JP6336997B2 - オフセットした同心の溝のパターンを有する研磨パッドおよびそれを用いて基材を研磨するための方法 - Google Patents

オフセットした同心の溝のパターンを有する研磨パッドおよびそれを用いて基材を研磨するための方法 Download PDF

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JP6336997B2
JP6336997B2 JP2015541855A JP2015541855A JP6336997B2 JP 6336997 B2 JP6336997 B2 JP 6336997B2 JP 2015541855 A JP2015541855 A JP 2015541855A JP 2015541855 A JP2015541855 A JP 2015541855A JP 6336997 B2 JP6336997 B2 JP 6336997B2
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less
grooves
center
concentricity
polishing pad
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JP2015541855A
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Japanese (ja)
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JP2015533668A5 (https=
JP2015533668A (ja
Inventor
ツァイ チン−ミーン
ツァイ チン−ミーン
チュヨン シー−ウエイ
チュヨン シー−ウエイ
ヤーン クン−シュウ
ヤーン クン−シュウ
スー ジア−チュヨン
スー ジア−チュヨン
リウ シュヨン−ホワン
リウ シュヨン−ホワン
スー フオン−チー
スー フオン−チー
コクジョン クレイグ
コクジョン クレイグ
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CMC Materials LLC
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Cabot Microelectronics Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2015541855A 2012-11-06 2013-11-05 オフセットした同心の溝のパターンを有する研磨パッドおよびそれを用いて基材を研磨するための方法 Active JP6336997B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261723226P 2012-11-06 2012-11-06
US61/723,226 2012-11-06
PCT/US2013/068523 WO2014074521A1 (en) 2012-11-06 2013-11-05 Polishing pad with offset concentric grooving pattern and method for polishing a substrate therewith

Publications (3)

Publication Number Publication Date
JP2015533668A JP2015533668A (ja) 2015-11-26
JP2015533668A5 JP2015533668A5 (https=) 2016-12-28
JP6336997B2 true JP6336997B2 (ja) 2018-06-06

Family

ID=50685113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015541855A Active JP6336997B2 (ja) 2012-11-06 2013-11-05 オフセットした同心の溝のパターンを有する研磨パッドおよびそれを用いて基材を研磨するための方法

Country Status (7)

Country Link
US (1) US9687956B2 (https=)
JP (1) JP6336997B2 (https=)
KR (1) KR102148050B1 (https=)
CN (1) CN104781913B (https=)
SG (1) SG11201503496YA (https=)
TW (1) TWI633970B (https=)
WO (1) WO2014074521A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449597B (zh) 2008-07-09 2014-08-21 Iv Technologies Co Ltd 研磨墊及其製造方法
KR101455919B1 (ko) * 2013-01-18 2014-11-03 주식회사 엘지실트론 웨이퍼 양면 연마 장치의 정반 구조
US20170232573A1 (en) * 2016-02-12 2017-08-17 Kabushiki Kaisha Toshiba Polishing member and semiconductor manufacturing method
US10864612B2 (en) * 2016-12-14 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad and method of using
US10861702B2 (en) * 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
US10857647B2 (en) * 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method
US10777418B2 (en) * 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
US10857648B2 (en) * 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
US12048980B2 (en) * 2017-08-25 2024-07-30 3M Innovative Properties Company Surface projection polishing pad
TWI642516B (zh) * 2017-10-02 2018-12-01 智勝科技股份有限公司 研磨墊以及研磨方法
CN108381331B (zh) * 2018-03-22 2020-02-18 大连理工大学 一种平面零件全局修形加工装置和方法
US11298794B2 (en) * 2019-03-08 2022-04-12 Applied Materials, Inc. Chemical mechanical polishing using time share control
CN112548845B (zh) * 2021-02-19 2021-09-14 清华大学 一种基板加工方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5842910A (en) * 1997-03-10 1998-12-01 International Business Machines Corporation Off-center grooved polish pad for CMP
KR20010002471A (ko) * 1999-06-15 2001-01-15 고석태 화학적 기계적 폴리싱 장치용 폴리싱 패드의 그루브 패턴
KR100314866B1 (ko) 1999-10-05 2001-11-17 김진우 다양한 표면 그루브패턴을 갖는 연마패드
US6736709B1 (en) * 2000-05-27 2004-05-18 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
US6913517B2 (en) 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US7377840B2 (en) * 2004-07-21 2008-05-27 Neopad Technologies Corporation Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs
US7252582B2 (en) * 2004-08-25 2007-08-07 Jh Rhodes Company, Inc. Optimized grooving structure for a CMP polishing pad
JP2007007771A (ja) 2005-06-30 2007-01-18 Mitsubishi Materials Techno Corp 研磨パット及び研磨機
US7226339B2 (en) 2005-08-22 2007-06-05 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
KR100882045B1 (ko) * 2006-02-15 2009-02-09 어플라이드 머티어리얼스, 인코포레이티드 그루브형 서브패드를 구비한 폴리싱 장치
US7234224B1 (en) * 2006-11-03 2007-06-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Curved grooving of polishing pads
US9180570B2 (en) * 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
TWI449597B (zh) * 2008-07-09 2014-08-21 Iv Technologies Co Ltd 研磨墊及其製造方法

Also Published As

Publication number Publication date
CN104781913A (zh) 2015-07-15
TW201429621A (zh) 2014-08-01
CN104781913B (zh) 2017-10-20
US9687956B2 (en) 2017-06-27
KR20150082463A (ko) 2015-07-15
SG11201503496YA (en) 2015-06-29
TWI633970B (zh) 2018-09-01
WO2014074521A1 (en) 2014-05-15
KR102148050B1 (ko) 2020-10-14
JP2015533668A (ja) 2015-11-26
US20150298287A1 (en) 2015-10-22

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