JP6361957B2 - 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材 - Google Patents
電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材 Download PDFInfo
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- JP6361957B2 JP6361957B2 JP2014050030A JP2014050030A JP6361957B2 JP 6361957 B2 JP6361957 B2 JP 6361957B2 JP 2014050030 A JP2014050030 A JP 2014050030A JP 2014050030 A JP2014050030 A JP 2014050030A JP 6361957 B2 JP6361957 B2 JP 6361957B2
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- Prior art keywords
- coating layer
- wiring film
- layer
- film
- main conductive
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Insulated Conductors (AREA)
- Powder Metallurgy (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014050030A JP6361957B2 (ja) | 2013-03-22 | 2014-03-13 | 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013059489 | 2013-03-22 | ||
JP2013059489 | 2013-03-22 | ||
JP2014050030A JP6361957B2 (ja) | 2013-03-22 | 2014-03-13 | 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014208887A JP2014208887A (ja) | 2014-11-06 |
JP6361957B2 true JP6361957B2 (ja) | 2018-07-25 |
Family
ID=51552193
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014050030A Active JP6361957B2 (ja) | 2013-03-22 | 2014-03-13 | 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6361957B2 (ko) |
KR (1) | KR101553472B1 (ko) |
CN (1) | CN104064549B (ko) |
TW (1) | TWI498441B (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6455303B2 (ja) * | 2014-12-19 | 2019-01-23 | 住友金属鉱山株式会社 | 被覆はんだワイヤおよびその製造方法 |
JP6823799B2 (ja) * | 2015-10-01 | 2021-02-03 | 日立金属株式会社 | 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材 |
JP6997945B2 (ja) * | 2016-12-27 | 2022-01-18 | 日立金属株式会社 | 積層配線膜およびその製造方法ならびにMo合金スパッタリングターゲット材 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4419037B2 (ja) * | 2000-11-27 | 2010-02-24 | 三菱マテリアル株式会社 | ブラックマトリックス用遮光膜を形成するためのスパッタリングターゲット |
JP3649238B2 (ja) * | 2002-10-17 | 2005-05-18 | 旭硝子株式会社 | 積層体、配線付き基体、有機el表示素子、有機el表示素子の接続端子及びそれらの製造方法 |
KR100938885B1 (ko) * | 2003-06-30 | 2010-01-27 | 엘지디스플레이 주식회사 | 액정표시장치용 어레이기판과 제조방법 |
JP2005079130A (ja) | 2003-08-28 | 2005-03-24 | Hitachi Metals Ltd | 薄膜配線層 |
JP4730662B2 (ja) * | 2005-03-02 | 2011-07-20 | 日立金属株式会社 | 薄膜配線層 |
TW201006938A (en) * | 2008-04-28 | 2010-02-16 | Starck H C Inc | Molybdenum-niobium alloys, sputtering targets containing such alloys, methods of making such targets, thin films prepared therefrom and uses thereof |
JP6016083B2 (ja) * | 2011-08-19 | 2016-10-26 | 日立金属株式会社 | 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材 |
-
2014
- 2014-03-13 JP JP2014050030A patent/JP6361957B2/ja active Active
- 2014-03-19 KR KR1020140032109A patent/KR101553472B1/ko active IP Right Grant
- 2014-03-21 TW TW103110584A patent/TWI498441B/zh active
- 2014-03-21 CN CN201410108904.6A patent/CN104064549B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR20140116002A (ko) | 2014-10-01 |
KR101553472B1 (ko) | 2015-09-15 |
CN104064549B (zh) | 2016-08-31 |
TW201437405A (zh) | 2014-10-01 |
TWI498441B (zh) | 2015-09-01 |
JP2014208887A (ja) | 2014-11-06 |
CN104064549A (zh) | 2014-09-24 |
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