JP6381828B2 - 熱硬化性樹脂フィルム、第１保護膜形成用シート及び第１保護膜の形成方法 - Google Patents
熱硬化性樹脂フィルム、第１保護膜形成用シート及び第１保護膜の形成方法 Download PDFInfo
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- JP6381828B2 JP6381828B2 JP2017548788A JP2017548788A JP6381828B2 JP 6381828 B2 JP6381828 B2 JP 6381828B2 JP 2017548788 A JP2017548788 A JP 2017548788A JP 2017548788 A JP2017548788 A JP 2017548788A JP 6381828 B2 JP6381828 B2 JP 6381828B2
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- thermosetting resin
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- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015217117 | 2015-11-04 | ||
| JP2015217117 | 2015-11-04 | ||
| PCT/JP2016/082514 WO2017078039A1 (ja) | 2015-11-04 | 2016-11-02 | 熱硬化性樹脂フィルム、第１保護膜形成用シート及び第１保護膜の形成方法 |
Publications (2)
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| JPWO2017078039A1 JPWO2017078039A1 (ja) | 2018-02-15 |
| JP6381828B2 true JP6381828B2 (ja) | 2018-08-29 |
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| JP (1) | JP6381828B2 (zh) |
| KR (1) | KR102534927B1 (zh) |
| CN (1) | CN108140586A (zh) |
| PH (1) | PH12018500799A1 (zh) |
| SG (1) | SG11201803082SA (zh) |
| TW (1) | TWI761317B (zh) |
| WO (1) | WO2017078039A1 (zh) |
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| JP7233377B2 (ja) * | 2017-11-17 | 2023-03-06 | リンテック株式会社 | 熱硬化性樹脂フィルム及び第１保護膜形成用シート |
| TWI692816B (zh) * | 2019-05-22 | 2020-05-01 | 友達光電股份有限公司 | 顯示裝置及其製作方法 |
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| JP2004200195A (ja) * | 2002-12-16 | 2004-07-15 | Seiko Epson Corp | 半導体装置および半導体装置の製造方法 |
| JP4170839B2 (ja) | 2003-07-11 | 2008-10-22 | 日東電工株式会社 | 積層シート |
| JP2005229044A (ja) * | 2004-02-16 | 2005-08-25 | Seiko Epson Corp | 電子部品の製造方法、電子部品および電子機器 |
| JP4303705B2 (ja) * | 2004-09-02 | 2009-07-29 | 住友ベークライト株式会社 | 半導体用接着フィルム及びこれを用いた半導体装置 |
| JP4179312B2 (ja) * | 2004-09-15 | 2008-11-12 | セイコーエプソン株式会社 | 半導体装置の実装方法、半導体装置 |
| JP2006253277A (ja) * | 2005-03-09 | 2006-09-21 | Matsushita Electric Ind Co Ltd | モジュール用半導体素子と、これを用いたモジュールおよび、前記モジュールの製造方法 |
| JP4380684B2 (ja) * | 2006-10-20 | 2009-12-09 | 住友ベークライト株式会社 | 半導体用接着フィルム、ダイシングフィルムおよび半導体装置 |
| WO2011033743A1 (ja) * | 2009-09-16 | 2011-03-24 | 住友ベークライト株式会社 | 接着フィルム、多層回路基板、電子部品及び半導体装置 |
| CN102842541A (zh) * | 2011-06-22 | 2012-12-26 | 日东电工株式会社 | 层叠膜及其使用 |
| JP2013062328A (ja) * | 2011-09-12 | 2013-04-04 | Toshiba Corp | 半導体装置 |
| TWI443761B (zh) * | 2011-09-14 | 2014-07-01 | Manufacturing method for flip chip packaging | |
| TWI600701B (zh) * | 2012-07-19 | 2017-10-01 | Nagase Chemtex Corp | A semiconductor sealing epoxy resin composition and a method of manufacturing the semiconductor device |
| JP2014019813A (ja) * | 2012-07-20 | 2014-02-03 | Sumitomo Bakelite Co Ltd | 熱硬化性樹脂組成物、接着フィルム、ダイシングテープ一体型接着フィルム、半導体装置、多層回路基板および電子部品 |
| JP5735029B2 (ja) * | 2013-03-28 | 2015-06-17 | 日東電工株式会社 | 電子デバイス封止用樹脂シート及び電子デバイスパッケージの製造方法 |
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|---|---|
| KR20180080206A (ko) | 2018-07-11 |
| CN108140586A (zh) | 2018-06-08 |
| PH12018500799A1 (en) | 2018-10-29 |
| KR102534927B1 (ko) | 2023-05-19 |
| TW201728636A (zh) | 2017-08-16 |
| TWI761317B (zh) | 2022-04-21 |
| WO2017078039A1 (ja) | 2017-05-11 |
| SG11201803082SA (en) | 2018-05-30 |
| JPWO2017078039A1 (ja) | 2018-02-15 |
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