JP6321013B2 - 成形された基板を含む発光デバイス - Google Patents
成形された基板を含む発光デバイス Download PDFInfo
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- JP6321013B2 JP6321013B2 JP2015531665A JP2015531665A JP6321013B2 JP 6321013 B2 JP6321013 B2 JP 6321013B2 JP 2015531665 A JP2015531665 A JP 2015531665A JP 2015531665 A JP2015531665 A JP 2015531665A JP 6321013 B2 JP6321013 B2 JP 6321013B2
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- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
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- H01L21/02436—Intermediate layers between substrates and deposited layers
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
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- H01L21/02505—Layer structure consisting of more than two layers
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
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- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
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Description
Claims (13)
- 第1の表面と該第1の表面の反対側の第2の表面とを有する基板であり、0≦a≦1であるLiNb a Ta 1−a O 3 、LiNbO 3 、LiTaO 3 、及びLiVO 3 のうちの1つを有する基板と、
発光層を含むGaN系半導体構造であり、当該GaN系半導体構造は、第1の表面と該第1の表面の反対側の第2の表面とを有し、当該GaN系半導体構造の前記第1の表面が、前記基板の前記第1の表面に接合されている、GaN系半導体構造と
を有し、
前記基板の前記第2の表面の少なくとも一部が、前記GaN系半導体構造の前記第1の表面を包含する面と、60°と75°との間である角度を形成している、
デバイス。 - 前記基板の前記第2の表面の少なくとも一部が、少なくとも1つのピラミッド構造へと成形されている、請求項1に記載のデバイス。
- 前記基板の前記第2の表面の少なくとも一部が、少なくとも1つの切頂ピラミッド構造へと成形されている、請求項1に記載のデバイス。
- 当該デバイスは更に、前記切頂ピラミッド構造内に形成された、交差し合うノッチを有し、前記交差し合うノッチは、前記GaN系半導体構造の前記第1の表面を包含する前記面と、60°と75°との間である角度を形成する側壁を有する、請求項3に記載のデバイス。
- 前記基板の前記第2の表面は、前記基板内に形成された造形部の部分であり、単一の発光デバイスに対応する発光層の部分の上に複数の造形部が形成されている、請求項1に記載のデバイス。
- 前記基板の前記第2の表面の上に配置された波長変換層を更に有する請求項1に記載のデバイス。
- 前記GaN系半導体構造は、前記基板の前記第1の表面に、1つ以上の誘電体接合層を介して接合されている、請求項1乃至6の何れか一項に記載のデバイス。
- 第1の基板上にGaN系半導体構造を成長させることと、
第1の表面と該第1の表面の反対側の第2の表面とを有する第2の基板を用意することであり、該第2の基板は、0≦a≦1であるLiNb a Ta 1−a O 3 、LiNbO 3 、LiTaO 3 、及びLiVO 3 のうちの1つを有する、用意することと、
前記第2の基板の前記第2の表面を、前記GaN系半導体構造の前記第1の表面を包含する面と鋭角を形成するように、成形することと、
前記GaN系半導体構造を前記第2の基板に接合することと、
を有する方法。 - 前記鋭角は、60°と75°との間である、請求項8に記載の方法。
- 前記成形はソーイングを有する、請求項8に記載の方法。
- 前記成形はエッチングを有する、請求項8に記載の方法。
- 前記成形は、少なくとも1つのピラミッド構造を形成することを有する、請求項8に記載の方法。
- 前記第2の基板の上に波長変換層を配置すること、を更に有する請求項8に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261701742P | 2012-09-17 | 2012-09-17 | |
US61/701,742 | 2012-09-17 | ||
PCT/IB2013/058295 WO2014041463A2 (en) | 2012-09-17 | 2013-09-05 | Light emitting device including shaped substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015532012A JP2015532012A (ja) | 2015-11-05 |
JP6321013B2 true JP6321013B2 (ja) | 2018-05-09 |
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015531665A Active JP6321013B2 (ja) | 2012-09-17 | 2013-09-05 | 成形された基板を含む発光デバイス |
Country Status (7)
Country | Link |
---|---|
US (1) | US10326051B2 (ja) |
EP (1) | EP2896077B1 (ja) |
JP (1) | JP6321013B2 (ja) |
KR (1) | KR101972200B1 (ja) |
CN (1) | CN104620397B (ja) |
TW (1) | TWI624960B (ja) |
WO (1) | WO2014041463A2 (ja) |
Families Citing this family (4)
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JP6273124B2 (ja) * | 2013-11-08 | 2018-01-31 | シチズン電子株式会社 | Led照明装置 |
JP6832282B2 (ja) * | 2015-02-18 | 2021-02-24 | ルミレッズ ホールディング ベーフェー | 複数の積み重ねられた発光デバイスを有するデバイス |
WO2017069964A1 (en) * | 2015-10-19 | 2017-04-27 | Koninklijke Philips N.V. | Wavelength converted light emitting device with textured substrate |
US11296262B2 (en) * | 2017-12-21 | 2022-04-05 | Lumileds Llc | Monolithic segmented LED array architecture with reduced area phosphor emission surface |
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-
2013
- 2013-09-05 EP EP13815135.2A patent/EP2896077B1/en active Active
- 2013-09-05 US US14/427,320 patent/US10326051B2/en active Active
- 2013-09-05 JP JP2015531665A patent/JP6321013B2/ja active Active
- 2013-09-05 CN CN201380048228.1A patent/CN104620397B/zh active Active
- 2013-09-05 WO PCT/IB2013/058295 patent/WO2014041463A2/en active Application Filing
- 2013-09-05 KR KR1020157009989A patent/KR101972200B1/ko active IP Right Grant
- 2013-09-17 TW TW102133707A patent/TWI624960B/zh active
Also Published As
Publication number | Publication date |
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WO2014041463A3 (en) | 2014-06-05 |
EP2896077B1 (en) | 2019-01-16 |
KR101972200B1 (ko) | 2019-04-24 |
TWI624960B (zh) | 2018-05-21 |
WO2014041463A2 (en) | 2014-03-20 |
CN104620397B (zh) | 2019-04-30 |
US20150243842A1 (en) | 2015-08-27 |
KR20150058424A (ko) | 2015-05-28 |
US10326051B2 (en) | 2019-06-18 |
JP2015532012A (ja) | 2015-11-05 |
EP2896077A2 (en) | 2015-07-22 |
CN104620397A (zh) | 2015-05-13 |
TW201417333A (zh) | 2014-05-01 |
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