JP6324778B2 - Die bonder mounting position correction method, die bonder and bonding method - Google Patents

Description

  The present invention relates to a die bonder mounting position correction method, a die bonder, and a bonding method, and more particularly to a highly reliable die bonder mounting position correction method, a die bonder, and a bonding method.

  In a die bonder, a die (semiconductor chip) is vacuum-adsorbed with a bonding head, and then picked up at high speed, picked up, moved horizontally, lowered and transferred to a work such as a wiring board or lead frame that has been transported in a transport lane. Implement.

  There exists patent document 1 as a prior art of such a die bonder. In Patent Document 1, the position of the linear scale is read and feedback control is performed so that the reading position is obtained.

JP 2013-179206 A

  As the die mounting density increases, it is desired to further reduce the positional accuracy required for transporting the die to an accurate position and accurately bonding it from about 2 to 3 μm.

  As in the prior art, position feedback control using a simple linear scale does not absorb variations in positional accuracy due to drive systems such as ball screws and manufacturing / mounting errors such as linear slides and linear scales. It was difficult. As a method to reduce such variation in positional accuracy, assuming that the die is actually mounted on the workpiece, a dummy die is mounted on the workpiece or a die is virtually mounted after attaching a needle to the bonding head. For example, the position information data on which about 2000 points of dies should be mounted is obtained by executing the mounting operation and plotting the positions where the dies are mounted on the workpiece. Based on this data, the position information is obtained. It is conceivable to correct this. However, such a method is very time consuming and labor intensive, and it is difficult to process and handle a huge amount of data.

  The present invention has been made in view of the above-described problems. By calculating the periodicity of a drive system such as a linear scale of a die bonder or a ball screw and correcting the positional accuracy, the position can be easily and reliably improved in a short time. An object of the present invention is to provide a die bonder mounting position correcting method, a die bonder and a bonding method capable of correcting the accuracy.

  In order to achieve the above object, the present invention has at least the following features.

  The present invention relates to a die bonder mounting position correction method or a die bonder, which is placed in parallel with a moving direction of a driving target, and sequentially moves the driving target with the positions of a plurality of marks provided at predetermined intervals as target values. , Mark the drive target at the target value sequentially with the camera, and sequentially detect the positioning error, which is the difference in the moving direction between the desired image position of each of the multiple marks and the actual image position obtained by imaging The target position of the drive target toward the mounting position is corrected based on an error correction periodic curve indicating the periodicity of a positioning error curve formed by positioning errors obtained for a plurality of marks.

Further, according to the present invention, the movement direction is the first direction (the same direction as the movement direction of the driving target?) And the second direction (the first direction) that moves the bonding head in a direction parallel to the conveyance direction. The position correction step may also be performed in the second direction to move the bonding head in the first direction and the second direction.
Further, in the present invention, the driving target is a bonding head and a substrate recognition camera that images a substrate that has been conveyed and defines a mounting position, and the movement direction is a first that moves the substrate recognition camera further on the conveyance path. There may be a third direction parallel to the direction, and the position correction step may also be performed in the third direction to define the mounting position.

In the present invention, the movement direction is the third direction and the fourth direction in which the substrate recognition camera is moved in the direction parallel to the second direction on the conveyance path, and is also located with respect to the fourth direction. A mounting step may be defined by performing a correction step.
Further, in the present invention, the positioning error curve may be Fourier transformed to extract a frequency having periodicity, and the error correction periodic curve may be automatically set from the frequency and the peak value of the positioning error curve.

Further, the present invention corrects the mounting position using the die bonder mounting position correction method of the present invention,
The die is mounted at a mounting position corrected by the bonding head.

  According to the present invention, it is possible to provide a die bonder mounting position correction method, a die bonder, and a bonding method capable of correcting position accuracy easily and in a short time with high reliability.

It is the conceptual diagram which looked at the die bonder which is one Embodiment of this invention from the top. FIG. 6 is a process flow that is a trigger for recognizing the drive control method that is a feature of the present invention, and is a diagram illustrating a pre-processing flow of the drive control method that is a feature of the present invention. It is a figure which shows the detection method of the positioning error of a drive shaft. It is the figure which showed the measurement position with respect to the target position of a bonding head when the space | interval of the mark obtained by the process of FIG. 2 was narrowed. It is the figure obtained by Fourier-transforming a part of positioning error curve formed with a positioning error. It is the figure which showed typically the bonding range between the conveyance rails 22. FIG. It is a flowchart which shows the method of determining the positioning range at the time of mass production. It is a figure which shows the mounting process flow based on the positioning error curve obtained by the process flow shown in FIG. It is a figure which shows the measurement result in the bonding range between the conveyance lanes of the bonding head Y drive shaft as an example of a positioning error curve. FIG. 9A shows data obtained by performing Fourier transform on measurement data in a positioning error range in which accuracy required for mass production shown in FIG. 8 is obtained. FIG. 9A shows error wave height data, and FIG. 9B shows error phase data. FIG. FIG. 9 is a diagram showing a corrected positioning error curve obtained by superimposing a periodic error correction periodic curve on FIG. 8 and subtracting the periodic error correction periodic curve from the positioning error curve. It is a figure which shows the mounting process flow based on the positioning error curve obtained by the process flow shown in FIG. This figure shows the variation and average value of the positioning error curve before correction and the positioning error curve after correction.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a conceptual view of a die bonder 10 according to an embodiment of the present invention as viewed from above. The die bonder according to this embodiment is roughly divided into a die supply unit 1, a workpiece transfer unit 2, a workpiece position recognition unit 3, a die bonding unit 4, and a control unit 5 that controls them.

  The wafer supply unit 1 includes a pickup device 11 that holds a wafer W having dies D arranged in a matrix, and a wafer recognition camera 12 that recognizes the dies D to be picked up. Further, although not shown, the wafer supply unit 1 moves the pickup device 11 in the X and Y directions to move the die D to the pick position, and pushes up the die D so that the die D can be easily picked up. Device.

  The work transport unit 2 includes a stack loader 21 that supplies a work, for example, a substrate S to the pallet P, a transport lane 22 that transports the pallet P, and an unloader unit 23 that takes out the substrate S on which the die D is mounted to the outside of the die bonder 10. Have The board | substrate S is conveyed by the position which mounts die | dye D by a workpiece conveyance part.

  The workpiece position recognition unit 3 is provided in the vicinity of the area where the die D is mounted and can recognize the workpiece, and detects the recognition mark on the conveyed substrate S. Then, the workpiece position recognition unit 3 includes a substrate recognition camera 32 that detects the position of the substrate S, a substrate recognition camera X drive shaft 33 that moves the substrate recognition camera 32 to the position of the substrate S to be mounted, and a substrate recognition camera Y drive. And a shaft 34. In the present embodiment, the substrate recognition camera X drive shaft 33 and the substrate recognition camera Y drive shaft 34 are position-controlled by detecting the position with a linear scale (not shown) having a position detection accuracy of 0.1 μm, for example.

  The die bonding unit 3 picks up a predetermined die D from the wafer 11 and mounts it on the substrate S, a bonding head mounting camera 42 mounted on the bonding head for recognizing the position of the bonding head 41, and a bonding head. A bonding head X drive shaft 43 for moving 41 to a mounting position and a bonding head Y drive shaft 44 are provided. In the present embodiment, the positions of the bonding head X drive shaft 43 and the bonding head Y drive shaft 44 are controlled by detecting positions using a linear scale (not shown) having a position detection accuracy of 0.1 μm, for example.

  With such a configuration, the bonding head 41 mounts the die picked up from the wafer W at the position of the substrate S detected by the substrate recognition camera 32.

  In the workpiece position recognition unit 3, the substrate recognition camera X drive shaft 33 and the substrate recognition camera Y drive shaft 34 that determine the position of the substrate recognition camera 32 have positioning accuracy Δεxs and Δεys, respectively. Will have position errors Δεxs and Δεys in the X and Y directions, respectively.

  The bonding position is mounted on the basis of the detection position obtained by the bonding head mounting camera 42 based on the positioning accuracy Δεxb and Δεyb of the bonding head X drive shaft 43 and the bonding head Y drive shaft 44 that drive the bonding head 41. Position control is performed with position errors Δεxb and Δεyb in the X and Y directions, respectively.

Therefore, in order to keep the die within a predetermined positioning error Δε μm, the positioning accuracy of each axis needs to satisfy the formula (1).
Δεxs + Δεxb, Δεys + Δεyb ≦ Δε (1)

  FIG. 2 is a process flow that triggered the recognition of the drive control method that is a feature of the present invention, and is a diagram showing a pre-processing flow of the drive control method that is a feature of the present invention. Data processing in the processing flow shown in FIG. 2 is performed by a preprocessing unit 51 having an image processing unit built in the control unit 5.

  First, a measurement scale on which marks are accurately provided at every predetermined interval ΔL is placed in parallel with the moving direction of the drive shaft (step S1). The camera, for example, images the outermost mark at the origin as the reference mark Ms, and detects the reference image position Ps of the reference mark Ms (step S2). As shown in FIG. 3, if the drive shaft has moved to the next marks M1, M2, M3,... Sequentially with an interval .DELTA.L, the camera and the mark Mn (n = 1, 2, 3,...). Therefore, the reference image position of the mark Mn is always Ps.

  Therefore, the drive shaft is moved by an interval ΔL to image the mark Mn, the image position Pn of the mark Mn is detected (step S3), and the deviation from the reference image position Ps that is the position where the mark Mn of the image position Pn should be. The positioning error Δε (ΔX or ΔY) is obtained (step S4). Steps S3 and S4 are performed for all marks (step S5). Next, a positioning error curve fε is created from the positioning error Δε obtained for each mark (step S6).

  In the above method, the mark is picked up by moving the drive shaft at intervals of ΔL, and the deviation of the obtained image from the image position where the mark should be is regarded as a positioning error. The drive shaft may be moved so as to reach the position, and the displacement of the drive shaft at that time may be a positioning error.

  Even if the measurement scale is not parallel to the moving direction, the reference image position Ps shifts with a certain inclination, so that the same data as when it is made parallel can be obtained by correcting the inclination. it can.

  FIG. 4 is a diagram showing an actual measurement position with respect to the target position of the bonding head 41 when the mark interval ΔL obtained by the process of FIG. 2 is narrowed to 25 μm. ft is a target position straight line ft, and fr is an actually measured position curve. FIG. 5 is a diagram showing a peak value curve indicating the magnitude of each positioning error obtained by Fourier transform of a part of the positioning error curve fε formed by positioning error Δε = fr−ft. Of course, the entire range of the positioning error curve fε may be Fourier transformed.

  As can be seen from FIG. 5, the positioning error curve fε has a periodicity having a frequency fs. In addition, it was found that the periodicity depends on the pitch of the ball screw of the driving system and the magnetic pole of the linear motor, and it is not necessary to make the mark interval ΔL too large.

  Therefore, when creating the positioning error curve fε, it is necessary to determine a range for acquiring and measuring data. FIG. 6 is a diagram schematically showing a bonding range between the conveyance rails 22. Conventionally, positioning errors at all cross points shown in a matrix form are obtained in advance, stored in a memory, and corrected by the positioning errors at the time of mass production and bonded.

  On the other hand, in the present embodiment, a positioning error within a certain range, for example, a thick solid line frame shown in FIG. 6 or a thick broken line frame is obtained, and the entire bonding range is partially covered by using periodicity characteristics. Correction is performed based on the positioning error obtained in the above and bonding is performed.

  The method for determining the positioning range during mass production will be described more specifically with reference to FIG. In this embodiment, when a so-called device is completed, which is a stage before mass production of semiconductor devices, it is about 2 to 10 times the ball screw pitch or the pitch of a drive system such as a linear motor magnet that causes a periodic error. For example, a range indicated by a thick broken line frame is set (step S1). The set range is measured based on FIG. 2, and the characteristic of positioning error, that is, periodicity is confirmed from the measurement data (step S2). After that, in mass production and correction after shipping, relocation, maintenance, etc. of die bonder, positioning error range that can obtain the required accuracy based on the data of the above-mentioned periodic positioning error acquired when the device is completed, For example, a range indicated by a thick solid line is obtained (steps S3 to S6).

As a result, the time required for correction can be greatly reduced by measuring only the range indicated by the thick broken line, and the number of positioning error data can be greatly reduced by storing only the data in the range indicated by the thick solid line.
Next, actual examples of the positioning error curve fε and the error correction period curve for correcting the positioning error will be described with reference to FIGS.

  FIG. 8 is a diagram showing a measurement result in the Y direction, for example, with a thick dashed line in the bonding range between the transport lanes 22 of the bonding head Y drive shaft 44 as an example of the positioning error curve fε. At this time, the pitch of the ball screw on the Y drive shaft is 5 mm, and the mark interval ΔL of the measurement scale is 1 mm.

  The curve shown by the thick solid line shown in FIG. 8 shows the measurement data of the positioning error range obtained in FIG. 7 in the accuracy required for mass production, and the curve shown by the thin solid line shows the effect of this embodiment. For this reason, it is temporarily illustrated and is data that is not used to obtain the error correction period curve fh.

  FIG. 9 shows data obtained by Fourier-transforming the measurement data in the positioning error range in which the accuracy required for mass production shown in FIG. 8 can be obtained, FIG. 9A shows the error wave height data, and FIG. Indicates error phase data.

The error correction period curve fh (y) shown by a thick broken line in FIG. 10 that corrects the positioning error Δε using periodicity over the entire bonding range is an error representing the magnitude obtained from the Fourier transform of the positioning error curve fε. It is obtained from the wave height data m (y) and error phase data p (y) representing the phase by the following equation. y represents the frequency in the Y direction in the frequency range (0-0.5).
fh (y) = m (f1) * sin (y * f1 + p (f1)) + m (f2) * sin (y * f2 + p (f2)) +
m (f3) × sin (y × f3 + p (f3)) (2)
Here, f1, f2, and f3 are defined frequencies that define the error correction period curve fh (y).
The specified frequency is determined by setting a threshold value based on target position accuracy and selecting a frequency having a large positioning error or a characteristic frequency among positioning errors equal to or higher than the threshold value. If a predetermined position accuracy cannot be obtained with the set threshold value, the threshold value is decreased. In this example, three locations f1, f2, and f3 shown in FIG. 9A are set as the prescribed frequencies.

The error correction cycle curve fh (y) obtained as described above is indicated by a thick broken line in FIG. 10, and thereafter, the error correction cycle curve fh (y) is repeatedly used to obtain a corrected positioning error.
In this example, three specified frequencies are selected, but may be four or five. The larger the number, the more accurately it can be corrected, but the error correction periodic curve fh becomes complicated. In that case, the error correction periodic curve fh may be fitted with a quadratic function, for example.

  Next, a mounting process flow based on the positioning error curve fε obtained by the process flow shown in FIG. 2 will be described with reference to FIG.

  The operator looks at the error wave height data m (y) obtained from the Fourier transform of the positioning error curve fε shown in FIG. 9A and selects the periods f1, f2, and f3, and the preprocessing unit 51 uses the equation (2). Thus, an error correction period curve fh indicated by a broken line in FIG. 10 is determined, and correction data for one period is stored in the memory in the control unit 5 (step S7).

  In the present embodiment, the operator determines f1, f2, and f3 by looking at the error wave height data m (y) shown in FIG. Of course, in the pre-processing unit 51, predetermined selection criteria and order such as a large positioning error or a characteristic frequency among positioning errors of a threshold value or more from the error wave height data m (y) shown in FIG. And f1, f2, and f3 may be automatically selected. The characteristic frequency includes, for example, a frequency fs indicating periodicity (f2 in FIG. 9A).

  The preprocessing unit 51 obtains the error correction cycle curve fh shown above for each line in the X and Y directions shown in the positioning measurement range shown in FIG. 6 during mass production, and the correction data for each cycle is obtained. It memorize | stores in the memory in the control part 5 (step S8).

  Next, an error correction cycle curve fh is determined for the X drive axis of the bonding head 41 and the X and Y drive axes of the substrate recognition camera 32 in the same manner as in FIG. 10, and correction data for one cycle is stored in the memory. Store (step S9). FIG. 10 shows a corrected positioning error curve fhε obtained by superimposing the periodic error correction periodic curve fh on the positioning error curve fε shown in FIG. 8 and subtracting the periodic error correction periodic curve fh from the positioning error curve fε. FIG.

  FIG. 12 shows a variation 3σ and an average value of each data of the positioning error curve fε before correction and the positioning error curve fhε after correction. The corrected positioning error Δεyb is 0.7 μm as an average value.

  Similarly, the corrected positioning errors Δεyb, Δεxs, and Δεys for the X drive axis of the bonding head 41 and the X and Y drive axes of the substrate recognition camera 32 can be expected to be about 0.7 μm as average values. Therefore, in the formula (1), ε can be set to 1.5 μm or less as compared with 7.4 μm of the prior art.

  Further, when this periodicity is further independent in the X and Y directions, it is not necessary to obtain correction data by the error correction cycle curve fh in the entire positioning measurement range during mass production, as described above. The correction data based on the error correction periodic curve fh may be obtained.

  Therefore, in this case, the correction data stored for correction is also compared with the method of obtaining correction data in a matrix in the X and Y directions, for example, even if the mark interval ΔL = 1 mm at a cycle of 5 mm, the bonding range is 60 mm. In the case of (X) × 30 mm (Y), 60 × 30 = 1800 positioning errors are corrected data, and in the present embodiment, a maximum of 60 + 30 positioning errors are obtained. On the other hand, for example, a total of six correction data of three f1, f2, and f3 can be dealt with by the error correction period curve fh.

  Furthermore, since the time for obtaining the correction data is 2 hours for 30 + 60 = 90 processes in this embodiment, 30 × 60 = 1800 for 20 times and 40 hours of process for obtaining a matrix. I need time. Therefore, according to the present embodiment, work efficiency can be improved.

  If the mark interval ΔL is set to a smaller value in the method of taking data in a matrix, the effect of the number of correction data and the processing time becomes larger.

Next, the mounting process entered from step S10 in FIG. 11 will be described.
In step S10, the mounting position is corrected from the correction data of the error correction curve fh. The mounting position is detected by the substrate recognizing camera 32 on the order of 0.1 μm of scale decomposition by the recognition mark of the substrate S to be bonded next. For example, Y = 12.1255 mm is detected with respect to the position in the Y direction. Therefore, interpolation processing is performed between 12 mm and 13 mm of the error correction curve fh. If the error correction curve fh has a period of 5 mm, the correction data of 2 mm and 3 mm corresponding to one period of the error correction period curve fh are linearly complemented to obtain a correction value for correction. If the correction value is −3 to 8 μm, the corrected mounting position is 12.1217 mm.

  Next, the target position of the bonding head 41 is set so that the corrected mounting position is obtained. For example, since the mounting position in the Y direction after the correction in step 10 is 12.1217 mm, the value of the error correction periodic curve fh at 12.1217 mm in FIG. A certain target position is corrected (step S11).

  The bonding head 41 is controlled at the corrected mounting position, and the die D is mounted (step S12). Steps S9 to 11 are performed for all the dies D (step S13).

  According to the embodiments described above, it is possible to provide a highly reliable die bonder mounting position correction method and die bonder that can be mounted with high positional accuracy.

  In the embodiment described above, the positioning error data obtained by using the measurement scale for all of the two driving axes X and Y of the bonding head, the two driving axes X and Y of the substrate recognition camera, and the total of four driving axes. Based on this, positioning correction was performed.

  However, for example, with respect to the X and Y drive axes of the substrate recognition camera, a predetermined accuracy can be ensured by other methods, or even in the bonding head, the X drive axis has a small movable range and requires an accuracy correction. In other cases, it is not always necessary to apply the present invention to all drive shafts. It is particularly important to mount the die accurately on the Y drive shaft of the bonding head having a large movable range.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

1: Die supply unit 2: Work transfer unit 3: Work position recognition unit 4: Die bonding unit 5: Control unit 10: Die bonder 11: Pickup device 12: Wafer recognition camera 22: Transfer lane 32: Substrate recognition camera 33: Substrate recognition Camera X drive axis 34: Substrate recognition camera Y drive axis 41: Bonding head 42: Bonding head mounted camera 43: Bonding head X drive axis 44: Bonding head Y drive axis 51: Pre-processing unit D: Die fh: Error correction period curve fhε: positioning error curve fr: measured position curve fs: frequency indicating periodicity ft: target position straight line fε: positioning error curve
S: Substrate W: Wafer ΔL: Mark interval Δε: Positioning error

Claims (15)

A bonding position correction method for a die bonder in which a bonding head moves toward a mounting position of a work that has been transported on a transport path, and a mounted die is mounted at the mounting position.
Said parallel to placed in the moving direction to move the bonding head, the position of a plurality of marks provided at regular intervals sequentially moving the bonding head as a target value, said mark the bonding head has come to the target value the sequentially captured by a camera mounted on the bonding head, successively the positioning error is the difference between the moving direction of the actual image position obtained by image shooting with each of there should image the position of the plurality of marks Detecting and correcting a target position where the bonding head moves toward the mounting position based on an error correction periodic curve indicating the periodicity of a positioning error curve formed by the positioning errors obtained for a plurality of the marks. A position correction step to
Before SL movement direction is a first direction perpendicular to the conveying direction of the workpiece,
A mounting position correction method for a die bonder, characterized by: A method for correcting a mounting position of a die bonder according to claim 1,
The moving direction is the first direction and a second direction for moving the bonding head in a direction parallel to the transport direction,
The position correction step is also performed for the second direction, and the bonding head is moved in the first direction and the second direction.
A mounting position correction method for a die bonder, characterized by: A mounting position correcting method for a die bonder according to claim 2 ,
Further, the substrate recognition camera is placed in parallel with the moving direction of the substrate recognition camera for detecting the position of the substrate, and the substrate recognition camera is sequentially moved with the positions of a plurality of marks provided at equal intervals as a target value. The camera sequentially captures the marks that have reached the target value, and sequentially determines a positioning error that is a difference in the moving direction between the image position that each of the plurality of marks should be and the actual image position obtained by the imaging. A target position where the substrate recognition camera moves toward the mounting position is detected based on an error correction periodic curve that is detected and indicates a periodicity of a positioning error curve formed by the positioning errors obtained for a plurality of the marks. A correction step for correcting,
The moving direction, Ru third direction der parallel to said first direction to further the board recognition camera moves the conveying path,
A mounting position correction method for a die bonder, characterized by: A method for correcting a mounting position of a die bonder according to claim 3 ,
The moving direction is the third direction and a fourth direction in which the substrate recognition camera is moved in a direction parallel to the second direction on the conveyance path.
Performed before Kiho positive step against the fourth direction, defining the mounting position,
A mounting position correction method for a die bonder, characterized by: A method for correcting a mounting position of a die bonder according to any one of claims 1 to 4,
Extracting the frequency having the periodicity by Fourier transforming the positioning error curve, and automatically setting the error correction periodic curve from the frequency and the peak value of the positioning error curve;
A mounting position correction method for a die bonder, characterized by: A die bonder mounting position correction method according to claim 1 or 2,
The image position is before Symbol to is an imaging position of the mark obtained by the first image pickup,
A mounting position correction method for a die bonder, characterized by: A die bonder mounting position correction method according to claim 3 or 4,
The image position is before Symbol to is an imaging position of the mark first the board recognition camera is obtained by the imaging,
A mounting position correction method for a die bonder, characterized by: The mounting position is corrected using the die bonder mounting position correction method according to any one of claims 1 to 7,
A bonding method comprising mounting the die at the mounting position corrected by the bonding head. The bonding head moves toward the mounting position of the workpiece that has been transported on the transport path, and is a die bonder that mounts the mounted die at the mounting position,
Said parallel to placed in the moving direction to move the bonding head, the position of a plurality of marks provided at regular intervals sequentially moving the bonding head as a target value, said mark the bonding head has come to the target value the sequentially captured by a camera mounted on the bonding head, successively the positioning error is the difference between the moving direction of the actual image position obtained by image shooting with each of there should image the position of the plurality of marks A memory for detecting and storing a previously obtained error correction periodic curve indicating a periodicity of a positioning error curve formed by the positioning errors obtained for a plurality of the marks;
Position correcting means for correcting a target position at which the bonding head moves toward the mounting position based on the error correction periodic curve,
Before SL movement direction is a first direction perpendicular to the conveying direction of the workpiece,
A die bonder characterized by that. A die bonder according to claim 9, wherein
The moving direction is the first direction and a second direction for moving the bonding head in a direction parallel to the transport direction,
The memory stores the error correction periodic curve obtained in advance for the second direction,
The position correction means also corrects the target position of the bonding head based on the error correction period curve in the second direction, and moves the bonding head in the first direction and the second direction. Move,
A die bonder characterized by that. A die bonder according to claim 10 , wherein
The memory is further placed in parallel with the movement direction of the substrate recognition camera that detects the position of the substrate, and sequentially moves the substrate recognition camera with the positions of a plurality of marks provided at equal intervals as target values. The difference between the moving direction between the image position of each of the plurality of marks and the actual image position obtained by imaging the marks that have reached the target value sequentially by the board recognition camera. Detecting positioning error sequentially, storing a previously obtained error correction periodic curve indicating the periodicity of the positioning error curve formed by the positioning error obtained for a plurality of the marks ,
The movement direction further includes a third direction parallel to the first direction for moving the substrate recognition camera on the conveyance path,
Before Symbol position correction means, said corrects the target position of the board recognition camera, defining the mounting position on the basis of said error correction cycle curve with respect to said third direction,
A die bonder characterized by that. A die bonder according to claim 11 ,
The moving direction is the third direction and a fourth direction in which the substrate recognition camera is moved in a direction parallel to the second direction on the conveyance path.
The memory stores the error correction periodic curve obtained in advance for the fourth direction,
The position correction means corrects the target position of the substrate recognition camera based on the error correction periodic curve also in the fourth direction, and defines the mounting position.
A die bonder characterized by that. A die bonder according to any one of claims 9 to 12,
Each of the positioning error curves is Fourier-transformed to extract a frequency having the periodicity, and each error correction periodic curve is automatically set from the frequency and a peak value of the positioning error curve.
A die bonder characterized by that. The die bonder according to claim 9 or 10, wherein
The image position is before Symbol to is an imaging position of the mark obtained by the first image pickup,
A die bonder characterized by that. A die bonder according to claim 11 or 12,
The image position is before Symbol to is an imaging position of the mark first the board recognition camera is obtained by the imaging,
A die bonder characterized by that.

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