JP6345742B2 - 基板処理方法 - Google Patents
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Description
Claims (16)
- 基板(2)を処理する方法であって、当該基板(2)は、その上に形成された少なくとも1つの分割線(22)を有する第1面(2a)と、前記第1面(2a)の反対の第2面(2b)と、を有し、
当該方法は、前記基板(2)内に複数の穴領域(23)を形成するために、前記少なくとも1つの分割線(22)に沿った少なくとも複数の位置において、前記第1面(2a)の側から前記基板(2)にパルス状レーザービーム(LB)を適用する工程と、
前記複数の穴領域(23)が形成された前記少なくとも1つの分割線(22)に沿って、基板材料を除去する工程と、
を備え、
各穴領域(23)は、前記第1面(2a)から前記第2面(2b)に向かって延在し、 各穴領域(23)は、改変領域(232)と、当該改変領域(232)において前記第1面(2a)に開いた空間(231)と、から構成される
ことを特徴とする方法。 - 前記パルス状レーザービーム(LB)は、当該パルス状レーザービーム(LB)の焦点(P)が前記第1面(2a)上に位置付けられているという条件で、または、前記第1面(2a)から前記第2面(2b)に向かう方向において、当該第1面(2a)からある距離で位置付けられているという条件で、前記基板(2)に対して適用される
ことを特徴とする請求項1に記載の方法。 - 前記パルス状レーザービーム(LB)は、当該パルス状レーザービーム(LB)の焦点(P)が前記第1面(2a)上に位置付けられているという条件で、または、前記第1面(2a)から前記第2面(2b)に向かう方向とは反対方向において、当該第1面(2a)からある距離で位置付けられているという条件で、前記基板(2)に対して適用されることを特徴とする請求項1に記載の方法。
- 前記基板(2)は、単結晶基板、ガラス基板、化合物基板または多結晶基板である
ことを特徴とする請求項1乃至3のいずれか一項に記載の方法。 - 前記改変領域(232)は、アモルファス領域、または、クラックが形成された領域である
ことを特徴とする請求項1乃至4のいずれか一項に記載の方法。 - 前記基板材料は、前記複数の穴領域(23)が形成された前記少なくとも1つの分割線(22)に沿って、前記基板(2)を切断することによって、除去される
ことを特徴とする請求項1乃至5のいずれか一項に記載の方法。 - 前記基板材料は、前記複数の穴領域(23)が形成された前記少なくとも1つの分割線(22)に沿って、機械的に除去される
ことを特徴とする請求項1乃至6のいずれか一項に記載の方法。 - 前記基板の厚さを調節するために、前記基板(2)の前記第2面(2b)を研磨する工程を更に備えた
ことを特徴とする請求項1乃至7のいずれか一項に記載の方法。 - 前記基板(2)の前記第2面(2b)を研磨する工程は、前記複数の穴領域(23)が形成された前記少なくとも1つの分割線(22)に沿って前記基板材料を除去する工程の後で、行われる
ことを特徴とする請求項8に記載の方法。 - 前記基板材料は、前記第1面(2a)から前記第2面(2b)に向かう方向において、前記基板(2)の前記厚さの一部のみに沿って除去され、
前記基板(2)の前記第2面(2b)を研磨する工程は、前記少なくとも1つの分割線(22)に沿って前記基板(2)を分割するために、基板材料が除去されていない前記基板(2)の前記厚さの残りの部分に沿って、行われる
ことを特徴とする請求項9に記載の方法。 - 前記穴領域(23)は、前記第1面(2a)から前記第2面(2b)に向かう方向において、前記基板(2)の前記厚さの一部のみに沿って延在するように、あるいは、前記第1面(2a)から前記第2面(2b)に向かう方向において、前記基板(2)の前記厚さ全体に沿って延在するように、形成される
ことを特徴とする請求項1乃至10のいずれか一項に記載の方法。 - 前記基板材料は、前記第1面(2a)から前記第2面(2b)に向かう方向において、前記穴領域(23)の延び全体に沿って、除去される
ことを特徴とする請求項1乃至11のいずれか一項に記載の方法。 - 前記少なくとも1つの分割線(22)は、当該少なくとも1つの分割線(22)の延在方向と実質的に直交する方向において、ある幅(w)を有し、
前記方法は、前記分割線(22)の前記幅(w)内に複数列の穴領域(23)を形成するために、前記少なくとも1つの分割線(22)の幅方向に沿った複数の位置においても、前記パルス状レーザービーム(LB)を適用する工程を更に備え、
各列は、前記少なくとも1つの分割線(22)の延在方向に沿って延び、前記列は、前記少なくとも1つの分割線(22)の幅方向において互いに隣接して配置される
ことを特徴とする請求項1乃至12のいずれか一項に記載の方法。 - 前記基板材料は、前記複数の穴領域(23)が形成された前記少なくとも1つの分割線(22)に沿って、切断手段(6、6’)を用いて前記基板(2)を機械的に切断することによって、除去され、
前記少なくとも1つの分割線(22)の延在方向と実質的に直交する方向において、前記複数列の穴領域(23)が形成された前記基板(2)の領域の幅が、前記少なくとも1つの分割線(22)の延在方向と実質的に直交する方向において、前記切断手段(6、6’)の幅の90%から110%の範囲内である
ことを特徴とする請求項13に記載の方法。 - 前記少なくとも1つの分割線(22)の前記幅方向において、当該少なくとも1つの分割線(22)の中央の近位に配置された1列または複数列の穴領域(23)が、前記少なくとも1つの分割線(22)の前記幅方向において、当該少なくとも1つの分割線(22)の中央から更に離れて配置された1列または複数列の穴領域(23)を形成するために使用されるパルス状レーザービーム(LB)よりも、高い出力を有するパルス状レーザービーム(LB)を用いて、形成される
ことを特徴とする請求項13または14に記載の方法。 - 前記基板(2)は、前記パルス状レーザービーム(LB)を透過させる材料で作られることを特徴とする請求項1乃至15のいずれか一項に記載の方法。
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Publication number | Priority date | Publication date | Assignee | Title |
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DE102017201151A1 (de) * | 2016-02-01 | 2017-08-03 | Disco Corporation | Verfahren zum Bearbeiten eines Substrats |
WO2017179144A1 (ja) * | 2016-04-13 | 2017-10-19 | オリンパス株式会社 | 内視鏡用光学ユニットの製造方法および内視鏡 |
DE102016224978B4 (de) | 2016-12-14 | 2022-12-29 | Disco Corporation | Substratbearbeitungsverfahren |
DE102017200631B4 (de) * | 2017-01-17 | 2022-12-29 | Disco Corporation | Verfahren zum Bearbeiten eines Substrats |
DE102017212858A1 (de) * | 2017-07-26 | 2019-01-31 | Disco Corporation | Verfahren zum Bearbeiten eines Substrats |
JP6973916B2 (ja) * | 2017-08-21 | 2021-12-01 | 株式会社ディスコ | チップの製造方法 |
US20190363017A1 (en) * | 2018-05-24 | 2019-11-28 | Semiconductor Components Industries, Llc | Die sawing singulation systems and methods |
CN113103071B (zh) * | 2021-03-22 | 2022-05-27 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及其磨边方法 |
CN116435175A (zh) * | 2023-05-19 | 2023-07-14 | 河北同光半导体股份有限公司 | 一种应用于碳化硅单晶衬底的加工方法 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61152345A (ja) * | 1984-12-24 | 1986-07-11 | Toshiba Corp | レ−ザ併用加工法 |
US6562698B2 (en) * | 1999-06-08 | 2003-05-13 | Kulicke & Soffa Investments, Inc. | Dual laser cutting of wafers |
JP3408805B2 (ja) | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | 切断起点領域形成方法及び加工対象物切断方法 |
US6770544B2 (en) * | 2001-02-21 | 2004-08-03 | Nec Machinery Corporation | Substrate cutting method |
JP4286488B2 (ja) * | 2001-02-21 | 2009-07-01 | キヤノンマシナリー株式会社 | 基板切断方法 |
US7550367B2 (en) * | 2004-08-17 | 2009-06-23 | Denso Corporation | Method for separating semiconductor substrate |
JP4571850B2 (ja) * | 2004-11-12 | 2010-10-27 | 東京応化工業株式会社 | レーザーダイシング用保護膜剤及び該保護膜剤を用いたウエーハの加工方法 |
JP4694845B2 (ja) | 2005-01-05 | 2011-06-08 | 株式会社ディスコ | ウエーハの分割方法 |
JP2007134454A (ja) * | 2005-11-09 | 2007-05-31 | Toshiba Corp | 半導体装置の製造方法 |
KR100858983B1 (ko) * | 2005-11-16 | 2008-09-17 | 가부시키가이샤 덴소 | 반도체 장치 및 반도체 기판 다이싱 방법 |
US7838331B2 (en) * | 2005-11-16 | 2010-11-23 | Denso Corporation | Method for dicing semiconductor substrate |
JP5002808B2 (ja) * | 2006-03-07 | 2012-08-15 | 国立大学法人北海道大学 | レーザ加工装置及びレーザ加工方法 |
JP4402708B2 (ja) * | 2007-08-03 | 2010-01-20 | 浜松ホトニクス株式会社 | レーザ加工方法、レーザ加工装置及びその製造方法 |
JP5340806B2 (ja) * | 2009-05-21 | 2013-11-13 | 株式会社ディスコ | 半導体ウエーハのレーザ加工方法 |
JP5670764B2 (ja) * | 2011-01-13 | 2015-02-18 | 浜松ホトニクス株式会社 | レーザ加工方法 |
KR101504461B1 (ko) | 2011-07-29 | 2015-03-24 | 헨켈 아이피 앤드 홀딩 게엠베하 | 반도체 웨이퍼를 개개의 반도체 다이로 개별화하는 방법 |
JP5995428B2 (ja) * | 2011-11-11 | 2016-09-21 | 株式会社ディスコ | カバー付きチップの製造方法 |
JP5881464B2 (ja) * | 2012-02-27 | 2016-03-09 | 株式会社ディスコ | ウェーハのレーザー加工方法 |
JP2013197108A (ja) * | 2012-03-15 | 2013-09-30 | Disco Abrasive Syst Ltd | ウエーハのレーザー加工方法 |
US8845854B2 (en) | 2012-07-13 | 2014-09-30 | Applied Materials, Inc. | Laser, plasma etch, and backside grind process for wafer dicing |
CN102861994B (zh) | 2012-09-28 | 2015-04-01 | 合肥彩虹蓝光科技有限公司 | 一种发光原件的切割方法 |
JP6013858B2 (ja) * | 2012-10-01 | 2016-10-25 | 株式会社ディスコ | ウェーハの加工方法 |
JP2014093445A (ja) * | 2012-11-05 | 2014-05-19 | Disco Abrasive Syst Ltd | 光デバイスウエーハの加工方法 |
TWI543833B (zh) | 2013-01-28 | 2016-08-01 | 先進科技新加坡有限公司 | 將半導體基板輻射開槽之方法 |
JP6113529B2 (ja) * | 2013-03-05 | 2017-04-12 | 株式会社ディスコ | ウエーハの加工方法 |
JP6097146B2 (ja) * | 2013-05-16 | 2017-03-15 | 株式会社ディスコ | 光デバイスウエーハの加工方法 |
JP6121281B2 (ja) * | 2013-08-06 | 2017-04-26 | 株式会社ディスコ | ウエーハの加工方法 |
JP6270520B2 (ja) * | 2014-02-07 | 2018-01-31 | 株式会社ディスコ | ウェーハの加工方法 |
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