JP6349953B2 - 発光装置の製造方法 - Google Patents

発光装置の製造方法 Download PDF

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Publication number
JP6349953B2
JP6349953B2 JP2014104248A JP2014104248A JP6349953B2 JP 6349953 B2 JP6349953 B2 JP 6349953B2 JP 2014104248 A JP2014104248 A JP 2014104248A JP 2014104248 A JP2014104248 A JP 2014104248A JP 6349953 B2 JP6349953 B2 JP 6349953B2
Authority
JP
Japan
Prior art keywords
light emitting
substrate
light
sealing member
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014104248A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015220392A (ja
JP2015220392A5 (enrdf_load_stackoverflow
Inventor
鈴木　亮
亮 鈴木
博凡 佐々
博凡 佐々
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2014104248A priority Critical patent/JP6349953B2/ja
Priority to US14/716,451 priority patent/US9543465B2/en
Publication of JP2015220392A publication Critical patent/JP2015220392A/ja
Priority to US15/361,630 priority patent/US9780275B2/en
Publication of JP2015220392A5 publication Critical patent/JP2015220392A5/ja
Application granted granted Critical
Publication of JP6349953B2 publication Critical patent/JP6349953B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
JP2014104248A 2014-05-20 2014-05-20 発光装置の製造方法 Active JP6349953B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014104248A JP6349953B2 (ja) 2014-05-20 2014-05-20 発光装置の製造方法
US14/716,451 US9543465B2 (en) 2014-05-20 2015-05-19 Method for manufacturing light emitting device
US15/361,630 US9780275B2 (en) 2014-05-20 2016-11-28 Method for manufacturing light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014104248A JP6349953B2 (ja) 2014-05-20 2014-05-20 発光装置の製造方法

Publications (3)

Publication Number Publication Date
JP2015220392A JP2015220392A (ja) 2015-12-07
JP2015220392A5 JP2015220392A5 (enrdf_load_stackoverflow) 2017-03-02
JP6349953B2 true JP6349953B2 (ja) 2018-07-04

Family

ID=54779526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014104248A Active JP6349953B2 (ja) 2014-05-20 2014-05-20 発光装置の製造方法

Country Status (1)

Country Link
JP (1) JP6349953B2 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6642552B2 (ja) * 2017-11-08 2020-02-05 日亜化学工業株式会社 発光装置
KR101971436B1 (ko) * 2017-12-22 2019-04-23 주식회사 에이유이 탑뷰 및 사이드뷰 실장이 가능한 cob 타입 엘이디 패키지 및 그 제조 방법
JP7057508B2 (ja) * 2019-03-28 2022-04-20 日亜化学工業株式会社 発光装置
KR102839478B1 (ko) * 2023-05-25 2025-07-28 주식회사 엘포톤 반도체 발광소자를 제조하는 방법
KR102845106B1 (ko) * 2023-07-06 2025-08-12 주식회사 엘포톤 반도체 발광소자를 제조하는 방법
KR102822578B1 (ko) * 2023-07-06 2025-06-19 주식회사 엘포톤 반도체 발광소자를 제조하는 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04134606A (ja) * 1990-09-25 1992-05-08 Hitachi Ltd 薄膜磁気ヘッドとその製造方法および磁気ディスク装置
JP3917619B2 (ja) * 1997-01-24 2007-05-23 ローム株式会社 半導体発光素子の製法
JP2008108952A (ja) * 2006-10-26 2008-05-08 Matsushita Electric Ind Co Ltd 半導体発光装置および半導体発光装置の製造方法
JP5603166B2 (ja) * 2010-08-23 2014-10-08 セイコーインスツル株式会社 電子デバイス、電子機器及び電子デバイスの製造方法
JP2012069645A (ja) * 2010-09-22 2012-04-05 Citizen Holdings Co Ltd 半導体発光装置及びその製造方法
JPWO2012086483A1 (ja) * 2010-12-21 2014-05-22 コニカミノルタ株式会社 蛍光体塗布装置および発光装置の製造方法
KR101761834B1 (ko) * 2011-01-28 2017-07-27 서울바이오시스 주식회사 웨이퍼 레벨 발광 다이오드 패키지 및 그것을 제조하는 방법
WO2013038304A1 (en) * 2011-09-14 2013-03-21 Koninklijke Philips Electronics N.V. Reflective coating for a light emitting device mount

Also Published As

Publication number Publication date
JP2015220392A (ja) 2015-12-07

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