CN103635264B - 超声换能组件及其制造方法 - Google Patents
超声换能组件及其制造方法 Download PDFInfo
- Publication number
- CN103635264B CN103635264B CN201280031923.2A CN201280031923A CN103635264B CN 103635264 B CN103635264 B CN 103635264B CN 201280031923 A CN201280031923 A CN 201280031923A CN 103635264 B CN103635264 B CN 103635264B
- Authority
- CN
- China
- Prior art keywords
- layer
- ultrasound transducer
- electrode layer
- transducer element
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
- A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Landscapes
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mechanical Engineering (AREA)
- Biomedical Technology (AREA)
- Molecular Biology (AREA)
- Biophysics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Pathology (AREA)
- Radiology & Medical Imaging (AREA)
- Gynecology & Obstetrics (AREA)
- Heart & Thoracic Surgery (AREA)
- Medical Informatics (AREA)
- Physics & Mathematics (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Manufacturing & Machinery (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161501307P | 2011-06-27 | 2011-06-27 | |
| US61/501,307 | 2011-06-27 | ||
| PCT/IB2012/053216 WO2013001448A1 (en) | 2011-06-27 | 2012-06-26 | Ultrasound transducer assembly and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103635264A CN103635264A (zh) | 2014-03-12 |
| CN103635264B true CN103635264B (zh) | 2016-06-01 |
Family
ID=46704971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280031923.2A Active CN103635264B (zh) | 2011-06-27 | 2012-06-26 | 超声换能组件及其制造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9293690B2 (enExample) |
| EP (1) | EP2723506B1 (enExample) |
| JP (1) | JP6388536B2 (enExample) |
| CN (1) | CN103635264B (enExample) |
| WO (1) | WO2013001448A1 (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2331571B1 (en) | 2008-09-18 | 2015-08-26 | Northwestern University | Nmda receptor modulators and uses thereof |
| DE102012206875B4 (de) * | 2012-04-25 | 2021-01-28 | Robert Bosch Gmbh | Verfahren zum Herstellen eines hybrid integrierten Bauteils und entsprechendes hybrid integriertes Bauteil |
| WO2014120783A1 (en) | 2013-01-29 | 2014-08-07 | Naurex, Inc. | Spiro-lactam nmda receptor modulators and uses thereof |
| BR112015018095A2 (pt) | 2013-01-29 | 2017-07-18 | Naurex Inc | moduladores de receptor nmda de espiro-lactama e usos dos mesmos |
| CN105408336B (zh) | 2013-01-29 | 2018-06-26 | 阿普廷伊克斯股份有限公司 | 螺-内酰胺nmda受体调节剂及其用途 |
| ES2618421T3 (es) | 2013-01-29 | 2017-06-21 | Aptinyx Inc. | Moduladores espiro-lactama del receptor NMDA y usos de los mismos |
| AU2014212487C1 (en) | 2013-01-29 | 2018-10-25 | Aptinyx, Inc. | Spiro-lactam NMDA receptor modulators and uses thereof |
| WO2015063702A2 (en) * | 2013-11-04 | 2015-05-07 | Koninklijke Philips N.V. | High volume manufacture of single element ultrasound transducers |
| US11231491B2 (en) * | 2013-11-11 | 2022-01-25 | Koninklijke Philips N.V. | Robust ultrasound transducer probes having protected integrated circuit interconnects |
| CN104916773B (zh) * | 2014-03-14 | 2017-10-20 | 中国科学院苏州纳米技术与纳米仿生研究所 | 电致变形薄膜阵列、其制备方法及应用 |
| KR102406927B1 (ko) * | 2014-12-02 | 2022-06-10 | 삼성메디슨 주식회사 | 초음파 프로브 및 그 제조방법 |
| EP3028772B1 (en) * | 2014-12-02 | 2022-12-28 | Samsung Medison Co., Ltd. | Ultrasonic probe and method of manufacturing the same |
| JP6510290B2 (ja) * | 2015-03-30 | 2019-05-08 | キヤノンメディカルシステムズ株式会社 | 超音波プローブ及び超音波診断装置 |
| EP3316791B1 (en) | 2015-07-02 | 2020-08-05 | Koninklijke Philips N.V. | Multi-mode capacitive micromachined ultrasound transducer and associated devices and systems |
| AU2017267708B2 (en) | 2016-05-19 | 2020-02-20 | Aptinyx Inc. | Spiro-lactam NMDA receptor modulators and uses thereof |
| WO2017201285A1 (en) | 2016-05-19 | 2017-11-23 | Aptinyx Inc. | Spiro-lactam nmda receptor modulators and uses thereof |
| US10497856B2 (en) * | 2016-06-20 | 2019-12-03 | Butterfly Network, Inc. | Electrical contact arrangement for microfabricated ultrasonic transducer |
| JP6712917B2 (ja) * | 2016-07-14 | 2020-06-24 | 株式会社日立製作所 | 半導体センサチップアレイ、および超音波診断装置 |
| AU2017306158B2 (en) | 2016-08-01 | 2021-10-14 | Aptinyx Inc. | Spiro-lactam and bis-spiro-lactam NMDA receptor modulators and uses thereof |
| ES2972533T3 (es) | 2016-08-01 | 2024-06-13 | Tenacia Biotechnology Hong Kong Co Ltd | Moduladores del receptor de NMDA a base de espirolactama, y sus usos |
| WO2018026798A1 (en) | 2016-08-01 | 2018-02-08 | Aptinyx Inc. | Spiro-lactam nmda modulators and methods of using same |
| ES2973283T3 (es) | 2016-08-01 | 2024-06-19 | Tenacia Biotechnology Hong Kong Co Ltd | Moduladores de receptores de NMDA espirolactámicos y usos de los mismos |
| EA201990424A1 (ru) | 2016-08-01 | 2019-08-30 | Аптиникс Инк. | Спиролактамовые модуляторы nmda-рецептора и их применение |
| EP3472430A4 (en) | 2016-09-27 | 2020-01-08 | Halliburton Energy Services, Inc. | MULTIDIRECTIONAL ULTRASONIC TRANSDUCER FOR DOWNHOLE MEASUREMENTS |
| WO2018065405A1 (en) * | 2016-10-03 | 2018-04-12 | Koninklijke Philips N.V. | Transducer arrays with air kerfs for intraluminal imaging |
| GB2555835B (en) * | 2016-11-11 | 2018-11-28 | Novosound Ltd | Ultrasound transducer |
| KR102761196B1 (ko) | 2018-01-31 | 2025-02-03 | 테나시아 바이오테크놀로지 (홍콩) 코., 리미티드 | 스피로-락탐 nmda 수용체 조정제 및 그의 용도 |
| US11806191B2 (en) | 2018-05-21 | 2023-11-07 | General Electric Company | Phased array transducers and wafer scale manufacturing for making the same |
| KR20190143179A (ko) * | 2018-06-20 | 2019-12-30 | 삼성메디슨 주식회사 | 초음파프로브 및 그 제조방법 |
| US12012413B2 (en) | 2019-11-11 | 2024-06-18 | Tenacia Biotechnology (Hong Kong) Co., Limited | Methods of treating painful diabetic peripheral neuropathy |
| WO2021099618A1 (en) | 2019-11-22 | 2021-05-27 | Novioscan B.V. | Robust, simple, and efficiently manufacturable transducer array |
| WO2023036742A1 (en) * | 2021-09-09 | 2023-03-16 | Koninklijke Philips N.V. | Intraluminal ultrasound imaging assembly with electrical connection for multi-row transducer array |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5774960A (en) * | 1993-03-05 | 1998-07-07 | Thomson-Csf | Process for manufacturing a multi-element acoustic probe, especially an echograph probe |
| US5793149A (en) * | 1995-07-26 | 1998-08-11 | Francotyp-Postalia Ag & Co. | Arrangement for plate-shaped piezoactuators and method for the manufacture thereof |
| EP0785826B1 (en) * | 1994-10-14 | 1999-02-03 | Parallel Design, Inc. | Ultrasonic transducer array with apodized elevation focus |
| CN101069295A (zh) * | 2004-10-15 | 2007-11-07 | 富士胶卷迪马蒂克斯股份有限公司 | 具有腔体和压电岛的微机电装置及形成具有压电换能器的装置的方法 |
| CN100398224C (zh) * | 2001-09-17 | 2008-07-02 | Ge帕拉莱尔设计公司 | 换能器的频率和振幅旁瓣缩减 |
| CN101662989A (zh) * | 2006-11-03 | 2010-03-03 | 研究三角协会 | 使用挠曲模式压电换能器的增强的超声成像探头 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3697200B2 (ja) * | 2001-11-07 | 2005-09-21 | アロカ株式会社 | 超音波探触子 |
| DE60313900T2 (de) * | 2002-03-12 | 2008-01-17 | Hamamatsu Photonics K.K., Hamamatsu | Methode zur Trennung von Substraten |
| TWI520269B (zh) * | 2002-12-03 | 2016-02-01 | 濱松赫德尼古斯股份有限公司 | Cutting method of semiconductor substrate |
| CN100583234C (zh) * | 2003-06-09 | 2010-01-20 | 皇家飞利浦电子股份有限公司 | 用于设计具有声激励集成电子器件的超声换能器的方法 |
| JP2007158467A (ja) * | 2005-11-30 | 2007-06-21 | Toshiba Corp | 超音波プローブ及びその製造方法 |
| US7892176B2 (en) | 2007-05-02 | 2011-02-22 | General Electric Company | Monitoring or imaging system with interconnect structure for large area sensor array |
| US20080315331A1 (en) | 2007-06-25 | 2008-12-25 | Robert Gideon Wodnicki | Ultrasound system with through via interconnect structure |
-
2012
- 2012-06-26 JP JP2014518018A patent/JP6388536B2/ja active Active
- 2012-06-26 US US14/125,958 patent/US9293690B2/en active Active
- 2012-06-26 EP EP12748535.7A patent/EP2723506B1/en active Active
- 2012-06-26 WO PCT/IB2012/053216 patent/WO2013001448A1/en not_active Ceased
- 2012-06-26 CN CN201280031923.2A patent/CN103635264B/zh active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5774960A (en) * | 1993-03-05 | 1998-07-07 | Thomson-Csf | Process for manufacturing a multi-element acoustic probe, especially an echograph probe |
| EP0785826B1 (en) * | 1994-10-14 | 1999-02-03 | Parallel Design, Inc. | Ultrasonic transducer array with apodized elevation focus |
| US5793149A (en) * | 1995-07-26 | 1998-08-11 | Francotyp-Postalia Ag & Co. | Arrangement for plate-shaped piezoactuators and method for the manufacture thereof |
| CN100398224C (zh) * | 2001-09-17 | 2008-07-02 | Ge帕拉莱尔设计公司 | 换能器的频率和振幅旁瓣缩减 |
| CN101069295A (zh) * | 2004-10-15 | 2007-11-07 | 富士胶卷迪马蒂克斯股份有限公司 | 具有腔体和压电岛的微机电装置及形成具有压电换能器的装置的方法 |
| CN101662989A (zh) * | 2006-11-03 | 2010-03-03 | 研究三角协会 | 使用挠曲模式压电换能器的增强的超声成像探头 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014523689A (ja) | 2014-09-11 |
| US20140139072A1 (en) | 2014-05-22 |
| EP2723506B1 (en) | 2017-02-15 |
| CN103635264A (zh) | 2014-03-12 |
| WO2013001448A1 (en) | 2013-01-03 |
| US9293690B2 (en) | 2016-03-22 |
| JP6388536B2 (ja) | 2018-09-12 |
| EP2723506A1 (en) | 2014-04-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103635264B (zh) | 超声换能组件及其制造方法 | |
| JP5591549B2 (ja) | 超音波トランスデューサ、超音波プローブ、超音波トランスデューサの製造方法 | |
| JP4969456B2 (ja) | マイクロビームフォーマ及び医用超音波システム用再配布相互接続 | |
| CN1327976C (zh) | 用于将声学元件装接到集成电路上的系统 | |
| RU2449418C2 (ru) | Межсоединение по методу перевернутого кристалла через сквозные отверстия в микросхеме | |
| US7892176B2 (en) | Monitoring or imaging system with interconnect structure for large area sensor array | |
| US20080315331A1 (en) | Ultrasound system with through via interconnect structure | |
| US7791252B2 (en) | Ultrasound probe assembly and method of fabrication | |
| JP4992995B2 (ja) | アレイ型超音波振動子 | |
| CN101237947A (zh) | 弯曲的二维阵列换能器 | |
| CN113948505A (zh) | 用于多维换能器阵列的直接阵列上芯片 | |
| JPH0723500A (ja) | 2次元アレイ超音波プローブ | |
| JP7049323B2 (ja) | 超音波アレイ用の冗長な接続点を有するフレキシブル回路 | |
| JP2011110111A (ja) | 超音波プローブ及び超音波プローブの製造方法 | |
| US11938514B2 (en) | Curved shape piezoelectric transducer and method for manufacturing the same | |
| US20240215951A1 (en) | Connection for a multi-dimensional matrix transducer | |
| JP6876645B2 (ja) | 超音波プローブ及びその製造方法 | |
| JP2000214144A (ja) | 2次元配列型超音波探触子 | |
| US11756520B2 (en) | 2D ultrasound transducer array and methods of making the same | |
| JP2010130592A (ja) | 超音波探触子及び超音波探触子の作製方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |