JP6324637B1 - ポリッシングバッドの凹部形成方法およびポリッシングパッド - Google Patents

ポリッシングバッドの凹部形成方法およびポリッシングパッド Download PDF

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Publication number
JP6324637B1
JP6324637B1 JP2017553193A JP2017553193A JP6324637B1 JP 6324637 B1 JP6324637 B1 JP 6324637B1 JP 2017553193 A JP2017553193 A JP 2017553193A JP 2017553193 A JP2017553193 A JP 2017553193A JP 6324637 B1 JP6324637 B1 JP 6324637B1
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Japan
Prior art keywords
polishing pad
polishing
recess
layer
forming
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JP2017553193A
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English (en)
Japanese (ja)
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JPWO2018142623A1 (ja
Inventor
邦晴 大石
邦晴 大石
達広 海野
達広 海野
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Daiki Co Ltd
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Daiki Co Ltd
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Publication of JPWO2018142623A1 publication Critical patent/JPWO2018142623A1/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2017553193A 2017-02-06 2017-02-06 ポリッシングバッドの凹部形成方法およびポリッシングパッド Active JP6324637B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/004259 WO2018142623A1 (ja) 2017-02-06 2017-02-06 ポリッシングバッドの凹部形成方法およびポリッシングパッド

Publications (2)

Publication Number Publication Date
JP6324637B1 true JP6324637B1 (ja) 2018-05-16
JPWO2018142623A1 JPWO2018142623A1 (ja) 2019-02-07

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JP2017553193A Active JP6324637B1 (ja) 2017-02-06 2017-02-06 ポリッシングバッドの凹部形成方法およびポリッシングパッド

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JP (1) JP6324637B1 (zh)
CN (1) CN109562506B (zh)
WO (1) WO2018142623A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115805523A (zh) * 2022-12-29 2023-03-17 西安奕斯伟材料科技有限公司 定盘、抛光设备和抛光方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5232470A (en) * 1990-05-21 1993-08-03 Wiand Ronald C Flexible one-piece diamond sheet material with spaced apart abrasive portions
JP2006346805A (ja) * 2005-06-15 2006-12-28 Toyo Tire & Rubber Co Ltd 積層研磨パッド
JP2009520343A (ja) * 2005-11-30 2009-05-21 アプライド マテリアルズ インコーポレイテッド 表面粗さを備えた研磨パッド
JP2013202775A (ja) * 2012-03-29 2013-10-07 Fujibo Holdings Inc 研磨パッド及び研磨パッドの製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5339680B2 (ja) * 2006-02-15 2013-11-13 アプライド マテリアルズ インコーポレイテッド 表面の研磨
CN103648718A (zh) * 2011-07-15 2014-03-19 东丽株式会社 研磨垫
US9522454B2 (en) * 2012-12-17 2016-12-20 Seagate Technology Llc Method of patterning a lapping plate, and patterned lapping plates
US10160092B2 (en) * 2013-03-14 2018-12-25 Cabot Microelectronics Corporation Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
TWI597125B (zh) * 2014-09-25 2017-09-01 三芳化學工業股份有限公司 拋光墊及其製造方法
CN204108814U (zh) * 2014-09-28 2015-01-21 中芯国际集成电路制造(北京)有限公司 研磨垫

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5232470A (en) * 1990-05-21 1993-08-03 Wiand Ronald C Flexible one-piece diamond sheet material with spaced apart abrasive portions
JP2006346805A (ja) * 2005-06-15 2006-12-28 Toyo Tire & Rubber Co Ltd 積層研磨パッド
JP2009520343A (ja) * 2005-11-30 2009-05-21 アプライド マテリアルズ インコーポレイテッド 表面粗さを備えた研磨パッド
JP2013202775A (ja) * 2012-03-29 2013-10-07 Fujibo Holdings Inc 研磨パッド及び研磨パッドの製造方法

Also Published As

Publication number Publication date
CN109562506A (zh) 2019-04-02
CN109562506B (zh) 2021-11-12
JPWO2018142623A1 (ja) 2019-02-07
WO2018142623A1 (ja) 2018-08-09

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