JP6341999B2 - 有機発光素子およびその製造方法 - Google Patents
有機発光素子およびその製造方法 Download PDFInfo
- Publication number
- JP6341999B2 JP6341999B2 JP2016529733A JP2016529733A JP6341999B2 JP 6341999 B2 JP6341999 B2 JP 6341999B2 JP 2016529733 A JP2016529733 A JP 2016529733A JP 2016529733 A JP2016529733 A JP 2016529733A JP 6341999 B2 JP6341999 B2 JP 6341999B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- organic light
- emitting device
- substrate
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title description 3
- 239000000758 substrate Substances 0.000 claims description 59
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 30
- 238000007789 sealing Methods 0.000 claims description 27
- 239000011521 glass Substances 0.000 claims description 20
- 239000010409 thin film Substances 0.000 claims description 12
- 230000001681 protective effect Effects 0.000 claims description 10
- 238000000605 extraction Methods 0.000 claims description 9
- 239000010408 film Substances 0.000 claims description 9
- 239000011368 organic material Substances 0.000 claims description 3
- 239000002985 plastic film Substances 0.000 claims description 3
- 229920006255 plastic film Polymers 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 51
- 238000000034 method Methods 0.000 description 18
- 239000000463 material Substances 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- 238000002347 injection Methods 0.000 description 9
- 239000007924 injection Substances 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000011777 magnesium Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 229910052749 magnesium Inorganic materials 0.000 description 7
- 239000012044 organic layer Substances 0.000 description 7
- -1 polyethylene terephthalate Polymers 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000011135 tin Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052791 calcium Inorganic materials 0.000 description 5
- 239000011575 calcium Substances 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052738 indium Inorganic materials 0.000 description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 229910052718 tin Inorganic materials 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 229910052721 tungsten Inorganic materials 0.000 description 5
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 4
- 229910052688 Gadolinium Inorganic materials 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 4
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 239000002019 doping agent Substances 0.000 description 4
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000011133 lead Substances 0.000 description 4
- 229910052744 lithium Inorganic materials 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910052700 potassium Inorganic materials 0.000 description 4
- 239000011591 potassium Substances 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- 229910052727 yttrium Inorganic materials 0.000 description 4
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229910052741 iridium Inorganic materials 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- QENGPZGAWFQWCZ-UHFFFAOYSA-N 3-Methylthiophene Chemical compound CC=1C=CSC=1 QENGPZGAWFQWCZ-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000004549 pulsed laser deposition Methods 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- 239000010944 silver (metal) Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- BCMCBBGGLRIHSE-UHFFFAOYSA-N 1,3-benzoxazole Chemical compound C1=CC=C2OC=NC2=C1 BCMCBBGGLRIHSE-UHFFFAOYSA-N 0.000 description 1
- SSABEFIRGJISFH-UHFFFAOYSA-N 2-(2,4-difluorophenyl)pyridine Chemical compound FC1=CC(F)=CC=C1C1=CC=CC=N1 SSABEFIRGJISFH-UHFFFAOYSA-N 0.000 description 1
- 239000005725 8-Hydroxyquinoline Substances 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 125000003785 benzimidazolyl group Chemical class N1=C(NC2=C1C=CC=C2)* 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- UFVXQDWNSAGPHN-UHFFFAOYSA-K bis[(2-methylquinolin-8-yl)oxy]-(4-phenylphenoxy)alumane Chemical compound [Al+3].C1=CC=C([O-])C2=NC(C)=CC=C21.C1=CC=C([O-])C2=NC(C)=CC=C21.C1=CC([O-])=CC=C1C1=CC=CC=C1 UFVXQDWNSAGPHN-UHFFFAOYSA-K 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- UEEXRMUCXBPYOV-UHFFFAOYSA-N iridium;2-phenylpyridine Chemical compound [Ir].C1=CC=CC=C1C1=CC=CC=N1.C1=CC=CC=C1C1=CC=CC=N1.C1=CC=CC=C1C1=CC=CC=N1 UEEXRMUCXBPYOV-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 238000001182 laser chemical vapour deposition Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 125000005487 naphthalate group Chemical group 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229960003540 oxyquinoline Drugs 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- SIOXPEMLGUPBBT-UHFFFAOYSA-M picolinate Chemical compound [O-]C(=O)C1=CC=CC=N1 SIOXPEMLGUPBBT-UHFFFAOYSA-M 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- YYMBJDOZVAITBP-UHFFFAOYSA-N rubrene Chemical compound C1=CC=CC=C1C(C1=C(C=2C=CC=CC=2)C2=CC=CC=C2C(C=2C=CC=CC=2)=C11)=C(C=CC=C2)C2=C1C1=CC=CC=C1 YYMBJDOZVAITBP-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 150000003413 spiro compounds Chemical class 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/877—Arrangements for extracting light from the devices comprising scattering means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/854—Arrangements for extracting light from the devices comprising scattering means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
- F21Y2115/15—Organic light-emitting diodes [OLED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/82—Interconnections, e.g. terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
Description
本出願は有機発光素子およびその製造方法に関する。
基板、前記基板上に第1電極、有機物層および第2電極が順次積層された有機発光部、および前記有機発光部の外側を密封する封止部を含み、
前記有機発光部および封止部が備えられていない基板上の領域のうち少なくとも一部領域と、前記基板の側面領域のうち少なくとも一部領域上に、保護部が備えられることを特徴とする有機発光素子を提供する。
Claims (16)
- 基板、
前記基板上に第1電極、有機物層および第2電極が順次積層された有機発光部、並びに
前記有機発光部の外側を密封する封止部を含む有機発光素子であって、
前記有機発光部からの光は前記基板を通して放出され、
前記有機発光部および封止部が備えられていない基板上の領域のうち少なくとも一部領域上、前記基板の側面領域のうち少なくとも一部領域上、並びに、前記封止部の上部領域および側面領域の全ての領域の上に、保護部が備えられ、
前記封止部は、前記有機発光部の前記外側と接するシーリング層および前記シーリング層上に備えられた金属層を含み、
前記基板の下部には、基板より広い面積を有するOCF(Out Coupling Film)がさらに備えられる、
有機発光素子。 - 前記基板は薄膜ガラス(thin glass)基板であることを特徴とする、請求項1に記載の有機発光素子。
- 前記薄膜ガラス基板の厚さは0.1mm以下であることを特徴とする、請求項2に記載の有機発光素子。
- 前記有機発光部および封止部が備えられていない基板上の領域と、基板の側面領域の全ての領域上に保護部が備えられることを特徴とする、請求項1に記載の有機発光素子。
- 前記OCF上にOCFより小さい面積を有する基板が備えられ、
前記基板が備えられていないOCFの領域上に前記保護部がさらに備えられることを特徴とする、請求項1に記載の有機発光素子。 - 前記保護部はプラスチックフィルムを含むことを特徴とする、請求項1に記載の有機発光素子。
- 前記保護部は絶縁層および金属パターン層を含むことを特徴とする、請求項1に記載の有機発光素子。
- 前記保護部は、2層の絶縁層と前記2層の絶縁層の間に備えられた金属パターン層とを含むことを特徴とする、請求項7に記載の有機発光素子。
- 前記第1電極または第2電極は、前記金属パターン層を介して外部電源と電気的に接続されることを特徴とする、請求項7に記載の有機発光素子。
- 前記金属パターン層は、前記第1電極と外部電源を電気的に接続する第1金属パターンを含むことを特徴とする、請求項7に記載の有機発光素子。
- 前記金属パターン層は、前記第2電極と外部電源を電気的に接続する第2金属パターンを含むことを特徴とする、請求項7に記載の有機発光素子。
- 前記有機発光素子はフレキシブル有機発光素子であることを特徴とする、請求項1に記載の有機発光素子。
- 前記基板および第1電極の間には光抽出層をさらに含むことを特徴とする、請求項1に記載の有機発光素子。
- 前記光抽出層上に平坦層をさらに含むことを特徴とする、請求項13に記載の有機発光素子。
- 請求項1から14のいずれか1項に記載の有機発光素子を含む照明装置。
- 請求項1から14のいずれか1項に記載の有機発光素子を含むディスプレイ装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20130116192 | 2013-09-30 | ||
KR10-2013-0116192 | 2013-09-30 | ||
PCT/KR2014/009241 WO2015047056A1 (ko) | 2013-09-30 | 2014-09-30 | 유기 발광 소자 및 이의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016525779A JP2016525779A (ja) | 2016-08-25 |
JP6341999B2 true JP6341999B2 (ja) | 2018-06-13 |
Family
ID=52744055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016529733A Active JP6341999B2 (ja) | 2013-09-30 | 2014-09-30 | 有機発光素子およびその製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9728739B2 (ja) |
EP (1) | EP3018724B1 (ja) |
JP (1) | JP6341999B2 (ja) |
KR (2) | KR20150037713A (ja) |
CN (1) | CN105474425B (ja) |
TW (1) | TWI562428B (ja) |
WO (1) | WO2015047056A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6258471B2 (ja) * | 2013-05-21 | 2018-01-10 | エルジー・ケム・リミテッド | 封止フィルムおよびこれを利用した有機電子装置の封止方法 |
TWI562428B (en) | 2013-09-30 | 2016-12-11 | Lg Display Co Ltd | Organic light emitting device and method for preparing the same |
CN107565047A (zh) * | 2017-08-18 | 2018-01-09 | 福州大学 | 一种柔性oled器件的封装方法 |
KR102603870B1 (ko) * | 2018-02-01 | 2023-11-21 | 삼성디스플레이 주식회사 | 봉지 구조, 상기 봉지 구조를 갖는 유기발광표시장치 및 이의 제조방법 |
CN108630732B (zh) * | 2018-04-25 | 2020-07-28 | 深圳市华星光电技术有限公司 | Oled显示面板及其制作方法 |
CN110350007B (zh) * | 2019-06-28 | 2024-04-16 | 福建华佳彩有限公司 | 一种amoled封装结构及其制作方法 |
Family Cites Families (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU694143B2 (en) * | 1993-10-04 | 1998-07-16 | 3M Innovative Properties Company | Cross-linked acrylate coating material useful for forming capacitor dielectrics and oxygen barriers |
KR100266532B1 (ko) | 1997-02-03 | 2000-09-15 | 가네꼬 히사시 | 유기 el 소자 |
KR100249784B1 (ko) * | 1997-11-20 | 2000-04-01 | 정선종 | 고분자복합막을이용한유기물혹은고분자전기발광소자의패키징방법 |
TW468283B (en) | 1999-10-12 | 2001-12-11 | Semiconductor Energy Lab | EL display device and a method of manufacturing the same |
JP2002008856A (ja) | 2000-06-27 | 2002-01-11 | Nippon Seiki Co Ltd | 有機elパネル |
US6867539B1 (en) * | 2000-07-12 | 2005-03-15 | 3M Innovative Properties Company | Encapsulated organic electronic devices and method for making same |
US6900590B2 (en) | 2000-10-17 | 2005-05-31 | Samsung Sdi Co., Ltd. | Organic electroluminescent device having non-continuous metal auxiliary electrodes |
KR100413450B1 (ko) | 2001-07-20 | 2003-12-31 | 엘지전자 주식회사 | 표시소자의 보호막 구조 |
JP4154898B2 (ja) * | 2002-02-21 | 2008-09-24 | コニカミノルタホールディングス株式会社 | 有機エレクトロルミネッセンス表示装置及び有機エレクトロルミネッセンス表示素子の封止方法 |
US6891330B2 (en) | 2002-03-29 | 2005-05-10 | General Electric Company | Mechanically flexible organic electroluminescent device with directional light emission |
KR20030083529A (ko) * | 2002-04-23 | 2003-10-30 | 주식회사 대한전광 | 측면봉지구조의 유기전계발광소자 |
US20050136625A1 (en) * | 2002-07-17 | 2005-06-23 | Debora Henseler | Ultra-thin glass devices |
JP2005050697A (ja) * | 2003-07-29 | 2005-02-24 | Toyota Industries Corp | 有機エレクトロルミネッセンス素子 |
JP4218450B2 (ja) * | 2003-07-29 | 2009-02-04 | 株式会社豊田自動織機 | 有機エレクトロルミネッセンス素子 |
US7541671B2 (en) * | 2005-03-31 | 2009-06-02 | General Electric Company | Organic electronic devices having external barrier layer |
US20060278965A1 (en) | 2005-06-10 | 2006-12-14 | Foust Donald F | Hermetically sealed package and methods of making the same |
US7663312B2 (en) * | 2006-07-24 | 2010-02-16 | Munisamy Anandan | Flexible OLED light source |
KR20080035835A (ko) * | 2006-10-20 | 2008-04-24 | 삼성전자주식회사 | 표시장치 |
WO2009028456A1 (ja) * | 2007-08-27 | 2009-03-05 | Panasonic Electric Works Co., Ltd. | 有機el発光素子 |
JP4844520B2 (ja) * | 2007-09-25 | 2011-12-28 | パナソニック電工株式会社 | 照明装置 |
JP2010055918A (ja) | 2008-08-28 | 2010-03-11 | Seiko Epson Corp | 電気光学装置、電気光学装置の製造方法、及び電子機器 |
JP5748397B2 (ja) * | 2009-07-27 | 2015-07-15 | ローム株式会社 | 有機el装置 |
KR20110012943A (ko) * | 2009-07-31 | 2011-02-09 | 웅진케미칼 주식회사 | 광추출 효율이 개선된 유기전계 발광장치 |
KR101613726B1 (ko) * | 2009-09-21 | 2016-04-20 | 엘지디스플레이 주식회사 | 유기전계발광소자의 제조방법 |
KR101267534B1 (ko) * | 2009-10-30 | 2013-05-23 | 엘지디스플레이 주식회사 | 유기전계발광소자의 제조방법 |
JP2011171128A (ja) | 2010-02-19 | 2011-09-01 | Konica Minolta Holdings Inc | 有機エレクトロルミネッセンスパネル及び有機エレクトロルミネッセンスパネルの製造方法 |
EP3608984B1 (en) | 2010-04-08 | 2020-11-11 | Agc Inc. | Organic led element |
KR20120062191A (ko) * | 2010-12-06 | 2012-06-14 | 엘지디스플레이 주식회사 | 플렉서블 유기전계발광소자 |
KR101769068B1 (ko) | 2010-12-14 | 2017-08-18 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
KR101238215B1 (ko) | 2010-12-27 | 2013-03-04 | 웅진케미칼 주식회사 | 유기전계 발광소자용 충전제 및 이를 활용한 유기전계 발광장치 |
JP5698993B2 (ja) | 2011-01-27 | 2015-04-08 | 富士フイルム株式会社 | 光拡散層形成材料、及び光取り出し部材、並びに有機電界発光装置及びその製造方法 |
WO2012119111A1 (en) * | 2011-03-03 | 2012-09-07 | Nitto Denko Corporation | Porous films for use in light-emitting devices |
WO2012147322A1 (ja) * | 2011-04-27 | 2012-11-01 | シャープ株式会社 | 表示装置、それを備えた電子機器、及び表示装置の製造方法 |
WO2013046545A1 (ja) * | 2011-09-26 | 2013-04-04 | パナソニック株式会社 | 発光装置の製造方法および発光装置 |
DE102011085034A1 (de) * | 2011-10-21 | 2013-04-25 | Tesa Se | Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung |
JP2013101923A (ja) | 2011-10-21 | 2013-05-23 | Semiconductor Energy Lab Co Ltd | 分散組成物の加熱方法、及びガラスパターンの形成方法 |
KR101561321B1 (ko) | 2011-11-14 | 2015-10-19 | 주식회사 엘지화학 | 워터젯을 이용하여 패턴화된 광추출층을 포함하는 유기전자소자의 제조방법 |
WO2013094617A1 (ja) | 2011-12-19 | 2013-06-27 | パナソニック株式会社 | 面状発光素子 |
KR20130084848A (ko) * | 2012-01-18 | 2013-07-26 | 한국전자통신연구원 | 유기 발광 소자 및 유기 발광 소자 제조 방법 |
JP2013186984A (ja) * | 2012-03-07 | 2013-09-19 | Panasonic Corp | 複合基板構造及びその作製方法、並びに、有機エレクトロルミネッセンス素子 |
JP5609941B2 (ja) | 2012-09-26 | 2014-10-22 | セイコーエプソン株式会社 | 表示装置および電子機器 |
KR102009727B1 (ko) * | 2012-11-26 | 2019-10-22 | 삼성디스플레이 주식회사 | 표시 장치, 표시 장치의 제조 방법 및 표시 장치를 제조하기 위한 캐리어 기판 |
US9196849B2 (en) * | 2013-01-09 | 2015-11-24 | Research & Business Foundation Sungkyunkwan University | Polymer/inorganic multi-layer encapsulation film |
KR102048467B1 (ko) * | 2013-04-03 | 2019-11-26 | 삼성디스플레이 주식회사 | 유기발광 표시장치 |
JP2014212107A (ja) * | 2013-04-05 | 2014-11-13 | 日東電工株式会社 | 有機エレクトロルミネッセンスデバイス、及びその製造方法 |
TWI562428B (en) | 2013-09-30 | 2016-12-11 | Lg Display Co Ltd | Organic light emitting device and method for preparing the same |
-
2014
- 2014-09-30 TW TW103134127A patent/TWI562428B/zh active
- 2014-09-30 KR KR20140132096A patent/KR20150037713A/ko active Application Filing
- 2014-09-30 WO PCT/KR2014/009241 patent/WO2015047056A1/ko active Application Filing
- 2014-09-30 EP EP14846850.7A patent/EP3018724B1/en active Active
- 2014-09-30 JP JP2016529733A patent/JP6341999B2/ja active Active
- 2014-09-30 CN CN201480045520.2A patent/CN105474425B/zh active Active
- 2014-09-30 US US14/910,226 patent/US9728739B2/en active Active
-
2016
- 2016-01-15 KR KR1020160005472A patent/KR101866296B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP3018724A4 (en) | 2017-05-10 |
WO2015047056A1 (ko) | 2015-04-02 |
TWI562428B (en) | 2016-12-11 |
KR101866296B1 (ko) | 2018-06-11 |
TW201523958A (zh) | 2015-06-16 |
EP3018724B1 (en) | 2023-03-01 |
US9728739B2 (en) | 2017-08-08 |
EP3018724A1 (en) | 2016-05-11 |
KR20150037713A (ko) | 2015-04-08 |
CN105474425B (zh) | 2018-02-09 |
KR20160013235A (ko) | 2016-02-03 |
US20160181571A1 (en) | 2016-06-23 |
CN105474425A (zh) | 2016-04-06 |
JP2016525779A (ja) | 2016-08-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6336569B2 (ja) | 有機発光素子およびその製造方法 | |
JP6417330B2 (ja) | フレキシブル基板を含む有機発光素子およびその製造方法 | |
JP6341999B2 (ja) | 有機発光素子およびその製造方法 | |
KR101717472B1 (ko) | 봉지용 적층체, 유기발광장치 및 이들의 제조방법 | |
JP6043401B2 (ja) | 有機発光素子およびその製造方法 | |
JP6751459B2 (ja) | 有機エレクトロルミネッセンス照明パネル、その製造方法及び有機エレクトロルミネッセンス照明装置 | |
KR101582719B1 (ko) | 유기 발광 소자 및 이의 제조방법 | |
JP2015015238A (ja) | 有機発光表示装置 | |
KR20140033724A (ko) | 유기 발광 표시 장치 및 그의 제조 방법 | |
KR101947381B1 (ko) | 플렉서블 기판의 제조방법 및 이를 포함하는 유기 발광 소자의 제조방법 | |
KR101752337B1 (ko) | 유기 발광 소자 및 이의 제조방법 | |
KR20150037025A (ko) | 플렉서블 기판을 포함하는 유기 발광 소자 및 이의 제조방법 | |
KR20150035262A (ko) | 유기 발광 소자 및 이의 제조방법 | |
KR20150024189A (ko) | 플렉서블 기판의 제조방법 및 이를 포함하는 유기 발광 소자의 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20160705 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20161130 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20161220 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170321 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170905 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171121 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180424 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180515 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6341999 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |