CN103635264B - 超声换能组件及其制造方法 - Google Patents

超声换能组件及其制造方法 Download PDF

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Publication number
CN103635264B
CN103635264B CN201280031923.2A CN201280031923A CN103635264B CN 103635264 B CN103635264 B CN 103635264B CN 201280031923 A CN201280031923 A CN 201280031923A CN 103635264 B CN103635264 B CN 103635264B
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CN
China
Prior art keywords
layer
ultrasound transducer
electrode layer
transducer element
piezoelectric
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Active
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CN201280031923.2A
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English (en)
Chinese (zh)
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CN103635264A (zh
Inventor
W·苏多尔
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Koninklijke Philips NV
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Koninklijke Philips NV
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Publication of CN103635264A publication Critical patent/CN103635264A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Surgery (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Physics & Mathematics (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Gynecology & Obstetrics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
CN201280031923.2A 2011-06-27 2012-06-26 超声换能组件及其制造方法 Active CN103635264B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161501307P 2011-06-27 2011-06-27
US61/501,307 2011-06-27
PCT/IB2012/053216 WO2013001448A1 (en) 2011-06-27 2012-06-26 Ultrasound transducer assembly and method of manufacturing the same

Publications (2)

Publication Number Publication Date
CN103635264A CN103635264A (zh) 2014-03-12
CN103635264B true CN103635264B (zh) 2016-06-01

Family

ID=46704971

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280031923.2A Active CN103635264B (zh) 2011-06-27 2012-06-26 超声换能组件及其制造方法

Country Status (5)

Country Link
US (1) US9293690B2 (enExample)
EP (1) EP2723506B1 (enExample)
JP (1) JP6388536B2 (enExample)
CN (1) CN103635264B (enExample)
WO (1) WO2013001448A1 (enExample)

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MX2011003015A (es) 2008-09-18 2011-11-18 Univ Northwestern Moduladores del receptor de n-metil-d-aspartato, y usos de los mismos.
DE102012206875B4 (de) * 2012-04-25 2021-01-28 Robert Bosch Gmbh Verfahren zum Herstellen eines hybrid integrierten Bauteils und entsprechendes hybrid integriertes Bauteil
CA2898861C (en) 2013-01-29 2021-07-20 Naurex, Inc. Spiro-lactam nmda receptor modulators and uses thereof
WO2014120784A1 (en) 2013-01-29 2014-08-07 Naurex, Inc. Spiro-lactam nmda receptor modulators and uses thereof
SG11201505937SA (en) 2013-01-29 2015-09-29 Naurex Inc Spiro-lactam nmda receptor modulators and uses thereof
CN105308049A (zh) 2013-01-29 2016-02-03 阿普廷伊克斯股份有限公司 螺-内酰胺nmda受体调节剂及其用途
JP6419087B2 (ja) 2013-01-29 2018-11-07 アプティニックス インコーポレイテッド スピロラクタム系nmda受容体モジュレーターおよびその使用
JP6542769B2 (ja) * 2013-11-04 2019-07-10 コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. 単一素子超音波トランスデューサの大量生産
CN105723532B (zh) * 2013-11-11 2019-02-05 皇家飞利浦有限公司 具有受保护的集成电路连接体的鲁棒超声换能器探头
CN104916773B (zh) * 2014-03-14 2017-10-20 中国科学院苏州纳米技术与纳米仿生研究所 电致变形薄膜阵列、其制备方法及应用
KR102406927B1 (ko) * 2014-12-02 2022-06-10 삼성메디슨 주식회사 초음파 프로브 및 그 제조방법
EP3028772B1 (en) 2014-12-02 2022-12-28 Samsung Medison Co., Ltd. Ultrasonic probe and method of manufacturing the same
JP6510290B2 (ja) * 2015-03-30 2019-05-08 キヤノンメディカルシステムズ株式会社 超音波プローブ及び超音波診断装置
US11766237B2 (en) 2015-07-02 2023-09-26 Philips Image Guided Therapy Corporation Multi-mode capacitive micromachined ultrasound transducer and associated devices, systems, and methods for multiple different intravascular sensing capabilities
WO2017201285A1 (en) 2016-05-19 2017-11-23 Aptinyx Inc. Spiro-lactam nmda receptor modulators and uses thereof
PE20190174A1 (es) 2016-05-19 2019-02-01 Aptinyx Inc Moduladores del receptor espiro-lactama n-metil-d-aspartato y usos de los mismos
AU2017281280B2 (en) * 2016-06-20 2022-01-06 Butterfly Network, Inc. Electrical contact arrangement for microfabricated ultrasonic transducer
JP6712917B2 (ja) * 2016-07-14 2020-06-24 株式会社日立製作所 半導体センサチップアレイ、および超音波診断装置
PE20190501A1 (es) 2016-08-01 2019-04-10 Aptinyx Inc Moduladores nmda espiro-lactam y metodos de uso de los mismos
EP3490992B1 (en) 2016-08-01 2023-03-22 Aptinyx Inc. Spiro-lactam nmda receptor modulators and uses thereof
JP2019527235A (ja) 2016-08-01 2019-09-26 アプティニックス インコーポレイテッド スピロ−ラクタム及びビス−スピロ−ラクタムnmda受容体修飾因子及びその使用
CN109890825B (zh) 2016-08-01 2022-03-11 阿普廷伊克斯股份有限公司 螺-内酰胺nmda受体调节剂及其用途
CA3031534C (en) 2016-08-01 2023-10-17 Aptinyx Inc. Spiro-lactam nmda receptor modulators and uses thereof
EP3472430A4 (en) 2016-09-27 2020-01-08 Halliburton Energy Services, Inc. MULTIDIRECTIONAL ULTRASONIC TRANSDUCER FOR DOWNHOLE MEASUREMENTS
US11504091B2 (en) * 2016-10-03 2022-11-22 Koninklijke Philips N.V. Transducer arrays with air kerfs for intraluminal imaging
GB2555835B (en) * 2016-11-11 2018-11-28 Novosound Ltd Ultrasound transducer
PE20210455A1 (es) 2018-01-31 2021-03-08 Aptinyx Inc Moduladores del receptor nmda espiro-lactama y usos de los mismos
US11806191B2 (en) 2018-05-21 2023-11-07 General Electric Company Phased array transducers and wafer scale manufacturing for making the same
KR20190143179A (ko) * 2018-06-20 2019-12-30 삼성메디슨 주식회사 초음파프로브 및 그 제조방법
US12012413B2 (en) 2019-11-11 2024-06-18 Tenacia Biotechnology (Hong Kong) Co., Limited Methods of treating painful diabetic peripheral neuropathy
EP4061545A1 (en) 2019-11-22 2022-09-28 NovioScan B.V. Robust, simple, and efficiently manufacturable transducer array
WO2023036742A1 (en) * 2021-09-09 2023-03-16 Koninklijke Philips N.V. Intraluminal ultrasound imaging assembly with electrical connection for multi-row transducer array
JP2024141458A (ja) * 2023-03-29 2024-10-10 富士フイルム株式会社 超音波探触子

Citations (6)

* Cited by examiner, † Cited by third party
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US5774960A (en) * 1993-03-05 1998-07-07 Thomson-Csf Process for manufacturing a multi-element acoustic probe, especially an echograph probe
US5793149A (en) * 1995-07-26 1998-08-11 Francotyp-Postalia Ag & Co. Arrangement for plate-shaped piezoactuators and method for the manufacture thereof
EP0785826B1 (en) * 1994-10-14 1999-02-03 Parallel Design, Inc. Ultrasonic transducer array with apodized elevation focus
CN101069295A (zh) * 2004-10-15 2007-11-07 富士胶卷迪马蒂克斯股份有限公司 具有腔体和压电岛的微机电装置及形成具有压电换能器的装置的方法
CN100398224C (zh) * 2001-09-17 2008-07-02 Ge帕拉莱尔设计公司 换能器的频率和振幅旁瓣缩减
CN101662989A (zh) * 2006-11-03 2010-03-03 研究三角协会 使用挠曲模式压电换能器的增强的超声成像探头

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JP3697200B2 (ja) * 2001-11-07 2005-09-21 アロカ株式会社 超音波探触子
CN101335235B (zh) * 2002-03-12 2010-10-13 浜松光子学株式会社 基板的分割方法
TWI520269B (zh) * 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
CN100583234C (zh) * 2003-06-09 2010-01-20 皇家飞利浦电子股份有限公司 用于设计具有声激励集成电子器件的超声换能器的方法
JP2007158467A (ja) * 2005-11-30 2007-06-21 Toshiba Corp 超音波プローブ及びその製造方法
US7892176B2 (en) 2007-05-02 2011-02-22 General Electric Company Monitoring or imaging system with interconnect structure for large area sensor array
US20080315331A1 (en) 2007-06-25 2008-12-25 Robert Gideon Wodnicki Ultrasound system with through via interconnect structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5774960A (en) * 1993-03-05 1998-07-07 Thomson-Csf Process for manufacturing a multi-element acoustic probe, especially an echograph probe
EP0785826B1 (en) * 1994-10-14 1999-02-03 Parallel Design, Inc. Ultrasonic transducer array with apodized elevation focus
US5793149A (en) * 1995-07-26 1998-08-11 Francotyp-Postalia Ag & Co. Arrangement for plate-shaped piezoactuators and method for the manufacture thereof
CN100398224C (zh) * 2001-09-17 2008-07-02 Ge帕拉莱尔设计公司 换能器的频率和振幅旁瓣缩减
CN101069295A (zh) * 2004-10-15 2007-11-07 富士胶卷迪马蒂克斯股份有限公司 具有腔体和压电岛的微机电装置及形成具有压电换能器的装置的方法
CN101662989A (zh) * 2006-11-03 2010-03-03 研究三角协会 使用挠曲模式压电换能器的增强的超声成像探头

Also Published As

Publication number Publication date
WO2013001448A1 (en) 2013-01-03
EP2723506A1 (en) 2014-04-30
JP6388536B2 (ja) 2018-09-12
JP2014523689A (ja) 2014-09-11
US9293690B2 (en) 2016-03-22
EP2723506B1 (en) 2017-02-15
US20140139072A1 (en) 2014-05-22
CN103635264A (zh) 2014-03-12

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