JP2015220392A5 - - Google Patents

Download PDF

Info

Publication number
JP2015220392A5
JP2015220392A5 JP2014104248A JP2014104248A JP2015220392A5 JP 2015220392 A5 JP2015220392 A5 JP 2015220392A5 JP 2014104248 A JP2014104248 A JP 2014104248A JP 2014104248 A JP2014104248 A JP 2014104248A JP 2015220392 A5 JP2015220392 A5 JP 2015220392A5
Authority
JP
Japan
Prior art keywords
light emitting
light
manufacturing
sealing member
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014104248A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015220392A (ja
JP6349953B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2014104248A priority Critical patent/JP6349953B2/ja
Priority claimed from JP2014104248A external-priority patent/JP6349953B2/ja
Priority to US14/716,451 priority patent/US9543465B2/en
Publication of JP2015220392A publication Critical patent/JP2015220392A/ja
Priority to US15/361,630 priority patent/US9780275B2/en
Publication of JP2015220392A5 publication Critical patent/JP2015220392A5/ja
Application granted granted Critical
Publication of JP6349953B2 publication Critical patent/JP6349953B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014104248A 2014-05-20 2014-05-20 発光装置の製造方法 Active JP6349953B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014104248A JP6349953B2 (ja) 2014-05-20 2014-05-20 発光装置の製造方法
US14/716,451 US9543465B2 (en) 2014-05-20 2015-05-19 Method for manufacturing light emitting device
US15/361,630 US9780275B2 (en) 2014-05-20 2016-11-28 Method for manufacturing light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014104248A JP6349953B2 (ja) 2014-05-20 2014-05-20 発光装置の製造方法

Publications (3)

Publication Number Publication Date
JP2015220392A JP2015220392A (ja) 2015-12-07
JP2015220392A5 true JP2015220392A5 (enrdf_load_stackoverflow) 2017-03-02
JP6349953B2 JP6349953B2 (ja) 2018-07-04

Family

ID=54779526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014104248A Active JP6349953B2 (ja) 2014-05-20 2014-05-20 発光装置の製造方法

Country Status (1)

Country Link
JP (1) JP6349953B2 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6642552B2 (ja) * 2017-11-08 2020-02-05 日亜化学工業株式会社 発光装置
KR101971436B1 (ko) * 2017-12-22 2019-04-23 주식회사 에이유이 탑뷰 및 사이드뷰 실장이 가능한 cob 타입 엘이디 패키지 및 그 제조 방법
JP7057508B2 (ja) * 2019-03-28 2022-04-20 日亜化学工業株式会社 発光装置
KR102839478B1 (ko) * 2023-05-25 2025-07-28 주식회사 엘포톤 반도체 발광소자를 제조하는 방법
KR102822578B1 (ko) * 2023-07-06 2025-06-19 주식회사 엘포톤 반도체 발광소자를 제조하는 방법
KR102845106B1 (ko) * 2023-07-06 2025-08-12 주식회사 엘포톤 반도체 발광소자를 제조하는 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04134606A (ja) * 1990-09-25 1992-05-08 Hitachi Ltd 薄膜磁気ヘッドとその製造方法および磁気ディスク装置
JP3917619B2 (ja) * 1997-01-24 2007-05-23 ローム株式会社 半導体発光素子の製法
JP2008108952A (ja) * 2006-10-26 2008-05-08 Matsushita Electric Ind Co Ltd 半導体発光装置および半導体発光装置の製造方法
JP5603166B2 (ja) * 2010-08-23 2014-10-08 セイコーインスツル株式会社 電子デバイス、電子機器及び電子デバイスの製造方法
JP2012069645A (ja) * 2010-09-22 2012-04-05 Citizen Holdings Co Ltd 半導体発光装置及びその製造方法
JPWO2012086483A1 (ja) * 2010-12-21 2014-05-22 コニカミノルタ株式会社 蛍光体塗布装置および発光装置の製造方法
KR101761834B1 (ko) * 2011-01-28 2017-07-27 서울바이오시스 주식회사 웨이퍼 레벨 발광 다이오드 패키지 및 그것을 제조하는 방법
WO2013038304A1 (en) * 2011-09-14 2013-03-21 Koninklijke Philips Electronics N.V. Reflective coating for a light emitting device mount

Similar Documents

Publication Publication Date Title
JP2015220392A5 (enrdf_load_stackoverflow)
WO2016064134A3 (en) Light emitting device and method of fabricating the same
JP2014029853A5 (enrdf_load_stackoverflow)
JP2012256848A5 (enrdf_load_stackoverflow)
EP2866257A3 (en) Printed circuit board and manufacturing method thereof and semiconductor pacakge using the same
JP2020526004A5 (enrdf_load_stackoverflow)
TW201613087A (en) Organic light emitting display device
EP2503607A3 (en) Light emitting device and method for manufacturing the same
GB2561775A (en) Electrode integration into organs on chip devices
JP2013175738A5 (ja) 発光装置の作製方法
JP2015015270A5 (enrdf_load_stackoverflow)
JP2013083993A5 (enrdf_load_stackoverflow)
JP2014195064A5 (enrdf_load_stackoverflow)
EP2657992A3 (en) Light emitting device and light emitting device package
JP2014237545A5 (enrdf_load_stackoverflow)
EP2863446A3 (en) Flexible organic light emitting diode display and manufacturing method thereof
EP2725629A3 (en) Light emitting element
JP2012190785A5 (enrdf_load_stackoverflow)
JP2015216344A5 (enrdf_load_stackoverflow)
TW201613060A (en) Semiconductor device having terminals formed on a chip package including a plurality of semiconductor chips and manufacturing method thereof
JP2013232484A5 (enrdf_load_stackoverflow)
EP3029497A3 (en) Wire grid polarizer, display device including the same, and method of fabricating the same
EP3584852A4 (en) TRANSPARENT COMPOSITE ELECTRODE, OLED, ITS MANUFACTURING PROCESS, NETWORK SUBSTRATE AND DISPLAY DEVICE
EP2924728A3 (en) Bond pad for a semiconductor device
JP2015144197A5 (enrdf_load_stackoverflow)