JP6370409B2 - センサモジュールおよびセンサモジュールの製造方法 - Google Patents
センサモジュールおよびセンサモジュールの製造方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000463 material Substances 0.000 claims description 26
- 238000003466 welding Methods 0.000 claims description 22
- 230000004927 fusion Effects 0.000 claims description 5
- 239000000155 melt Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 description 4
- 238000005304 joining Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007499 fusion processing Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
- B29C66/543—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles joining more than two hollow-preforms to form said hollow articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
- B29K2995/0026—Transparent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/752—Measuring equipment
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
Claims (14)
- センサユニット(4,32,60)と、
センサカバー(6,36,48)と、
別個の基体部(8,34,54)と、
を備えるセンサモジュール(2,35,47)であって、
前記センサユニット(4,32,60)は、センサ面(16)と基準面(12,38)とを有しており、
前記センサカバー(6,36,48)は、前記センサ面(16)と、前記基準面(12,38)の少なくとも一部の領域とを覆っており、
前記センサカバー(6,36,48)は、前記基準面(12,38)と前記基体部(8,34,54)とのうちの少なくとも1つと溶融結合によって接合されており、
前記基体部(8,34,54)は、少なくとも前記センサユニット(4,32,60)の前記基準面(12,38)と、前記センサカバー(6,36,48)に対して選択可能な相対位置で溶融結合によって接合されていることを特徴とする、センサモジュール(2,35,47)。 - 前記センサカバー(6,36,48)と、前記基体部(8,34,54)と、前記センサユニット(4,32,60)とのうちの少なくとも1つは、レーザー透過性材料からなり、それにより、各レーザー透過性構成部品への溶接に適したレーザービームの作用によって、前記レーザー透過性構成部品と、隣接するレーザー非透過性構成部品との間の境界面への熱導入が生じる、請求項1に記載のセンサモジュール(2,35,47)。
- 前記基準面(12,38)と前記センサカバー(6,36,48)とのうちの少なくとも1つは、少なくとも部分的に周辺突起(14,18,26,42,46,52,56)を有し、前記突起(14,18,26,42,46,52,56)は、前記基準面(12,38)に対して垂直方向に延在し、かつ、前記センサカバー(6,36,48)又は前記基準面(12,38)の材料と融着して溶融結合を形成するように構成されている、請求項1または2に記載のセンサモジュール(2,35,47)。
- 前記センサユニット(4,32,60)は、レーザー透過性材料からなり、前記センサカバー(6,36,48)および前記基体部(8,34,54)は、レーザー非透過性材料からなる、請求項1乃至3のいずれか1項に記載のセンサモジュール(2,35,47)。
- 前記センサカバー(6,36,48)および前記基体部(8,34,54)は、レーザー透過性材料からなり、前記センサユニット(4,32,60)は、レーザー非透過性材料からなる、請求項1乃至3のいずれか1項に記載のセンサモジュール(2,35,47)。
- 前記基体部(8,34,54)は、前記センサカバー(6,36,48)から径方向に離間されており、それにより前記センサカバー(6,36,48)と前記基体部(8,34,54)との間に間隙(28)が形成され、前記基体部(8,34,54)は、前記基準面(12,38)の、前記センサカバー(6,36,48)と同じ側に配置されている、請求項1乃至5のいずれか1項に記載のセンサモジュール(2,35,47)。
- 前記センサカバー(6,36,48)は、前記基体部(8,34,54)と融着され、前記センサユニット(4,32,60)は、専ら前記基体部(8,34,54)と融着される、請求項1乃至6のいずれか1項に記載のセンサモジュール(2,35,47)。
- 前記融着は、超音波溶着法によって形成される、請求項1に記載のセンサモジュール(2,35,47)。
- センサモジュール(2,35,47)を製造するための方法であって、
センサ面(16)と基準面(12,38)とを有するセンサユニット(4,32,60)と、センサカバー(6,36,48)と、別個の基体部(8,34,54)とを準備するステップと、
前記センサカバー(6,36,48)が、前記センサ面(16)と前記基準面(12,38)の少なくとも一部の領域とを覆うように、前記センサカバー(6,36,48)を、前記センサユニット(4,32,60)の上に配置するステップと、
前記センサカバー(6,36,48)を、前記センサユニット(4,32,60)の前記基準面(12,38)と前記基体部(8,34,54)とのうちの少なくとも1つと融着するステップと、
前記基体部(8,34,54)を、前記センサユニット(4,32,60)の前記基準面(12,38)に配置するステップと、
前記基体部(8,34,54)を、少なくとも前記センサユニット(4,32,60)の前記基準面(12,38)に、前記センサカバー(6,36,48)に対して選択可能な相対位置で融着するステップと、
を含んでいることを特徴とする方法。 - 前記センサカバー(6,36,48)を、前記センサユニット(4,32,60)の前記基準面(12,38)と前記基体部(8,34,54)とのうちの少なくとも1つに融着するステップは、前記センサカバー(6,36,48)を、前記基準面(12,38)に融着するステップを含んでいる、請求項9記載の方法。
- さらに、前記基体部(8,34,54)を、前記基準面(12,38)上で前記センサカバーと同じ側に配置し、前記基体部(8,34,54)を、前記基準面(12,38)に融着するステップを含んでいる、請求項10に記載の方法。
- 前記基体部(8,34,54)を、少なくとも前記センサユニット(4,32,60)の前記基準面(12,38)に融着するステップは、前記基体部(8,34,54)を、前記センサユニットの前記基準面(12,38)と前記センサカバー(6,36,48)に融着するステップを含んでいる、請求項9または10に記載の方法。
- 前記センサカバー(6,36,48)と前記センサユニット(4,32,60)とを、前記基体部(8,34,54)の相互に相対向する2つの側で融着する、請求項12記載の方法。
- 前記融着は、レーザー溶着法または超音波溶着法により実施される、請求項9乃至13のいずれか1項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014212296.1 | 2014-06-26 | ||
DE102014212296.1A DE102014212296A1 (de) | 2014-06-26 | 2014-06-26 | Sensormodul und Verfahren zum Herstellen eines Sensormoduls |
PCT/EP2015/064289 WO2015197713A1 (de) | 2014-06-26 | 2015-06-24 | Sensormodul und verfahren zum herstellen eines sensormoduls |
Publications (2)
Publication Number | Publication Date |
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JP2017519994A JP2017519994A (ja) | 2017-07-20 |
JP6370409B2 true JP6370409B2 (ja) | 2018-08-08 |
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Application Number | Title | Priority Date | Filing Date |
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JP2016575566A Active JP6370409B2 (ja) | 2014-06-26 | 2015-06-24 | センサモジュールおよびセンサモジュールの製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10634526B2 (ja) |
EP (1) | EP3161421B1 (ja) |
JP (1) | JP6370409B2 (ja) |
DE (1) | DE102014212296A1 (ja) |
WO (1) | WO2015197713A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102015219569B4 (de) | 2015-10-09 | 2024-05-16 | Vitesco Technologies Germany Gmbh | Elektronische Anordnung, Kombination und Verfahren zur Montage einer elektronischen Anordnung |
DE102017201711A1 (de) | 2017-02-02 | 2018-08-02 | Continental Teves Ag & Co. Ohg | Sensor mit einem Schutzgehäuse |
DE102017209179A1 (de) * | 2017-05-31 | 2018-12-06 | Conti Temic Microelectronic Gmbh | Elektronikanordnung |
CN113646568A (zh) * | 2019-03-29 | 2021-11-12 | 株式会社不二工机 | 电动阀 |
US20230116237A1 (en) * | 2020-02-17 | 2023-04-13 | Sony Semiconductor Solutions Corporation | Sensor module and method for producing sensor module |
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US3089609A (en) | 1961-01-09 | 1963-05-14 | D Andrea A Ralph | Receptacle and opening means therefor |
US5233871A (en) * | 1991-11-01 | 1993-08-10 | Delco Electronics Corporation | Hybrid accelerometer assembly |
DE4432081A1 (de) * | 1994-09-09 | 1996-03-14 | Basf Ag | Verfahren zum Schweißverbinden von Kunststoffteilen |
DE19911890A1 (de) * | 1999-03-17 | 2000-10-12 | Sonotronic Nagel Gmbh | Sensorhalter für ein Trägerteil |
EP1162468A3 (en) * | 2000-06-05 | 2002-05-29 | Matsushita Electric Industrial Co., Ltd. | Acceleration sensor |
DE10131430A1 (de) | 2001-06-29 | 2003-01-16 | Bosch Gmbh Robert | Verfahren zum Verschweißen |
DE10306697A1 (de) * | 2002-02-20 | 2003-08-28 | Bosch Gmbh Robert | Verfahren zum Schweißverbinden von Kunststoffteilen mit Hilfe von Laserstrahlung |
DE10207777A1 (de) * | 2002-02-23 | 2003-09-11 | A B Elektronik Gmbh | Laserverschweißte Sensorgehäuse |
JP2005288934A (ja) * | 2004-04-01 | 2005-10-20 | Denso Corp | 樹脂材のレーザ溶着方法 |
DE102005046558A1 (de) * | 2005-09-28 | 2007-03-29 | Mann + Hummel Gmbh | Laserdurchstrahlschweißverfahren sowie Vorrichtung zur Durchführung des Verfahrens |
DE102005055949A1 (de) * | 2005-11-24 | 2007-05-31 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Drehmoment- und Winkelsensors sowie zugehöriger Drehmoment- und Winkelsensor |
JP4645477B2 (ja) | 2006-02-27 | 2011-03-09 | 株式会社デンソー | 回転検出装置 |
DE102008008336A1 (de) | 2007-03-19 | 2008-09-25 | Conti Temic Microelectronic Gmbh | Verfahren zur Positionsbestimmung und zur Positionierung eines abgedeckten Sensorelements einer Sensoranordnung sowie Sensoranordnung mit einem entsprechend positionierten Sensorelement |
JP4531074B2 (ja) | 2007-04-20 | 2010-08-25 | 三菱電機株式会社 | 樹脂溶着体 |
JP4433024B2 (ja) | 2007-09-06 | 2010-03-17 | 株式会社デンソー | 回転検出装置の製造方法 |
DE102009043200A1 (de) * | 2009-09-26 | 2011-04-21 | Continental Automotive Gmbh | Verfahren zum Verschweißen eines Kunststoffgehäuses |
JP2011133242A (ja) * | 2009-12-22 | 2011-07-07 | Nippon Seiki Co Ltd | 移動物体検出装置 |
DE102011118642A1 (de) * | 2011-11-15 | 2013-05-16 | Valeo Schalter Und Sensoren Gmbh | Verfahren zum Verbinden eines Sensorteils mit einem Wellenteil eines Kraftfahrzeugs und Anordnung mit einem Wellenteil und einem Sensorteil |
DE102011121818B4 (de) | 2011-12-21 | 2024-08-14 | Vitesco Technologies Germany Gmbh | Anordnung eines elektronischen Bauteils in einem Gehäuse |
DE112012006391B4 (de) | 2012-06-15 | 2022-04-28 | Hitachi Astemo, Ltd. | Durchflusssensoren und Verfahren zu ihrer Herstellung |
-
2014
- 2014-06-26 DE DE102014212296.1A patent/DE102014212296A1/de not_active Withdrawn
-
2015
- 2015-06-24 WO PCT/EP2015/064289 patent/WO2015197713A1/de active Application Filing
- 2015-06-24 EP EP15731905.4A patent/EP3161421B1/de active Active
- 2015-06-24 JP JP2016575566A patent/JP6370409B2/ja active Active
- 2015-06-24 US US15/322,209 patent/US10634526B2/en active Active
Also Published As
Publication number | Publication date |
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DE102014212296A1 (de) | 2015-12-31 |
US10634526B2 (en) | 2020-04-28 |
JP2017519994A (ja) | 2017-07-20 |
US20180023982A1 (en) | 2018-01-25 |
WO2015197713A1 (de) | 2015-12-30 |
EP3161421B1 (de) | 2020-01-29 |
EP3161421A1 (de) | 2017-05-03 |
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