JP6345489B2 - 研磨液の研磨性能判定方法及び装置 - Google Patents

研磨液の研磨性能判定方法及び装置 Download PDF

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Publication number
JP6345489B2
JP6345489B2 JP2014113915A JP2014113915A JP6345489B2 JP 6345489 B2 JP6345489 B2 JP 6345489B2 JP 2014113915 A JP2014113915 A JP 2014113915A JP 2014113915 A JP2014113915 A JP 2014113915A JP 6345489 B2 JP6345489 B2 JP 6345489B2
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Prior art keywords
polishing
liquid
polished
wavelength
component
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Japanese (ja)
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JP2015226959A (ja
JP2015226959A5 (enExample
Inventor
高東　智佳子
智佳子 高東
由美子 中村
由美子 中村
大保　忠司
忠司 大保
松尾　尚典
尚典 松尾
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Ebara Corp
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Ebara Corp
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Priority to JP2014113915A priority Critical patent/JP6345489B2/ja
Priority to US14/725,322 priority patent/US20150346088A1/en
Publication of JP2015226959A publication Critical patent/JP2015226959A/ja
Publication of JP2015226959A5 publication Critical patent/JP2015226959A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/33—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using ultraviolet light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0056—Control means for lapping machines or devices taking regard of the pH-value of lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/314—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry with comparison of measurements at specific and non-specific wavelengths
    • G01N2021/3155—Measuring in two spectral ranges, e.g. UV and visible
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N30/00—Investigating or analysing materials by separation into components using adsorption, absorption or similar phenomena or using ion-exchange, e.g. chromatography or field flow fractionation
    • G01N30/02—Column chromatography
    • G01N30/88—Integrated analysis systems specially adapted therefor, not covered by a single one of the groups G01N30/04 - G01N30/86
    • G01N2030/8809—Integrated analysis systems specially adapted therefor, not covered by a single one of the groups G01N30/04 - G01N30/86 analysis specially adapted for the sample

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Molecular Biology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
JP2014113915A 2014-06-02 2014-06-02 研磨液の研磨性能判定方法及び装置 Active JP6345489B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014113915A JP6345489B2 (ja) 2014-06-02 2014-06-02 研磨液の研磨性能判定方法及び装置
US14/725,322 US20150346088A1 (en) 2014-06-02 2015-05-29 Method and apparatus for judging polishing performance of polishing liquid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014113915A JP6345489B2 (ja) 2014-06-02 2014-06-02 研磨液の研磨性能判定方法及び装置

Publications (3)

Publication Number Publication Date
JP2015226959A JP2015226959A (ja) 2015-12-17
JP2015226959A5 JP2015226959A5 (enExample) 2016-12-28
JP6345489B2 true JP6345489B2 (ja) 2018-06-20

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US (1) US20150346088A1 (enExample)
JP (1) JP6345489B2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3049370B2 (ja) 1991-03-08 2000-06-05 ヤマハ発動機株式会社 内燃エンジンの排気可変バルブ
JP3198596B2 (ja) 1992-03-31 2001-08-13 スズキ株式会社 ２サイクルエンジンの排気制御装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109623632B (zh) * 2018-12-24 2020-02-07 上海华力集成电路制造有限公司 一种化学机械抛光系统及其工作过程
CN118331338B (zh) * 2024-03-29 2025-05-30 北京创思工贸有限公司 一种抛光液浓度自动监测控制装置以及控制方法
CN120791641B (zh) * 2025-09-02 2025-11-28 丰豹智能科技(上海)有限公司 一种在线检测抛光液状态的护圈及检测方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5876266A (en) * 1997-07-15 1999-03-02 International Business Machines Corporation Polishing pad with controlled release of desired micro-encapsulated polishing agents
US6077337A (en) * 1998-12-01 2000-06-20 Intel Corporation Chemical-mechanical polishing slurry
US7041599B1 (en) * 1999-12-21 2006-05-09 Applied Materials Inc. High through-put Cu CMP with significantly reduced erosion and dishing
US20020045349A1 (en) * 2000-03-23 2002-04-18 Rhoades Robert L. Method for chemical-mechanical-polishing a substrate
US7111501B2 (en) * 2003-10-03 2006-09-26 Agilent Technologies, Inc. Devices and methods for separating constituents
JP2006062047A (ja) * 2004-08-27 2006-03-09 Ebara Corp 研磨装置および研磨方法
TW200916261A (en) * 2007-09-07 2009-04-16 Cabot Microelectronics Corp CMP sensor and control system
US20090287340A1 (en) * 2008-05-15 2009-11-19 Confluense Llc In-line effluent analysis method and apparatus for CMP process control
JP5760403B2 (ja) * 2010-11-24 2015-08-12 株式会社Sumco 薬液リサイクル方法および該方法に用いる装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3049370B2 (ja) 1991-03-08 2000-06-05 ヤマハ発動機株式会社 内燃エンジンの排気可変バルブ
JP3198596B2 (ja) 1992-03-31 2001-08-13 スズキ株式会社 ２サイクルエンジンの排気制御装置

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US20150346088A1 (en) 2015-12-03
JP2015226959A (ja) 2015-12-17

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