JP2015179689A5 - - Google Patents

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Publication number
JP2015179689A5
JP2015179689A5 JP2014055326A JP2014055326A JP2015179689A5 JP 2015179689 A5 JP2015179689 A5 JP 2015179689A5 JP 2014055326 A JP2014055326 A JP 2014055326A JP 2014055326 A JP2014055326 A JP 2014055326A JP 2015179689 A5 JP2015179689 A5 JP 2015179689A5
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JP
Japan
Prior art keywords
die bonder
mounting position
bonding head
camera
substrate recognition
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Application number
JP2014055326A
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English (en)
Japanese (ja)
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JP6324778B2 (ja
JP2015179689A (ja
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Priority to JP2014055326A priority Critical patent/JP6324778B2/ja
Priority claimed from JP2014055326A external-priority patent/JP6324778B2/ja
Publication of JP2015179689A publication Critical patent/JP2015179689A/ja
Publication of JP2015179689A5 publication Critical patent/JP2015179689A5/ja
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Publication of JP6324778B2 publication Critical patent/JP6324778B2/ja
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JP2014055326A 2014-03-18 2014-03-18 ダイボンダの実装位置補正方法並びにダイボンダ及びボンディング方法 Active JP6324778B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014055326A JP6324778B2 (ja) 2014-03-18 2014-03-18 ダイボンダの実装位置補正方法並びにダイボンダ及びボンディング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014055326A JP6324778B2 (ja) 2014-03-18 2014-03-18 ダイボンダの実装位置補正方法並びにダイボンダ及びボンディング方法

Publications (3)

Publication Number Publication Date
JP2015179689A JP2015179689A (ja) 2015-10-08
JP2015179689A5 true JP2015179689A5 (enExample) 2017-03-23
JP6324778B2 JP6324778B2 (ja) 2018-05-16

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ID=54263585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014055326A Active JP6324778B2 (ja) 2014-03-18 2014-03-18 ダイボンダの実装位置補正方法並びにダイボンダ及びボンディング方法

Country Status (1)

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JP (1) JP6324778B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6667326B2 (ja) * 2016-03-17 2020-03-18 ファスフォードテクノロジ株式会社 ダイボンダおよびボンディング方法
KR102792629B1 (ko) * 2020-11-23 2025-04-04 세메스 주식회사 다이 본딩 방법 및 다이 본딩 장치

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008166410A (ja) * 2006-12-27 2008-07-17 Toray Eng Co Ltd 位置決め較正方法及びそれを適用した実装装置
JP5278184B2 (ja) * 2009-06-12 2013-09-04 ソニー株式会社 部品供給装置、部品実装装置及び部品供給方法
JP2014017313A (ja) * 2012-07-06 2014-01-30 Panasonic Corp 部品実装装置

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