JP6317997B2 - 導電性粒子、導電材料及び接続構造体 - Google Patents
導電性粒子、導電材料及び接続構造体 Download PDFInfo
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- JP6317997B2 JP6317997B2 JP2014098687A JP2014098687A JP6317997B2 JP 6317997 B2 JP6317997 B2 JP 6317997B2 JP 2014098687 A JP2014098687 A JP 2014098687A JP 2014098687 A JP2014098687 A JP 2014098687A JP 6317997 B2 JP6317997 B2 JP 6317997B2
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- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- KLEHMHBLPUXXPU-UHFFFAOYSA-M sodium;decyl hydrogen phosphate Chemical compound [Na+].CCCCCCCCCCOP(O)([O-])=O KLEHMHBLPUXXPU-UHFFFAOYSA-M 0.000 description 1
- JDSVWTAJRNTSSL-UHFFFAOYSA-M sodium;dodecyl hydrogen phosphate Chemical compound [Na+].CCCCCCCCCCCCOP(O)([O-])=O JDSVWTAJRNTSSL-UHFFFAOYSA-M 0.000 description 1
- QDZFJQPFGZWVHR-UHFFFAOYSA-M sodium;hexyl hydrogen phosphate Chemical compound [Na+].CCCCCCOP(O)([O-])=O QDZFJQPFGZWVHR-UHFFFAOYSA-M 0.000 description 1
- DZNVQXUZTZXYPW-UHFFFAOYSA-M sodium;nonyl hydrogen phosphate Chemical compound [Na+].CCCCCCCCCOP(O)([O-])=O DZNVQXUZTZXYPW-UHFFFAOYSA-M 0.000 description 1
- KOJSOGZMZDBNPG-UHFFFAOYSA-M sodium;octyl hydrogen phosphate Chemical compound [Na+].CCCCCCCCOP(O)([O-])=O KOJSOGZMZDBNPG-UHFFFAOYSA-M 0.000 description 1
- ZGMLVUQCSRECAE-UHFFFAOYSA-M sodium;undecyl hydrogen phosphate Chemical compound [Na+].CCCCCCCCCCCOP(O)([O-])=O ZGMLVUQCSRECAE-UHFFFAOYSA-M 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000010558 suspension polymerization method Methods 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- GEKDEMKPCKTKEC-UHFFFAOYSA-N tetradecane-1-thiol Chemical compound CCCCCCCCCCCCCCS GEKDEMKPCKTKEC-UHFFFAOYSA-N 0.000 description 1
- KRIXEEBVZRZHOS-UHFFFAOYSA-N tetradecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCCCCOP(O)(O)=O KRIXEEBVZRZHOS-UHFFFAOYSA-N 0.000 description 1
- ALKGSOOKRJKXMF-UHFFFAOYSA-N tetradecyl dihydrogen phosphite Chemical compound CCCCCCCCCCCCCCOP(O)O ALKGSOOKRJKXMF-UHFFFAOYSA-N 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- IPBROXKVGHZHJV-UHFFFAOYSA-N tridecane-1-thiol Chemical compound CCCCCCCCCCCCCS IPBROXKVGHZHJV-UHFFFAOYSA-N 0.000 description 1
- GAJQCIFYLSXSEZ-UHFFFAOYSA-N tridecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCCCOP(O)(O)=O GAJQCIFYLSXSEZ-UHFFFAOYSA-N 0.000 description 1
- BWPNIANVWARHPR-UHFFFAOYSA-N tridecyl dihydrogen phosphite Chemical compound CCCCCCCCCCCCCOP(O)O BWPNIANVWARHPR-UHFFFAOYSA-N 0.000 description 1
- SAWDTKLQESXBDN-UHFFFAOYSA-N triethoxy(heptyl)silane Chemical compound CCCCCCC[Si](OCC)(OCC)OCC SAWDTKLQESXBDN-UHFFFAOYSA-N 0.000 description 1
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 1
- FZXOVEZAKDRQJC-UHFFFAOYSA-N triethoxy(nonyl)silane Chemical compound CCCCCCCCC[Si](OCC)(OCC)OCC FZXOVEZAKDRQJC-UHFFFAOYSA-N 0.000 description 1
- ZJLGWINGXOQWDC-UHFFFAOYSA-N triethoxy(pentadecyl)silane Chemical compound CCCCCCCCCCCCCCC[Si](OCC)(OCC)OCC ZJLGWINGXOQWDC-UHFFFAOYSA-N 0.000 description 1
- SVKDNKCAGJVMMY-UHFFFAOYSA-N triethoxy(tetradecyl)silane Chemical compound CCCCCCCCCCCCCC[Si](OCC)(OCC)OCC SVKDNKCAGJVMMY-UHFFFAOYSA-N 0.000 description 1
- BBWMWJONYVGXGQ-UHFFFAOYSA-N triethoxy(undecyl)silane Chemical compound CCCCCCCCCCC[Si](OCC)(OCC)OCC BBWMWJONYVGXGQ-UHFFFAOYSA-N 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- JRSJRHKJPOJTMS-UHFFFAOYSA-N trimethoxy(2-phenylethenyl)silane Chemical compound CO[Si](OC)(OC)C=CC1=CC=CC=C1 JRSJRHKJPOJTMS-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- LCXXOYOABWDYBF-UHFFFAOYSA-N trimethoxy(pentadecyl)silane Chemical compound CCCCCCCCCCCCCCC[Si](OC)(OC)OC LCXXOYOABWDYBF-UHFFFAOYSA-N 0.000 description 1
- AXNJHBYHBDPTQF-UHFFFAOYSA-N trimethoxy(tetradecyl)silane Chemical compound CCCCCCCCCCCCCC[Si](OC)(OC)OC AXNJHBYHBDPTQF-UHFFFAOYSA-N 0.000 description 1
- QSYYSIXGDAAPNN-UHFFFAOYSA-N trimethoxy(tridecyl)silane Chemical compound CCCCCCCCCCCCC[Si](OC)(OC)OC QSYYSIXGDAAPNN-UHFFFAOYSA-N 0.000 description 1
- LIJFLHYUSJKHKV-UHFFFAOYSA-N trimethoxy(undecyl)silane Chemical compound CCCCCCCCCCC[Si](OC)(OC)OC LIJFLHYUSJKHKV-UHFFFAOYSA-N 0.000 description 1
- GRPURDFRFHUDSP-UHFFFAOYSA-N tris(prop-2-enyl) benzene-1,2,4-tricarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C(C(=O)OCC=C)=C1 GRPURDFRFHUDSP-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- CCIDWXHLGNEQSL-UHFFFAOYSA-N undecane-1-thiol Chemical compound CCCCCCCCCCCS CCIDWXHLGNEQSL-UHFFFAOYSA-N 0.000 description 1
- VAIOGRPEROWKJX-UHFFFAOYSA-N undecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCOP(O)(O)=O VAIOGRPEROWKJX-UHFFFAOYSA-N 0.000 description 1
- MVLKOUSZNPHMIY-UHFFFAOYSA-N undecyl dihydrogen phosphite Chemical compound CCCCCCCCCCCOP(O)O MVLKOUSZNPHMIY-UHFFFAOYSA-N 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 229920006163 vinyl copolymer Polymers 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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Description
本発明に係る導電性粒子は、基材粒子と、上記基材粒子の表面上に配置された導電層とを備える。上記基材粒子を10%圧縮したときの圧縮弾性率(10%K値)は1000N/mm2以上である。上記導電層は、外表面側にパラジウム層を有する。上記パラジウム層100重量%中、パラジウムの含有量は99.9重量%以上である。
F:基材粒子が10%圧縮変形したときの荷重値(N)
S:基材粒子が10%圧縮変形したときの圧縮変位(mm)
R:基材粒子の半径(mm)
上記基材粒子としては、樹脂粒子、金属を除く無機粒子、有機無機ハイブリッド粒子及び金属粒子等が挙げられる。上記基材粒子は、金属粒子を除く基材粒子であることが好ましく、樹脂粒子、金属を除く無機粒子又は有機無機ハイブリッド粒子であることがより好ましい。
上記導電層は外表面側にパラジウム層を有する。上記導電層は、パラジウム層以外の導電層(第1の導電層)と、パラジウム層(第2の導電層)とを有していてもよい。
上記芯物質が上記導電層中に埋め込まれていることによって、上記導電層が外表面に複数の突起を有するようにすることが容易である。但し、導電性粒子及び導電層の表面に突起を形成するために、芯物質を必ずしも用いなくてもよい。
本発明に係る導電性粒子は、上記導電層の外表面上に配置された絶縁物質を備えることが好ましい。上記絶縁物質が、パラジウム層の外表面上に配置されていることが好ましい。この場合には、導電性粒子を電極間の接続に用いると、隣接する電極間の短絡を防止できる。具体的には、複数の導電性粒子が接触したときに、複数の電極間に絶縁物質が存在するので、上下の電極間ではなく横方向に隣り合う電極間の短絡を防止できる。なお、電極間の接続の際に、2つの電極で導電性粒子を加圧することにより、導電性粒子の導電層と電極との間の絶縁物質を容易に排除できる。導電性粒子が導電層の外表面に複数の突起を有する場合には、導電性粒子の導電層と電極との間の絶縁物質を容易に排除できる。
導電性粒子の腐食を抑え、電極間の接続抵抗をより一層低くする観点からは、上記導電層の外表面は防錆処理されていることが好ましく、上記パラジウム層の外表面は防錆処理されていることが好ましい。
本発明に係る導電材料は、上述した導電性粒子と、バインダー樹脂とを含む。上記導電性粒子は、バインダー樹脂中に分散され、導電材料として用いられることが好ましい。上記導電材料は、異方性導電材料であることが好ましい。上記導電材料は、電極の電気的な接続に好適に用いられる。上記導電材料は、回路接続材料であることが好ましい。
上記導電性粒子を用いて、又は上記導電性粒子とバインダー樹脂とを含む導電材料を用いて、接続対象部材を接続することにより、接続構造体を得ることができる。
粒子径が3.0μmであるジビニルベンゼン共重合体樹脂粒子(積水化学工業社製「ミクロパールSP−203」)の表面を、ゾルゲル反応による縮合反応を用いて無機シェル(厚み250nm)により被覆したコアシェル型の有機無機ハイブリッド粒子(基材粒子)を用意した。
粒子径が3.0μmであるジビニルベンゼン共重合体樹脂粒子(積水化学工業社製「ミクロパールSP−203」)を用意した。
パラジウム層を形成する際に、パラジウム層の厚みを5nmに変更したこと以外は実施例1と同様にして、導電性粒子を得た。
実施例1で得られた有機無機ハイブリッド粒子を用意した。この有機無機ハイブリッド粒子をエッチングし、水洗した。次に、得られた有機無機ハイブリッド粒子及び分散剤を含む分散液と、平均粒径が50〜200nmであるニッケルナノ粒子を含む高分散性のニッケルナノペーストとを混合して、上記有機無機ハイブリッド粒子の表面に、ヘテロ凝集によりニッケルナノ粒子を付着させた。次に、固液分離した後、50℃で5時間真空乾燥を行い、芯物質が付着された有機無機ハイブリッド粒子を得た。
4ツ口セパラブルカバー、攪拌翼、三方コック、冷却管及び温度プローブが取り付けられた1000mLのセパラブルフラスコに、メタクリル酸メチル100mmolと、N,N,N−トリメチル−N−2−メタクリロイルオキシエチルアンモニウムクロライド1mmolと、2,2’−アゾビス(2−アミジノプロパン)二塩酸塩1mmolとを含むモノマー組成物を固形分率が5重量%となるようにイオン交換水に秤取した後、200rpmで攪拌し、窒素雰囲気下70℃で24時間重合を行った。反応終了後、凍結乾燥して、表面にアンモニウム基を有し、平均粒子径220nm及びCV値10%の絶縁性粒子を得た。
粒子径が3.0μmであるジビニルベンゼン共重合体樹脂粒子(積水化学工業社製「ミクロパールSP−203」)3gに対し、アルカリ脱脂を施した後、酸で中和した。pH6.0に調整したカチオン性高分子液100mLに、上記樹脂粒子を添加し、60℃で1時間攪拌した。その後、直径3μmのメンブレンフィルタ(ミリポア社製)で濾過し、水洗を行った。パラジウム触媒(アトテックジャパン社製「アトテックネネオガント834」)8重量%を含むパラジウム触媒化液100mLに、水洗後の樹脂粒子を添加し、35℃で30分攪拌した。その後、直径3μmのメンブレンフィルタ(ミリポア社製)で濾過し、水洗した。パラジウム触媒液へ繰り返し樹脂粒子を添加して、樹脂粒子の表面に十分な量のパラジウム触媒を付与した。次に、水洗後の樹脂粒子をpH6.0に調整した次亜リン酸ナトリウム液3g/Lに添加し、表面が活性化された樹脂粒子(コア粒子)を得た。その後、表面が活性化された樹脂粒子を蒸留水に浸漬し、超音波分散させた。上記の液を直径3μmのメンブレンフィルタ(ミリポア社製)で濾過し、無電解パラジウムめっき液(小島化学薬品社製「パレット」)に、70℃の条件で、表面が活性化された樹脂粒子を浸漬し、無電解パラジウムめっきを行い、樹脂粒子の表面に上、厚み20nmのパラジウム層を形成した。その後、直径3μmのメンブレンフィルタ(ミリポア社製)で濾過し、水洗を3回行った。40℃で7時間真空乾燥した後、解砕により凝集を解して、樹脂粒子の表面上に、厚み20nmのパラジウム層を有する導電性粒子を作製した。
シリコーンゴム粒子の調製
下記式(1)で表されるメチルビニルシロキサン(粘度600cP)500gと、下記式(2)で表されるメチルビニルシロキサン(粘度30cP)20gとを用意した。
樹脂粒子を10%圧縮したときの圧縮弾性率が1400N/mm2である樹脂粒子に変更したこと以外は実施例2と同様にして、導電性粒子を得た。
比較例1の導電性粒子1gを蒸留水1000mL(比抵抗18MΩ)に分散させ、撹拌機付オートクレーブに入れて0.1MPaの加圧下、121℃で10時間攪拌洗浄した。その後、濾別乾燥させて、導電性粒子を得た。
攪拌機及び温度計が取り付けられた500mLの反応容器内に、0.13重量%のアンモニア水溶液300gを入れた。次に、反応容器内のアンモニア水溶液中に、メチルトリメトキシシラン4.1gと、ビニルトリメトキシシラン19.2gと、シリコーンアルコキシオリゴマー(信越化学工業社製「X−41−1053」、メトキシ基とエトキシ基とエポキシ基と珪素原子に直接結合したアルキル基とを有する、重量平均分子量:約1600)0.7gとの混合物をゆっくりと添加した。撹拌しながら、加水分解及び縮合反応を進行させた後、25重量%アンモニア水溶液2.4mL添加した後、アンモニア水溶液中から粒子を単離して、得られた粒子を酸素分圧10−17atm、400℃で2時間焼成して、有機無機ハイブリッド粒子を得た。得られた有機無機ハイブリッド粒子の粒子径は3.5μmであった。
粒子径が2.0μmであるジビニルベンゼン共重合体樹脂粒子(積水化学工業社製)の表面を、ゾルゲル反応による縮合反応を用いて無機シェル(厚み250nm)により被覆したコアシェル型の有機無機ハイブリッド粒子(基材粒子)を用意した。この基材粒子を用いたこと以外は実施例1と同様にして、導電性粒子を得た。
冷却管、温度計、滴下口を備えた四つ口フラスコに、イオン交換水804重量部と、25%アンモニア水1.2重量部と、メタノール336.6重量部とを入れ、攪拌下、滴下口から3−メタクリロキシプロピルトリメトキシシラン(信越化学工業社製「KBM503」)80重量部及びメタノール59.4重量部の混合液を添加して、3−メタクリロキシプロピルトリメトキシシランの加水分解、縮合反応を行って、メタクリロイル基を有するポリシロキサン粒子(重合性ポリシロキサン粒子)の乳濁液を調製した。反応開始から2時間後、得られたポリシロキサン粒子の乳濁液をサンプリングし、粒子径を測定したところ、粒子径は2.25μmであった。
(1)基材粒子の上記圧縮弾性率(10%K値)
基材粒子の上記圧縮弾性率(10%K値)を、上述した方法により、微小圧縮試験機(フィッシャー社製「フィッシャースコープH−100」)を用いて測定した。
60%硝酸5mLと37%塩酸10mLとの混合液に、導電性粒子5gを加え、パラジウム層を完全に溶解させ、溶液を得た。得られた溶液を用いて、パラジウムの含有量をICP−MS分析器(日立製作所社製)により分析した。
パラジウム層の厚み方向における各成分の含有量の分布を測定した。パラジウム層の内表面(基材粒子側の表面)から厚み方向に外側に向かって厚み5nmの領域Rにおいて、パラジウム以外の成分の含有量を評価した。
ビスフェノールA型エポキシ樹脂(三菱化学社製「エピコート1009」)10重量部と、アクリルゴム(重量平均分子量約80万)40重量部と、メチルエチルケトン200重量部と、マイクロカプセル型硬化剤(旭化成ケミカルズ社製「HX3941HP」)50重量部と、シランカップリング剤(東レダウコーニングシリコーン社製「SH6040」)2重量部とを混合し、導電性粒子を含有量が3重量%となるように添加し、分散させ、樹脂組成物を得た。
得られた接続構造体の対向する電極間の接続抵抗を4端子法により測定した。また、接続抵抗から導通信頼性を下記の基準で判定した。
○○:接続抵抗が2.0Ω以下
○:接続抵抗が2.0Ωを超え、3.0Ω以下
△:接続抵抗が3.0Ωを超え、5.0Ω以下
×:接続抵抗が5.0Ωを超える
実施例1〜9、比較例1及び参考例Aの手順で導電性粒子を得た場合には、比較例2の手順で導電性粒子を得た場合と比べて、環境負荷をかなり小さくすることができ、かつ製造コストが低かった。
得られた接続構造体を冷熱衝撃試験機(エスペック社製「TSA−72ES」)に放置し、−40℃,30分/100℃,30分を交互に繰り返す条件に、接続構造体を1000サイクルさらした後、対向する電極間の接続抵抗を4端子法により測定した。接続抵抗から、冷熱衝撃信頼性を下記の基準で判定した。
○○○:接続抵抗が5.5Ω以下
○○:接続抵抗が5.5Ωを超え、6.0Ω以下
○:接続抵抗が6.0Ωを超え、10.0Ω以下
△:接続抵抗が10.0Ωを超え、15.0Ω以下
×:接続抵抗が15.0Ωを超える
2…基材粒子
3…導電層(パラジウム層)
11…導電性粒子
12…導電層
12A…第1の導電層
12B…第2の導電層(パラジウム層)
21…導電性粒子
21a…突起
22…導電層(パラジウム層)
22a…突起
23…芯物質
24…絶縁物質
51…接続構造体
52…第1の接続対象部材
52a…第1の電極
53…第2の接続対象部材
53a…第2の電極
54…接続部
Claims (9)
- 基材粒子と、前記基材粒子の表面上に配置された導電層とを備え、
前記基材粒子を10%圧縮したときの圧縮弾性率が1000N/mm2以上であり、
前記導電層が外表面側にパラジウム層を有し、
前記パラジウム層100重量%中、パラジウムの含有量が99.9重量%以上である、導電性粒子。 - 前記パラジウム層の厚みが20nm未満である、請求項1に記載の導電性粒子。
- 前記基材粒子の表面上に直接前記パラジウム層が配置されている、請求項1又は2に記載の導電性粒子。
- 前記基材粒子が、樹脂粒子又はコアシェル型の有機無機ハイブリッド粒子である、請求項1〜3のいずれか1項に記載の導電性粒子。
- 前記基材粒子が、前記有機無機ハイブリッド粒子である、請求項4に記載の導電性粒子。
- 前記導電層が外表面に、複数の突起を有する、請求項1〜5のいずれか1項に記載の導電性粒子。
- 前記導電層の外表面上に配置された絶縁物質を備える、請求項1〜6のいずれか1項に記載の導電性粒子。
- 請求項1〜7のいずれか1項に記載の導電性粒子と、バインダー樹脂とを含む、導電材料。
- 第1の電極を表面に有する第1の接続対象部材と、
第2の電極を表面に有する第2の接続対象部材と、
前記第1の接続対象部材と前記第2の接続対象部材とを接続している接続部とを備え、
前記接続部が、請求項1〜7のいずれか1項に記載の導電性粒子により形成されているか、又は前記導電性粒子とバインダー樹脂とを含む導電材料により形成されており、
前記第1の電極と前記第2の電極とが前記導電性粒子により電気的に接続されている、接続構造体。
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