KR102148050B1 - 오프셋 동심형 그루빙 패턴을 갖는 폴리싱 패드, 및 이로써 기판을 폴리싱하는 방법 - Google Patents

오프셋 동심형 그루빙 패턴을 갖는 폴리싱 패드, 및 이로써 기판을 폴리싱하는 방법 Download PDF

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KR102148050B1
KR102148050B1 KR1020157014705A KR20157014705A KR102148050B1 KR 102148050 B1 KR102148050 B1 KR 102148050B1 KR 1020157014705 A KR1020157014705 A KR 1020157014705A KR 20157014705 A KR20157014705 A KR 20157014705A KR 102148050 B1 KR102148050 B1 KR 102148050B1
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South Korea
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less
grooves
concentricity
center
polishing
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Korean (ko)
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KR20150082463A (ko
Inventor
칭-밍 차이
쉬-웨이 쳉
쿤-슈 양
지아-쳉 수
쉥-후안 리우
펭-치 수
크레이그 콕존
Original Assignee
캐보트 마이크로일렉트로닉스 코포레이션
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Publication of KR20150082463A publication Critical patent/KR20150082463A/ko
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    • H01L21/304—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020157014705A 2012-11-06 2013-11-05 오프셋 동심형 그루빙 패턴을 갖는 폴리싱 패드, 및 이로써 기판을 폴리싱하는 방법 Active KR102148050B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261723226P 2012-11-06 2012-11-06
US61/723,226 2012-11-06
PCT/US2013/068523 WO2014074521A1 (en) 2012-11-06 2013-11-05 Polishing pad with offset concentric grooving pattern and method for polishing a substrate therewith

Publications (2)

Publication Number Publication Date
KR20150082463A KR20150082463A (ko) 2015-07-15
KR102148050B1 true KR102148050B1 (ko) 2020-10-14

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Application Number Title Priority Date Filing Date
KR1020157014705A Active KR102148050B1 (ko) 2012-11-06 2013-11-05 오프셋 동심형 그루빙 패턴을 갖는 폴리싱 패드, 및 이로써 기판을 폴리싱하는 방법

Country Status (7)

Country Link
US (1) US9687956B2 (https=)
JP (1) JP6336997B2 (https=)
KR (1) KR102148050B1 (https=)
CN (1) CN104781913B (https=)
SG (1) SG11201503496YA (https=)
TW (1) TWI633970B (https=)
WO (1) WO2014074521A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449597B (zh) 2008-07-09 2014-08-21 Iv Technologies Co Ltd 研磨墊及其製造方法
KR101455919B1 (ko) * 2013-01-18 2014-11-03 주식회사 엘지실트론 웨이퍼 양면 연마 장치의 정반 구조
US20170232573A1 (en) * 2016-02-12 2017-08-17 Kabushiki Kaisha Toshiba Polishing member and semiconductor manufacturing method
US10864612B2 (en) * 2016-12-14 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad and method of using
US10861702B2 (en) * 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
US10857647B2 (en) * 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method
US10777418B2 (en) * 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
US10857648B2 (en) * 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
US12048980B2 (en) * 2017-08-25 2024-07-30 3M Innovative Properties Company Surface projection polishing pad
TWI642516B (zh) * 2017-10-02 2018-12-01 智勝科技股份有限公司 研磨墊以及研磨方法
CN108381331B (zh) * 2018-03-22 2020-02-18 大连理工大学 一种平面零件全局修形加工装置和方法
US11298794B2 (en) * 2019-03-08 2022-04-12 Applied Materials, Inc. Chemical mechanical polishing using time share control
CN112548845B (zh) * 2021-02-19 2021-09-14 清华大学 一种基板加工方法

Citations (2)

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JP2007007771A (ja) 2005-06-30 2007-01-18 Mitsubishi Materials Techno Corp 研磨パット及び研磨機
JP2007227915A (ja) * 2006-02-15 2007-09-06 Applied Materials Inc 表面の研磨

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US5842910A (en) * 1997-03-10 1998-12-01 International Business Machines Corporation Off-center grooved polish pad for CMP
KR20010002471A (ko) * 1999-06-15 2001-01-15 고석태 화학적 기계적 폴리싱 장치용 폴리싱 패드의 그루브 패턴
KR100314866B1 (ko) 1999-10-05 2001-11-17 김진우 다양한 표면 그루브패턴을 갖는 연마패드
US6736709B1 (en) * 2000-05-27 2004-05-18 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
US6913517B2 (en) 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US7377840B2 (en) * 2004-07-21 2008-05-27 Neopad Technologies Corporation Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs
US7252582B2 (en) * 2004-08-25 2007-08-07 Jh Rhodes Company, Inc. Optimized grooving structure for a CMP polishing pad
US7226339B2 (en) 2005-08-22 2007-06-05 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
US7234224B1 (en) * 2006-11-03 2007-06-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Curved grooving of polishing pads
US9180570B2 (en) * 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
TWI449597B (zh) * 2008-07-09 2014-08-21 Iv Technologies Co Ltd 研磨墊及其製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007007771A (ja) 2005-06-30 2007-01-18 Mitsubishi Materials Techno Corp 研磨パット及び研磨機
JP2007227915A (ja) * 2006-02-15 2007-09-06 Applied Materials Inc 表面の研磨

Also Published As

Publication number Publication date
CN104781913A (zh) 2015-07-15
TW201429621A (zh) 2014-08-01
CN104781913B (zh) 2017-10-20
US9687956B2 (en) 2017-06-27
KR20150082463A (ko) 2015-07-15
JP6336997B2 (ja) 2018-06-06
SG11201503496YA (en) 2015-06-29
TWI633970B (zh) 2018-09-01
WO2014074521A1 (en) 2014-05-15
JP2015533668A (ja) 2015-11-26
US20150298287A1 (en) 2015-10-22

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