JP6324778B2 - ダイボンダの実装位置補正方法並びにダイボンダ及びボンディング方法 - Google Patents

ダイボンダの実装位置補正方法並びにダイボンダ及びボンディング方法 Download PDF

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JP6324778B2
JP6324778B2 JP2014055326A JP2014055326A JP6324778B2 JP 6324778 B2 JP6324778 B2 JP 6324778B2 JP 2014055326 A JP2014055326 A JP 2014055326A JP 2014055326 A JP2014055326 A JP 2014055326A JP 6324778 B2 JP6324778 B2 JP 6324778B2
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die bonder
mounting position
bonding head
curve
recognition camera
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JP2015179689A (ja
JP2015179689A5 (enExample
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良英 石井
良英 石井
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Fasford Technology Co Ltd
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JP2014055326A 2014-03-18 2014-03-18 ダイボンダの実装位置補正方法並びにダイボンダ及びボンディング方法 Active JP6324778B2 (ja)

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JP2015179689A JP2015179689A (ja) 2015-10-08
JP2015179689A5 JP2015179689A5 (enExample) 2017-03-23
JP6324778B2 true JP6324778B2 (ja) 2018-05-16

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JP6667326B2 (ja) * 2016-03-17 2020-03-18 ファスフォードテクノロジ株式会社 ダイボンダおよびボンディング方法
KR102792629B1 (ko) * 2020-11-23 2025-04-04 세메스 주식회사 다이 본딩 방법 및 다이 본딩 장치

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JP2008166410A (ja) * 2006-12-27 2008-07-17 Toray Eng Co Ltd 位置決め較正方法及びそれを適用した実装装置
JP5278184B2 (ja) * 2009-06-12 2013-09-04 ソニー株式会社 部品供給装置、部品実装装置及び部品供給方法
JP2014017313A (ja) * 2012-07-06 2014-01-30 Panasonic Corp 部品実装装置

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