JP6338785B2 - 表面を加熱するための方法および装置 - Google Patents
表面を加熱するための方法および装置 Download PDFInfo
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- JP6338785B2 JP6338785B2 JP2017538945A JP2017538945A JP6338785B2 JP 6338785 B2 JP6338785 B2 JP 6338785B2 JP 2017538945 A JP2017538945 A JP 2017538945A JP 2017538945 A JP2017538945 A JP 2017538945A JP 6338785 B2 JP6338785 B2 JP 6338785B2
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- radiation
- layer
- absorber
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- luminescent agent
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- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 150000003195 pteridines Chemical class 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- GGVMPKQSTZIOIU-UHFFFAOYSA-N quaterrylene Chemical group C12=C3C4=CC=C2C(C2=C56)=CC=C5C(C=57)=CC=CC7=CC=CC=5C6=CC=C2C1=CC=C3C1=CC=CC2=CC=CC4=C21 GGVMPKQSTZIOIU-UHFFFAOYSA-N 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- HYXGAEYDKFCVMU-UHFFFAOYSA-N scandium oxide Chemical compound O=[Sc]O[Sc]=O HYXGAEYDKFCVMU-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- BYMUNNMMXKDFEZ-UHFFFAOYSA-K trifluorolanthanum Chemical compound F[La](F)F BYMUNNMMXKDFEZ-UHFFFAOYSA-K 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/032—Heaters specially adapted for heating by radiation heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2214/00—Aspects relating to resistive heating, induction heating and heating using microwaves, covered by groups H05B3/00, H05B6/00
- H05B2214/02—Heaters specially designed for de-icing or protection against icing
Landscapes
- Optical Filters (AREA)
- Planar Illumination Modules (AREA)
- Radiation-Therapy Devices (AREA)
- Laminated Bodies (AREA)
- Luminescent Compositions (AREA)
- Resistance Heating (AREA)
Description
Aex/LSC>1/D (1)
ここで、Dは装置の厚さである。LSCに沿ったエッジに連結された要素までの光輸送中の再吸収は、発光剤の放出波長での吸収係数、Aem/LSCに関する下記条件により最小化される。
Aem/LSC<<1/m (2)
ここで、mは装置の長さである。
Aem≦1/dL (3)
ここで、dLは放射線放出層の厚さである(図1を参照されたい)。図2は、源スペクトルSはダウンシフト(downshifting)発光剤の励起スペクトルExと重なる可能性があることを示す。装置の長さにわたる源光の分配は、発光剤の励起波長での濃度依存性吸収係数、Aexに関する下記条件により促進される。
Aex〜1/L、 0.2/L≦Aex≦5/L (4)
ここで、Lはエッジに連結された光源から測定された装置の長さであり、ここで、第2のエッジに連結された光源が第1の光源と反対のエッジに配置された場合、そうすると、Lは、式4においてL/2に置き換えられるであろう。第2の発光剤が存在する場合、例えば、その励起スペクトルが源スペクトルSと重ならない場合、式4の影響を受けず、かなり高い有効濃度で存在することができ、よって、第1の発光剤の放出スペクトルの長波長テールにおける光子をより効果的にリサイクルさせることができることに注意すべきである。
Claims (10)
- 源放射線を放出する放射線源と、
放出層ホスト材料および発光剤を含む放射線放出層であって、前記放射線放出層はエッジ、放出層第一表面、および放出層第二表面を含み、前記エッジはdLの高さを有し、前記放出層第一表面は長さLを有し、長さLは高さdLより大きく、前記長さL対前記高さdLの比は10以上である、放射線放出層と、
前記放射線源は前記エッジに連結され、前記源放射線は前記放射線源から前記エッジを通して伝達され、前記発光剤を励起し、その後、前記発光剤は放出放射線を放出し、前記放出放射線の少なくとも一部は、エスケープコーンを通り前記放出層第二表面を通って出て行き、
吸収体層であって、前記吸収体層は吸収体層第一表面を含み、前記吸収体層第一表面は前記放出層第二表面と直接接触し、前記吸収体層は、前記エスケープコーンを通って脱出する放出放射線を吸収する吸収体を含む、吸収体層と
を備える、加熱装置。 - 前記放出層第一表面および前記放出層第二表面の1つまたは両方から放出される前記放出放射線は均一であり、そのため、前記放出層第一表面および前記放出層第二表面上の全ての場所で測定される放射線は、前記個々の表面から放出される平均放射線の40%以内である、請求項1に記載の装置。
- 前記長さL対前記高さdLの比は30以上である、前記請求項のいずれか一項に記載の装置。
- 前記吸収体層は、吸収体層ホスト材料を含み、
前記放出層ホスト材料および前記吸収体層ホスト材料の1つまたは両方はポリカーボネート、ポリエステル、ポリアクリレート、ポリビニルブチラール、ポリイソプレン、ポリイミド、または前記の1つ以上を含む組み合わせを含む、前記請求項のいずれか一項に記載の装置。 - 前記放射線放出層は、前記吸収体層よりも高い屈折率を有する、前記請求項のいずれか一項に記載の装置。
- 前記発光剤は染料、量子ドット、希土類錯体、遷移金属イオン、または前記の1つ以上を含む組み合わせを含む、前記請求項のいずれか一項に記載の装置。
- 前記発光剤は、主軸上で測定すると、40nm以下の平均粒子サイズを有する、前記請求項のいずれか一項に記載の装置。
- 水または氷の存在を検出するためのセンサ、及び前記放射線源をオンおよびオフするように構成されたスイッチのうちの1つまたは両方をさらに備える、前記請求項のいずれか一項に記載の装置。
- 前記発光剤は(py)24Nd28F68(SePh)16、NaCl:Ti2+、MgCl2:Ti2+、Cs2ZrBr6:Os4+、Cs2ZrCl6:Re4+、YAlO3:Cr3+,Yb3+、Y3Ga5O12:Cr3+,Yb3+、ローダミン6G、インダセン染料、置換されたアミノ基およびシアノ基の1つまたは両方を有するピラジン型化合物、プテリジン化合物、ペリレン型化合物、アントラキノン型化合物、チオインジゴ型化合物、ナフタレン型化合物、キサンテン型化合物、ピロロピロールシアニン(PPCy)、ビス(PPCy)染料、受容体置換スクアライン、ランタニド系化合物、または前記の1つ以上を含む組み合わせを含む、前記請求項のいずれか一項に記載の装置。
- 吸収体層第二表面を加熱するための方法であって、
放射線源から源放射線を放出させる工程、
放出層ホスト材料および発光剤を含む放射線放出層を前記源放射線で照射する工程であって、前記放射線放出層はエッジ、放出層第一表面、および放出層第二表面を含む、工程、
前記放射線源は前記エッジに連結され、前記源放射線は前記放射線源から前記エッジを通して伝達され、前記発光剤を励起し、その後、前記発光剤は放出放射線を放出し、前記放出放射線の少なくとも一部は、エスケープコーンを通り前記放出層第二表面を通って出て行き、
前記放出放射線を吸収体層第一表面および吸収体層第二表面を含む吸収体層中の吸収体により吸収させる工程であって、前記吸収体層第一表面は前記放出層第二表面と直接接触する、工程、
前記吸収体層第二表面を加熱する工程
を含む、方法。
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US201462084071P | 2014-11-25 | 2014-11-25 | |
US62/084,071 | 2014-11-25 | ||
PCT/IB2015/059108 WO2016084008A1 (en) | 2014-11-25 | 2015-11-25 | Method and device for heating a surface |
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JP2018505524A JP2018505524A (ja) | 2018-02-22 |
JP6338785B2 true JP6338785B2 (ja) | 2018-06-06 |
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US (1) | US9913318B2 (ja) |
EP (1) | EP3192325B1 (ja) |
JP (1) | JP6338785B2 (ja) |
KR (2) | KR102451711B1 (ja) |
CN (1) | CN107006075B (ja) |
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JP6313527B2 (ja) | 2014-11-25 | 2018-04-18 | サビック グローバル テクノロジーズ ベスローテン フェンノートシャップ | 表面から放射線を放出するための方法および物品 |
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JP7290655B2 (ja) * | 2018-02-28 | 2023-06-13 | サビック グローバル テクノロジーズ ベスローテン フェンノートシャップ | 表面から輻射線又は熱を放射する方法及び装置 |
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WO2016084008A1 (en) | 2016-06-02 |
KR102451711B1 (ko) | 2022-10-06 |
EP3192325A1 (en) | 2017-07-19 |
US9913318B2 (en) | 2018-03-06 |
KR20170090445A (ko) | 2017-08-07 |
CN107006075A (zh) | 2017-08-01 |
JP2018505524A (ja) | 2018-02-22 |
EP3192325B1 (en) | 2018-12-26 |
CN107006075B (zh) | 2019-08-06 |
KR20210064420A (ko) | 2021-06-02 |
US20170311385A1 (en) | 2017-10-26 |
KR102258797B1 (ko) | 2021-05-31 |
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