JP6324372B2 - 撮像装置 - Google Patents
撮像装置 Download PDFInfo
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- JP6324372B2 JP6324372B2 JP2015508483A JP2015508483A JP6324372B2 JP 6324372 B2 JP6324372 B2 JP 6324372B2 JP 2015508483 A JP2015508483 A JP 2015508483A JP 2015508483 A JP2015508483 A JP 2015508483A JP 6324372 B2 JP6324372 B2 JP 6324372B2
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- 238000003384 imaging method Methods 0.000 title claims description 35
- 238000012546 transfer Methods 0.000 claims description 48
- 238000012545 processing Methods 0.000 claims description 38
- 238000001514 detection method Methods 0.000 claims description 37
- 238000007599 discharging Methods 0.000 claims description 30
- 238000009825 accumulation Methods 0.000 claims description 10
- 230000003321 amplification Effects 0.000 claims description 7
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 7
- 239000003990 capacitor Substances 0.000 description 19
- 238000001228 spectrum Methods 0.000 description 14
- 230000005284 excitation Effects 0.000 description 13
- 230000006870 function Effects 0.000 description 13
- 230000000875 corresponding effect Effects 0.000 description 12
- 238000002060 fluorescence correlation spectroscopy Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 230000008859 change Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000004088 simulation Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 230000002123 temporal effect Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 101100191136 Arabidopsis thaliana PCMP-A2 gene Proteins 0.000 description 4
- 101100048260 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) UBX2 gene Proteins 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000005070 sampling Methods 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 3
- 238000005311 autocorrelation function Methods 0.000 description 2
- 230000003915 cell function Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005653 Brownian motion process Effects 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005537 brownian motion Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000005314 correlation function Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/64—Fluorescence; Phosphorescence
- G01N21/645—Specially adapted constructive features of fluorimeters
- G01N21/6456—Spatial resolved fluorescence measurements; Imaging
- G01N21/6458—Fluorescence microscopy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/616—Noise processing, e.g. detecting, correcting, reducing or removing noise involving a correlated sampling function, e.g. correlated double sampling [CDS] or triple sampling
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/64—Fluorescence; Phosphorescence
- G01N2021/6417—Spectrofluorimetric devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
|F(0)|=(g1+g3)2/2,
|F(ω)|=(g1 2+2g2 2+g3 2−2g1g2−2g2g3)/2
g=Af
によって表される。ここで、A=(1+cosω1t,1+sinω1t,1−cosω1t,…,1+cosωKt,1+sinωKt)とする。データ処理部109は、計測したgから、上述した関係式を用いてパワースペクトルに変換できる。
g’=Bf,
AB−1g’=AB−1Bf=Af=g
正弦波基底を用いて各パワースペクトル成分を別々に求める場合、L個のパワースペクトルを求めるために、3L個の基底関数が必要である。それに対し、適切な基底関数を選ぶことにより、2L+1個の基底関数により、同数のパワースペクトル成分を得ることができる。
Claims (6)
- 光を電荷に変換する複数の画素回路と、
前記複数の画素回路のそれぞれに接続された複数の信号処理回路と、
前記画素回路と前記信号処理回路の動作を制御する制御回路とを備え、
前記画素回路は、
光を電荷に変換する受光部と、前記受光部の中心部から端部にかけて形成された長手状の電荷排出部と、前記電荷排出部の前記端部側に設けられた一時蓄積部と、前記一時蓄積部を囲むように配置された複数の転送ゲートと、前記一時蓄積部において前記複数の転送ゲートのそれぞれを挟んで設けられた複数の電荷検出部とを有し、
前記複数の信号処理回路は、それぞれ、前記複数の電荷検出部のそれぞれに対応して設けられた複数の読み出し回路を有し、
前記読み出し回路のそれぞれは、前記電荷検出部からの電圧信号をインピーダンス変換して読み出すソースフォロアアンプと、前記電圧信号からリセットノイズを除去して増幅するゲインアンプと、前記ゲインアンプの出力する電圧信号を並列に受ける複数のサンプルホールド回路とを含み、
前記制御回路は、前記画素回路におけるリセット動作、電荷蓄積動作、及び電荷読み出し動作を前記複数の電荷検出部に対応してパイプライン処理で実行するように制御すると同時に、前記信号処理回路の前記複数の読み出し回路における増幅動作、サンプルホールド動作、外部への信号読み出し動作をパイプライン処理で実行するように制御する、
ことを特徴とする撮像装置。 - 前記電荷排出部は、前記受光部の前記中心部から前記端部に向けて幅が広くなるように形成されている、
ことを特徴とする請求項1記載の撮像装置。 - 前記画素回路は、3つの転送ゲートと3つの電荷検出部とを有する、
ことを特徴とする請求項1又は2記載の撮像装置。 - 前記ゲインアンプは、より大きいゲインを有する第1の増幅器と、より小さいゲインを有する第2の増幅器とを有する、
ことを特徴とする請求項1〜3のいずれか1項に記載の撮像装置。 - 前記制御回路は、前記読み出し回路のそれぞれにおけるサンプルホールド動作及び前記信号読み出し動作においては、前記複数のサンプルホールド回路を順次用いて実行させるように制御する、
ことを特徴とする請求項1〜4のいずれか1項に記載の撮像装置。 - 前記制御回路は、前記複数の信号処理回路に対して、前記複数の画素回路の全てから同時に信号読み出し動作を実行させるように制御する、
ことを特徴とする請求項1〜5のいずれか1項に記載の撮像装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013062917 | 2013-03-25 | ||
JP2013062917 | 2013-03-25 | ||
PCT/JP2014/058086 WO2014157086A1 (ja) | 2013-03-25 | 2014-03-24 | 撮像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2014157086A1 JPWO2014157086A1 (ja) | 2017-02-16 |
JP6324372B2 true JP6324372B2 (ja) | 2018-05-16 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2015508483A Active JP6324372B2 (ja) | 2013-03-25 | 2014-03-24 | 撮像装置 |
Country Status (2)
Country | Link |
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JP (1) | JP6324372B2 (ja) |
WO (1) | WO2014157086A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11917313B2 (en) | 2021-09-21 | 2024-02-27 | Kabushiki Kaisha Toshiba | Solid-state imaging device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003052048A (ja) * | 2001-08-07 | 2003-02-21 | Olympus Optical Co Ltd | 撮像素子、撮像装置および撮像方法 |
JP2003234496A (ja) * | 2002-02-12 | 2003-08-22 | Sony Corp | 固体撮像装置およびその製造方法 |
JP2004194488A (ja) * | 2002-12-13 | 2004-07-08 | Toyota Motor Corp | ハイブリッドモータ |
JP2004266597A (ja) * | 2003-03-03 | 2004-09-24 | Shoji Kawahito | 全画素同時電子シャッタ機能つきイメージセンサ |
JP4894275B2 (ja) * | 2006-01-20 | 2012-03-14 | ソニー株式会社 | 固体撮像装置 |
JP4644825B2 (ja) * | 2007-03-30 | 2011-03-09 | 国立大学法人静岡大学 | 固体撮像装置及びその駆動方法 |
JP2011243862A (ja) * | 2010-05-20 | 2011-12-01 | Sony Corp | 撮像デバイス及び撮像装置 |
-
2014
- 2014-03-24 WO PCT/JP2014/058086 patent/WO2014157086A1/ja active Application Filing
- 2014-03-24 JP JP2015508483A patent/JP6324372B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11917313B2 (en) | 2021-09-21 | 2024-02-27 | Kabushiki Kaisha Toshiba | Solid-state imaging device |
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Publication number | Publication date |
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JPWO2014157086A1 (ja) | 2017-02-16 |
WO2014157086A1 (ja) | 2014-10-02 |
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