JP6392683B2 - 凹部を充填する方法及び処理装置 - Google Patents
凹部を充填する方法及び処理装置 Download PDFInfo
- Publication number
- JP6392683B2 JP6392683B2 JP2015029734A JP2015029734A JP6392683B2 JP 6392683 B2 JP6392683 B2 JP 6392683B2 JP 2015029734 A JP2015029734 A JP 2015029734A JP 2015029734 A JP2015029734 A JP 2015029734A JP 6392683 B2 JP6392683 B2 JP 6392683B2
- Authority
- JP
- Japan
- Prior art keywords
- gas
- thin film
- container
- epitaxial region
- control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 98
- 238000012545 processing Methods 0.000 title description 31
- 239000010409 thin film Substances 0.000 claims description 146
- 239000004065 semiconductor Substances 0.000 claims description 101
- 239000012535 impurity Substances 0.000 claims description 82
- 238000005530 etching Methods 0.000 claims description 79
- 239000000463 material Substances 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 52
- 239000010408 film Substances 0.000 claims description 51
- 239000013078 crystal Substances 0.000 claims description 16
- 238000000137 annealing Methods 0.000 claims description 15
- 239000012808 vapor phase Substances 0.000 claims description 12
- 239000007789 gas Substances 0.000 description 218
- 230000008569 process Effects 0.000 description 54
- 235000012431 wafers Nutrition 0.000 description 33
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 229910052710 silicon Inorganic materials 0.000 description 14
- 239000010703 silicon Substances 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 12
- 238000010926 purge Methods 0.000 description 9
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 8
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 8
- 239000000654 additive Substances 0.000 description 8
- 230000000996 additive effect Effects 0.000 description 8
- 229910000078 germane Inorganic materials 0.000 description 8
- 229910052732 germanium Inorganic materials 0.000 description 8
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 8
- 239000011261 inert gas Substances 0.000 description 8
- 230000005012 migration Effects 0.000 description 7
- 238000013508 migration Methods 0.000 description 7
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 7
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 7
- 229910021417 amorphous silicon Inorganic materials 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 239000007790 solid phase Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000008186 active pharmaceutical agent Substances 0.000 description 3
- RBFQJDQYXXHULB-UHFFFAOYSA-N arsane Chemical compound [AsH3] RBFQJDQYXXHULB-UHFFFAOYSA-N 0.000 description 3
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 3
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- QUZPNFFHZPRKJD-UHFFFAOYSA-N germane Chemical compound [GeH4] QUZPNFFHZPRKJD-UHFFFAOYSA-N 0.000 description 1
- 229910052986 germanium hydride Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B1/00—Single-crystal growth directly from the solid state
- C30B1/02—Single-crystal growth directly from the solid state by thermal treatment, e.g. strain annealing
- C30B1/023—Single-crystal growth directly from the solid state by thermal treatment, e.g. strain annealing from solids with amorphous structure
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/04—Pattern deposit, e.g. by using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02694—Controlling the interface between substrate and epitaxial layer, e.g. by ion implantation followed by annealing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2251—Diffusion into or out of group IV semiconductors
- H01L21/2252—Diffusion into or out of group IV semiconductors using predeposition of impurities into the semiconductor surface, e.g. from a gaseous phase
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
- H01L21/3247—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering for altering the shape, e.g. smoothing the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Recrystallisation Techniques (AREA)
- Chemical Vapour Deposition (AREA)
Description
Claims (3)
- 被処理体の凹部を充填する方法であって、該被処理体は、半導体基板及び該半導体基板上に設けられた絶縁膜を備え、前記凹部は、前記絶縁膜を貫通して前記半導体基板の内部まで延在しており、該方法は、
前記凹部を画成する壁面に沿って、実質的に不純物を含まない半導体材料の第1の薄膜を形成する工程と、
前記被処理体を容器の内側においてアニールすることにより、前記凹部の底に向けて移動させた前記第1の薄膜の半導体材料から前記半導体基板の結晶に応じたエピタキシャル領域を形成する工程と、
前記凹部の前記壁面に残留している前記第1の薄膜をエッチングする工程と、
前記エピタキシャル領域を気相ドーピングする工程と、
前記凹部を画成する壁面に沿って、実質的に不純物を含まない半導体材料の第2の薄膜を形成する工程と、
前記被処理体を前記容器の内側においてアニールすることにより、前記凹部の底に向けて移動させた前記第2の薄膜の半導体材料からエピタキシャル領域を更に形成する工程と、
前記凹部の前記壁面に残留している前記第2の薄膜、及び前記エピタキシャル領域を気相ドーピングする工程と、
を備える、方法。 - 前記エピタキシャル領域を形成する前記工程は、第1の圧力に設定された前記容器の内側で前記被処理体をアニールし、
前記エピタキシャル領域を更に形成する前記工程は、第2の圧力に設定された前記容器の内側で前記被処理体をアニールし、
前記第1の圧力及び前記第2の圧力は、1.3×102Pa以下の圧力である、請求項1に記載の方法。 - 前記第2の薄膜及び前記エピタキシャル領域を気相ドーピングする前記工程の後に、前記凹部の前記壁面に残留している前記第2の薄膜をエッチングする工程を更に備える、請求項1又は請求項2に記載の方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015029734A JP6392683B2 (ja) | 2015-02-18 | 2015-02-18 | 凹部を充填する方法及び処理装置 |
US15/018,949 US9574284B2 (en) | 2015-02-18 | 2016-02-09 | Depression filling method and processing apparatus |
KR1020160017267A KR101923766B1 (ko) | 2015-02-18 | 2016-02-15 | 오목부를 충전하는 방법 및 처리 장치 |
TW105104371A TWI624858B (zh) | 2015-02-18 | 2016-02-16 | 凹部之充填方法及處理裝置 |
CN201610090996.9A CN105895506B (zh) | 2015-02-18 | 2016-02-18 | 填充凹部的方法以及处理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015029734A JP6392683B2 (ja) | 2015-02-18 | 2015-02-18 | 凹部を充填する方法及び処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016150879A JP2016150879A (ja) | 2016-08-22 |
JP6392683B2 true JP6392683B2 (ja) | 2018-09-19 |
Family
ID=56621479
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015029734A Active JP6392683B2 (ja) | 2015-02-18 | 2015-02-18 | 凹部を充填する方法及び処理装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9574284B2 (ja) |
JP (1) | JP6392683B2 (ja) |
KR (1) | KR101923766B1 (ja) |
CN (1) | CN105895506B (ja) |
TW (1) | TWI624858B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10504747B2 (en) | 2017-09-29 | 2019-12-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bending |
JP7319288B2 (ja) * | 2018-03-09 | 2023-08-01 | アプライド マテリアルズ インコーポレイテッド | Pecvdによるsiギャップ充填の方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58116722A (ja) * | 1981-12-29 | 1983-07-12 | Fujitsu Ltd | 半導体装置の製造方法 |
JPS6477924A (en) * | 1987-09-18 | 1989-03-23 | Fujitsu Ltd | Manufacture of semiconductor device |
JP2706469B2 (ja) * | 1988-06-01 | 1998-01-28 | 松下電器産業株式会社 | 半導体装置の製造方法 |
US5888876A (en) * | 1996-04-09 | 1999-03-30 | Kabushiki Kaisha Toshiba | Deep trench filling method using silicon film deposition and silicon migration |
JPH1131659A (ja) * | 1997-07-10 | 1999-02-02 | Toshiba Corp | 半導体装置の製造方法 |
JP3485081B2 (ja) * | 1999-10-28 | 2004-01-13 | 株式会社デンソー | 半導体基板の製造方法 |
US6890833B2 (en) * | 2003-03-26 | 2005-05-10 | Infineon Technologies Ag | Trench isolation employing a doped oxide trench fill |
JP2005116952A (ja) * | 2003-10-10 | 2005-04-28 | Toshiba Corp | トレンチキャパシタ及びその製造方法 |
JP2008091645A (ja) * | 2006-10-02 | 2008-04-17 | Tokyo Electron Ltd | 半導体製造装置、半導体装置の製造方法及び記憶媒体 |
JP2011091242A (ja) | 2009-10-23 | 2011-05-06 | Elpida Memory Inc | 半導体装置の製造方法 |
JP5864360B2 (ja) * | 2011-06-30 | 2016-02-17 | 東京エレクトロン株式会社 | シリコン膜の形成方法およびその形成装置 |
JP6059085B2 (ja) * | 2013-05-27 | 2017-01-11 | 東京エレクトロン株式会社 | トレンチを充填する方法及び処理装置 |
JP6150724B2 (ja) | 2013-12-27 | 2017-06-21 | 東京エレクトロン株式会社 | 凹部を充填する方法 |
-
2015
- 2015-02-18 JP JP2015029734A patent/JP6392683B2/ja active Active
-
2016
- 2016-02-09 US US15/018,949 patent/US9574284B2/en active Active
- 2016-02-15 KR KR1020160017267A patent/KR101923766B1/ko active IP Right Grant
- 2016-02-16 TW TW105104371A patent/TWI624858B/zh active
- 2016-02-18 CN CN201610090996.9A patent/CN105895506B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
TW201707050A (zh) | 2017-02-16 |
TWI624858B (zh) | 2018-05-21 |
JP2016150879A (ja) | 2016-08-22 |
KR101923766B1 (ko) | 2018-11-29 |
KR20160101864A (ko) | 2016-08-26 |
CN105895506A (zh) | 2016-08-24 |
US9574284B2 (en) | 2017-02-21 |
US20160240379A1 (en) | 2016-08-18 |
CN105895506B (zh) | 2020-01-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6150724B2 (ja) | 凹部を充填する方法 | |
JP6059085B2 (ja) | トレンチを充填する方法及び処理装置 | |
JP6174943B2 (ja) | 凹部を充填する方法 | |
JP5864360B2 (ja) | シリコン膜の形成方法およびその形成装置 | |
JP6367734B2 (ja) | 凹部を充填する方法及び処理装置 | |
JP5692763B2 (ja) | シリコン膜の形成方法およびその形成装置 | |
JP2015032712A (ja) | シリコン膜の形成方法およびその形成装置 | |
JP6392683B2 (ja) | 凹部を充填する方法及び処理装置 | |
JP6397307B2 (ja) | 凹部を充填する方法 | |
JP2016092051A (ja) | 凹部を充填する方法及び処理装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170807 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180712 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180731 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180803 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180821 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180823 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6392683 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |