E:アンテナコイル導体
53、53H:配線導体
60、60A:接着層
70:RFIC
71:実装電子部品
321、322、330:ランド導体
440、450:スリット
451:天面
452:側面
460:接地用導体パターン
461:ビア導体
470:接着層
501、501A、501E:主体部
502、502H:配線部
Claims (12)
- 電子部品用電極を備えたメイン基板と、
ベース基板、該ベース基板に実装された表面実装部品、および、前記表面実装部品を覆う磁性シールド層を備え、前記電子部品用電極に実装された複合電子部品と、
フレキシブル基材、および、該フレキシブル基材に設けられたアンテナコイル導体を有するアンテナ素子と、を備え、
前記アンテナ素子は、前記磁性シールド層を前記アンテナコイル導体の磁性体コアとするように、前記複合電子部品の前記磁性シールド層上に配置されており、
前記複合電子部品は、
前記表面実装部品を覆う樹脂封止層を備え、
前記磁性シールド層は、前記樹脂封止層の天面側および側面側を覆い、
前記アンテナコイル導体は、
前記複合電子部品の天面よりも広い面積を有し、
前記複合電子部品の前記天面から側面に亘る形状で配置されている、
電子機器。 - 前記アンテナ素子は、前記アンテナコイル導体に接続する配線導体を備え、
前記メイン基板は、RFICチップが実装されるとともに、該RFICチップに接続するアンテナ用電極を備えており、
前記アンテナ素子の前記配線導体は、前記アンテナ用電極に接続されている、
請求項1に記載の電子機器。 - 前記複合電子部品は、
前記表面実装部品を覆う樹脂封止層を備え、
前記磁性シールド層は、
磁性セラミック焼結体である、
請求項1または請求項2に記載の電子機器。 - 前記磁性シールド層は、磁性粉を含有した樹脂である、
請求項1または請求項2に記載の電子機器。 - 前記複合電子部品は、複数であり、
前記複数の複合電子部品は、前記メイン基板に並んで実装されており、
前記アンテナコイル導体は、前記複数の複合電子部品の磁性シールド層に亘って配置されている、
請求項1乃至請求項4のいずれかに記載の電子機器。 - 前記ベース基板は、磁性体基板である、
請求項1乃至請求項5のいずれかに記載の電子機器。 - 前記アンテナコイル導体の一方端に接続され、該一方端を接地するコイル導体用キャパシタを、備える、
請求項1乃至請求項6のいずれかに記載の電子機器。 - 前記表面実装部品と前記磁性シールド層との間には、金属シールド層が配置されている、
請求項1乃至請求項7のいずれかに記載の電子機器。 - 前記金属シールド層は、スリットまたは複数の開口を有する、
請求項8に記載の電子機器。 - 前記金属シールド層を接地する金属シールド層用キャパシタを備える、
請求項8または請求項9に記載の電子機器。 - 前記金属シールド層用キャパシタは、前記ベース基板の内層導体パターンによって形成される、
請求項10に記載の電子機器。 - 請求項1乃至請求項11のいずれかに記載の電子機器の構成を備え、
前記アンテナ素子によってデータ通信を行う、通信機器。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017099430 | 2017-05-19 | ||
JP2017099430 | 2017-05-19 | ||
PCT/JP2018/016398 WO2018211915A1 (ja) | 2017-05-19 | 2018-04-23 | 電子機器および通信機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018211915A1 JPWO2018211915A1 (ja) | 2019-11-07 |
JP6642764B2 true JP6642764B2 (ja) | 2020-02-12 |
Family
ID=64273643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019519145A Active JP6642764B2 (ja) | 2017-05-19 | 2018-04-23 | 電子機器および通信機器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20200036086A1 (ja) |
JP (1) | JP6642764B2 (ja) |
WO (1) | WO2018211915A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113141742A (zh) * | 2021-04-16 | 2021-07-20 | 阳光电源股份有限公司 | 机箱及充电桩 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS567500A (en) * | 1979-06-28 | 1981-01-26 | Mitsubishi Electric Corp | Method of grounding shield case |
JP2011014659A (ja) * | 2009-06-30 | 2011-01-20 | Murata Mfg Co Ltd | 複合電子部品モジュール |
JP2011198999A (ja) * | 2010-03-19 | 2011-10-06 | Fujitsu Semiconductor Ltd | 半導体装置及びその製造方法 |
CN103026551B (zh) * | 2010-09-14 | 2015-03-25 | 株式会社村田制作所 | 读写用天线模块以及天线装置 |
JP2012235337A (ja) * | 2011-05-02 | 2012-11-29 | Auto Network Gijutsu Kenkyusho:Kk | アンテナ装置 |
JP5803550B2 (ja) * | 2011-10-14 | 2015-11-04 | ソニー株式会社 | アンテナ回路、通信装置、および通信方法 |
JP6402421B2 (ja) * | 2014-03-25 | 2018-10-10 | 北川工業株式会社 | 電磁波シールド部材、及び電磁波シールド構造 |
US9774087B2 (en) * | 2014-05-30 | 2017-09-26 | Apple Inc. | Wireless electronic device with magnetic shielding layer |
DE102014116537B4 (de) * | 2014-11-12 | 2024-05-29 | Infineon Technologies Ag | Funktionales Hautpflaster sowie System zum Überwachen eines Körpergesundheitsparameters |
-
2018
- 2018-04-23 JP JP2019519145A patent/JP6642764B2/ja active Active
- 2018-04-23 WO PCT/JP2018/016398 patent/WO2018211915A1/ja active Application Filing
-
2019
- 2019-10-01 US US16/589,447 patent/US20200036086A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2018211915A1 (ja) | 2018-11-22 |
US20200036086A1 (en) | 2020-01-30 |
JPWO2018211915A1 (ja) | 2019-11-07 |
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