JP6344058B2 - 発光モジュール及び照明装置 - Google Patents

発光モジュール及び照明装置 Download PDF

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Publication number
JP6344058B2
JP6344058B2 JP2014107501A JP2014107501A JP6344058B2 JP 6344058 B2 JP6344058 B2 JP 6344058B2 JP 2014107501 A JP2014107501 A JP 2014107501A JP 2014107501 A JP2014107501 A JP 2014107501A JP 6344058 B2 JP6344058 B2 JP 6344058B2
Authority
JP
Japan
Prior art keywords
light emitting
light
emitting module
wiring pattern
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2014107501A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015222798A (ja
Inventor
絵梨果 竹中
絵梨果 竹中
和也 近藤
和也 近藤
倫宏 松尾
倫宏 松尾
優 佐々木
優 佐々木
壮一 渋沢
壮一 渋沢
真 叶内
真 叶内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Lighting and Technology Corp
Original Assignee
Toshiba Lighting and Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Lighting and Technology Corp filed Critical Toshiba Lighting and Technology Corp
Priority to JP2014107501A priority Critical patent/JP6344058B2/ja
Priority to CN201520056759.1U priority patent/CN204424318U/zh
Publication of JP2015222798A publication Critical patent/JP2015222798A/ja
Application granted granted Critical
Publication of JP6344058B2 publication Critical patent/JP6344058B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Landscapes

  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
JP2014107501A 2014-05-23 2014-05-23 発光モジュール及び照明装置 Expired - Fee Related JP6344058B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014107501A JP6344058B2 (ja) 2014-05-23 2014-05-23 発光モジュール及び照明装置
CN201520056759.1U CN204424318U (zh) 2014-05-23 2015-01-27 发光模块及照明装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014107501A JP6344058B2 (ja) 2014-05-23 2014-05-23 発光モジュール及び照明装置

Publications (2)

Publication Number Publication Date
JP2015222798A JP2015222798A (ja) 2015-12-10
JP6344058B2 true JP6344058B2 (ja) 2018-06-20

Family

ID=53474662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014107501A Expired - Fee Related JP6344058B2 (ja) 2014-05-23 2014-05-23 発光モジュール及び照明装置

Country Status (2)

Country Link
JP (1) JP6344058B2 (zh)
CN (1) CN204424318U (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6350808B2 (ja) * 2014-05-30 2018-07-04 東芝ライテック株式会社 照明器具

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4889267B2 (ja) * 2005-09-07 2012-03-07 共立エレックス株式会社 発光ダイオード用パッケージの製造方法
US8304660B2 (en) * 2008-02-07 2012-11-06 National Taiwan University Fully reflective and highly thermoconductive electronic module and method of manufacturing the same
JP5450854B2 (ja) * 2008-06-24 2014-03-26 シャープ株式会社 発光装置
JPWO2010150830A1 (ja) * 2009-06-23 2012-12-10 旭硝子株式会社 発光装置
JP2013125783A (ja) * 2011-12-13 2013-06-24 Harison Toshiba Lighting Corp Ｌｅｄ実装基板およびｌｅｄ照明装置
WO2013150882A1 (ja) * 2012-04-06 2013-10-10 シチズン電子株式会社 Ｌｅｄ発光装置

Also Published As

Publication number Publication date
CN204424318U (zh) 2015-06-24
JP2015222798A (ja) 2015-12-10

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