JP6400904B2 - 硬化性樹脂組成物 - Google Patents

硬化性樹脂組成物 Download PDF

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Publication number
JP6400904B2
JP6400904B2 JP2013554125A JP2013554125A JP6400904B2 JP 6400904 B2 JP6400904 B2 JP 6400904B2 JP 2013554125 A JP2013554125 A JP 2013554125A JP 2013554125 A JP2013554125 A JP 2013554125A JP 6400904 B2 JP6400904 B2 JP 6400904B2
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Japan
Prior art keywords
group
silicone resin
sio
composition
zirconium
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JP2013554125A
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English (en)
Japanese (ja)
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JPWO2014021419A1 (ja
Inventor
吉仁 武井
吉仁 武井
丈章 齋木
丈章 齋木
元紀 田熊
元紀 田熊
奈央 佐藤
奈央 佐藤
つばさ 伊藤
つばさ 伊藤
愛美 金
愛美 金
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokohama Rubber Co Ltd
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Yokohama Rubber Co Ltd
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Publication of JPWO2014021419A1 publication Critical patent/JPWO2014021419A1/ja
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • C08L83/06Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/14Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80Siloxanes having aromatic substituents, e.g. phenyl side groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0091Complexes with metal-heteroatom-bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/05Alcohols; Metal alcoholates
    • C08K5/057Metal alcoholates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)
JP2013554125A 2012-08-03 2013-08-01 硬化性樹脂組成物 Active JP6400904B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012173252 2012-08-03
JP2012173252 2012-08-03
PCT/JP2013/070875 WO2014021419A1 (ja) 2012-08-03 2013-08-01 硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2014021419A1 JPWO2014021419A1 (ja) 2016-07-21
JP6400904B2 true JP6400904B2 (ja) 2018-10-03

Family

ID=50028086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013554125A Active JP6400904B2 (ja) 2012-08-03 2013-08-01 硬化性樹脂組成物

Country Status (4)

Country Link
JP (1) JP6400904B2 (zh)
CN (1) CN104411771B (zh)
TW (1) TWI596160B (zh)
WO (1) WO2014021419A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109075238B (zh) 2016-04-18 2021-10-12 奥斯兰姆奥普托半导体有限责任公司 制造光电子部件的方法和光电子部件
KR102363592B1 (ko) * 2016-07-19 2022-02-16 니치아 카가쿠 고교 가부시키가이샤 경화성 수지 조성물, 그의 경화물 및 반도체 장치
CN107841141A (zh) * 2016-09-21 2018-03-27 王志明 硬化性混合硅氧烷树脂组合物、其硬化物及其应用
CN115612448B (zh) * 2022-12-19 2023-08-25 北京康美特科技股份有限公司 用于微型led元件的有机硅封装胶及其封装方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005162859A (ja) * 2003-12-02 2005-06-23 Dow Corning Toray Silicone Co Ltd 付加反応硬化型オルガノポリシロキサン樹脂組成物および光学部材
JP4733933B2 (ja) * 2004-06-18 2011-07-27 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物
JP5114971B2 (ja) * 2007-02-23 2013-01-09 横浜ゴム株式会社 発光素子用封止材組成物、その硬化物および発光素子封止体
JP5149022B2 (ja) * 2008-01-25 2013-02-20 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 光半導体封止用シリコーン組成物及びそれを用いた光半導体装置
JP5555989B2 (ja) * 2008-08-08 2014-07-23 横浜ゴム株式会社 シリコーン樹脂組成物、これを用いるシリコーン樹脂および光半導体素子封止体
JP4877381B2 (ja) * 2008-12-16 2012-02-15 横浜ゴム株式会社 シラノール縮合触媒、加熱硬化性光半導体封止用シリコーン樹脂組成物およびこれを用いる光半導体封止体
JP5526823B2 (ja) * 2009-02-24 2014-06-18 信越化学工業株式会社 シリコーン樹脂で封止された光半導体装置
JP4788837B2 (ja) * 2010-01-26 2011-10-05 横浜ゴム株式会社 シリコーン樹脂組成物およびその使用方法、シリコーン樹脂、シリコーン樹脂含有構造体、ならびに光半導体素子封止体
JP2012074416A (ja) * 2010-09-27 2012-04-12 Sekisui Chem Co Ltd 光半導体装置用ダイボンド材及びそれを用いた光半導体装置
JP2012121992A (ja) * 2010-12-08 2012-06-28 Yokohama Rubber Co Ltd:The 硬化性樹脂組成物

Also Published As

Publication number Publication date
CN104411771B (zh) 2017-02-22
TW201412882A (zh) 2014-04-01
JPWO2014021419A1 (ja) 2016-07-21
WO2014021419A1 (ja) 2014-02-06
TWI596160B (zh) 2017-08-21
CN104411771A (zh) 2015-03-11

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