JP6388536B2 - 超音波振動子アセンブリ及びその製造方法 - Google Patents

超音波振動子アセンブリ及びその製造方法 Download PDF

Info

Publication number
JP6388536B2
JP6388536B2 JP2014518018A JP2014518018A JP6388536B2 JP 6388536 B2 JP6388536 B2 JP 6388536B2 JP 2014518018 A JP2014518018 A JP 2014518018A JP 2014518018 A JP2014518018 A JP 2014518018A JP 6388536 B2 JP6388536 B2 JP 6388536B2
Authority
JP
Japan
Prior art keywords
layer
conductive
piezoelectric
electrode layer
ultrasonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014518018A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014523689A (ja
JP2014523689A5 (enExample
Inventor
ヴォイテク スドル
ヴォイテク スドル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV filed Critical Koninklijke Philips NV
Publication of JP2014523689A publication Critical patent/JP2014523689A/ja
Publication of JP2014523689A5 publication Critical patent/JP2014523689A5/ja
Application granted granted Critical
Publication of JP6388536B2 publication Critical patent/JP6388536B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Biomedical Technology (AREA)
  • Molecular Biology (AREA)
  • Biophysics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Gynecology & Obstetrics (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Physics & Mathematics (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Manufacturing & Machinery (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
JP2014518018A 2011-06-27 2012-06-26 超音波振動子アセンブリ及びその製造方法 Active JP6388536B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161501307P 2011-06-27 2011-06-27
US61/501,307 2011-06-27
PCT/IB2012/053216 WO2013001448A1 (en) 2011-06-27 2012-06-26 Ultrasound transducer assembly and method of manufacturing the same

Publications (3)

Publication Number Publication Date
JP2014523689A JP2014523689A (ja) 2014-09-11
JP2014523689A5 JP2014523689A5 (enExample) 2015-08-13
JP6388536B2 true JP6388536B2 (ja) 2018-09-12

Family

ID=46704971

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014518018A Active JP6388536B2 (ja) 2011-06-27 2012-06-26 超音波振動子アセンブリ及びその製造方法

Country Status (5)

Country Link
US (1) US9293690B2 (enExample)
EP (1) EP2723506B1 (enExample)
JP (1) JP6388536B2 (enExample)
CN (1) CN103635264B (enExample)
WO (1) WO2013001448A1 (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2331571B1 (en) 2008-09-18 2015-08-26 Northwestern University Nmda receptor modulators and uses thereof
DE102012206875B4 (de) * 2012-04-25 2021-01-28 Robert Bosch Gmbh Verfahren zum Herstellen eines hybrid integrierten Bauteils und entsprechendes hybrid integriertes Bauteil
WO2014120783A1 (en) 2013-01-29 2014-08-07 Naurex, Inc. Spiro-lactam nmda receptor modulators and uses thereof
BR112015018095A2 (pt) 2013-01-29 2017-07-18 Naurex Inc moduladores de receptor nmda de espiro-lactama e usos dos mesmos
CN105408336B (zh) 2013-01-29 2018-06-26 阿普廷伊克斯股份有限公司 螺-内酰胺nmda受体调节剂及其用途
ES2618421T3 (es) 2013-01-29 2017-06-21 Aptinyx Inc. Moduladores espiro-lactama del receptor NMDA y usos de los mismos
AU2014212487C1 (en) 2013-01-29 2018-10-25 Aptinyx, Inc. Spiro-lactam NMDA receptor modulators and uses thereof
WO2015063702A2 (en) * 2013-11-04 2015-05-07 Koninklijke Philips N.V. High volume manufacture of single element ultrasound transducers
US11231491B2 (en) * 2013-11-11 2022-01-25 Koninklijke Philips N.V. Robust ultrasound transducer probes having protected integrated circuit interconnects
CN104916773B (zh) * 2014-03-14 2017-10-20 中国科学院苏州纳米技术与纳米仿生研究所 电致变形薄膜阵列、其制备方法及应用
KR102406927B1 (ko) * 2014-12-02 2022-06-10 삼성메디슨 주식회사 초음파 프로브 및 그 제조방법
EP3028772B1 (en) * 2014-12-02 2022-12-28 Samsung Medison Co., Ltd. Ultrasonic probe and method of manufacturing the same
JP6510290B2 (ja) * 2015-03-30 2019-05-08 キヤノンメディカルシステムズ株式会社 超音波プローブ及び超音波診断装置
EP3316791B1 (en) 2015-07-02 2020-08-05 Koninklijke Philips N.V. Multi-mode capacitive micromachined ultrasound transducer and associated devices and systems
AU2017267708B2 (en) 2016-05-19 2020-02-20 Aptinyx Inc. Spiro-lactam NMDA receptor modulators and uses thereof
WO2017201285A1 (en) 2016-05-19 2017-11-23 Aptinyx Inc. Spiro-lactam nmda receptor modulators and uses thereof
US10497856B2 (en) * 2016-06-20 2019-12-03 Butterfly Network, Inc. Electrical contact arrangement for microfabricated ultrasonic transducer
JP6712917B2 (ja) * 2016-07-14 2020-06-24 株式会社日立製作所 半導体センサチップアレイ、および超音波診断装置
AU2017306158B2 (en) 2016-08-01 2021-10-14 Aptinyx Inc. Spiro-lactam and bis-spiro-lactam NMDA receptor modulators and uses thereof
ES2972533T3 (es) 2016-08-01 2024-06-13 Tenacia Biotechnology Hong Kong Co Ltd Moduladores del receptor de NMDA a base de espirolactama, y sus usos
WO2018026798A1 (en) 2016-08-01 2018-02-08 Aptinyx Inc. Spiro-lactam nmda modulators and methods of using same
ES2973283T3 (es) 2016-08-01 2024-06-19 Tenacia Biotechnology Hong Kong Co Ltd Moduladores de receptores de NMDA espirolactámicos y usos de los mismos
EA201990424A1 (ru) 2016-08-01 2019-08-30 Аптиникс Инк. Спиролактамовые модуляторы nmda-рецептора и их применение
EP3472430A4 (en) 2016-09-27 2020-01-08 Halliburton Energy Services, Inc. MULTIDIRECTIONAL ULTRASONIC TRANSDUCER FOR DOWNHOLE MEASUREMENTS
WO2018065405A1 (en) * 2016-10-03 2018-04-12 Koninklijke Philips N.V. Transducer arrays with air kerfs for intraluminal imaging
GB2555835B (en) * 2016-11-11 2018-11-28 Novosound Ltd Ultrasound transducer
KR102761196B1 (ko) 2018-01-31 2025-02-03 테나시아 바이오테크놀로지 (홍콩) 코., 리미티드 스피로-락탐 nmda 수용체 조정제 및 그의 용도
US11806191B2 (en) 2018-05-21 2023-11-07 General Electric Company Phased array transducers and wafer scale manufacturing for making the same
KR20190143179A (ko) * 2018-06-20 2019-12-30 삼성메디슨 주식회사 초음파프로브 및 그 제조방법
US12012413B2 (en) 2019-11-11 2024-06-18 Tenacia Biotechnology (Hong Kong) Co., Limited Methods of treating painful diabetic peripheral neuropathy
WO2021099618A1 (en) 2019-11-22 2021-05-27 Novioscan B.V. Robust, simple, and efficiently manufacturable transducer array
WO2023036742A1 (en) * 2021-09-09 2023-03-16 Koninklijke Philips N.V. Intraluminal ultrasound imaging assembly with electrical connection for multi-row transducer array

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2702309B1 (fr) * 1993-03-05 1995-04-07 Thomson Csf Procédé de fabrication d'une sonde acoustique multiéléments, notamment d'une sonde d'échographie.
US5511550A (en) 1994-10-14 1996-04-30 Parallel Design, Inc. Ultrasonic transducer array with apodized elevation focus
US5793149A (en) * 1995-07-26 1998-08-11 Francotyp-Postalia Ag & Co. Arrangement for plate-shaped piezoactuators and method for the manufacture thereof
US6726631B2 (en) * 2000-08-08 2004-04-27 Ge Parallel Designs, Inc. Frequency and amplitude apodization of transducers
JP3697200B2 (ja) * 2001-11-07 2005-09-21 アロカ株式会社 超音波探触子
DE60313900T2 (de) * 2002-03-12 2008-01-17 Hamamatsu Photonics K.K., Hamamatsu Methode zur Trennung von Substraten
TWI520269B (zh) * 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
CN100583234C (zh) * 2003-06-09 2010-01-20 皇家飞利浦电子股份有限公司 用于设计具有声激励集成电子器件的超声换能器的方法
US7388319B2 (en) * 2004-10-15 2008-06-17 Fujifilm Dimatix, Inc. Forming piezoelectric actuators
JP2007158467A (ja) * 2005-11-30 2007-06-21 Toshiba Corp 超音波プローブ及びその製造方法
KR20130014619A (ko) 2006-11-03 2013-02-07 리써치 트라이앵글 인스티튜트 굴곡 모드 압전 트랜스듀서를 사용하는 보강된 초음파 촬영 프로브
US7892176B2 (en) 2007-05-02 2011-02-22 General Electric Company Monitoring or imaging system with interconnect structure for large area sensor array
US20080315331A1 (en) 2007-06-25 2008-12-25 Robert Gideon Wodnicki Ultrasound system with through via interconnect structure

Also Published As

Publication number Publication date
JP2014523689A (ja) 2014-09-11
US20140139072A1 (en) 2014-05-22
CN103635264B (zh) 2016-06-01
EP2723506B1 (en) 2017-02-15
CN103635264A (zh) 2014-03-12
WO2013001448A1 (en) 2013-01-03
US9293690B2 (en) 2016-03-22
EP2723506A1 (en) 2014-04-30

Similar Documents

Publication Publication Date Title
JP6388536B2 (ja) 超音波振動子アセンブリ及びその製造方法
JP5591549B2 (ja) 超音波トランスデューサ、超音波プローブ、超音波トランスデューサの製造方法
CN1327976C (zh) 用于将声学元件装接到集成电路上的系统
US20080315331A1 (en) Ultrasound system with through via interconnect structure
US7892176B2 (en) Monitoring or imaging system with interconnect structure for large area sensor array
JP4992995B2 (ja) アレイ型超音波振動子
CN105596027B (zh) 基于三维超声成像的二维阵列超声换能器及其制备方法
CN113948505A (zh) 用于多维换能器阵列的直接阵列上芯片
JP2016537883A (ja) 保護された集積回路相互接続を有するロバストな超音波トランスデューサプローブ
CN104663006A (zh) 超声内窥镜及其制造方法
JP3612312B2 (ja) 超音波探触子及びその製造方法
JP7049323B2 (ja) 超音波アレイ用の冗長な接続点を有するフレキシブル回路
US20240326093A1 (en) Ultrasound probe
JP2002027594A (ja) 超音波探触子およびその製造方法
JP4304112B2 (ja) 超音波探触子の製造方法
US20240215951A1 (en) Connection for a multi-dimensional matrix transducer
US11938514B2 (en) Curved shape piezoelectric transducer and method for manufacturing the same
JP5349141B2 (ja) 超音波プローブ
JP6876645B2 (ja) 超音波プローブ及びその製造方法
US11756520B2 (en) 2D ultrasound transducer array and methods of making the same
WO2025200223A1 (zh) 一种超声换能器及其的制备方法
JP2010130592A (ja) 超音波探触子及び超音波探触子の作製方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150624

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150624

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20160307

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160311

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160603

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20161028

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170224

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20170303

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20170414

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180508

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180814

R150 Certificate of patent or registration of utility model

Ref document number: 6388536

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250